Silicon wafer texturing device and silicon wafer texturing equipment
By using a slitting mechanism and an air blowing structure to separate adjacent silicon wafers in a silicon wafer texturing device, the problem of adhesion during the wet texturing process of large-size silicon wafers is solved, achieving efficient forming and high cleanliness of double-sided texturing, and improving texturing efficiency and loading capacity.
Patent Information
- Application Number
- CN202422810418.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-18
- Publication Date
- 2025-12-05
- Estimated Expiration
- 2034-11-18
AI Technical Summary
In the wet texturing process of large-size and thin silicon wafers, adjacent silicon wafers are prone to sticking together, which prevents the adhesive surfaces from making sufficient contact and reacting, affecting the texturing surface formation and cleanliness. At the same time, increasing the basket tooth pitch reduces the loading capacity and affects the texturing efficiency.
The wafer slicing mechanism uses an air pump and air blowing structure to form air holes on the outer periphery of the silicon wafer, separating adjacent silicon wafers, ensuring double-sided contact, reducing spacing requirements, and increasing loading capacity.
It achieves efficient forming and high cleanliness of double-sided textured silicon wafers, while improving texturing efficiency and basket loading capacity, and avoiding damage from hard contact.
Smart Images
Figure CN223639624U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to the technical field of silicon wafer production, especially to a silicon wafer texturing device and a silicon wafer texturing equipment. BACKGROUND
[0002] With the continuous promotion of photovoltaic industry cost reduction and efficiency improvement, the size of silicon wafers shows a trend of large size and thinning. However, with the increase in size and thinning of silicon wafers, in the wet process link, the silicon wafers need to be soaked in the chemical solution, which leads to the sticking of adjacent two silicon wafers, thereby causing the sticking surface of the silicon wafer to be unable to form a textured surface. In the related art, although the above problem can be avoided by increasing the distance between the adjacent two silicon wafers, such as increasing the pitch of the wafer basket loaded with silicon wafers, the loading capacity of the wafer basket will be reduced, which directly affects the texturing efficiency of the silicon wafers. Therefore, there is room for improvement. SUMMARY
[0003] The utility model discloses a first aspect of a kind of silicon wafer texturing device, the silicon wafer texturing device has the advantages of guaranteeing the double side textured surface formation of silicon wafer while improving texturing efficiency.
[0004] According to the silicon wafer texturing device of the first aspect embodiment of the utility model, including: texturing groove body, form texturing space, multiple silicon wafers are suitable for being arranged in the texturing space along the first direction, the first direction is parallel to the axial direction of the silicon wafer;Chip separation mechanism, the chip separation mechanism is used to separate any adjacent two silicon wafers in the first direction in the texturing process of the silicon wafer.
[0005] According to the silicon wafer texturing device of the first aspect embodiment of the utility model, any two adjacent silicon wafers in the first direction can be prevented from sticking by the chip separation mechanism, so that the two sides of the silicon wafer can be fully contacted with the chemical solution in the texturing groove, to ensure the double side textured surface formation of the silicon wafer and high cleanliness, in addition, the distance between the adjacent two silicon wafers can be preferably reduced, so as to reduce the distance between the adjacent two silicon wafers, thereby the loading capacity of the silicon wafer in the texturing space can be improved in a single texturing, so as to improve the texturing efficiency of the silicon wafer texturing device.
[0006] According to some embodiments of the utility model, the chip separation mechanism includes a gas pump and a gas blowing structure in communication with the gas pump, the gas blowing structure is located on the outer circumferential side of the silicon wafer and forms a gas blowing hole, and each gas blowing hole corresponds to at least one gas blowing hole.
[0007] According to some embodiments of the utility model, the center axis of at least one of the gas blowing holes corresponding to each gas blowing area extends along the radial direction of the silicon wafer.
