Liquid gas gasification heat transfer and absorption device

Abstract

The utility model discloses a liquid gas gasification heat transfer and absorption device which comprises a liquid gas storage device used for containing liquid gas; the gasifier is used for converting the liquid gas into gaseous gas; the liquid gas storage device is communicated with the gasifier through the gasification pipeline; the heat dissipation equipment is equipment for generating heat; and the gasification pipeline exchanges heat with the heat dissipation equipment through the heat exchange assembly. The gasification pipeline and the heat dissipation equipment can exchange heat so that low temperature of the gasification pipeline can be transmitted to the heat dissipation equipment, cooling of the heat dissipation equipment is achieved, the gasification pipeline absorbs heat from the heat dissipation equipment, and heating of the gasification pipeline is achieved. The liquid gas in the gasification pipeline absorbs heat generated by the heat dissipation equipment, and the temperature of the liquid gas entering the gasifier is relatively high, so that the energy absorbed in the gasification process of the liquid gas in the gasifier is reduced; the heat dissipation equipment obtains the cooling capacity from the gasification pipeline, cooling of the heat dissipation equipment is achieved, energy integration is achieved, and energy waste is reduced.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of liquid gas gasification, and particularly relates to a liquid gas gasification heat transfer and absorption device. BACKGROUND

[0002] A large amount of heat needs to be absorbed in the process of converting liquid nitrogen into gaseous nitrogen. At present, the pipeline of liquid nitrogen in the conveying process exchanges heat with the external atmospheric environment, that is, absorbs heat from the atmospheric environment and releases the cold of the liquid nitrogen to the atmospheric environment, causing waste of energy.

[0003] Therefore, how to provide a liquid gas gasification heat transfer and absorption device to realize energy integration and reduce energy waste is a technical problem to be solved by those skilled in the art. CONTENT OF THE UTILITY MODEL

[0004] In view of the above problems, the present application provides a liquid gas gasification heat transfer and absorption device, which realizes energy integration and reduces energy waste.

[0005] The specific scheme is as follows:

[0006] The first aspect of the present application provides a liquid gas gasification heat transfer and absorption device, comprising: a liquid gas storage device, the liquid gas storage device is used for containing liquid gas; a gasifier, the gasifier is used for converting liquid gas into gaseous gas; a gasification pipeline, the liquid gas storage device and the gasifier are communicated through the gasification pipeline; a heat dissipation device, the heat dissipation device is a device that generates heat; a heat exchange assembly, the gasification pipeline and the heat dissipation device are heat exchanged through the heat exchange assembly.

[0007] In a possible implementation, the liquid gas gasification heat transfer and absorption device, the heat exchange assembly comprises: a heat conduction member, the heat conduction member is in contact with the gasification pipeline for heat conduction; a heat exchanger, a first side of the heat exchanger is connected with the heat conduction member, and a second side of the heat exchanger is communicated with the heat dissipation device; the first side and the second side of the heat exchanger are in contact for heat conduction.

[0008] In a possible implementation, the liquid gas gasification heat transfer and absorption device, the heat exchange assembly further comprises: a heat transfer device, the heat conduction member is in contact with the heat transfer device for heat conduction, and the heat dissipation area of the heat conduction member and the heat transfer device is adjustable.

[0009] In a possible implementation, the liquid gas gasification heat transfer and absorption device, the heat conduction member comprises: a sleeve, the sleeve is sleeved on the outside of the gasification pipeline, and the inner wall of the sleeve is attached to the outer wall of the gasification pipeline; a heat conduction fin, the heat conduction fin is connected with the sleeve, and the heat dissipation area of the heat conduction fin and the heat transfer device is adjustable.

[0010] In a possible implementation of the liquid gas vaporization heat transfer and absorption device, the heat transfer device comprises a cooling liquid tank containing cooling liquid, and the heat conduction fins extend into the cooling liquid tank.

[0011] In a possible implementation of the liquid gas vaporization heat transfer and absorption device, the adjusting device comprises a telescopic cylinder, or the adjusting device is a liquid reservoir in communication with the cooling liquid tank, and the cooling liquid in the cooling liquid tank can enter the liquid reservoir, or the adjusting device comprises an elastic air bag in the cooling liquid tank and a compressed air storage device outside the cooling liquid, and the compressed air storage device is in communication with the elastic air bag.

