Bearing device

Abstract

The utility model discloses a bearing device. The bearing device comprises a base body, and the base body is provided with a bearing face, a first air hole and a second air hole, wherein the first air hole and the second air hole are used for being communicated with an airflow source respectively, the first air hole and the second air hole are configured to allow airflow in opposite flow directions to pass through, and the airflow forms an air cushion layer on the bearing surface. The bearing device can provide good support for the to-be-supported object.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of detection equipment, and particularly relates to a bearing device. BACKGROUND

[0002] The bearing device is used for providing support for a silicon wafer and the like in a semiconductor detection equipment, and can also drive the silicon wafer to move. In the related art, the bearing device is easy to contaminate the silicon wafer, and has poor support stability. CONTENT OF THE UTILITY MODEL

[0003] The bearing device provided by the embodiment of the present application can provide stable support and effective adsorption, and has good support stability by limiting the movement of the movable part and the fixed part through the following technical solutions.

[0004] The bearing device provided by the embodiment of the present application comprises a base body, the base body is provided with a bearing surface, and a first air hole and a second air hole are arranged on the bearing surface; wherein the first air hole and the second air hole are respectively used for connecting a gas flow source, and the first air hole and the second air hole are configured to pass gas flow in opposite directions, and the gas flow forms an air cushion layer on the bearing surface.

[0005] The bearing device provided by the embodiment of the present application comprises a base body, the base body is provided with a bearing surface, and a first air hole and a second air hole are arranged on the bearing surface; wherein the first air hole and the second air hole are respectively used for connecting a gas flow source, and the first air hole and the second air hole are configured to pass gas flow in opposite directions, and the gas flow forms an air cushion layer on the bearing surface.

[0006] In a possible implementation manner of the present application, the first air hole is configured to pass negative pressure gas flow, and the negative pressure gas flow flows from the base body to the gas flow source; the number of the first air holes is multiple, and the multiple first air holes are uniformly distributed on the bearing surface.

[0007] Here, the first air holes are used for negative pressure airflow, so that the positive pressure airflow flowing out of the base can return to the airflow source, realizing the recycling of the airflow. The negative pressure airflow provides more flow direction for the positive pressure airflow in the air cushion layer, and the plurality of first air holes are uniformly distributed on the bearing surface, which is conducive to improving the uniformity of the distribution of the negative pressure airflow, and further improving the stability of the air cushion layer.

[0008] In a possible implementation of the present application, the base has a set center, and a plurality of first air holes are arranged at intervals around the outer periphery of the center to form a hole system; and a plurality of hole systems are arranged in a nested manner around the center.

[0009] Here, the plurality of first air holes are arranged at intervals around the outer periphery of the center to form a hole system, which is convenient for adapting to a circular base and improves the uniformity of the distribution of the first air holes, so that the object to be supported is more uniformly stressed. The plurality of hole systems are arranged in a nested manner around the center, which is conducive to the uniform distribution of the first air holes to provide stable negative pressure airflow.

[0010] In a possible implementation of the present application, the base is made of a porous material, and the pores of the porous material form second air holes; the second air holes are configured to pass through the positive pressure airflow, and the positive pressure airflow flows from the airflow source to the base.

[0011] Here, the second air flow is formed by using the pores of the porous material, without the need to additionally open air holes for the positive pressure airflow, and the porous material can form second air holes with smaller sizes, which is less difficult to process and more convenient to produce.

[0012] In a possible implementation of the present application, the airflow includes positive pressure airflow flowing from the airflow source to the base; the base includes a side wall between adjacent bearing surfaces, and the base is provided with a gas discharge groove, and the gas discharge groove is provided with openings corresponding to the bearing surfaces and the side wall, respectively, for discharging the positive pressure airflow out of the base.

[0013] Here, by arranging the gas discharge groove on the bearing surface, the gas discharge groove can guide the positive pressure airflow to the outside of the base, which is conducive to maintaining the dynamic balance of the airflow and improving the stability of the air cushion layer.

[0014] In a possible implementation of the present application, the base is provided with a gas discharge groove for the airflow to flow out; the diameter of the first air hole is 0.5-1.0 mm; and / or, the diameter of the second air hole is 15-25 μm; and / or, the width of the gas discharge groove is 1.0-10 mm; and / or, the depth of the gas discharge groove is 2.0-6.0 mm.

[0015] Here, by arranging the first air hole, the second air hole and the gas discharge groove within a reasonable size range, it is conducive to improving the balance of the positive pressure airflow and the negative pressure airflow, and further improving the stability of the air cushion layer.

[0016] In one possible implementation of this application, the supporting device further includes a plurality of limiting members. The limiting members are connected to the base and located at the edge of the supporting surface. Each limiting member includes a limiting surface, which is set at an angle to the supporting surface to restrict the movement of the object to be supported along the supporting surface.

[0017] Here, a limiting component is provided, and the limiting component has a limiting surface. The limiting surface can abut against the side wall of the object to be supported, so as to reduce the possibility of the object to be supported coming off the bearing surface, and also to provide support for the object to be supported, reducing the possibility of the object to be supported tilting.

