Wafer adsorption structure for ultraviolet lithography machine

Abstract

The utility model discloses a wafer adsorption structure for an ultraviolet lithography machine, which relates to the technical field of wafer adsorption and comprises a base, a support arranged at the top of the base, a bearing table arranged at the top of the support and a wafer body arranged at the top of the bearing table. The adsorption assembly comprises an outer suction cup arranged at the top of the bearing table, an inner suction cup is arranged at the top of the outer suction cup, an air outlet is formed in the top of the inner suction cup, an air inlet is formed in the outer suction cup, and an air channel is formed in the outer suction cup; the purification assembly is arranged at the top of the wafer body, the purification assembly comprises a purification box arranged at the top of the wafer body, a fixing rod is rotationally connected to the interior of the purification box, blades are fixedly connected to the fixing rod, an activated carbon filter plate is arranged in the purification box, and the activated carbon filter plate is located at the bottoms of the blades. And oil-containing components in the gas are removed, so that the gas can pass through the adsorption structure in a more uniform and stable manner, and uniform adsorption force is provided for the wafer.

Description

TECHNICAL FIELD

[0001] The utility model relates to wafer adsorption technical field, concretely is a wafer adsorption structure for ultraviolet photoetching machine. BACKGROUND

[0002] With the rapid development of semiconductor industry, the integration of chip is continuously improved, and the precision requirement of photoetching process is also higher and higher. In the photoetching process, the wafer needs to be accurately fixed and positioned to ensure that the pattern on the mask can be accurately transferred to the wafer. The traditional wafer fixing mode, such as mechanical clamping, is easy to cause damage to the wafer surface, and it is difficult to meet the requirements of wafer flatness and stability for high-precision photoetching, so a more advanced and reliable wafer adsorption structure is needed.

[0003] In the prior art, a negative pressure environment is usually created by a vacuum pump to extract air from the adsorption area to reduce the pressure, and a vacuum area is generated between the wafer and the adsorption disc, and the adsorption of the wafer is realized by using the pressure difference between the atmospheric pressure and the vacuum area. However, if the vacuum fails or is not operated properly, it may cause damage to the wafer. For very fragile or ultra-thin wafers, mechanical contact may cause additional stress, affecting the quality of the finished product. In the case of using Bernoulli chuck adsorption, there may be dust particles or oil stains in the air on the top of the wafer, which will cause turbulence of the air flow between the Bernoulli chuck and the wafer. Turbulence of the air flow will make the pressure difference between the wafer and the adsorption disc unstable, affecting the adsorption effect of the wafer, so we propose a wafer adsorption structure for ultraviolet photoetching machine. UTILITY MODEL CONTENT

[0004] The utility model aims at providing a wafer adsorption structure for ultraviolet photoetching machine to solve the problems raised in the above background.

[0005] To achieve the above-mentioned purpose, the utility model provides the following technical scheme: a wafer adsorption structure for ultraviolet photoetching machine, comprising:

[0006] A base, a support provided on the top of the base, a receiving table provided on the top of the support, and a wafer body provided on the top of the receiving table;

[0007] An adsorption assembly is arranged on the top of the receiving table, which comprises an outer chuck provided on the top of the receiving table, an inner chuck provided on the top of the outer chuck, an air outlet provided on the top of the inner chuck, an air inlet provided on the outer chuck, and an air duct provided in the inner part of the outer chuck;

[0008] The purification assembly is arranged on the top of the wafer body, and the purification assembly comprises a purification box arranged on the top of the wafer body, a fixing rod rotatably connected in the purification box, and a blade fixedly connected to the fixing rod.

[0009] Further, the top of the purification box is provided with a shell, the shell is provided with a motor, and the fixing rod is fixedly connected to the output end of the motor.

[0010] The above technical scheme has the following advantages: the motor is arranged as the power source of the purification assembly to drive the blade to rotate and separate oil droplets from gas by centrifugal force.

[0011] Further, the base is provided with a gas supply assembly, the gas supply assembly comprises an extension plate, the top of the extension plate is provided with a compressed air bottle, the top of the compressed air bottle is fixedly connected with an air inlet pipe, one end of the air inlet pipe away from the compressed air bottle is fixedly connected in an air inlet, and the air inlet pipe is provided with an electromagnetic valve.

[0012] The above technical scheme has the following advantages: the gas supply assembly is arranged to provide a continuous gas source for the Bernoulli chuck. The high-pressure gas passes through a specific channel and nozzle and is sprayed at high speed to form a high-speed airflow layer between the Bernoulli chuck and the surface of the object to be adsorbed.

[0013] Further, the top of the support is rotatably connected to the bottom of the receiving table, the support is provided with a rotating assembly, the rotating assembly comprises a knob, the knob is fixedly connected with a connecting shaft, the top of the connecting shaft is fixedly connected to the bottom of the receiving table, and the connecting shaft is sleeved on the support.