[0012] In a possible implementation of the liquid gas vaporization heat transfer and absorption device, the first side of the heat exchanger is provided with a first circulating liquid path in communication with the cooling liquid tank, and the second side of the heat exchanger is provided with a second circulating liquid path in heat exchange with the heat dissipation device.

[0013] In a possible implementation of the liquid gas vaporization heat transfer and absorption device, the heat exchange assembly further comprises a temperature sensor for detecting the temperature of the cooling liquid in the cooling liquid tank, and a controller connected with the temperature sensor and the adjusting device and capable of controlling the operation of the adjusting device.

[0014] In a possible implementation of the liquid gas vaporization heat transfer and absorption device, the temperature sensor is installed in the cooling liquid tank, or the temperature sensor comprises a first temperature sensor for detecting the temperature of the cooling liquid at the outlet of the cooling liquid tank and a second temperature sensor for detecting the temperature of the cooling liquid at the inlet of the cooling liquid tank.

[0015] In a possible implementation of the liquid gas vaporization heat transfer and absorption device, the heat exchange assembly further comprises a liquid level sensor for detecting the liquid level in the cooling liquid tank, and the liquid level sensor is connected with the controller.

[0016] By the technical scheme, the liquid gas gasification heat transfer absorption device provided by the application can realize heat exchange between the gasification pipeline and the heat dissipation equipment, so as to transfer the low temperature of the gasification pipeline to the heat dissipation equipment, realize the cooling of the heat dissipation equipment, and realize the heating of the gasification pipeline by absorbing heat from the heat dissipation equipment. Since the liquid gas in the gasification pipeline absorbs the heat generated by the heat dissipation equipment, the temperature of the liquid gas entering the gasifier is relatively high, which is beneficial to reducing the energy absorbed in the gasification process of the liquid gas in the gasifier; and the heat dissipation equipment obtains cold energy from the gasification pipeline, realizes the cooling of the heat dissipation equipment, and realizes the energy integration and reduces the energy waste. BRIEF DESCRIPTION OF DRAWINGS

[0017] The above and other features, advantages, and aspects of the present disclosure will become more apparent by referring to the following detailed description in conjunction with the accompanying drawings. Throughout the drawings, the same or similar reference numerals indicate the same or similar elements. It should be understood that the drawings are schematic, and the original and elements are not necessarily drawn according to the scale.

[0018] Figure 1 A structure schematic diagram of the liquid gas gasification heat transfer absorption device provided by the embodiment of the application is provided.

[0019] Figure 2 A first connection relationship diagram of the heat exchange assembly provided by the embodiment of the application is provided.

[0020] Figure 3 Another state diagram of the first connection relationship of the heat exchange assembly provided by the embodiment of the application is provided.

[0021] Figure 4 A structure schematic diagram of the heat exchange assembly provided by the embodiment of the application is provided.

[0022] Figure 5 A second connection relationship diagram of the heat exchange assembly provided by the embodiment of the application is provided.

[0023] Figure 6 Another state diagram of the second connection relationship of the heat exchange assembly provided by the embodiment of the application is provided.

[0024] Figure 7 A partial structure schematic diagram of the third structure of the heat exchange assembly provided by the embodiment of the application is provided.

[0025] Figure 8 Another state diagram of the partial structure of the third structure of the heat exchange assembly provided by the embodiment of the application is provided.

[0026] Figure 9 A connection relationship diagram of the third structure of the heat exchange assembly provided by the embodiment of the application is provided.

[0027] Wherein,

[0028] 1 is a liquid gas storage device, 2 is a gasification pipeline, 3 is a gasifier, 4 is a gas using device, 5 is a heat dissipation device, 6 is a heat conducting member, 7 is a heat exchanger, 8 is a heat transfer device, 9 is a circulating pump, 100 is a heat exchange assembly;

[0029] 61 is a sleeve, 62 is a heat conducting fin, 71 is a first side, 72 is a second side, 711 is a first outlet, 712 is a first inlet, 721 is a second inlet, 722 is a second outlet, 81 is a cooling liquid tank, 82 is a regulating device, 821 is a connecting plate, 822 is a telescopic cylinder, 823 is an elastic air bag, 824 is a compressed air storage device, 10 is a controller, 11 is a liquid level sensor, 12 is a first temperature sensor, 13 is a second temperature sensor. DETAILED DESCRIPTION

[0030] The embodiments of the present application are described below in conjunction with the accompanying drawings. The terms used in the embodiment part of the present application are only used to explain the specific embodiments of the present application, and are not intended to limit the present application.