[0018] In one possible implementation of this application, the substrate has a defined center, and the plurality of limiting members include a movable member that is movably connected to the substrate and moves relative to the substrate so that the limiting surface of the movable member moves closer to or away from the center; or, the bearing device further includes a connector that is connected to the plurality of movable members, the connector being movably connected to the substrate and moving relative to the substrate so that the limiting surfaces of the plurality of movable members move closer to or away from the center.

[0019] Here, the limiting component is set as a movable component. The movable component is movably connected to the base through a connector or directly. During the process of picking up and placing the object to be supported, the limiting surface of the movable component is moved away from the center of the base to facilitate the picking up and placing of the object to be supported.

[0020] In one possible implementation of this application, the substrate includes multiple layout areas located at the edge of the bearing surface, and the multiple layout areas are spaced apart in the circumferential direction around the center; the multiple limiting members also include fixing members, which are fixedly connected to the substrate, and the layout areas are provided with at least one of fixing members and movable members.

[0021] Here, a layout area is set sequentially along the edge of the bearing surface. The layout area is equipped with at least one of fixed parts and movable parts, so that the limiting parts can be distributed more evenly to improve the limiting effect. The movable parts cooperate with the fixed parts, which not only facilitates the placement and removal of the object to be supported, but also provides good limiting.

[0022] In one possible implementation of this application, the support device further includes an adjustment component for connecting to an airflow source and configured to adjust the airflow provided by the airflow source to change the thickness of the air cushion layer.

[0023] Here, an adjustment component is provided to adjust the airflow generated by the airflow source, thereby changing the airflow velocity, air pressure, etc. in the first and second air holes, and thus changing the thickness of the air cushion layer to adapt to different load-bearing requirements. Attached Figure Description

[0024] Figure 1 An isometric view of the detection device provided in the embodiments of this application;

[0025] Figure 2 A cross-sectional view of the detection device provided in the embodiments of this application;

[0026] Figure 3 Provided for the embodiments of this application Figure 2 A magnified schematic diagram of the local structure at point A;

[0027] Figure 4 A top view of the detection device provided in the embodiments of this application;

[0028] Figure 5 One of the partial views of the detection device provided in the embodiments of this application;

[0029] Figure 6 A second partial view of the detection device provided in an embodiment of this application.

[0030] Figure label:

[0031] 100 - Substrate; 110 - First vent; 120 - Second vent; 130 - Bearing surface; 140 - Venting groove; 150 - Layout area; 160 - Positive pressure chamber; 200 - Limiting component; 210 - Limiting surface; 20a - Movable component; 21a - First movable component; 22a - Second movable component; 20b - Fixing component; 21b - First fixing component; 22b - Second fixing component; 23b - Third fixing component; 24b - Fourth fixing component; 300 - Connecting component. Detailed Implementation

[0032] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the specific technical solutions of this application will be further described in detail below with reference to the accompanying drawings of the embodiments of this application. The following embodiments are used to illustrate this application, but are not intended to limit the scope of this application.

[0033] In the embodiments of this application, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the embodiments of this application, unless otherwise stated, "multiple" means two or more.

[0034] Furthermore, in the embodiments of this application, directional terms such as "upper," "lower," "left," and "right" are defined relative to the positions in which the components are schematically placed in the accompanying drawings. It should be understood that these directional terms are relative concepts, used for relative description and clarification, and can change accordingly depending on the position of the components in the accompanying drawings.

[0035] In the embodiments of this application, unless otherwise explicitly specified and limited, the term "connection" should be interpreted broadly. For example, "connection" can be a fixed connection, a detachable connection, or an integral part; it can be a direct connection or an indirect connection through an intermediate medium.

[0036] In embodiments of this application, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes that element.

[0037] In the embodiments of this application, the terms "exemplary" or "for example" are used to indicate that something is an example, illustration, or description. Any embodiment or design that is described as "exemplary" or "for example" in the embodiments of this application should not be construed as being more preferred or advantageous than other embodiments or design. Specifically, the use of the terms "exemplary" or "for example" is intended to present the relevant concepts in a specific manner.

[0038] This application provides a support device that can be used for semiconductor processing, testing, and transportation, providing support for semiconductors. For example, in semiconductor testing equipment, it can provide support for silicon wafers and can also drive the movement of silicon wafers.

[0039] In some technical solutions, the support device provides support for the semiconductor through vacuum chucks, electrostatic chucks, etc. Both vacuum chucks and electrostatic chucks are in contact with the semiconductor, which can easily scratch and damage the semiconductor, and also cannot meet the contactless production requirements of some semiconductors.

[0040] Reference Figure 1 , Figure 2 and Figure 3 The supporting device in this application embodiment includes a base 100, the base 100 is provided with a supporting surface 130, and a first air hole 110 and a second air hole 120 arranged on the supporting surface 130; wherein, the first air hole 110 and the second air hole 120 are respectively used to connect to an airflow source, and the first air hole 110 and the second air hole 120 are configured to allow airflows in opposite directions to pass through, and the airflow forms an air cushion layer on the supporting surface 130.