[0008] According to some embodiments of the present application, a plurality of groups of air blowing holes are formed on the air blowing structure and arranged along the first direction, and each group of air blowing holes corresponds to one of the air blowing regions.
[0009] According to some embodiments of the present application, each air blowing region corresponds to at least one pair of air blowing holes arranged along a third direction, and the third direction is perpendicular to the axial direction of the silicon wafer.
[0010] According to some embodiments of the present application, the air blowing structure comprises at least one air blowing pipe extending along the first direction, the air blowing pipe is in communication with the air pump and is formed with a plurality of air blowing holes arranged along the first direction, and the plurality of air blowing holes on the air blowing pipe correspond to the plurality of air blowing regions.
[0011] According to some embodiments of the present application, the air blowing pipe comprises at least a first air blowing pipe, a second air blowing pipe and at least one third air blowing pipe, the first air blowing pipe and the second air blowing pipe are arranged along the third direction, the third air blowing pipe is located between the first air blowing pipe and the second air blowing pipe, and the first air blowing pipe and the third air blowing pipe and the second air blowing pipe and the third air blowing pipe are formed with a wafer space, the silicon wafer is adapted to be placed in the wafer space, and the first air blowing pipe and the second air blowing pipe are formed with the air blowing holes on the side facing the third air blowing pipe, and the third air blowing pipe is formed with the air blowing holes on both sides.
[0012] According to some embodiments of the present application, the air blowing pipe is a plastic part.
[0013] According to some embodiments of the present application, the air blowing pipe is detachably connected with the etching groove body.
[0014] According to some embodiments of the present application, the etching groove body is provided with a pipe clamp, the pipe clamp is formed with an open clamping groove, and the air blowing pipe is clamped in the clamping groove.
[0015] According to some embodiments of the present application, the wafer separating mechanism further comprises a throttle valve connected between the air pump and the air blowing structure, and the throttle valve is used for adjusting the air flow of the air blowing holes.
[0016] The present application provides a silicon wafer etching device.
[0017] The silicon wafer etching device according to the second aspect of the present application.
[0018] According to the silicon wafer texturing device provided by the embodiment of the present application, the slicing mechanism can prevent the two adjacent silicon wafers from being pasted in the first direction, so that the two surfaces of the silicon wafer can be fully contacted with the liquid medicine in the texturing groove, the double-textured surface forming and high cleanliness of the silicon wafer are ensured, in addition, the requirement on the distance between the two adjacent silicon wafers can be reduced, the distance between the two adjacent silicon wafers is reduced, the silicon wafer loading capacity of the texturing space in one-time texturing is improved, and the texturing efficiency of the silicon wafer texturing device is improved.
[0019] Additional aspects and advantages of the present application will be given in part in the following description, become apparent from the following description, or be understood by practice of the present application. BRIEF DESCRIPTION OF DRAWINGS
[0020] Figure 1 is a partial structure schematic view of one side of the silicon wafer texturing device in the first direction according to the embodiment of the present application;
[0021] Figure 2 is a partial structure schematic view of one side of the silicon wafer texturing device in the third direction according to the embodiment of the present application;
[0022] Figure 3 is Figure 2 an enlarged view of the A area in figure 1;
[0023] Figure 4 is Figure 3 an enlarged view of the B area in figure 1;
[0024] Figure 5 is a sectional view of the first air blowing pipe of the silicon wafer texturing device according to the embodiment of the present application;
[0025] Figure 6 is a sectional view of the second air blowing pipe of the silicon wafer texturing device according to the embodiment of the present application;
[0026] Figure 7 is a sectional view of the third air blowing pipe of the silicon wafer texturing device according to the embodiment of the present application.
[0027] REFERENCE SIGNS:
[0028] 100, silicon wafer texturing device; 10, silicon wafer; 1, texturing groove body; 11, texturing space; 2, air blowing pipe; 2a, first air blowing pipe; 2b, second air blowing pipe; 2c, third air blowing pipe; 21, air blowing hole; 3, flower basket; 4, pipe clamp; e1, first direction; e2, second direction; e3, third direction. DETAILED DESCRIPTION
[0029] The embodiments of this utility model are described in detail below. Examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain this utility model, and should not be construed as limiting this utility model.
