High-viscosity high-temperature-resistant adhesive tape

Abstract

The utility model discloses a high-viscosity high-temperature-resistant adhesive tape, which comprises a unit base material layer which is provided with a first surface and a second surface opposite to each other along the layer thickness and is a heat-conducting base layer; the unit adhesive layer is arranged on the first surface and / or the second surface; each unit adhesive layer comprises a low-viscosity layer and a high-viscosity layer which are matched in a concave-convex mode, the high-viscosity layers are arranged in at least two layers, the low-viscosity layers are arranged between the adjacent high-viscosity layers in a clamped mode, each low-viscosity layer comprises a plurality of protruding adhesive portions, the cross sections of the protruding adhesive portions are of a closing-up structure gradually from inside to outside, the adjacent protruding adhesive portions are communicated, and the protruding adhesive portions are arranged in a staggered mode. The outer surface of the convex rubber part and the outer surface of the high-viscosity layer are on the same plane; and the low-viscosity layer is a heat-conducting glue layer. The high-viscosity high-temperature-resistant adhesive tape is reasonable in structure, and the cross section of the convex adhesive part is of a gradually closed-up structure from inside to outside, so that the heat conduction efficiency of the adhesive layer is improved, the high-temperature resistance of the adhesive layer is optimized, the bonding area of the high-viscosity layer and the bonded object as well as the bonding area of the high-viscosity layer and the unit base material layer are increased, and the connection firmness and the structural stability of the adhesive tape are improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of adhesive tape, especially to a high-adhesion high-temperature-resistant adhesive tape. BACKGROUND

[0002] The high-adhesion and easy-to-tear adhesive tape is widely applied in the fields of electronic products, semiconductor manufacturing, precision instruments and the like. The existing adhesive tape has large viscosity but is not easy to be peeled off, and the poor high-temperature resistance leads to poor adhesion of the adhesive tape, and the adhesive tape cannot be easily torn in use and needs to be assisted by a cutter, which leads to low efficiency of bonding the bonded objects and the cutter is easy to rub against the bonded objects to generate static electricity, which leads to dust adsorbed on the surface of the bonded objects to reduce the adhesion of the adhesive tape. The end of the adhesive tape after being torn is not easy to be found, which also reduces the use efficiency.

[0003] Therefore, it is necessary to improve the high-adhesion high-temperature-resistant adhesive tape in the prior art. UTILITY MODEL CONTENT

[0004] The utility model discloses a high-adhesion high-temperature-resistant adhesive tape, which has the advantages that the cross section of the convex adhesive part gradually presents a tapering structure from inside to outside, which not only improves the heat conduction efficiency of the adhesive layer, optimizes the high-temperature resistance of the adhesive layer, but also increases the bonding area of the high-adhesion layer and the bonded objects and the unit substrate layer, and improves the connection firmness and the stability of the adhesive tape structure.

[0005] To achieve the above technical effects, the technical scheme of the utility model is as follows: a high-adhesion high-temperature-resistant adhesive tape comprises:

[0006] a unit substrate layer having a first surface and a second surface opposite along the layer thickness, which is a heat-conducting base layer;

[0007] a unit adhesive layer arranged on the first surface and / or the second surface;

[0008] The unit adhesive layer comprises a low-adhesion layer and a high-adhesion layer in a concave-convex matching mode, the high-adhesion layer is provided in at least two layers, the low-adhesion layer is arranged between adjacent high-adhesion layers, the low-adhesion layer comprises a plurality of convex adhesive parts, the cross section of the convex adhesive part gradually presents a tapering structure from inside to outside, adjacent convex adhesive parts are connected, the outer surface of the convex adhesive part and the outer surface of the high-adhesion layer are in the same plane, and the low-adhesion layer is a heat-conducting adhesive layer.

[0009] Preferably, adjacent unit substrate layers and adjacent unit adhesive layers are connected in a point-discontinuous line mode, the point-discontinuous line extends along the width direction of the adhesive tape, and the perforation of the point-discontinuous line penetrates along the thickness direction of the adhesive tape.

[0010] Preferably, the perforation of the point-discontinuous line is arranged between the adjacent convex adhesive parts.

[0011] Preferably, the high-adhesion layer of the perforated point-disconnection line is a first high-adhesion unit layer, and the first high-adhesion unit layer is a colored adhesive layer.

[0012] Preferably, the unit substrate layer is a laminated structure of TPU / PET / TPU or PI / PET / PI.

[0013] Preferably, the material of the low-adhesion layer and the high-adhesion layer is the same, and is a silicone pressure-sensitive adhesive.

[0014] Preferably, the unit adhesive layer is provided with an antistatic release film away from the surface of the unit substrate layer.

[0015] The high-adhesion high-temperature-resistant adhesive tape has the following advantages and beneficial effects:

[0016] The high-adhesion high-temperature-resistant adhesive tape has the following advantages and beneficial effects: BRIEF DESCRIPTION OF DRAWINGS

[0017] Figure 1 is a structural schematic view of the high-adhesion high-temperature-resistant adhesive tape of the utility model;

[0018] Figure 2 is another structural schematic view of the high-adhesion high-temperature-resistant adhesive tape of the utility model.

