Discharging device of semiconductor processing equipment

Abstract

The utility model relates to the technical field of semiconductor processing, in particular to a discharging device of semiconductor processing equipment, which comprises a base, the top end of the base is fixedly connected with side plates which are symmetrically arranged, a transmission belt is arranged between the side plates, and the top end of the base is fixedly connected with a supporting leg positioned on the right side of the transmission belt. According to the device, through the arrangement of the fixing plate, the guide groove, the supporting rods, the steel balls, the fixing shell, the collecting box, the collecting groove, the first hydraulic rod, the limiting plate, the electrostatic chuck and other components, a semiconductor plate on the guide plate can be adsorbed through the arranged electrostatic chuck, and after adsorption is completed, the semiconductor plate can be conveniently collected. The second hydraulic rod can drive the push plate and the guide plate to move, the guide plate is collected to the position below the conveying belt, then the first hydraulic rod drives the limiting plate, the electrostatic chuck and the semiconductor plate to move downwards, and the limiting plate can enter the limiting groove along with descending of the limiting plate.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of semiconductor processing, specifically to a kind of unloading device of semiconductor processing equipment. BACKGROUND

[0002] Semiconductor plate can also refer to semiconductor material itself, semiconductor refers to the electrical conductivity between conductor and insulator at room temperature, its conductivity can be controlled, range can be from insulator to conductor, common semiconductor materials include silicon, germanium and gallium arsenide, among which silicon is the most common and most influential material, semiconductor has wide application in integrated circuit, consumer electronics, communication system, photovoltaic power generation and other fields.

[0003] After semiconductor processing is finished, semiconductor plate needs to be unloaded, but the existing unloading device is not convenient for subsequent handling or transportation after unloading is finished;And in the adsorption process of unloading, the adsorption structure needs to move to adjust the position of semiconductor plate, compared with vertical lifting, the stability is poor in left and right movement, there is the risk of falling off, therefore, aiming at the above problems, a kind of unloading device of semiconductor processing equipment is provided. UTILITY MODEL CONTENT

[0004] The utility model aims at providing a kind of unloading device of semiconductor processing equipment to solve the problems raised in the above background.

[0005] To achieve the above object, the utility model provides the following technical scheme:

[0006] A kind of unloading device of semiconductor processing equipment, including base, the top of the base is fixedly connected with the side plate of symmetry arrangement, transmission belt is equipped between the side plate, the top of the base is fixedly connected with the support leg in transmission belt right side, the top of the support leg is fixedly connected with fixed plate, the top of the fixed plate is equipped with guide slot, the inside of the guide slot is slidably connected with support rod, the bottom of the support rod is equipped with the steel ball of guide slot rolling connection, the bottom of the fixed plate is fixedly connected with motor, the output of the motor is connected with fixed shell penetrating fixed plate, the inside of the fixed shell is equipped with collection box, the top of the collection box is equipped with collection groove, the top of the collection box is equipped with the limiting slot of collection groove outside, the top of the fixed plate is fixedly connected with the fixed rod of symmetry arrangement, the top of the fixed rod is fixedly connected with support plate, the bottom of the support plate is fixedly connected with the first hydraulic rod of symmetry arrangement, the bottom of the first hydraulic rod is fixedly connected with limiting plate, the bottom of the limiting plate is fixedly connected with the electrostatic chuck of symmetry arrangement.

[0007] Preferably, one side of the base is fixedly connected with a second hydraulic rod located below the conveying belt, one end of the second hydraulic rod away from the base is fixedly connected with a push plate, and the side of the push plate away from the second hydraulic rod is fixedly connected with a guide plate.

[0008] Preferably, the number of the support rods is four, and the top end of each support rod is fixedly connected with the bottom end of the fixed plate.

[0009] Preferably, the collecting box, the collecting groove and the four limiting grooves form a group, and the collecting box, the collecting groove and the four limiting grooves are four in total and are symmetrically arranged in the interior of the fixed shell.