[0014] The above technical scheme has the following advantages: the rotating assembly is arranged, when the wafer and other workpieces are adsorbed, the rotating receiving table can make the Bernoulli chuck adsorb the workpiece at different angles to ensure that the adsorption force on each part of the surface of the workpiece is more uniform.

[0015] Further, the bottom of the purification box is provided with a quick release assembly, the quick release assembly comprises a cover plate, the top of the cover plate is provided with a clamping groove on each side, the clamping groove is provided with a magnetic block, one side of the bottom of the purification box corresponding to the magnetic block is provided with a magnetic strip, and the magnetic block and the magnetic strip are magnetically connected.

[0016] The above technical scheme has the following advantages: the quick release assembly is arranged to open the bottom of the purification box, which facilitates regular cleaning of the activated carbon filter plate.

[0017] Further, the top of the purification box is fixedly connected with an air suction pipe, and the bottom of the purification box is fixedly connected with an air exhaust pipe.

[0018] The above technical scheme has the advantages that: the air suction pipe is arranged to suck the gas into the purification box, and then the purified air is discharged through the air discharge pipe.

[0019] Further, the air passage is in S-shaped distribution in the outer suction disc.

[0020] The above technical scheme has the advantages that: the flow rate of the gas in the air passage is accelerated.

[0021] Compared with the prior art, the advantages and positive effects of the utility model are that:

[0022] In the utility model, the oil-containing components in the gas are removed by the purification assembly, so that the gas can pass through the adsorption structure in a more uniform and stable manner, and uniform adsorption force is provided for the wafer, the problem that in the prior art, a vacuum pump is used to create a negative pressure environment, air is sucked from the adsorption area, the pressure is reduced, a vacuum area is generated between the wafer and the adsorption disc, and the wafer is adsorbed by using the pressure difference between the atmospheric pressure and the vacuum area, however, if the vacuum fails or is not operated properly, the wafer may be damaged, for the wafer that is extremely fragile or ultrathin, mechanical contact may bring additional stress, and affect the quality of the finished product, and in the case of using the Bernoulli chuck adsorption, dust particles or oil stains may exist in the air on the top of the wafer, which will cause the airflow between the Bernoulli chuck and the wafer to be turbulent. The turbulent airflow will make the pressure difference between the wafer and the adsorption disc unstable, and affect the adsorption effect of the wafer. BRIEF DESCRIPTION OF DRAWINGS

[0023] Figure 1 It is a front view of a wafer adsorption structure for an ultraviolet photolithography machine.

[0024] Figure 2 It is a side view of a wafer adsorption structure for an ultraviolet photolithography machine.

[0025] Figure 3 It is a structure diagram of a purification assembly in a wafer adsorption structure for an ultraviolet photolithography machine.

[0026] Figure 4 It is a structure diagram of a quick-release assembly in a wafer adsorption structure for an ultraviolet photolithography machine.

[0027] Figure 5 It is a split view of a wafer adsorption structure for an ultraviolet photolithography machine.

[0028] REFERENCE NUMERALS IN DRAWINGS

[0029] 1, base; 2, support; 3, receiving table;

[0030] 4, adsorption assembly; 41, outer suction disc; 42, inner suction disc; 43, air outlet; 44, air inlet; 45, air passage;

[0031] 5. Wafer body;

[0032] 6. Purification components; 61. Purification box; 62. Shell; 63. Fixing rod; 64. Blades; 65. Activated carbon filter plate;

[0033] 7. Quick-release assembly; 71. Cover plate; 72. Card slot; 73. Magnetic block;

[0034] 8. Air supply assembly; 81. Extension plate; 82. Compressed air cylinder; 83. Inlet pipe; 84. Solenoid valve;

[0035] 9. Rotating component; 91. Knob; 92. Connecting shaft;

[0036] 10. Intake pipe; 11. Exhaust pipe. Detailed Implementation

[0037] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0038] like Figures 1-5 As shown, this utility model provides a technical solution: a wafer adsorption structure for an ultraviolet lithography machine, comprising:

[0039] Base 1, support 2 on top of base 1, receiving platform 3 on top of support 2, and wafer body 5 on top of receiving platform 3;

[0040] Adsorption component 4 is placed on the top of the receiving platform 3. Adsorption component 4 includes an outer suction cup 41 set on the top of the receiving platform 3, an inner suction cup 42 set on the top of the outer suction cup 41, an air outlet 43 opened on the top of the inner suction cup 42, an air inlet 44 opened on the outer suction cup 41, and an air passage 45 set inside the outer suction cup 41. The air passage 45 is distributed in an S-shape inside the outer suction cup 41.