[0019] In the drawings: 1, unit substrate layer; 2, unit adhesive layer; 3, antistatic release film; 11, point-disconnection line; 20, first high-adhesion unit layer; 21, low-adhesion layer; 22, high-adhesion layer; 200, raised adhesive part. DETAILED DESCRIPTION

[0020] The specific implementation of the utility model will be further described below in combination with the drawings and examples. The following examples are only used to more clearly illustrate the technical scheme of the utility model, and cannot be used to limit the protection scope of the utility model.

[0021] "Outer surface" and "surface" are referred to the normal use state of the high-adhesion high-temperature-resistant adhesive tape, and are only used to facilitate the description of the utility model and simplify the description, and are not used to indicate or imply that the device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the utility model.

[0022] In addition, the terms "first", "second", and the like are used only for descriptive purposes and do not denote or imply relative importance or an indicated number of the technical features indicated. Thus, the features defined with "first", "second", and the like can explicitly or implicitly include one or more of the features. In the description of the utility model creation, unless otherwise specified, the meaning of "a plurality of" is two or more.

[0023] As shown in Figures 1-2 The high-adhesion high-temperature-resistant adhesive tape of the utility model includes a unit base material layer 1 and a unit adhesive layer 2, the unit base material layer 1 has a first surface (not indicated) and a second surface (not indicated) opposite along the layer thickness, and is a heat-conducting base layer; the unit adhesive layer 2 is arranged on the first surface and / or the second surface; the unit adhesive layer 2 includes a low-adhesion layer 21 and a high-adhesion layer 22 in concave-convex cooperation, the high-adhesion layer 22 is arranged in at least two layers, the low-adhesion layer 21 is clamped between adjacent high-adhesion layers 22, the low-adhesion layer 21 includes a plurality of convex adhesive portions 200, the cross section of the convex adhesive portion 200 gradually presents a tapering structure from inside to outside, adjacent convex adhesive portions 200 are connected, the outer surface of the convex adhesive portion 200 and the outer surface of the high-adhesion layer 22 are in the same plane; and the low-adhesion layer 21 is a heat-conducting adhesive layer.

[0024] The cross section of the convex adhesive portion 200 gradually presents a tapering structure from inside to outside, which not only improves the heat-conducting efficiency of the unit adhesive layer 2, optimizes the high-temperature resistance of the unit adhesive layer 2, but also increases the bonding area of the high-adhesion layer 22 with the adherend and the unit base material layer 1, and improves the connection firmness and the stability of the adhesive tape structure.

[0025] The unit adhesive layer 2 is arranged on the first surface or the second surface, and the adhesive tape is a single-sided adhesive tape.

[0026] The unit adhesive layer 2 is arranged on the first surface and the second surface, and the adhesive tape is a double-sided adhesive tape.

[0027] As shown in Figure 1 The high-adhesion layer 22 can be arranged in two layers.

[0028] As shown in Figure 2 In other embodiments, the high-adhesion layer 22 is arranged in three layers, and the unit adhesive layer 2 has better toughness.

[0029] In order to achieve the heat conduction performance of the unit substrate layer 1 and the unit adhesive layer 2, a heat-conducting filler needs to be added to the raw material. Further, the heat-conducting filler is one or more of aluminum oxide (Al2O3), boron nitride (BN), and aluminum nitride (AlN). Aluminum oxide is a commonly used heat-conducting filler, has good heat-conducting performance, can improve the hardness and rigidity of the adhesive, but excessive addition may affect flexibility; has good chemical stability and is not easy to react with silicone glue; has relatively low cost and high cost performance. Boron nitride has very high thermal conductivity and is a high-efficiency heat-conducting filler; boron nitride has good lubricity and can improve the wear resistance of the adhesive; has excellent chemical stability and high temperature resistance. Aluminum nitride has very high thermal conductivity and can improve the hardness and rigidity of the adhesive; has good chemical stability and high temperature resistance.

[0030] In order to facilitate the selection of a suitable length of the adhesive tape and improve the tearing efficiency, the point break line 11 is connected between adjacent unit substrate layers 1 and between adjacent unit adhesive layers 2. The point break line 11 extends along the width direction of the adhesive tape, and the perforation of the point break line 11 penetrates along the thickness direction of the adhesive tape. Further, the perforation of the point break line 11 is arranged between adjacent raised adhesive portions. This prevents excessive heat-conducting material in the heat-conducting adhesive layer from being exposed to the air, which has a negative impact on the heat-conducting performance. Since the raised adhesive portion 200 of the low-adhesion layer 21 contains a large amount of heat-conducting material and is rigid, it is not conducive to the formation of the point break line.

[0031] To solve the problem that the end of the adhesive tape after tearing is difficult to find, the perforation of the point break line is arranged in the first high-adhesion unit layer 20, which is a colored adhesive layer.