[0031] The embodiments of the present application are described below in conjunction with the accompanying drawings. The skilled person can know that, with the development of technology and the emergence of new scenarios, the technical solutions provided by the embodiments of the present application are also applicable to similar technical problems.

[0032] The terms "first", "second", and the like in the specification and claims of the present application and the above-described drawings are used to distinguish similar objects, and do not necessarily indicate a specific order or sequence. It should be understood that the terms used in this way can be interchanged under appropriate circumstances, and this is only a way of distinguishing the objects with the same attributes in the description of the embodiments of the present application. In addition, the terms "include" and "have" and any variations thereof are intended to cover non-exclusive inclusion, so that the process, method, system, product or equipment including a series of units does not have to be limited to those units, but can include other units not clearly listed or inherent to these processes, methods, products or equipment.

[0033] Nitrogen is an inert gas with stable chemical properties and is not easily reacted with other substances. This property enables nitrogen to effectively isolate oxygen, water vapor and other components in the air that may have adverse effects on semiconductor materials during the semiconductor manufacturing process, thereby maintaining the purity of the production environment.

[0034] Nitrogen is usually stored in liquid form, and when nitrogen is needed, liquid nitrogen is converted into gaseous nitrogen.

[0035] The liquid nitrogen needs to absorb a large amount of heat in the process of being converted into gaseous nitrogen. At present, the pipeline of the liquid nitrogen in the conveying process exchanges heat with the external atmospheric environment, that is, absorbs heat from the atmospheric environment, and releases the cold of the liquid nitrogen to the atmospheric environment, causing waste of energy.

[0036] As shown in Figure 1 , Figure 1 The structure diagram of the liquid gas gasification heat transfer and absorption device provided by the embodiment of the present application, Figure 1 The liquid gas gasification heat transfer and absorption device comprises a liquid gas storage device 1, a gasification pipeline 2, a gasifier 3, a gas using equipment 4, a heat dissipation equipment 5 and a heat exchange assembly 100.

[0037] The liquid gas storage device 1 is used for containing liquid gas. For example, the liquid gas storage device 1 includes but is not limited to a liquid gas storage tank. The structure of the liquid gas storage device 1 can refer to the existing equipment for storing liquid gas. It should be noted that the liquid gas in the present application includes but is not limited to liquid nitrogen or liquid argon. Hereinafter, the conversion of liquid nitrogen into gaseous nitrogen is taken as an example for description.

[0038] The gasifier 3 is a device for converting liquid gas into gaseous gas. For example, the gasifier 3 is also called a nitrogen generator. The structure of the gasifier 3 can refer to the existing structure, which will not be described herein.

[0039] The gasification pipeline 2 is a pipeline connecting the liquid gas storage device 1 and the gasification pipeline 2, and is used for conveying the liquid nitrogen in the liquid gas storage device 1 to the gasifier 3.

[0040] During the flowing of the liquid nitrogen through the gasification pipeline 2, the liquid nitrogen is gradually gasified in the pipeline, and the low temperature generated by the gasification exchanges heat with the external environment through the gasification pipeline 2, that is, absorbs heat from the atmospheric environment, and then enters the gasifier 3 and is converted into gaseous state in the gasifier 3.

[0041] The gas using equipment 4 is a device using nitrogen. For example, the gas using equipment 4 can be a processing equipment needing nitrogen protection in the process of semiconductor device processing, and the embodiment of the present application is not limited to the processing equipment of semiconductor device.

[0042] The heat dissipation equipment 5 is a device generating heat. For example, the heat dissipation equipment 5 is a cooling tower, an ice machine (refrigeration equipment) or an air compressor and the like needing heat dissipation. The heat dissipation equipment 5 can be selected according to the application scene.