[0010] Preferably, the number of the second hydraulic rods is four, and the second hydraulic rods are symmetrically arranged between the base and the push plate.

[0011] Compared with the prior art, the utility model has the advantages that:

[0012] 1、In the utility model, the semiconductor plate on the guide plate can be adsorbed by the electrostatic chuck, the second hydraulic rod drives the push plate and the guide plate to move after the semiconductor plate is adsorbed, the guide plate is received below the conveying belt, then the limiting plate, the electrostatic chuck and the semiconductor plate are driven to move downward by the first hydraulic rod, the limiting plate enters the limiting groove under the action of the limiting plate and the limiting groove, the track of the electrostatic chuck descending can be guided under the action of the limiting plate and the limiting groove, the stability of falling is guaranteed, finally the plate material is placed in the collecting groove, the semiconductor plate is collected by the collecting box, when the discharging is completed and needs to be transported, the collecting box is directly taken out from the fixed shell, under the action of the collecting box, the semiconductor plate is more convenient to carry or transport, the semiconductor plate can be protected by the collecting box, thereby solving the problem that the semiconductor plate needs to be discharged after the semiconductor processing is completed, but the subsequent carrying or transporting is inconvenient after the discharging of the existing discharging device is completed.

[0013] 2. The utility model discloses a fixed plate, guide groove, motor, second hydraulic rod, push board and guide plate and other components are set up, after placing a group of semiconductor plate, first hydraulic rod drives the position reset of limiting board and electrostatic chuck, second hydraulic rod promotes push board and guide plate to move, and guide plate is re-extended to the below of electrostatic chuck, the motor can drive fixed plate to rotate under the support of support rod, avoids the deviation of fixed plate when rotating through guide groove and support rod, damages the rotating shaft of motor, the resistance when fixed plate rotates can be reduced through the steel ball set up at the bottom of support rod, reduces power consumption, through the output end of motor drives fixed plate, fixed shell and collection box to rotate one hundred and eighty, after restarting the conveyer belt, the conveyer belt continues to transport semiconductor plate and moves to guide plate, through the gradient of guide plate, under the action of gravity, semiconductor plate will slide to the below of electrostatic chuck, need not adsorption structure to move left and right, can stably unload semiconductor plate, thereby solve the adsorption process of unloading, and adsorption structure needs to move and adjust the position of semiconductor plate, compared with vertical lifting, the stability is poor in left and right movement process, and there is the risk of falling off. BRIEF DESCRIPTION OF DRAWINGS

[0014] Figure 1 It is whole structure schematic diagram of the utility model;

[0015] Figure 2 It is guide plate storage state structure schematic diagram of the utility model;

[0016] Figure 3 It is push board detailed structure schematic diagram of the utility model;

[0017] Figure 4 It is collection box side view cross section structure schematic diagram of the utility model;

[0018] Figure 5 It is collection box detailed structure schematic diagram of the utility model.

[0019] In the drawing: 1, base;2, side plate;3, conveyer belt;4, support leg;5, fixed plate;6, guide groove;7, support rod;8, steel ball;9, fixed shell;10, collection box;11, collection groove;12, limiting groove;13, fixed rod;14, support plate;15, first hydraulic rod;16, limiting board;17, electrostatic chuck;18, second hydraulic rod;19, push board;20, guide plate;21, motor. DETAILED DESCRIPTION

[0020] Clearly, the examples described are merely a part of the embodiments of the present application, but not all the embodiments. Based on the embodiments of the present application, all the other embodiments obtained by those skilled in the art without creative labor fall within the scope of the present application.

[0021] It is to be noted that the terms used herein are merely for the purpose of describing specific embodiments and are not intended to limit the exemplary embodiments according to the present application. As used herein, the singular form is intended to include the plural form as well, unless the context clearly indicates otherwise, and it is further understood that the terms "comprise" and / or "include" when used in this specification, specify the presence of features, steps, operations, devices, components and / or combinations thereof.