[0032] In some embodiments, the unit substrate layer 1 is a laminated structure of TPU / PET / TPU.

[0033] In some embodiments, the unit substrate layer 1 is a laminated structure of PI / PET / PI.

[0034] The TPU layer provides excellent flexibility and wear resistance, while the PET layer provides high tensile strength and rigidity. This combination makes the composite material both flexible and strong enough to effectively prevent the problem of excessive rigidity and poor bending resistance caused by the thermal conductive material. The TPU layer has excellent tear resistance, which can effectively prevent the material from tearing when subjected to external forces. The high elasticity and toughness of the TPU layer enable the material to resist puncture by sharp objects. TPU has good chemical resistance and can resist many common solvents and chemicals. PET also has some chemical resistance, especially in acidic and alkaline environments. TPU has good low-temperature performance and can maintain flexibility at low temperatures, while PET has a high melting point and can remain stable at high temperatures. TPU / PET / TPU composite materials can be made by co-extrusion or lamination. The TPU layer has excellent wear resistance, which can protect the PET layer from wear and tear.

[0035] The PET layer provides high tensile strength and rigidity, while the PI layer increases the overall strength and toughness of the material. PET has a high Young's modulus, making the composite material less likely to deform when stretched. The PI layer has excellent tear resistance, which can effectively prevent the material from tearing when subjected to external forces. PI has excellent temperature resistance and can remain stable at temperatures ranging from -269°C to +400°C. The PI layer does not easily decompose at high temperatures, maintaining good mechanical properties and dimensional stability. PI has excellent chemical resistance and can resist most solvents, acids, bases, and other chemicals. PET also has some chemical resistance, especially in acidic and alkaline environments. PI / PET / PI composite materials can be made by lamination, co-extrusion, etc. The PI layer can provide good scratch resistance and prevent surface scratches.

[0036] The materials of the low-adhesion layer 21 and the high-adhesion layer 22 are the same, which is organic silicone pressure-sensitive adhesive. Silicone pressure-sensitive adhesive can maintain its performance in a wide temperature range, with high temperature resistance and low temperature resistance. It has strong resistance to many chemicals, solvents and oils, making it suitable for harsh chemical environments. It can maintain its adhesion for a long time, even after long-term exposure to ultraviolet light, oxygen and other environmental factors. It also has good flexibility and elasticity, which can adapt to curved and deformed surfaces, making it suitable for use on irregularly shaped objects.

[0037] The unit adhesive layer 2 is provided with an antistatic release film 3 away from the surface of the unit substrate layer 1.

[0038] The above merely is the preferred implementation manner of the present application, and it should be noted that, for the ordinary skilled in the art, without departing from the technical principles of the present application, a number of improvements and refinements can be made, and these improvements and refinements should also be considered as the protection scope of the present application.

Claims

1. A high-viscosity high-temperature-resistant adhesive tape, comprising: a unit substrate layer having a first surface and a second surface opposite along the thickness of the layer, serving as a heat-conducting base layer; a unit adhesive layer arranged on the first surface and / or the second surface; characterized in that the unit adhesive layer comprises a low-viscosity layer and a high-viscosity layer in a concave-convex matching manner, the high-viscosity layer is arranged in at least two layers, the low-viscosity layer is arranged between adjacent high-viscosity layers, the low-viscosity layer comprises a plurality of convex adhesive portions, the cross section of the convex adhesive portion gradually presents a converging structure from inside to outside, the adjacent convex adhesive portions are connected, the outer surface of the convex adhesive portion and the outer surface of the high-viscosity layer are in the same plane, and the low-viscosity layer is a heat-conducting adhesive layer.

2. The high-tack high-temperature resistant adhesive tape of claim 1, wherein, The adjacent unit substrate layers and the adjacent unit adhesive layers are connected by point-discontinuous lines, the point-discontinuous lines extend along the width direction of the adhesive tape, and the perforations of the point-discontinuous lines penetrate along the thickness direction of the adhesive tape.

3. The high-tack high-temperature resistant adhesive tape of claim 2, wherein, The perforations of the point-discontinuous lines are arranged between the adjacent convex adhesive portions.

4. The high-tack high-temperature resistant adhesive tape of claim 3, wherein, The high-viscosity layer in which the perforations of the point-discontinuous lines are arranged is a first high-viscosity unit layer, and the first high-viscosity unit layer is a colored adhesive layer.

5. The high-tack high-temperature resistant tape of claim 1, wherein, The unit substrate layer is a laminated structure of TPU / PET / TPU or PI / PET / PI.

6. The high-tack high-temperature resistant tape of claim 1, wherein, The material of the low-viscosity layer and the high-viscosity layer is the same, which is organic silicon pressure-sensitive adhesive.

7. The high-tack high-temperature resistant tape of claim 1, wherein, The unit adhesive layer is provided with an antistatic release film away from the surface of the unit substrate layer.

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