[0043] The heat exchange assembly 100 connects the gasification pipeline 2 and the heat dissipation equipment 5. The heat exchange assembly 100 is used for transferring the heat generated by the heat dissipation equipment 5 to the gasification pipeline 2, and providing the heat to the liquid nitrogen in the gasification pipeline 2, so as to realize the heat absorption of the liquid nitrogen.

[0044] The gasification pipeline 2 of the embodiment of the present application can exchange heat with the heat dissipation device 5 to transfer the low temperature of the gasification pipeline 2 to the heat dissipation device 5, realize the cooling of the heat dissipation device 5, and the gasification pipeline 2 absorbs heat from the heat dissipation device 5, realizes the heating of the gasification pipeline 2. Because the liquid gas in the gasification pipeline 2 absorbs the heat generated by the heat dissipation device 5, the temperature of the liquid gas entering the gasifier 3 is relatively high, which is beneficial to reduce the energy absorbed in the gasification process of the liquid gas in the gasifier 3; and the heat dissipation device 5 obtains cold energy from the gasification pipeline 2, realizes the cooling of the heat dissipation device 5, that is, realizes the energy integration, and reduces the waste of energy.

[0045] In some embodiments, in combination with Figures 2 to 4 The structure of the liquid gas gasification heat transfer and absorption device of the heat exchange assembly 100 and the first structure of the heat exchange assembly are described. Among them, Figure 2 The first connection relationship diagram of the heat exchange assembly provided by the embodiment of the present application; Figure 3 Another state diagram of the first connection relationship of the heat exchange assembly provided by the embodiment of the present application; Figure 4 The structure diagram of the heat exchange assembly provided by the embodiment of the present application.

[0046] Figure 2 In the embodiment, the heat exchange assembly 100 includes a heat conduction member 6, a heat exchanger 7 and a heat transfer device 8.

[0047] The heat conduction member 6 is connected with the gasification pipeline 2 to exchange heat with the gasification pipeline 2. For example, the heat conduction member 6 is sleeved on the outside of the gasification pipeline 2.

[0048] Figure 2 The heat conduction member 6 in the embodiment includes a sleeve 61 and a heat conduction fin 62.

[0049] The sleeve 61 is a cylindrical structure and is sleeved on the outside of the gasification pipeline 2. In some embodiments, the inner wall of the sleeve 61 is arranged in close contact with the outer wall of the gasification pipeline 2 to realize the connection of the sleeve 61 with the gasification pipeline 2 and improve the heat conduction efficiency of the sleeve 61 with the gasification pipeline 2.

[0050] The heat conduction fin 62 is connected with the outer wall of the sleeve 61. For example, the heat conduction fin 62 is integrally formed or welded with the sleeve 61. The heat conduction fin 62 is a plurality of fins and is arranged around the circumference of the outer wall of the sleeve 61.

[0051] In some embodiments, the heat conduction member 6 is made of a material with good heat conduction performance, such as metal material. The metal material includes but is not limited to copper and aluminum.

[0052] The heat transfer device 8 is connected with the heat conduction member 6 and can exchange heat with the heat conduction member 6. Figure 2 The heat transfer device 8 in the embodiment includes a cooling liquid tank 81 and an adjusting device 82.

[0053] The cooling liquid tank 81 is used to contain cooling liquid, which includes but is not limited to water or other heat-conducting medium. The heat-conducting fins 62 extend into the cooling liquid tank 81 and can exchange heat with the cooling liquid.

[0054] The adjusting device 82 is used to adjust the relative position of the heat-conducting fins 62 and the cooling liquid in the cooling liquid tank, so as to change the contact area between the cooling liquid in the cooling liquid tank 81 and the heat-conducting fins 62, thereby adjusting the heat dissipation area of the heat-conducting member 6 and the heat transfer device 8.

[0055] Figure 2 The heat exchanger 7 in the heat exchanger assembly 100 includes a first side 71 and a second side 72.

[0056] The first side 71 is connected with the cooling liquid tank 81, and the second side 72 is connected with the heat dissipation device 5. For example, the first side 71 is integrated with a first circulating liquid path having a first inlet 712 and a first outlet 711. The second side 72 is integrated with a second circulating liquid path having a second inlet 721 and a second outlet 722.

