Multi-layer heat insulation and condensation prevention device for data center
By using multi-layer thermal insulation and anti-condensation devices, the thermal insulation and anti-condensation problems of the data center's external envelope have been solved, achieving efficient energy management and improved equipment stability.
Patent Information
- Application Number
- CN202423133605.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-18
- Publication Date
- 2025-12-09
- Estimated Expiration
- 2034-12-18
AI Technical Summary
Traditional data center envelope structures are inadequate in terms of thermal insulation, sealing, and condensation prevention, leading to increased energy consumption, higher equipment failure rates, and security threats.
The system employs a multi-layered heat insulation and anti-condensation device, including longitudinally and transversely arranged enclosure panels, main panels, insulation cotton, and PVC panels. These are connected by a splicing structure and sealing strips, and bonded with fire-retardant adhesive to enhance the overall strength and sealing performance of the enclosure panels.
It significantly improves the thermal insulation, sealing, and anti-condensation capabilities of data centers, reduces energy consumption and construction costs, and enhances the reliability and stability of data centers.
Smart Images

Figure CN223652564U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of data center peripheral maintenance structure technology, specifically a multi-layer heat insulation and anti-condensation device for data centers. Background Technology
[0002] With the acceleration of global informatization, data centers, as the infrastructure of the information society, are becoming increasingly important. The widespread application of technologies such as AI and big data is constantly increasing the demand for computing power. As a key infrastructure providing computing power, the scale of data centers will continue to expand to meet the high-performance computing needs of various industries. With the deepening development of the digital economy, data centers will become a key infrastructure supporting the digital transformation of various industries. Looking to the future, data centers will continue to develop towards large-scale, intelligent, and green development.
[0003] However, data centers face challenges such as high energy consumption and heat dissipation during operation, as well as equipment failures caused by external environmental factors. In particular, the external envelope of traditional data centers has many shortcomings in terms of thermal insulation, sealing, and condensation prevention, leading to increased operating costs and threats to data security and stability.
[0004] For example, existing data center enclosures use single-layer protection to address thermal insulation issues, but lack effective insulation measures, leading to heat loss and external heat interference, thus increasing data center energy consumption. This directly results in energy waste, increased operating costs, and higher equipment failure rates. Furthermore, when there is a significant temperature difference and high humidity between the inside and outside of the data center, condensation can easily occur in the server room area without effective anti-condensation measures. This can cause corrosion and short circuits to the equipment inside the data center, and also lead to dampness, mold, and even corrosion of the building structure. Some data centers densely deploy a large number of servers, storage devices, and network switching equipment. These devices generate enormous amounts of heat while operating efficiently, placing higher demands on the fire resistance of data centers. Therefore, developing a new type of data center enclosure structure to improve its thermal insulation, sealing, flame retardant properties, and anti-condensation capabilities is of great significance. Utility Model Content
[0005] The purpose of this utility model is to overcome the shortcomings in the above-mentioned background technology and provide a multi-layer thermal insulation and anti-condensation device for data centers, so as to solve the problems of the traditional external enclosure structure in terms of sealing, flame retardancy, anti-condensation and thermal insulation.
[0006] The technical solution of this utility model is:
[0007] A multi-layer thermal insulation and anti-condensation device for data centers; characterized in that: it includes a perimeter panel arranged in a longitudinal and transverse manner and interconnected by a splicing structure; the perimeter panel includes a main panel, thermal insulation cotton and a PVC panel; in the splicing structure, the four edges of the main panel are respectively inward or outward flanges, and the outward and inward flanges of two adjacent main panels are interlocked and fixed by fasteners.
[0008] The top edge of the main panel has an outward flange; the bottom edge of the main panel has an inward flange; the two sides of the main panel have outward or inward flanges; and a sealing strip is provided between the outward and inward flanges of two adjacent main panels.
[0009] The main panel has outward-curved edges on both sides, or inward-curved edges on both sides.
[0010] The thermal insulation cotton is bonded and fixed to the main panel with fire-retardant adhesive; the PVC panel is bonded and fixed to the thermal insulation cotton with fire-retardant adhesive.
[0011] The outer gap between two adjacent main panels is filled with outer structural adhesive; the edge of the PVC panel is filled with inner structural adhesive between it and the main panel.
[0012] The main panel is provided with reinforcing ribs; the insulation cotton includes main insulation cotton and reinforcing rib insulation cotton.