[0041] The technical solution provided in this application embodiment includes a substrate 100 with a bearing surface 130 for supporting semiconductors and other supports. The bearing surface 130 is provided with a first vent 110 and a second vent 120. The first vent 110 and the second vent 120 are respectively connected to an airflow source, which can provide airflow flowing through the first vent 110 and the second vent 120. The first vent 110 and the second vent 120 are configured to allow airflows of opposite directions to pass through. Specifically, one of the first vent 110 and the second airflow is supplied with airflow exiting the substrate 100 from the side where the bearing surface 130 is located, and the other is supplied with airflow flowing into the substrate 100 from the side where the bearing surface 130 is located, thereby forming an air cushion layer on the bearing surface 130. The air cushion layer suspends the object to be supported on the bearing surface 130 to provide support. Furthermore, because the airflow has two different directions, it achieves dynamic equilibrium within the air cushion layer, reducing the possibility of the supported object tilting due to uneven airflow pressure. The airflow flowing into the substrate 100 generates an adsorption force that firmly holds the supported object, further enhancing its stability. On one hand, the air cushion layer achieves non-contact support between the bearing surface 130 and the supported object, protecting the object. On the other hand, the opposing airflow directions form a more stable air cushion layer, improving the stability of the support.

[0042] In this embodiment, the base 100 can be a block structure, a plate structure, a frame structure, etc., and the bearing surface 130 can be the outer surface of one side of the base 100, such as the upper surface of the base 100. The bearing surface 130 can be circular, square, triangular, rhomboid, trapezoidal, etc., and the shape of the bearing surface 130 can be set with reference to the shape of the object to be supported. For example, the base 100 is a plate structure, the bearing surface 130 is one side surface perpendicular to the thickness direction of the base 100, and the bearing surface 130 is circular.

[0043] In this embodiment, the first vent 110 and the second vent 120 are configured to allow airflows in opposite directions to pass through. This can be that the airflow through the first vent 110 flows from the substrate 100 to the airflow source, and the airflow through the second vent 120 flows from the airflow source to the substrate 100; or, the airflow through the first vent 110 flows from the airflow source to the substrate 100, and the airflow through the second vent 120 flows from the substrate 100 to the airflow source. The airflow flowing from the substrate 100 to the airflow source is a negative pressure airflow, and the airflow flowing from the airflow source to the substrate 100 is a positive pressure airflow.

[0044] It should be noted that there can be one or more airflow sources. For example, a single airflow source can be provided, with the first air port 110 connected to the air inlet side and the second air port 120 connected to the air outlet side. Alternatively, multiple airflow sources can be provided, with a high-pressure air source connected to the second air port 120 to provide positive pressure airflow, and a vacuum pump connected to the first air port 110 to provide negative pressure airflow. Furthermore, the airflow direction is used to indicate whether the airflow is positive or negative pressure, and does not limit the actual flow direction of the airflow. The actual flow direction of the airflow is defined by the extension axes of the first air port 110 and the second air port 120.

[0045] In this embodiment, the first vent 110 and the second vent 120 are disposed on the bearing surface 130, specifically, the first vent 110 and the second vent 120 have openings on the bearing surface 130. The first vent 110 and the second vent 120 can be equal-diameter holes, variable-diameter holes, stepped holes, etc.; the extension axes of the first vent 110 and the second vent 120 can be straight lines, curves, spirals, etc.; the radial cross-sections of the first vent 110 and the second vent 120 can be regular or irregular shapes such as circles, squares, triangles, trapezoids, rhombuses, etc.

[0046] In this embodiment of the application, the first vent 110 and the second vent 120 may adopt or have the same structural form. For example, the first vent 110 is a stepped hole, and the opening located on the bearing surface 130 has a large radial dimension, which can act on a large range. The extension axis of the first vent 110 is set perpendicular to the bearing surface 130, and the radial cross section of the first vent 110 is circular, which is used to introduce negative pressure airflow. The second vent 120 is a non-standard hole, which is used to introduce positive pressure airflow.

[0047] Reference Figure 1 and Figure 2 In some possible embodiments of this application, the first vent 110 is configured to allow negative pressure airflow to pass through, and the negative pressure airflow flows from the substrate 100 to the airflow source; there are multiple first vents 110, and the multiple first vents 110 are evenly distributed on the bearing surface 130.

[0048] The technical solution provided in this application embodiment allows negative pressure airflow to pass through the first vent 110, so that the positive pressure airflow flowing out of the substrate 100 can return to the airflow source, realizing the recycling of airflow. Furthermore, the negative pressure airflow provides more flow directions for the positive pressure airflow in the air cushion layer. The multiple first vents 110 are evenly distributed on the bearing surface 130, which helps to improve the uniformity of the negative pressure airflow distribution, thereby enhancing the stability of the air cushion layer.

[0049] In this embodiment, there can be multiple first air holes 110, specifically, multiple openings of first air holes 110 are provided on the bearing surface 130. The multiple first air holes 110 are evenly distributed along the bearing surface 130, and can be distributed in a rectangular array, a ring array, or the like along the bearing surface 130. For example, the bearing surface 130 is circular, and the multiple first air holes 110 are distributed in a ring array along the bearing surface 130.

[0050] In this embodiment, the shapes or sizes of the multiple first air holes 110 may be the same or different, or some of the first air holes 110 may have the same shape or size. For example, the first air holes 110 near the edge of the bearing surface 130 are larger, and the first air holes 110 near the center of the bearing surface 130 are smaller; or, the multiple first air holes 110 may all have the same shape and size.

[0051] In this embodiment, the first vent 110 can be connected to an airflow source through a pipeline. Alternatively, multiple first vents 110 can be connected to airflow sources respectively, or a negative pressure chamber can be formed inside the substrate 100, with the first vent 110 and the airflow source respectively connected to the negative pressure chamber.