[0041] Purification component 6 is placed on top of wafer body 5. Purification component 6 includes purification box 61 set on top of wafer body 5. A fixing rod 63 is rotatably connected inside purification box 61. A blade 64 is fixedly connected to the fixing rod 63. An activated carbon filter plate 65 is set inside purification box 61. The activated carbon filter plate 65 is located at the bottom of blade 64. A housing 62 is set on top of purification box 61. A motor is set inside housing 62. The fixing rod 63 is fixedly connected to the output end of the motor.

[0042] Specifically, the gas enters the gas inlet 44 of the outer chuck 41, and is sprayed out of the gas outlet 43 at the top of the inner chuck 42, forming a high-speed airflow in the gap between the wafer and the inner chuck 42. In this gap, the gas near the surface of the inner chuck 42 and the surface of the wafer has a relatively slow flow rate due to viscosity, while the gas in the middle of the gap has a faster flow rate, thereby forming a difference in flow rate. The external atmospheric pressure acts on the upper surface of the wafer, and due to the pressure difference between the wafer and the inner chuck 42, the pressure below is less than the atmospheric pressure above, thereby forming an upward force between the wafer and the inner chuck 42, which is the force for adsorbing the wafer, allowing the wafer to be stably adsorbed on the inner chuck 42. Before the adsorption work, the external air will first enter the purification box 61, and then the motor will be started to drive the fixed rod 63 to rotate, the fixed rod 63 drives the blade 64 to rotate, and the oil droplets in the gas are separated from the gas by centrifugal force, and then filtered by the activated carbon filter plate 65. The purified gas is discharged above the wafer again, so that the gas can pass through the adsorption structure in a more uniform and stable manner, providing uniform adsorption force for the wafer.

[0043] Further, as shown in Figure 2 The base 1 is provided with a gas supply assembly 8, which includes an extension plate 81, and the top of the extension plate 81 is provided with a compressed air bottle 82. The top of the compressed air bottle 82 is fixedly connected with an air inlet pipe 83, one end of the air inlet pipe 83 away from the compressed air bottle 82 is fixedly connected in the air inlet 44, and the air inlet pipe 83 is provided with an electromagnetic valve 84. Opening the electromagnetic valve 84 will fill the gas in the compressed air bottle 82 into the air inlet 44 through the air inlet pipe 83, and then sprayed out of the air outlet 43 through the air channel 45;

[0044] In the above scheme, when adsorbing a wafer or other workpiece, the fixed receiving table 3 cannot make the Bernoulli chuck adsorb the workpiece at different angles, so that the adsorption force on the surface of the workpiece is not uniform, as shown in Figure 2 The top of the support 2 is rotatably connected with the bottom of the receiving table 3, and the support 2 is provided with a rotating assembly 9, which includes a knob 91, and the knob 91 is fixedly connected with a connecting shaft 92. The top of the connecting shaft 92 is fixedly connected with the bottom of the receiving table 3, and the connecting shaft 92 is sleeved on the support 2. Twisting the knob 91 can drive the receiving table 3 to rotate, so that the adsorption force on the surface of the workpiece is more uniform;

[0045] In the above scheme, the activated carbon filter plate 65 will have a lot of oil stains on its surface after long-term use, which will affect subsequent filtration, as shown in Figure 4As shown: the bottom of the purification tank 61 is provided with quick release assembly 7, quick release assembly 7 includes cover plate 71, the top of both sides of cover plate 71 is provided with clamping groove 72, clamping groove 72 is provided with magnetic block 73, the bottom of the purification tank 61 is provided with magnetic strip on the side corresponding to magnetic block 73, magnetic block 73 and magnetic strip are connected by magnetic attraction, by setting quick release assembly 7, the bottom of the purification tank 61 can be opened, facilitate regularly clean activated carbon filter plate 65;

[0046] Further, as Figure 1 As shown: the top of the purification tank 61 is fixedly connected with the suction pipe 10, and the bottom of the purification tank 61 is fixedly connected with the exhaust pipe 11. The suction pipe 10 is arranged to suck the gas into the purification tank 61, and then the purified air is discharged through the exhaust pipe 11.