[0013] The main panel is made of aluminum; the sealing strip is made of EPDM fire-retardant strip; the insulation cotton is fire-retardant insulation cotton with 3M adhesive backing; the PVC panel is a PVC fire-retardant panel with 3M adhesive backing; and the fire-retardant adhesive is Flüss 520 fire-retardant adhesive.
[0014] The beneficial effects of this utility model are:
[0015] The data center uses an innovative modular enclosure, multi-layer thermal insulation and anti-condensation device, which significantly improves the thermal insulation performance, sealing performance and environmental adaptability of the data center, effectively reduces energy consumption and construction costs, enhances the reliability and stability of the data center, and significantly improves its overall aesthetics and professional image. Attached Figure Description
[0016] Figure 1 This is one of the three-dimensional structural schematic diagrams of this utility model (showing the front of the enclosure).
[0017] Figure 2 This is a three-dimensional structural diagram of the enclosure panel of this utility model.
[0018] Figure 3 This is an exploded view of the enclosure panel of this utility model.
[0019] Figure 4 This is the second three-dimensional structural schematic diagram of this utility model (showing the back of the enclosure).
[0020] Figure 5 yes Figure 4 Enlarged schematic diagram of part A in the middle.
[0021] Figure 6 yes Figure 4 Enlarged schematic diagram of section B.
[0022] Figure 7 This is one of the schematic diagrams of the connection method of the enclosure panel of this utility model (showing the front of the enclosure panel).
[0023] Figure 8 yes Figure 7 Enlarged diagram of section C.
[0024] Figure 9 This is the second schematic diagram of the connection of the enclosure panels of this utility model (connection of the upper and lower enclosure panels, PVC panel and insulation cotton omitted).
[0025] Figure 10 This is the third schematic diagram of the connection of the enclosure panels of this utility model (connection of the left and right enclosure panels, PVC panels and insulation cotton omitted).
[0026] Figure label:
[0027] Main panel 1, mounting groove 1-1, outer flange 11, inner flange 12, female enclosure 13, female enclosure 14, insulation cotton 2, main body insulation cotton 21, reinforcing rib insulation cotton 22, PVC panel 3, sealing strip 4, reinforcing rib 5, outer structural adhesive 6-1, inner structural adhesive 6-2, fasteners 7. Detailed Implementation
[0028] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.
[0029] like Figure 1 , Figure 2 As shown, a multi-layer thermal insulation and anti-condensation device for data centers includes enclosure panels. The enclosure panels are arranged in a longitudinal and transverse manner, not only along the horizontal direction but also along the vertical direction, and are interconnected by splicing structures.
[0030] like Figure 3As shown, the enclosure includes a main panel 1, insulation cotton 2, and a PVC panel 3. The main panel is rectangular, with a smooth front surface. The four edges of the main panel have flanges that bend towards the back side, forming a mounting groove 1-1. The insulation cotton and the PVC panel are placed in the mounting groove. The insulation cotton is first bonded to the main panel, and then the PVC panel is bonded to the insulation cotton. The PVC panel of the enclosure faces the computer room, and the main panel faces the outside of the computer room.
[0031] like Figure 3 As shown, a horizontally arranged reinforcing rib 5 is provided in the center of the back of the main panel. The reinforcing rib is connected to the flanges on both sides of the main panel to enhance the overall strength and rigidity of the panel. The main panel is made of aluminum plate.
[0032] The insulation material is fire-retardant insulation material with 3M adhesive backing. The insulation material is bonded and fixed to the mounting groove on the back of the main panel using fire-retardant adhesive and 3M adhesive backing. The insulation material includes main insulation material 21 and reinforcing insulation material 22. The reinforcing insulation material is bonded and fixed to the reinforcing ribs. The two main insulation materials are respectively positioned above and below the reinforcing insulation material and bonded and fixed to the rest of the main panel.
[0033] The PVC panel is a fire-retardant PVC panel with 3M adhesive backing. The PVC panel is bonded to the back of the insulation cotton using fire-retardant adhesive and 3M adhesive, giving the enclosure structure both aesthetic appeal and durability. The fire-retardant adhesive is Flex 520 fire-retardant adhesive to enhance its flame-retardant properties.
[0034] The splicing structure includes flanges, sealing strips 4, and fasteners 7. The flanges are outer flanges 11 and inner flanges 12 respectively set on the top edge, bottom edge, and both sides of the main panel.
