Semiconductor laser

Abstract

The utility model relates to a semiconductor laser, which comprises a laser body, a main frame and an auxiliary frame, one side of the laser body is fixedly connected with a sliding block, the auxiliary frame is provided with a sliding track, the sliding block is arranged on the sliding track in an up-down sliding mode, and the auxiliary frame is provided with a lifting mechanism used for driving the laser body to move up and down. The auxiliary rack comprises fixing plates located on the front side and the rear side of the laser device body, guide sleeves are integrally formed on the fixing plates, guide rods are arranged on the front side and the rear side of the auxiliary rack on the main rack, the guide rods are movably sleeved with the guide sleeves, and a transverse driving mechanism used for driving the auxiliary rack to move left and right is arranged on the main rack. The guide sleeve is provided with a fixing mechanism which is used for fixing the guide sleeve on the guide rod and fixing the laser body on the auxiliary rack. According to the invention, position adjustment in two directions can be realized. In addition, the design of the fixing mechanism ensures that the laser body can be quickly and firmly fixed at any position.

Description

Technical Field

[0001] This utility model relates to the field of laser technology, and in particular to a semiconductor laser. Background Technology

[0002] Semiconductor lasers, as important optoelectronic devices, have wide applications in many fields such as communications, industrial processing, and medicine. To ensure their accurate and stable operation during use, improving their stability has always been a key research and development direction.

[0003] A semiconductor laser with good stability is described in application number CN202022775348.1. This device has certain innovations and practicality. It can drive the laser body to move left and right, and effectively fix the laser body by controlling the position of the limit gear. This innovative design avoids the shaking of the laser during use caused by non-human factors such as slight vibrations and environmental interference, so that the laser can operate more stably in practical applications, improving its reliability and accuracy.

[0004] However, this device still has some obvious drawbacks, limiting its application in more scenarios. 1. The device can only drive the laser to adjust in a single horizontal (left-right) direction. 2. Fixing the position of the laser body is cumbersome, affecting work efficiency. Therefore, this application makes improvements to address the above technical problems. Utility Model Content

[0005] This invention proposes a semiconductor laser that solves the aforementioned problems existing in the use of existing technologies.

[0006] The technical solution of this utility model is implemented as follows: A semiconductor laser includes a laser body, a main frame, and a sub-frame. A slider is fixedly connected to one side of the laser body. A sliding track is provided on the sub-frame, and the slider is slidably mounted on the sliding track. A lifting mechanism for driving the laser body to move up and down is provided on the sub-frame. The sub-frame includes fixed plates located on the front and rear sides of the laser body. A guide sleeve is integrally formed on the fixed plate. Guide rods are provided on both the front and rear sides of the sub-frame on the main frame. The guide sleeve is movably mounted on the guide rods. A lateral driving mechanism for driving the sub-frame to move left and right is provided on the main frame. A fixing mechanism for fixing the guide sleeve to the guide rod and fixing the laser body to the sub-frame is provided on the guide sleeve.

[0007] Preferably, the fixing mechanism includes a threaded rod, the guide sleeve has a threaded hole that penetrates the fixing plate, the guide rod has an elongated slot along its length, the threaded rod is threaded into the threaded hole and passes through the elongated slot, the guide sleeve has a receiving groove on the side of the guide rod away from the fixing plate, a first pressure plate is fixedly connected to the threaded rod in the receiving groove, and a second pressure plate is fixedly connected to the end of the threaded rod near the laser body.

[0008] Preferably, a torsion handle is fixedly connected to the end of the threaded rod away from the laser body.

[0009] Preferably, the lifting mechanism includes a motor, a lead screw, and a threaded seat. The motor is fixed on the upper side of the sub-frame, the lead screw is connected to the output shaft of the motor, and the threaded seat is fixed on the laser body and threadedly engaged with the lead screw.

[0010] Preferably, a partition is provided between the laser body and the slider, and a heat dissipation cavity is provided between the laser body, the partition and the slider. The threaded seat is located in the heat dissipation cavity and is fixedly connected to the upper side of the laser body.

[0011] Preferably, the upper and lower sides of the laser body are provided with ventilation openings at the upper and lower ends of the heat dissipation cavity, and the lead screw passes through the ventilation openings.

[0012] Preferably, the lateral drive mechanism includes a telescopic cylinder, which is fixed to the main frame, and the telescopic rod of the telescopic cylinder passes through the main frame and is fixed to the sub-frame.