[0047] The working principle of the utility model provides: first, the fan arranged in the suction pipe 10 is used to adsorb the external air into the purification tank 61, then the motor is started to drive the fixed rod 63 to rotate, the fixed rod 63 drives the blade 64 to rotate, the oil droplets in the gas are separated from the gas by centrifugal force, and then the activated carbon filter plate 65 is used for filtering, the purified gas is discharged above the wafer, so that the gas can pass through the adsorption structure in a more uniform and stable manner, and the wafer is provided with uniform adsorption force, the purified gas is discharged from the exhaust pipe 11, then the electromagnetic valve 84 is opened, the gas in the compressed air bottle 82 is filled into the air inlet 44 from the air inlet pipe 83, and then the gas is sprayed out from the air outlet 43 through the air channel 45 to form a high-speed airflow in the gap between the wafer and the air outlet 43, in this gap, the gas close to the surface of the inner suction disc 42 and the wafer surface flows at a relatively slow speed due to the viscous effect, while the gas in the middle part of the gap flows at a relatively fast speed, thereby forming a difference in flow rate distribution, the external atmospheric pressure acts on the upper surface of the wafer, and due to the pressure difference between the wafer and the inner suction disc 42, the pressure below is less than the atmospheric pressure above, thereby forming an upward force between the wafer and the inner suction disc 42, which is the force for adsorbing the wafer, so that the wafer can be stably adsorbed on the inner suction disc 42, and during the process, the knob 91 is twisted to drive the supporting table 3 to rotate, so that the adsorption force on the surface of the workpiece is more uniform, and the quick release assembly 7 can be used to open the bottom of the purification tank 61, so that the activated carbon filter plate 65 can be cleaned regularly.

[0048] The above merely describes preferred embodiments of the present application and is not intended to limit the present application in any form, although the present application has been disclosed as above with preferred embodiments, however, it is not intended to limit the present application, any person skilled in the art without departing from the technical scheme of the present application can make some changes or modifications to the above-mentioned technical content for equivalent embodiments, the implementation schemes in the above-mentioned embodiments can be further combined or replaced, as long as it does not deviate from the technical scheme of the present application, any simple modification, equivalent change and modification made to the above-mentioned embodiments according to the technical essence of the present application still belongs to the scope of the present application.

Claims

1. A wafer chucking structure for an ultraviolet lithography machine, characterized by, Include: Base (1), the support (2) arranged on the top of the base (1), the receiving table (3) arranged on the top of the support (2) and the wafer body (5) arranged on the top of the receiving table (3); The adsorption assembly (4) is arranged on the top of the receiving table (3), the adsorption assembly (4) includes the outer suction disc (41) arranged on the top of the receiving table (3), the inner suction disc (42) arranged on the top of the outer suction disc (41), the gas outlet (43) arranged on the top of the inner suction disc (42), the gas inlet (44) arranged on the outer suction disc (41), and the air duct (45) arranged in the outer suction disc (41); The purification assembly (6) is arranged on the top of the wafer body (5), the purification assembly (6) includes the purification box (61) arranged on the top of the wafer body (5), the fixed rod (63) rotatably connected in the purification box (61), the blade (64) fixedly connected on the fixed rod (63), and the activated carbon filter plate (65) arranged in the purification box (61), wherein the activated carbon filter plate (65) is located at the bottom of the blade (64).

2. The wafer chucking structure for an ultraviolet photolithography machine according to claim 1, wherein: The shell (62) is arranged on the top of the purification box (61), the motor is arranged in the shell (62), and the fixed rod (63) is fixedly connected with the output end of the motor.

3. The wafer chucking structure for the ultraviolet photolithography machine according to claim 1, wherein: The air supply assembly (8) is arranged on the base (1), the air supply assembly (8) includes the extension plate (81), the compressed air bottle (82) is arranged on the top of the extension plate (81), the air inlet pipe (83) is fixedly and communicatively connected to the top of the compressed air bottle (82), one end of the air inlet pipe (83) away from the compressed air bottle (82) is fixedly and communicatively connected in the gas inlet (44), and the electromagnetic valve (84) is arranged on the air inlet pipe (83).

4. The wafer chucking structure for an ultraviolet photolithography machine according to claim 1, wherein: The top of the support (2) is rotatably connected with the bottom of the receiving table (3), the rotating assembly (9) is arranged on the support (2), the rotating assembly (9) includes the knob (91), the connecting shaft (92) is fixedly connected on the knob (91), the top of the connecting shaft (92) is fixedly connected with the bottom of the receiving table (3), and the connecting shaft (92) is sleeved on the support (2).

5. The wafer chucking structure for an ultraviolet photolithography machine according to claim 1, wherein: The quick release assembly (7) is arranged on the bottom of the purification box (61), the quick release assembly (7) includes the cover plate (71), the clamping grooves (72) are arranged on the top of the cover plate (71), the magnetic attraction blocks (73) are arranged in the clamping grooves (72), the magnetic attraction strips are arranged on the side of the bottom of the purification box (61) corresponding to the magnetic attraction blocks (73), and the magnetic attraction blocks (73) are magnetically connected with the magnetic attraction strips.

6. The wafer chucking structure for an ultraviolet photolithography machine according to claim 1, wherein: The air suction pipe (10) is fixedly and communicatively connected to the top of the purification box (61), and the air exhaust pipe (11) is fixedly and communicatively connected to the bottom of the purification box (61).

7. The wafer chucking structure for an ultraviolet photolithography machine according to claim 1, wherein: The air duct (45) is S-shapedly arranged in the outer suction disc (41).

Images