[0052] Reference Figure 1 , Figure 2 and Figure 4 In some possible embodiments of this application, the substrate 100 has a defined center, and a plurality of first pores 110 are spaced around the outer periphery of the center to form a pore system; the plurality of pore systems are nested around the center.

[0053] The technical solution provided in this application embodiment has multiple first air holes 110 spaced around the outer periphery of the center to form a hole system, which is convenient to adapt to the circular base 100 and improves the uniformity of the distribution of the first air holes 110, so that the object to be supported is subjected to more uniform force. The multiple hole systems nested around the center help to uniformly distribute the first air holes 110 to provide a stable negative pressure airflow.

[0054] In this embodiment of the application, the center of the substrate 100 can be the geometric center of the bearing surface 130. For example, the bearing surface 130 is circular and the center is the circle of the circle; for another example, the bearing surface 130 is rectangular and the center is the intersection of the two diagonals of the rectangle; for yet another example, the bearing surface 130 is triangular and the center is the intersection of the three centers of the triangle.

[0055] In this embodiment of the application, a plurality of first pores 110 may form one or more pore systems, each pore system may include two or more first pores 110, and different pore systems may include the same or different number of first pores 110; the spacing of the first pores 110 in different pore systems along the circumferential direction may be the same or different.

[0056] In one example, the bearing surface 130 is provided with three hole systems. The inner hole system includes a smaller number of first vents 110, for example, 8. The middle and outer hole systems include the same number of first vents 110, for example, 16. The spacing of the first vents 110 in the different hole systems along the circumferential direction is different.

[0057] In this embodiment, the spacing between adjacent pore systems can be equal or unequal. Equal spacing results in a more uniform distribution of the pore systems. Specifically, the spacing is defined as the circle formed by connecting the midpoints of the multiple first pores 110 in the pore system; the difference between the circles of adjacent pore systems is the spacing distance. In one example, the spacing between the outer and middle pore systems is equal to the spacing between the middle and inner pore systems.

[0058] Reference Figure 1 In some possible embodiments of this application, the substrate 100 is made of a porous material, and the pores of the porous material form second pores 120; the second pores 120 are configured to allow positive pressure airflow to pass through, and the positive pressure airflow flows from the airflow source to the substrate 100.

[0059] The technical solution provided in this application embodiment utilizes the pores of porous materials to form a second airflow, eliminating the need for additional positive pressure airflow pores. Furthermore, porous materials can form smaller second pores 120, making processing easier and production more convenient.

[0060] In this embodiment, the matrix 100 can be porous ceramic, porous metal, porous rock, porous composite material, etc. For example, the matrix 100 is a porous ceramic, which not only has high porosity but also good chemical stability and is not easily corroded. The porosity of the porous ceramic can be between 30% and 35%, such as 30%, 32%, 35%, etc.

[0061] In this embodiment, the second pore 120 is formed by the pores of a porous material. The pores of the porous material can be a regular structure or a random structure. The size or shape of the first pore 110 is not specifically limited.

[0062] In this embodiment, a positive pressure chamber 160 may be formed inside the substrate 100. The second vent 120 connects to the positive pressure chamber 160, and the positive pressure chamber 160 is connected to an airflow source via a pipe. For example, multiple positive pressure chambers 160 are formed inside the substrate 100, and the multiple positive pressure chambers 160 are evenly arranged parallel to the bearing surface 130. Each of the multiple positive pressure chambers 160 is connected to an airflow source.

[0063] Reference Figure 1 , Figure 4 and Figure 5In some possible embodiments of this application, the airflow includes a positive pressure airflow from an airflow source to the substrate 100; the substrate 100 includes a sidewall adjacent to the bearing surface 130 (e.g., the periphery of the substrate 100), and the substrate 100 is provided with a venting groove 140, the venting groove 140 having openings corresponding to the bearing surface 130 and the sidewall respectively, for discharging the positive pressure airflow from the substrate 100.

[0064] The technical solution provided in this application embodiment, by providing an air venting groove 140 on the bearing surface 130, can guide the positive pressure airflow to the outside of the base 100, which helps to maintain the dynamic balance of the airflow and improve the stability of the air cushion layer.

[0065] In this embodiment, the venting groove 140 is a long groove structure. The venting groove 140 has openings on the bearing surface 130 and the side wall of the base 100. After the positive pressure airflow flows out from the second air hole 120, it comes into contact with the object to be supported, thereby changing the flow direction to flow toward the bearing surface 130. The airflow flows into the venting groove 140 through the opening on the bearing surface 130 and flows out through the opening on the side wall of the base 100.

[0066] In this embodiment of the application, the extension axis of the vent groove 140 can be a straight line, an arc, or a combination of multiple line segments. For example, the extension axis of the vent groove 140 is a straight line. When the bearing surface 130 is circular, the vent groove 140 is arranged radially along the bearing surface 130.

[0067] In this embodiment, the venting groove 140 can be a constant diameter structure or a variable diameter structure, and the radial cross-section of the venting groove 140 can be a regular or irregular shape such as a circle, square, triangle, trapezoid, or rhombus. For example, the venting groove 140 is a constant diameter structure, and its radial cross-section is rectangular.