[0013] In summary, the beneficial effects of this utility model are as follows:

[0014] 1. This invention provides a semiconductor laser capable of bidirectional adjustment, both vertically and horizontally. Through the cooperation of a slider and a sliding track, along with a lifting mechanism on the sub-frame, precise vertical adjustment of the laser body is achieved. Simultaneously, a lateral drive mechanism on the main frame allows the sub-frame to move horizontally, thus enabling omnidirectional position adjustment. Furthermore, the design of the fixing mechanism ensures that the laser body can be quickly and securely fixed in any position.

[0015] 2. During the fixing process, by rotating the threaded rod, the first clamping plate can be fastened to the guide rod, while the second clamping plate is pressed against the laser body. This achieves a double locking function in one step, ensuring that the laser body remains stable in any position. This simplifies the operation steps, improves work efficiency, and ensures that the laser will not shake unnecessarily due to non-human factors during use.

[0016] 3. The design of the partition and heat dissipation cavity not only makes it easy to install the laser body with the threaded seat, but also separates the laser body from the slider, providing an effective heat dissipation channel and extending the service life of the equipment, which is especially important under long-term high-load operation. Attached Figure Description

[0017] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0018] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0019] Figure 2 for Figure 1 A schematic diagram of the structure observed from another angle;

[0020] Figure 3 This is a front view of the present invention;

[0021] Figure 4 for Figure 3 Schematic diagram of the cross-sectional structure along the AA direction;

[0022] Figure 5 This is a schematic diagram of the structure where the laser body and the slider are cut apart in this utility model;

[0023] Figure 6 This is a schematic diagram of the sub-frame in this utility model;

[0024] Figure 7 This is an assembly diagram of the laser body, guide rod, and threaded rod in this utility model.

[0025] In the diagram: 1. Laser body; 11. Slider; 12. Partition plate; 13. Heat dissipation cavity; 14. Ventilation opening; 2. Main frame; 3. Guide rod; 31. Long slot; 4. Sub-frame; 41. Fixing plate; 5. Sliding track; 6. Guide sleeve; 61. Threaded hole; 62. Receiving groove; 7. Threaded rod; 71. First pressure plate; 72. Second pressure plate; 73. Twist handle; 81. Motor; 82. Lead screw; 83. Threaded seat; 9. Telescopic cylinder. Detailed Implementation

[0026] The following will refer to the appendix in the embodiments of this utility model. Figure 1-7The technical solutions in the embodiments of this utility model are clearly and completely described herein. Obviously, the described embodiments are only some embodiments of this utility model, and not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of this utility model.

[0027] Example:

[0028] like Figures 1 to 7 As shown, this utility model discloses a semiconductor laser, including a laser body 1, a main frame 2, and a sub-frame 4. A slider 11 is fixedly connected to one side of the laser body 1, and a sliding track 5 is provided on the sub-frame 4. The laser body 1 is slidably mounted on the sliding track 5 via the slider 11. A lifting mechanism for driving the laser body 1 to move up and down is provided on the sub-frame 4. In addition, the sub-frame 4 includes a fixing plate 41 located on the front and rear sides of the laser body 1, and a guide sleeve 6 is integrally formed on the fixing plate 41. The main frame 2 is provided with guide rods 3 on the front and rear sides of the sub-frame 4. The guide sleeve 6 is movably mounted on the guide rods 3 and can slide left and right. A lateral driving mechanism for driving the sub-frame 4 to move left and right is provided on the main frame 2. Furthermore, a fixing mechanism for fixing the guide sleeve 6 to the guide rods 3 and fixing the laser body 1 to the sub-frame 4 is provided on the guide sleeve 6.

[0029] Specifically, the fixing mechanism includes a threaded rod 7, and the guide sleeve 6 has a threaded hole 61 that penetrates the fixing plate 41. The guide rod 3 has a long slot 31 along its length direction. The threaded rod 7 is threaded into the threaded hole 61 and passes through the long slot 31. The guide sleeve 6 has a receiving groove 62 on the side of the guide rod 3 away from the fixing plate 41. The threaded rod 7 is fixedly connected to a first pressure plate 71 in the receiving groove 62. The threaded rod 7 is fixedly connected to a second pressure plate 71 at the end near the laser body 1. In addition, the threaded rod 7 is fixedly connected to a torsion handle 73 at the end away from the laser body 1.