[0022] In addition, it should be noted that the use of the terms "first", "second" and the like does not limit the corresponding parts, but is merely used to distinguish the corresponding parts for convenience, and unless otherwise stated, the above terms have no special meaning, and therefore cannot be understood as limiting the scope of protection of the present application.

[0023] Please refer to Figures 1-5 The present application provides a technical scheme:

[0024] The unloading device of the semiconductor processing equipment comprises a base 1, symmetrically arranged side plates 2 are fixedly connected to the top end of the base 1, a conveying belt 3 is arranged between the side plates 2, a supporting leg 4 is fixedly connected to the top end of the base 1 and located at the right side of the conveying belt 3, a fixed plate 5 is fixedly connected to the top end of the supporting leg 4, a guide groove 6 is formed in the top end of the fixed plate 5, a supporting rod 7 is slidably connected in the guide groove 6, steel balls 8 are arranged at the bottom end of the supporting rod 7 and in rolling connection with the guide groove 6, a motor 21 is fixedly connected to the bottom end of the fixed plate 5, a fixed shell 9 is connected to the output end of the motor 21 and penetrates through the fixed plate 5, a collecting box 10 is arranged in the fixed shell 9, a collecting groove 11 is formed in the top end of the collecting box 10, a limiting groove 12 is formed in the top end of the collecting box 10 and located at the outer side of the collecting groove 11, fixed rods 13 are fixedly connected to the top end of the fixed plate 5 and arranged symmetrically, a supporting plate 14 is fixedly connected to the top end of the fixed rods 13, first hydraulic rods 15 are fixedly connected to the bottom end of the supporting plate 14 and arranged symmetrically, a limiting plate 16 is fixedly connected to the bottom end of the first hydraulic rods 15, and electrostatic chucks 17 are fixedly connected to the bottom end of the limiting plate 16 and arranged symmetrically.

[0025] The base 1 is fixedly connected with a second hydraulic rod 18 below the conveying belt 3, the second hydraulic rod 18 is fixedly connected with a push plate 19 at the end away from the base 1, the push plate 19 is fixedly connected with a guide plate 20 at the side away from the second hydraulic rod 18, the number of the support rods 7 is four, the top end of the support rod 7 is fixedly connected with the bottom end of the fixed plate 5, the collecting box 10, the collecting groove 11 and the four limiting grooves 12 are a group, the collecting box 10, the collecting groove 11 and the four limiting grooves 12 are four in total and symmetrically arranged front and back in the fixed shell 9, the number of the second hydraulic rods 18 is four, and the second hydraulic rods 18 are symmetrically arranged above and below between the base 1 and the push plate 19.

[0026] Workflow: When the unloading device of a semiconductor processing equipment is needed, the whole device is powered by external power supply, and the whole device is controlled to work cooperatively by the prior art control module. First, the processed semiconductor plate is conveyed to the guide plate 20 by the conveying belt 3, at this time the conveying belt 3 is stopped by the prior art control module, and the semiconductor plate on the guide plate 20 can be adsorbed by the electrostatic chuck 17, after being adsorbed, the second hydraulic rod 18 drives the push plate 19 and the guide plate 20 to move, the guide plate 20 is received below the conveying belt 3, then the first hydraulic rod 15 drives the limiting plate 16, the electrostatic chuck 17 and the semiconductor plate to move downward, as the limiting plate 16 descends, the limiting plate 16 enters the limiting groove 12, under the action of the limiting plate 16 and the limiting groove 12, the track of the electrostatic chuck 17 descending can be guided to ensure the stability of falling, finally the plate material is placed into the collecting groove 11, the semiconductor plate is collected by the collecting box 10, after a group of semiconductor plates are placed, the first hydraulic rod 15 drives the limiting plate 16 and the electrostatic chuck 17 to reset, the second hydraulic rod 18 drives the push plate 19 and the guide plate 20 to move, the guide plate 20 is extended below the electrostatic chuck 17 again, at this time the conveying belt 3 resumes operation to continue moving the semiconductor plate, the next group of semiconductor plates will slide to the lower side of the electrostatic chuck 17 under the action of gravity through the slope of the guide plate 20, without moving the adsorption structure left and right, the semiconductor plate can be stably adsorbed, then the conveying belt 3 stops operation again, the above process is repeated, when the collecting box 10 on one side is full, the fixed plate 5 is rotated under the support of the support rod 7 by the motor 21, the fixed plate 5 is prevented from deviating and damaging the rotating shaft of the motor 21 by the guide groove 6 and the support rod 7, the resistance of the fixed plate 5 rotating is reduced by the steel ball 8 at the bottom end of the support rod 7 to reduce power consumption, the fixed plate 5, the fixed shell 9 and the collecting box 10 are rotated by one hundred and eighty degrees by the output end of the motor 21, then the above steps are repeated to complete the unloading of the semiconductor plate, when the unloading is completed and transportation is needed, the collecting box 10 is taken out from the fixed shell 9, under the action of the collecting box 10, the semiconductor plate is more convenient to carry or transport, the collecting box 10 also has a protection effect on the semiconductor plate.