[0068] In this embodiment of the application, there can be multiple venting grooves 140. The multiple venting grooves 140 are evenly distributed along the bearing surface 130. For example, multiple venting grooves 140 are provided on the bearing surface 130. The multiple venting grooves 140 are arranged in a ring array around the circle of the bearing surface 130, dividing the bearing surface 130 into multiple uniform fan-shaped areas.

[0069] In some possible embodiments of this application, the diameter of the first vent 110 is 0.5-1.0 millimeters (mm); and / or, the diameter of the second vent 120 is 15-25 micrometers (μm); and / or, the width of the vent groove 140 is 1.0-10 mm; and / or, the depth of the vent groove 140 is 2.0-6.0 mm.

[0070] The technical solution provided in this application, by setting the first air hole 110, the second air hole 120 and the venting groove 140 within a reasonable size range, helps to improve the balance of positive pressure airflow and negative pressure airflow, thereby improving the stability of the air cushion layer.

[0071] It should be noted that the diameters of the first vent 110, the second vent 120, the width of the vent groove 140, and the depth of the vent groove 140 are not necessarily set in a correlated manner. All four can be within their respective value ranges, or only some dimensions can be within their respective value ranges. For example, if the diameter of the first vent 110 is 0.5 mm, the diameter of the second vent 120 can be in the range of 15 μm to 25 μm, or it can be any other value that suits the actual needs.

[0072] In this embodiment, the radial dimension of the first vent 110 ranges from 0.5mm to 1.0mm, such as 0.5mm, 0.6mm, 0.7mm, 0.8mm, 0.9mm, 1.0mm, etc., and this embodiment does not specifically limit it. For example, the radial dimension of multiple first vents 110 is the same, all being 0.8mm.

[0073] In this embodiment, the radial dimension of the second pore 120 ranges from 15μm to 25μm, and this embodiment does not specifically limit it. For example, multiple second pores 120 may have different radial dimensions, such as 15μm, 18μm, 20μm, 22μm, 25μm, etc.

[0074] In this embodiment, the width of the vent groove 140 is the dimension of the vent groove 140 parallel to the bearing surface 130 and perpendicular to the extending axis. The width of the vent groove 140 ranges from 1.0 to 10 mm, such as 1.0 mm, 3.0 mm, 5.0 mm, 8.0 mm, 10 mm, etc. This embodiment does not specifically limit this. The depth of the vent groove 140 is the dimension of the vent groove 140 perpendicular to the bearing surface 130. The depth of the vent groove 140 ranges from 2.0 to 6.0 mm, such as 2.0 mm, 3.0 mm, 4.0 mm, 5.0 mm, 6.0 mm, etc. This embodiment does not specifically limit this.

[0075] Reference Figure 1 , Figure 2 and Figure 3 In some possible embodiments of this application, the supporting device further includes a plurality of limiting members 200. The limiting members 200 are connected to the base 100 and located at the edge of the supporting surface 130. The limiting members 200 include a limiting surface 210, which is set at an angle to the supporting surface 130 to restrict the movement of the object to be supported along the supporting surface 130.

[0076] The technical solution provided in this application embodiment includes a limiting member 200, which has a limiting surface 210. The limiting surface 210 can abut against the side wall of the object to be supported, thereby reducing the possibility of the object to be supported coming off the bearing surface 130 and providing support for the object to be supported, thus reducing the possibility of the object to be supported tilting.

[0077] In this embodiment, the limiting member 200 can be a protrusion formed on the substrate 100 protruding from the bearing surface 130, or it can be a plate-like structure, rod-like structure, block-like structure, etc., connected to the substrate 100. The connection between the limiting member 200 and the substrate 100 can be integral molding, snap-fitting, bonding, welding, riveting, fastener connection, etc.

[0078] In this embodiment, the limiting surface 210 is used to limit the object to be supported. It is understood that when the limiting surface 210 is used for limiting, the limiting groove 210 faces the center of the base 100. The limiting surface 210 can be a plane, an arc surface, a stepped surface, etc., and the angle between the limiting surface 210 and the bearing surface 130 can be a right angle, an acute angle, or an obtuse angle. For example, the limiting surface 210 is a plane, and the angle between the limiting surface 210 and the bearing surface 130 is a right angle.

[0079] In this embodiment, the side of the limiting member 200 away from the bearing surface 130 may be chamfered, such as a beveled chamfer or a rounded chamfer, to provide guidance for the object to be supported, so as to facilitate the placement of the object to be supported between multiple limiting members 200.

[0080] Reference Figure 4 , Figure 5 and Figure 6 In some possible embodiments of this application, the plurality of limiting members 200 include a movable member 20a, which is movably connected to the base 100. The movable member 20a moves relative to the base 100 so that the limiting surface 210 of the movable member 20a approaches or moves away from the center of the base 100.

[0081] The technical solution provided in this application embodiment sets the limiting member 200 as a movable member 20a. The movable member 20a is movably connected to the base 100 and can move relative to the base 100. During the process of picking up and putting down the object to be supported, the limiting surface 210 of the movable member 20a is moved away from the center of the base 100 to facilitate the picking up and putting down of the object to be supported.