[0030] The following disclosure provides numerous different embodiments or examples for implementing various structures of the present invention. To simplify the disclosure, specific examples of components and arrangements are described below. These are merely examples and are not intended to limit the scope of the invention. Furthermore, reference numerals and / or letters may be repeated in different examples. Such repetition is for simplification and clarity and does not in itself indicate a relationship between the various embodiments and / or arrangements discussed. In addition, examples of various specific processes and materials are provided in this invention; however, those skilled in the art will recognize the applicability of other processes and / or the use of other materials.
[0031] The silicon wafer texturing apparatus 100 according to a first aspect embodiment of the present invention is described below with reference to the accompanying drawings.
[0032] like Figures 1 to 6 As shown, the silicon wafer texturing apparatus 100 according to a first aspect embodiment of the present invention includes: a texturing tank 1 and a wafer slitting mechanism. The texturing tank 1 forms a texturing space 11, and a plurality of silicon wafers 10 are adapted to be arranged in the texturing space 11 along a first direction e1, the first direction e1 being parallel to the axial direction of the silicon wafers 10. That is, the silicon wafers 10 undergo a texturing process within the texturing space 11. Specifically, in the wet texturing process, a texturing solution is injected into the texturing space 11, and the silicon wafers 10 are immersed in the texturing solution to achieve texturing.
[0033] However, in the wet texturing process of related technologies, the influence of water molecules will cause two adjacent silicon wafers to stick together. On the one hand, this will prevent the bonding surfaces of the two silicon wafers from fully contacting and reacting with the chemical solution to form a monocrystalline texturing surface. On the other hand, the dirt on the bonding surfaces of the two silicon wafers cannot be cleaned, and the cleanliness of the silicon wafers cannot be guaranteed.
[0034] In the present application, the slicing mechanism is used to separate any two adjacent silicon wafers 10 in the first direction e1 during the texturing process of the silicon wafers 10. That is, the slicing mechanism can prevent the sticking of any two adjacent silicon wafers 10 in the first direction e1, so that both sides of the silicon wafers 10 can be in full contact with the chemical solution in the texturing groove, to ensure the formation of double-sided texture of the silicon wafers 10 and high cleanliness. In addition, the distance requirement between the two adjacent silicon wafers 10 can be reduced to reduce the spacing between the two adjacent silicon wafers 10, thereby increasing the loading capacity of the silicon wafers 10 in the texturing space 11 in a single texturing process, and improving the texturing efficiency of the silicon wafer texturing device 100. As the silicon wafers 10 are usually loaded and placed into the texturing space 11 by the flower basket 3, in order to prevent the sticking between the two adjacent silicon wafers 10, the pitch of the flower basket 3 needs to be increased, for example, 6.3mm. The larger the pitch, the farther the distance between the two adjacent silicon wafers 10, and the less likely to stick, but the loading capacity of the flower basket 3 is reduced. By using the slicing mechanism, the pitch of the flower basket 3 can be reduced, for example, 5.44mm, while ensuring that the two adjacent silicon wafers 10 do not stick, thereby increasing the loading capacity of the flower basket 3.
[0035] According to the silicon wafer texturing device 100 of the first aspect of the present application, the slicing mechanism can prevent the sticking of any two adjacent silicon wafers 10 in the first direction e1, so that both sides of the silicon wafers 10 can be in full contact with the chemical solution in the texturing groove, to ensure the formation of double-sided texture of the silicon wafers 10 and high cleanliness. In addition, the distance requirement between the two adjacent silicon wafers 10 can be reduced to reduce the spacing between the two adjacent silicon wafers 10, thereby increasing the loading capacity of the silicon wafers 10 in the texturing space 11 in a single texturing process, and improving the texturing efficiency of the silicon wafer texturing device 100.