[0027] Contents not described in detail in this specification are existing technologies known to those skilled in the art. Standard parts used in this invention can all be purchased commercially, and irregularly shaped parts can be custom-made according to the description and drawings. The specific connection methods for each part all employ conventional methods such as bolts, rivets, and welding, which are already mature technologies. The machinery, parts, and equipment all use conventional models from the prior art, and the circuit connections also employ conventional connection methods from the prior art, which will not be detailed here.

[0028] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A material unloading device for semiconductor processing equipment, comprising a base (1), characterized in that: The top of the base (1) is fixedly connected to symmetrically arranged side plates (2), and a conveyor belt (3) is provided between the side plates (2). The top of the base (1) is fixedly connected to a support leg (4) located on the right side of the conveyor belt (3). The top of the support leg (4) is fixedly connected to a fixing plate (5). The top of the fixing plate (5) is provided with a guide groove (6). A support rod (7) is slidably connected inside the guide groove (6). The bottom end of the support rod (7) is provided with a steel ball (8) that is rollably connected to the guide groove (6). The bottom end of the fixing plate (5) is fixedly connected to a motor (21). The output end of the motor (21) passes through the fixing plate (5) and is connected to a fixing shell (9). The fixed shell (9) is provided with a collection box (10) inside. The top of the collection box (10) is provided with a collection groove (11). The top of the collection box (10) is provided with a limiting groove (12) located outside the collection groove (11). The top of the fixed plate (5) is fixedly connected with a symmetrically arranged fixed rod (13). The top of the fixed rod (13) is fixedly connected with a support plate (14). The bottom of the support plate (14) is fixedly connected with a symmetrically arranged first hydraulic rod (15). The bottom of the first hydraulic rod (15) is fixedly connected with a limiting plate (16). The bottom of the limiting plate (16) is fixedly connected with a symmetrically arranged electrostatic chuck (17).

2. The unloading device for a semiconductor processing equipment according to claim 1, characterized in that: A second hydraulic rod (18) located below the conveyor belt (3) is fixedly connected to one side of the base (1). A push plate (19) is fixedly connected to the end of the second hydraulic rod (18) away from the base (1). A guide plate (20) is fixedly connected to the side of the push plate (19) away from the second hydraulic rod (18).

3. The unloading device for a semiconductor processing equipment according to claim 1, characterized in that: There are four support rods (7), and the top of each support rod (7) is fixedly connected to the bottom of the fixing plate (5).

4. The unloading device for a semiconductor processing equipment according to claim 2, characterized in that: The collection box (10), collection trough (11) and four limiting grooves (12) are a set. There are four types of collection boxes (10), collection troughs (11) and four limiting grooves (12), which are arranged symmetrically in front and behind inside the fixed shell (9).

5. The unloading device for a semiconductor processing equipment according to claim 1, characterized in that: There are four second hydraulic rods (18), which are arranged symmetrically between the base (1) and the push plate (19).

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