[0082] In this embodiment, the movable connection between the movable member 20a and the base 100 can be a rotational connection, a sliding connection, etc., so that the movable member 20a can rotate or slide relative to the base 100. The axis of rotation of the movable member 20a relative to the base 100 can be parallel to the bearing surface 130 or perpendicular to the bearing surface 130.

[0083] For example, the bearing surface 130 is circular, and the movable member 20a is slidably connected to the base 100 along the radial direction of the bearing surface 130. The movable member 20a moves toward the edge of the bearing surface 130, and the size between the multiple movable members 20a increases, which facilitates the placement and removal of the object to be supported. In some other possible embodiments, the movable member 20a is also rotatably connected to the base 100, and the axis of rotation is set parallel to the bearing surface 130. By rotating, the size between the multiple movable members 20a is changed to facilitate the placement and removal of the object to be supported.

[0084] In this embodiment, the movable member 20a may also be connected to a driving member or a resetting member. The driving member is a motor, cylinder, etc., to drive the movable member 20a to move relative to the base 100. The resetting member can be a spring, rubber pad, or other elastically deformable component. Under the action of external force, the movable member 20a moves relative to the base 100 and drives the resetting member to elastically deform. After the external force is removed, the elastic member drives the movable member 20a to reset through elastic force.

[0085] It should be noted that multiple moving parts 20a can move individually relative to the base 100, or they can move in groups relative to the base 100. (Refer to...) Figure 4 and Figure 5 In some other possible embodiments of this application, the supporting device further includes a connector 300, which is connected to a plurality of movable members 20a. The connector 300 is movably connected to the base 100 and moves relative to the base 100 so that the limiting surfaces 210 of the plurality of movable members 20a on it move closer to or further away from the center of the base 100. The connector 300 can drive the plurality of movable members 20a to move synchronously relative to the base 100, making the structure simpler.

[0086] In this embodiment, the movable connection between the connector 300 and the base 100 can be a rotary connection, a sliding connection, etc., so that the connector 300 can rotate or slide relative to the base 100. The axis of rotation of the connector 300 relative to the base 100 can be parallel to the bearing surface 130 or perpendicular to the bearing surface 130.

[0087] In this embodiment of the application, the connection between the movable part 20a and the connector 300 can be a fixed connection, a movable connection, etc., such as integral molding, snap-fit, welding, bonding, threaded connection, fastener connection, sliding connection, rotary connection, etc.

[0088] For example, the connector 300 is slidably connected to the base 100 along the radial direction of the bearing surface 130, the movable member 20a is rotatably connected to the connector 300, and the rotation axes of both are parallel to the bearing surface 130, and the reset member is connected to the connector 300.

[0089] Reference Figure 4In some possible embodiments of this application, the substrate 100 includes a plurality of layout areas 150, the layout areas 150 are located at the edge of the bearing surface 130, the plurality of layout areas 150 are spaced apart in the circumferential direction around the center of the substrate 100, the plurality of limiting members 200 also include fixing members 20b, the fixing members 20b are fixedly connected to the substrate 100, and the layout areas 150 are provided with at least one of fixing members 20b and movable members 20a.

[0090] The technical solution provided in this application embodiment involves sequentially setting up a layout area 150 along the edge of the bearing surface 130. The layout area 150 is provided with at least one of a fixing member 20b and a movable member 20a, so that the limiting member 200 can be distributed more evenly to improve the limiting effect. A portion of the layout area 150 is provided with a movable member 20a, and the movable member 20a cooperates with the fixing member 20b, which not only facilitates the placement and removal of the object to be supported, but also provides good limiting.

[0091] In this embodiment, the fixing member 20b is fixedly disposed relative to the base 100. One or more fixing members 20b and movable members 20a may be disposed on the base 100. The multiple fixing members 20b and multiple movable members 20a may be arranged at equal intervals along the edge of the bearing surface 130. It is understood that, since the movable member 20a can move relative to the base 100, when the movable member 20a moves to near the center of the bearing surface 130, the distance between the limiting surface 210 of the movable member 20a and the edge of the bearing surface 130 is greater than the distance between the limiting surface 210 of the fixing member 20b and the edge of the bearing surface 130.

[0092] In this embodiment, the distance between the limiting surface 210 of the fixing member 20b and the edge of the bearing surface 130 ranges from 0.3mm to 0.8mm, for example, 0.3mm, 0.5mm, 0.8mm, etc.; when the movable member 20a moves to near the center of the bearing surface 130, the distance between the limiting surface 210 of the movable member 20a and the edge of the bearing surface 130 ranges from 0.4mm to 1.0mm, for example, 0.4mm, 0.8mm, 1.0mm, etc. This embodiment does not specifically limit this.

[0093] The distances between the multiple fasteners 20b and the edge of the bearing surface 130 can be equal, and the distances between the multiple movable parts 20a and the bearing surface 130 can also be equal.

[0094] In this embodiment, the layout area 150 is only used to illustrate the positions of the fixing member 20b and the movable member 20a relative to the base 100, and is not a limitation on the actual structure of the base 100. Each layout area 150 may be provided with one of the fixing member 20b and the movable member 20a, and the limiting members 200 provided in multiple layout areas 150 may be the same or different.

[0095] In one example, only movable component 20a is provided in the layout area 150; in another example, only fixed component 20b is provided in the layout area 150; in yet another example, both movable component 20a and fixed component 20b are provided in the layout area 150. It should be noted that the number of movable component 20a and fixed component 20b in the above examples is not limited, and there can be one or more.