[0036] According to some embodiments of the present application, the slicing mechanism includes a gas pump and a blowing structure in communication with the gas pump. The blowing structure is located on the outer peripheral side of the silicon wafer 10 and is formed with a blowing hole 21. Each blowing area between any two adjacent silicon wafers 10 in the first direction e1 constitutes at least one blowing hole 21. The blowing hole 21 is used to deliver gas flow to the blowing area. That is, the gas pump is used to deliver gas flow to the blowing structure. The gas entering the blowing structure can be blown to the area between the two adjacent silicon wafers 10 in the first direction e1 through the blowing hole 21, so that the two adjacent silicon wafers 10 can be separated by blowing, and the two adjacent silicon wafers 10 can be kept in a spaced apart state during the texturing process. The two adjacent silicon wafers 10 are separated by blowing, which is low in cost and can avoid hard contact with the texturing surface of the silicon wafer 10, so that the double-sided texture of the silicon wafer 10 can be formed while avoiding damage to the texturing surface of the silicon wafer 10 caused by hard contact.
[0037] According to some embodiments of the utility model, the center axis of at least one of the blowing holes 21 corresponding to each blowing area extends along the radial direction of the silicon wafer 10. That is, each blowing area corresponds to at least one blowing hole 21 blowing towards the center position of the silicon wafer 10. It can be understood that the silicon wafer 10 is usually in the shape of a circular sheet, and after the silicon wafer 10 is placed in the flower basket 3, the outer peripheral edge of the silicon wafer 10 is limited by the flower basket 3, and the center position of the silicon wafer 10 cannot be effectively supported, which causes the center position of the silicon wafer 10 to be easily deformed, that is, the center position of the adjacent two silicon wafers 10 is more easily pasted. Therefore, by aligning the blowing holes 21 to blow at the position of the center of the silicon wafer 10, the area where the center position of the adjacent two silicon wafers 10 is easily deformed and pasted can be blown open, so as to improve the slicing effect of the slicing mechanism.
[0038] According to some embodiments of the utility model, a plurality of groups of blowing holes 21 are formed on the blowing structure and are arranged at intervals along the first direction e1, and the plurality of groups of blowing holes 21 correspond one-to-one to the plurality of blowing areas. Each group of blowing holes 21 includes a plurality of blowing holes 21 arranged at intervals along the second direction e2, and the second direction e2 is perpendicular to the first direction e1. That is, each blowing area corresponds to a plurality of blowing holes 21 arranged along the second direction e2, so that the plurality of blowing holes 21 of each group of blowing holes 21 can simultaneously blow air to the blowing area from different positions on the second direction e2, so as to improve the area covered by the airflow of the slicing mechanism on the second direction e2. It can be understood that the more blowing positions towards the blowing area, the better the separation effect of the corresponding adjacent two silicon wafers 10 by the group of blowing holes 21. Thus, it can be avoided that the silicon wafers 10 are pasted at any position on the second direction e2, so as to improve the slicing efficiency and effect of the slicing mechanism on the adjacent two silicon wafers 10.
[0039] It should be noted that the number of each group of blowing holes 21 can be flexibly adjusted according to the specific size of the silicon wafer 10, such as a larger size of the silicon wafer 10 can be provided with more blowing holes 21, and the like, so as to ensure that the adjacent two silicon wafers 10 will not be pasted at any position on the second direction e2. In one specific example, the second direction e2 is the up-down direction, and each group of blowing holes 21 is provided with three blowing holes 21 arranged at intervals along the up-down direction, wherein the blowing hole 21 located in the middle is opposite to the position of the center of the silicon wafer 10, and the two blowing holes 21 located on the upper and lower sides are symmetrically arranged relative to the middle blowing hole 21, so as to ensure the uniform distribution of the plurality of blowing holes 21 of the same group of blowing holes 21.