[0030] Therefore, when it is necessary to fix the laser body 1, the threaded rod 7 on the front and rear guide sleeves 6 is rotated by twisting the handle 73, so that the first pressing plate 71 presses the guide rod 3 and the second pressing plate 71 presses the laser body 1. When the second pressing plate 71 of the threaded rods 7 on both the front and rear sides presses the laser body 1, the double locking is completed, ensuring that it can be firmly fixed in any position.

[0031] Furthermore, the lifting mechanism includes a motor 81, a lead screw 82, and a threaded seat 83. The motor 81 is fixed on the upper side of the sub-frame 4, the lead screw 82 is connected to the output shaft of the motor 81, and the threaded seat 83 is fixed on the laser body 1 and threadedly engaged with the lead screw 82. Therefore, by driving the lead screw 82 through the motor 81, the laser body 1 can be driven to move up and down on the sliding track 5 through the action of the threaded seat 83.

[0032] In addition, a slider 12 is provided between the laser body 1 and the slider 11 in this application. A heat dissipation cavity 13 is provided between the laser body 1, the slider 12, and the slider 11. The threaded seat 83 is located in the heat dissipation cavity 13 and is fixedly connected to the upper side of the laser body 1. Furthermore, ventilation openings 14 are provided at the upper and lower ends of the heat dissipation cavity 13 on the upper and lower sides of the laser body 1. The lead screw 82 passes through the ventilation openings 14. The design of the slider 12 and the heat dissipation cavity 13 not only facilitates the installation of the threaded seat 83 on the laser body 1, but also separates the laser body 1 from the slider 11, providing an effective heat dissipation channel and extending the service life of the equipment, which is especially important under long-term high-load operation.

[0033] In this utility model, the lateral drive mechanism includes a telescopic cylinder 9, which is fixed on the main frame 2. The telescopic rod of the telescopic cylinder 9 passes through the main frame 2 and is fixed to the sub-frame 4. The lateral drive mechanism adopts the design of the telescopic cylinder 9, which allows the sub-frame 4 to move smoothly and controllably in the horizontal direction.

[0034] It should also be noted that the terms used in this utility model, such as "front", "rear", "vertical", "horizontal", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limiting the scope of protection of this utility model.

[0035] The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A semiconductor laser, characterized in that: The system includes a laser body, a main frame, and a sub-frame. A slider is fixedly connected to one side of the laser body. The sub-frame has a sliding track on which the slider slides up and down. The sub-frame has a lifting mechanism for driving the laser body to move up and down. The sub-frame includes fixed plates located on the front and rear sides of the laser body. Guide sleeves are integrally formed on the fixed plates. The main frame has guide rods on both the front and rear sides of the sub-frame. The guide sleeves are movably fitted onto the guide rods. The main frame has a lateral driving mechanism for driving the sub-frame to move left and right. The guide sleeves have a fixing mechanism for fixing the guide sleeves to the guide rods and fixing the laser body to the sub-frame.

2. A semiconductor laser according to claim 1, characterized in that: The fixing mechanism includes a threaded rod, the guide sleeve has a threaded hole that penetrates the fixing plate, the guide rod has an elongated slot along its length, the threaded rod is threaded into the threaded hole and passes through the elongated slot, the guide sleeve has a receiving groove on the side of the guide rod away from the fixing plate, a first pressure plate is fixedly connected to the threaded rod in the receiving groove, and a second pressure plate is fixedly connected to the end of the threaded rod near the laser body.

3. A semiconductor laser according to claim 2, characterized in that: A torsion handle is fixedly connected to the end of the threaded rod away from the laser body.

4. A semiconductor laser according to claim 1, characterized in that: The lifting mechanism includes a motor, a lead screw, and a threaded seat. The motor is fixed on the upper side of the sub-frame, the lead screw is connected to the output shaft of the motor, and the threaded seat is fixed on the laser body and threadedly engaged with the lead screw.

5. A semiconductor laser according to claim 4, characterized in that: A partition is provided between the laser body and the slider, and a heat dissipation cavity is provided between the laser body, the partition and the slider. The threaded seat is located in the heat dissipation cavity and is fixedly connected to the upper side of the laser body.

6. A semiconductor laser according to claim 5, characterized in that: The laser body has ventilation openings at the top and bottom ends of the heat dissipation cavity on both sides, and the lead screw passes through the ventilation openings.

7. A semiconductor laser according to claim 1, characterized in that: The lateral drive mechanism includes a telescopic cylinder, which is fixed on the main frame. The telescopic rod of the telescopic cylinder passes through the main frame and is fixed to the sub-frame.

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