[0096] In this embodiment of the application, multiple fixed members 20b can be distributed at equal intervals within the same layout area 150, and multiple movable members 20a can be distributed at equal intervals; within the same layout area 150, fixed members 20b and movable members 20a can be distributed alternately, or movable members 20a can be disposed between two fixed members 20b, or fixed members 20b can be disposed between two movable members 20a.

[0097] In one example, three layout areas 150 are formed on the substrate 100, and two of the layout areas 150 are respectively provided with a fastener 20b, namely a first fastener 21b and a second fastener 22b. The angle between the first fastener 21b and the second fastener 22b and the center of the bearing surface 130 is 120 degrees.

[0098] Another installation area 150 is provided with two fixed members 20b and two movable members 20a, namely a third fixed member 23b, a fourth fixed member 24b, a first movable member 21a, and a second movable member 22a. Along the circumference of the bearing surface 130, the first movable member 21a and the second movable member 22a are located between the third fixed member 23b and the fourth fixed member 24b, and the third fixed member 23b and the fourth fixed member 24b are symmetrically distributed with respect to this installation area 150, as are the first movable member 21a and the second movable member 22a.

[0099] The included angle between the third fixing member 23b and the fourth fixing member 24b and the center of the bearing surface 130 is 60 degrees. The included angle between the third fixing member 23b and the second fixing member 22b and the center of the bearing surface 130 is 90 degrees. The included angle between the fourth fixing member 24b and the first fixing member 21b and the center of the bearing surface 130 is also 90 degrees. The spacing between the first movable member 21a and the second movable member 22a along the circumference of the bearing surface 130 is 20mm-30mm, for example, 20mm, 23mm, 26mm, 28mm, 30mm, etc. This embodiment does not impose specific limitations on this.

[0100] In some possible embodiments of this application, the support device further includes an adjustment component (not shown in the figure), which is connected to an airflow source and is configured to adjust the airflow provided by the airflow source to change the thickness of the air cushion layer.

[0101] The technical solution provided in this application embodiment includes an adjustment component that can adjust the airflow generated by the airflow source to change the airflow velocity, air pressure, etc. in the first air hole 110 and the second air hole 120, thereby changing the thickness of the air cushion layer to adapt to different load-bearing requirements.

[0102] In this embodiment of the application, the regulating component can be a condition regulating device for the airflow source, such as power regulation, air pressure regulation, flow rate regulation, etc. The airflow source is connected to the first air port 110 and the second air port 120 through a pipe. The regulating component can also be a valve body installed on the pipe, such as a flow valve, pressure valve, etc.

[0103] For example, the adjustable range of the positive pressure airflow provided by the high-pressure gas source is 0.05-0.3 MPa, such as 0.05 MPa, 0.1 MPa, 0.2 MPa, 0.3 MPa, etc., and the adjustable range of the negative pressure airflow provided by the vacuum pump is -5 MPa to -10 MPa, such as -5 MPa, -8 MPa, -10 MPa, etc. The embodiments of this application do not impose specific limitations on this.

[0104] In this embodiment, the supporting device can also be movably configured to move the object to be supported. The movement speed and acceleration of the supporting device can be adapted to different detection modes by adjusting the air pressure of the high-pressure air source and / or vacuum pump. The thickness of the air cushion layer can also be changed by adjusting the air pressure of the high-pressure air source and / or vacuum pump, thereby adjusting the height of the object to be supported relative to the supporting surface 130.

[0105] Based on this, this application provides a semiconductor testing device, including a testing device, an airflow source, and a carrier device according to this application. The carrier device carries the semiconductor to be tested through an air cushion layer; the testing device is used to test the semiconductor to be tested.

[0106] The technical solution provided in this application embodiment includes a semiconductor testing device that supports the semiconductor testing equipment. Therefore, it has the same technical effect as the semiconductor testing equipment. The semiconductor testing equipment forms an air cushion layer through the first air hole 110 and the second air hole 120. On the one hand, the air cushion layer enables non-contact support between the support surface 130 and the object to be supported, thus protecting the object to be supported. On the other hand, the airflow in the opposite direction forms a more stable air cushion layer, which improves the stability of the support.

[0107] Reference Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figure 5 and Figure 6In one possible embodiment of this application, the supporting device includes a substrate 100, which is made of porous ceramic and has good stability and flatness. The pores of the porous ceramic form second pores 120. The supporting surface 130 of the substrate 100 is circular and is provided with a plurality of first pores 110. The plurality of first pores 110 form three pore systems. The three pore systems are concentrically nested and the spacing between adjacent pore systems is equal. In addition, the supporting surface 130 is also provided with a plurality of venting grooves 140, which are distributed radially along the supporting surface 130.

[0108] The airflow source includes a high-pressure air source and a vacuum pump. The high-pressure air source is connected to the second air hole 120 through the positive pressure chamber 160 in the substrate 100 to generate a positive pressure airflow. The vacuum pump is used to connect to the first air hole 110 to generate a negative pressure airflow. The positive pressure airflow and the negative pressure airflow together form an air cushion layer. The positive pressure airflow suspends the silicon wafer relative to the support surface 130, reducing the contact between the silicon wafer and the support device, thereby protecting the silicon wafer and reducing contamination of the silicon wafer.