[0040] According to some embodiments of the utility model, each blowing area corresponds to at least a pair of blowing holes 21 arranged oppositely along the third direction e3, and the third direction e3 is perpendicular to the axial direction of the silicon wafer 10. That is to say, each blowing area has at least one blowing hole 21 on each of the opposite sides in the third direction e3, and the blowing holes 21 on the opposite sides of the blowing area transport the airflow towards each other to separate the adjacent two silicon wafers 10. Thus, in the third direction e3, the airflow blown by the blowing holes 21 on the opposite sides of the blowing area can better cover the blowing area, thereby avoiding the adjacent two silicon wafers 10 from being pasted due to the dead angle of the airflow transport, and thus the slicing effect of the slicing mechanism can be improved. In addition, the airflow in each blowing hole 21 only needs to be transported to the center position of the blowing area in the third direction e3, thereby reducing the requirement for the gas pressure in the blowing pipe 2 to reduce the power consumption of the gas pump.
[0041] According to some embodiments of the utility model, the blowing structure at least includes a blowing pipe 2 extending along the first direction e1, the blowing pipe 2 is in communication with the gas pump and is formed with a plurality of blowing holes 21 arranged at intervals along the first direction e1, and the plurality of blowing holes 21 on the blowing pipe 2 correspond to the plurality of blowing areas one by one. That is to say, after the gas pump transports the airflow into the blowing pipe 2, the blowing pipe 2 can simultaneously transport the airflow to the plurality of blowing areas between the plurality of silicon wafers 10 through the plurality of blowing holes 21 arranged, thereby ensuring the simultaneous slicing of the plurality of silicon wafers 10 while simplifying the blowing structure.
[0042] In one specific example, the quick connector is a PVDF connector.
[0043] According to some embodiments of the utility model, the blowing pipe 2 is provided with a plurality of blowing pipes and at least includes a first blowing pipe 2a, a second blowing pipe 2b and at least one third blowing pipe 2c, the first blowing pipe 2a and the second blowing pipe 2b are arranged at intervals in the third direction e3, the third blowing pipe 2c is located between the first blowing pipe 2a and the second blowing pipe 2b, the first blowing pipe 2a and the third blowing pipe 2c and the second blowing pipe 2b and the third blowing pipe 2c are both formed with a slicing space, the silicon wafer 10 is adapted to be placed in the slicing space, the side of the first blowing pipe 2a and the second blowing pipe 2b facing the third blowing pipe 2c is formed with a blowing hole 21, and the two sides of the third blowing pipe 2c are both formed with a blowing hole 21.
[0044] That is to say, in the third direction e3, the third blowing pipe 2c located between the two side baskets 3 is provided with blowing holes 21 capable of conveying air flow to the two side baskets 3, that is, the blowing holes 21 conveying air flow to the silicon wafers 10 on both sides of the third direction e3 are integrated on the same third blowing pipe 2c. Thus, while ensuring that the third blowing pipe 2c conveys air flow to the two side silicon wafers 10, the number of third blowing pipes 2c can be saved, thereby reducing the space occupied by the third blowing pipe 2c and reducing the use cost. In addition, it can be understood that the first blowing pipe 2a and the second blowing pipe 2b have the same structure, and only the direction of the blowing hole 21 of the first blowing pipe 2a needs to be adjusted during installation, thereby reducing the types of parts.
[0045] It should be noted that when the third blowing pipe 2c is provided with multiple third blowing pipes 2c, the multiple third blowing pipes 2c are arranged in the second direction e2 between the first blowing pipe 2a and the second blowing pipe 2b, and a slicing space for placing the basket 3 is formed between any two adjacent second blowing pipes 2b.