[0035] The outward bend is achieved by bending the edge of the main panel twice in opposite directions at 90 degrees: first, bending it 90 degrees towards the back of the main panel, and second, bending it 90 degrees towards the periphery of the main panel. The inward bend is achieved by bending the edge of the main panel twice in the same direction at 90 degrees: first, bending it 90 degrees towards the back of the main panel, and second, bending it 90 degrees towards the center of the main panel.
[0036] The main panel includes two structures: Structure 1, which is the mother panel 13, with an outward-turned top edge, an inward-turned bottom edge, and outward-turned sides; Structure 2, which is the sub-panel 14, with an outward-turned top edge, an inward-turned bottom edge, and inward-turned sides.
[0037] When two adjacent main panels are joined, the outer and inner flanges interlock, a sealing strip is embedded between them, and fasteners secure the outer and inner flanges to ensure strength and facilitate installation and maintenance. Figure 9 As shown, vertically, the inward-curved edge at the bottom of the upper main panel and the outward-curved edge at the top of the lower main panel fit together vertically. Figure 10 As shown, in the horizontal direction, the inward flange of one side of the main panel fits into the outward flange of the other side of the main panel.
[0038] like Figure 4 , Figure 7 As shown, the mother panels are arranged vertically (longitudinally), and the daughter panels are also arranged vertically (longitudinally). The mother panels and daughter panels are arranged alternately in the horizontal direction (laterally).
[0039] The sealing strip is an EPDM fire-retardant strip. It is used for flexible connections between panels, preventing direct contact between adjacent panels and thus corrosion. The fasteners are bolts and nuts; through holes are provided on the outer and inner flanges and the sealing strip, allowing the bolts to pass through these holes before engaging with the nuts.
[0040] like Figure 7 , Figure 8 As shown, the outer gap between two adjacent main panels is filled with external structural adhesive 6-1. (As indicated...) Figure 8 As shown, the outer structural adhesive on the outside of the enclosure is in a mesh pattern. (As...) Figure 6 As shown, the gap between the edge of the PVC panel and the main panel is filled with internal structural adhesive 6-2 to seal the gap, prevent condensation, and further enhance the waterproof, heat insulation, and sealing performance.
[0041] The data center's multi-layer thermal insulation and anti-condensation enclosure structure adopts a modular design, which has advantages such as scalability, maintainability, aesthetics, and durability. It can be customized and expanded according to the actual size and type of the data center, and is suitable for data centers of various sizes and types.
[0042] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.
Claims
1. A multi-layer thermal insulation and anti-condensation device for data centers; characterized in that: It includes a series of panels arranged in a longitudinal and transverse manner and connected to each other by a splicing structure; the panels include a main panel (1), insulation cotton (2) and a PVC panel (3); in the splicing structure, the four edges of the main panel are respectively an inner flange (12) or an outer flange (11), and the outer flanges and inner flanges of two adjacent main panels are interlocked and fixed by fasteners (7).
2. The multi-layer thermal insulation and anti-condensation device for data centers according to claim 1, characterized in that: The top edge of the main panel is provided with an outward flange (11); the bottom edge of the main panel is provided with an inward flange (12); the two sides of the main panel are provided with outward flanges or inward flanges; a sealing strip (4) is also provided between the outward flanges and inward flanges of two adjacent main panels.
3. The multi-layer thermal insulation and anti-condensation device for data centers according to claim 2, characterized in that: The main panel has outward-curved edges on both sides, or inward-curved edges on both sides.
4. The multi-layer thermal insulation and anti-condensation device for data centers according to claim 3, characterized in that: The thermal insulation cotton is bonded and fixed to the main panel with fire-retardant adhesive; the PVC panel is bonded and fixed to the thermal insulation cotton with fire-retardant adhesive.
5. A multi-layer thermal insulation and anti-condensation device for data centers according to claim 4, characterized in that: The outer gap between two adjacent main panels is filled with outer structural adhesive (6-1); the edge of the PVC panel is filled with inner structural adhesive (6-2) between it and the main panel.
6. A multi-layer thermal insulation and anti-condensation device for data centers according to claim 1 or 5, characterized in that: The main panel is provided with reinforcing ribs (5); the insulation cotton includes main insulation cotton (21) and reinforcing rib insulation cotton (22).
7. A multi-layer thermal insulation and anti-condensation device for data centers according to claim 6, characterized in that: The main panel is an aluminum plate; the insulation cotton is fireproof insulation cotton with 3M adhesive backing; the PVC panel is a PVC fireproof panel with 3M adhesive backing.