[0109] Part of the positive pressure airflow flows out through the venting groove 140, while the other part is converted into negative pressure airflow and flows into the substrate 100. The negative pressure airflow adsorbs the silicon wafer, providing stable support and effectively preventing the silicon wafer from shaking. It also helps to improve the detection and positioning accuracy.

[0110] The edge of the substrate 100 is also provided with four fixing members 20b and two movable members 20a for abutting against the periphery of the silicon wafer, facilitating the movement of the silicon wafer with the substrate 100. Specifically, the angle between the first fixing member 21b and the second fixing member 22b and the center of the bearing surface 130 is 120 degrees; the angle between the third fixing member 23b and the fourth fixing member 24b and the center of the bearing surface 130 is 60 degrees; the angle between the third fixing member 23b and the second fixing member 22b and the center of the bearing surface 130 is 90 degrees; the angle between the fourth fixing member 24b and the first fixing member 21b and the center of the bearing surface 130 is also 90 degrees; and the first movable member 21a and the second movable member 22a are symmetrically arranged between the third fixing member 23b and the fourth fixing member 24b.

[0111] The first movable member 21a and the second movable member 22a can move relative to the substrate 100 to change the distance with the edge of the bearing surface 130, which facilitates the placement of the silicon wafer. The first movable member 21a, the second movable member 22a, the first fixed member 21b and the second fixed member 22b provide a limit for the silicon wafer through the reset member. In the case of large shaking, the first fixed member 21b, the second fixed member 22b, the third fixed member 23b and the fourth fixed member 24b provide a limit for the silicon wafer to limit the shaking of the silicon wafer.

[0112] The carrier device and semiconductor testing equipment of this application embodiment have better support stability. By adsorbing the silicon wafer through negative pressure airflow, they have higher positioning accuracy, thereby improving the accuracy of testing. Furthermore, the arrangement of the movable part 20a and the fixed part 20b can provide good limitation for the silicon wafer, further enhancing the stability of the support.

[0113] The sequence numbers of the embodiments in this application are for descriptive purposes only and do not represent the superiority or inferiority of the embodiments. The above are merely preferred embodiments of this application and do not limit the patent scope of this application. Any equivalent structural or procedural transformations made based on the content of this application's specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of this application.

Claims

1. A supporting device, characterized in that, include: The substrate has a bearing surface and a first pore and a second pore arranged on the bearing surface; The first vent and the second vent are respectively used to connect to the airflow source, and the first vent and the second vent are configured to allow airflows in opposite directions to pass through, and the airflow forms an air cushion layer on the bearing surface.

2. The bearing device according to claim 1, characterized in that, The first vent is configured to allow negative pressure airflow to pass through, and the negative pressure airflow flows from the substrate to the airflow source; The number of the first air holes is multiple, and the multiple first air holes are evenly distributed on the bearing surface.

3. The bearing device according to claim 2, characterized in that, The substrate has a defined center, and a plurality of first pores are arranged at intervals around the outer periphery of the center to form a pore system; The plurality of holes are arranged concentrically around the center.

4. The bearing device according to claim 1, characterized in that, The matrix is ​​made of a porous material, and the pores of the porous material form the second pores; The second vent is configured to allow positive pressure airflow to pass through, and the positive pressure airflow flows from the airflow source to the substrate.

5. The bearing device according to claim 1, characterized in that, The airflow includes a positive pressure airflow flowing from the airflow source to the substrate; The substrate includes a sidewall adjacent to the bearing surface, and the substrate is provided with a venting groove. The venting groove has an opening corresponding to the bearing surface and the sidewall, respectively, for discharging the positive pressure airflow from the substrate.

6. The bearing device according to claim 1, characterized in that, The substrate is provided with a venting groove for the airflow to exit; The diameter of the first vent is 0.5-1.0 mm; and / or the diameter of the second vent is 15-25 μm; and / or the width of the vent groove is 1.0-10 mm; and / or the depth of the vent groove is 2.0-6.0 mm.

7. The bearing device according to any one of claims 1 to 6, characterized in that, It also includes multiple limiting members, which are connected to the base and located at the edge of the bearing surface. Each limiting member includes a limiting surface that is set at an angle to the bearing surface to restrict the movement of the object to be supported along the bearing surface.

8. The bearing device according to claim 7, characterized in that, The base has a defined center, and the plurality of limiting members includes a movable member; The movable component is movably connected to the base, and the movable component moves relative to the base to cause the limiting surface of the movable component to move closer to or further away from the center; or, The supporting device further includes a connector, which is connected to a plurality of the movable parts. The connector is movably connected to the base and moves relative to the base so that the limiting surfaces of the plurality of movable parts move closer to or further away from the center.

9. The bearing device according to claim 8, characterized in that, The substrate includes multiple layout areas, which are located at the edge of the bearing surface, and the multiple layout areas are spaced apart in the circumferential direction around the center; The plurality of limiting members also include fixing members, which are fixedly connected to the base, and the layout area is provided with at least one of the fixing members and the movable members.

10. The bearing device according to any one of claims 1 to 6, characterized in that, It also includes an adjustment component for connecting to the airflow source and configured to adjust the airflow provided by the airflow source to change the thickness of the air cushion layer.

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