[0046] In a specific example, the first blowing pipe 2a, the second blowing pipe 2b and the third blowing pipe 2c are provided with multiple blowing pipes arranged in the second direction e2, thereby increasing the positions of the blowing areas conveying air flow.
[0047] According to some embodiments of the present application, the blowing pipe 2 is a plastic part. The plastic has the advantages of corrosion resistance, light weight and low use cost, thereby improving the corrosion resistance of the blowing pipe 2 and reducing the weight and production cost of the blowing pipe 2. In a specific example, the blowing pipe 2 is a PFA (Polyfluoroalkoxy: tetrafluoroethylene-perfluoroalkoxy vinyl ether copolymer) part.
[0048] According to some embodiments of the present application, the blowing pipe 2 is detachably connected with the texturing groove body 1. Therefore, when the blowing pipe 2 is damaged or the blowing hole 21 is blocked, the blowing pipe 2 can be detached from the texturing groove body 1 for cleaning or replacement, thereby reducing the difficulty of later maintenance or replacement of the blowing pipe 2 to reduce the use cost of the slicing mechanism.
[0049] According to some embodiments of the present application, the texturing groove body 1 is provided with a pipe clamp 4, the pipe clamp 4 is formed with an open clamping groove, and the blowing pipe 2 is clamped in the clamping groove. That is, the blowing pipe 2 can be clamped and connected with the texturing groove body 1 through the pipe clamp 4. Therefore, while realizing the detachable connection of the blowing pipe 2 and the texturing groove body 1, the connection structure of the blowing pipe 2 and the texturing groove body 1 can be simplified, thereby reducing the installation and disassembly difficulty of the blowing pipe 2.
[0050] According to some embodiments of the utility model, the slicing mechanism further comprises a throttle valve connected between the air pump and the air blowing structure, and the throttle valve is used for adjusting the air flow of the air blowing hole 21. That is to say, when the size of the silicon wafer 10 is large, the air flow of the air blowing hole 21 can be increased through the throttle valve, so as to increase the flow distance of the air flow output by the air blowing hole 21 to ensure the slicing effect; when the size of the silicon wafer 10 is small, the air flow of the air blowing hole 21 can be reduced through the throttle valve to reduce the power consumption of the air pump. Therefore, the air flow of the air blowing hole 21 can be flexibly controlled through the throttle valve according to the slicing requirement, so as to improve the application range of the slicing mechanism.
[0051] The silicon wafer texturing equipment according to the second aspect of the utility model is described below with reference to the drawings.
[0052] The silicon wafer texturing equipment according to the second aspect of the utility model comprises a silicon wafer texturing device 100.
[0053] The silicon wafer texturing equipment according to the second aspect of the utility model can prevent any two adjacent silicon wafers 10 from being pasted in the first direction e1 through the slicing mechanism, so as to ensure that both sides of the silicon wafer 10 can be fully contacted with the chemical liquid in the texturing groove, to ensure the formation of the double-sided texture of the silicon wafer 10 and high cleanliness, and in addition, the requirement for the distance between the two adjacent silicon wafers 10 can be preferably reduced to reduce the spacing between the two adjacent silicon wafers 10, so as to improve the loading amount of the silicon wafer 10 for single texturing of the texturing space 11, to improve the texturing efficiency of the silicon wafer texturing device 100.
[0054] The silicon wafer texturing equipment can further comprise a silicon wafer slicing device and other devices in the silicon wafer preparation process, which are not specifically limited here.
[0055] In the utility model, unless otherwise explicitly specified and limited, the terms such as "mounting", "connection", "connection", "fixing" and the like should be understood in a broad sense, for example, it can be fixedly connected, or it can be detachably connected, or it can be integrated; it can be directly connected, or it can be indirectly connected through an intermediate medium; it can be the communication or interaction relationship between two elements. For ordinary skilled in the art, the specific meaning of the above terms in the utility model can be understood according to the specific circumstances.
[0056] In the description of the present specification, the description referring to the terms "one embodiment", "some embodiments", "an example", "a specific example", or "some examples" and the like means that the specific features, structures, materials or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present application. In the present specification, the illustrative description of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any appropriate manner in any one or more embodiments or examples. Furthermore, the person skilled in the art can combine and combine the different embodiments or examples described in the present specification and the features of the different embodiments or examples, without mutual contradiction.
[0057] Although the embodiments of the present application have been shown and described, those skilled in the art can understand that various changes, modifications, replacements and variations can be made to these embodiments without departing from the principles and purposes of the present application, and the scope of the present application is defined by the claims and their equivalents.
Claims
1. A silicon wafer texturing apparatus, characterized in that, include: A texturing tank is formed with a texturing space, and multiple silicon wafers are adapted to be arranged in the texturing space along a first direction, which is parallel to the axial direction of the silicon wafers. The slitting mechanism is used to separate any two adjacent silicon wafers in the first direction during the texturing process of the silicon wafers. The slitting mechanism includes an air pump and an air blowing structure connected to the air pump. The air blowing structure is located on the outer periphery of the silicon wafer and has air blowing holes. An air blowing area is formed between any two adjacent silicon wafers in the first direction. Each air blowing area corresponds to at least one air blowing hole. The air blowing hole is used to deliver airflow toward the air blowing area.
2. The silicon wafer texturing apparatus of claim 1, wherein The central axis of at least one of the air holes corresponding to each air blowing area extends radially along the silicon wafer.
3. The silicon wafer texturing apparatus of claim 1, wherein The air blowing structure has multiple sets of air blowing holes arranged at intervals along the first direction. Each set of air blowing holes corresponds to a plurality of air blowing areas. Each set of air blowing holes includes multiple air blowing holes arranged at intervals along a second direction, which is perpendicular to the first direction.
4. The silicon wafer texturing apparatus of claim 1, wherein Each of the air-blowing regions corresponds to at least a pair of air-blowing holes disposed opposite each other along a third direction, which is perpendicular to the axial direction of the silicon wafer.
5. The silicon wafer texturing apparatus of claim 1, wherein The air blowing structure includes at least one air blowing pipe extending along the first direction. The air blowing pipe is connected to the air pump and has a plurality of air blowing holes arranged at intervals along the first direction. The plurality of air blowing holes on the air blowing pipe correspond one-to-one with a plurality of air blowing areas.
6. The silicon wafer texturing apparatus of claim 5, wherein The air blowing pipe is provided with multiple, including at least a first air blowing pipe, a second air blowing pipe and at least one third air blowing pipe. In the third direction, the first air blowing pipe and the second air blowing pipe are arranged at intervals, and the third air blowing pipe is located between the first air blowing pipe and the second air blowing pipe. A slicing space is formed between the first air blowing pipe and the third air blowing pipe, and between the second air blowing pipe and the third air blowing pipe. The silicon wafer is adapted to be placed in the slicing space. The air blowing hole is formed on the side of the first air blowing pipe and the second air blowing pipe facing the third air blowing pipe, and the air blowing hole is formed on both sides of the third air blowing pipe.
7. The silicon wafer texturing apparatus of claim 5, wherein The air blowing tube is made of plastic.
8. The silicon wafer texturing apparatus of claim 5, wherein, The air blowing pipe is detachably connected to the flocking tank.
9. The silicon wafer texturing apparatus of claim 8, wherein, The fabrication tank is equipped with a pipe clamp, which forms an open snap-fit groove, and the air blowing pipe is snapped into the snap-fit groove.
10. The silicon wafer texturing apparatus of claim 1, wherein The segmentation mechanism also includes a throttle valve connected between the air pump and the air blowing structure, the throttle valve being used to adjust the air flow rate of the air blowing orifice.
11. A silicon wafer texturing apparatus, characterized by, include: The silicon wafer texturing apparatus according to any one of claims 1-10.