[0057] The first inlet 712 is in communication with the outlet of the cooling liquid tank 81, and the first outlet 711 is in communication with the inlet of the cooling liquid tank 81, so as to realize the circulation of the cooling liquid between the cooling liquid tank 81 and the first side 71.

[0058] The second inlet 721 is in communication with the inlet of the heat dissipation device 5, and the second outlet 722 is in communication with the outlet of the heat dissipation device 5, so as to realize the circulation of the liquid in the second side 72 between the second side 72 and the heat dissipation device 5.

[0059] The cooling liquid in the first side 71 is the same as the cooling liquid in the cooling liquid tank 81, and the cooling liquid in the second side 72 is the same as or different from the cooling liquid in the first side 71.

[0060] The first side 71 and the second side 72 are not in communication and can exchange heat, so as to realize the heat exchange between the cooling liquid in the cooling liquid tank 81 and the heat dissipation device 5.

[0061] Some embodiments are provided with a circulating pump 9 between the cooling liquid tank 81 and the first inlet 712, and a circulating pump 9 between the second outlet 722 and the heat dissipation device 5.

[0062] The circulating pump 9 can improve the circulation rate of the liquid between the first side 71 and the cooling liquid tank 81, and improve the circulation rate of the liquid between the second side 72 and the heat dissipation device 5.

[0063] The above discloses the specific structure of the heat exchanger assembly 100, and the following will be described in combination with Figure 3 The adjusted state of the heat exchanger assembly 100 is described. The above discloses the specific structure of the heat exchanger assembly 100, and the following will be described in combination with

[0064] Figure 3 The distance between the heat-conducting fin 62 of the heat exchange assembly 100 and the cooling liquid tank 81 is smaller than the distance between the heat-conducting fin 62 of the heat exchange assembly 100 and the cooling liquid tank 81 in the prior art. Figure 2 The distance between the heat-conducting fin 62 and the cooling liquid tank 81 is increased, so that Figure 3 The contact area between the heat-conducting fin 62 and the cooling liquid in the cooling liquid tank 81 is reduced.

[0065] In combination with Figure 4 It can be seen that the adjusting device 82 of the embodiment of the present application can be a lifting assembly for controlling the movement of the cooling liquid tank 81 relative to the heat-conducting fin 62.

[0066] Figure 4 The adjusting device 82 in the embodiment of the present application comprises a connecting plate 821 and a telescopic air cylinder 822.

[0067] One end of the telescopic air cylinder 822 is fixed, and the other end is fixedly connected with the cooling liquid tank 81, and the lifting of the adjusting device 82 can be driven by the extension and contraction of the cylinder rod of the telescopic air cylinder 822.

[0068] The cylinder rod of the telescopic air cylinder 822 is connected through the connecting plate 821, and the connecting plate 821 is fixed on the cooling liquid tank 81.

[0069] In some embodiments, the adjusting device 82 comprises but is not limited to two, and is distributed at both ends of the length direction of the cooling liquid tank 81 (the direction of the longer length of the bottom surface of the cooling liquid tank 81).

[0070] It should be noted that during the driving of the cooling liquid tank 81 by the telescopic air cylinder 822, the pipeline between the cooling liquid tank 81 and the heat exchanger 7 is a flexible pipe, so as to prevent the pipeline from being broken during the lifting of the cooling liquid tank 81.

[0071] In some embodiments, the adjusting device 82 in the present application can also be other structures, which will be described below in combination with Figures 5 to 8 The adjusting device 82 provided in the embodiment of the present application can also be described as other structures, and it should be noted that the adjusting device 82 of the present application is not limited to the disclosed structure. Among them, Figure 5 a second connection relationship diagram of the heat exchange assembly provided in the embodiment of the present application;

[0072] Figure 6 another state diagram of the second connection relationship of the heat exchange assembly provided in the embodiment of the present application; Figure 7 a structure diagram of a third structure of the heat exchange assembly provided in the embodiment of the present application; Figure 8 a structure diagram of another state of the third structure of the heat exchange assembly provided in the embodiment of the present application; Figure 9 a connection relationship diagram of the third structure of the heat exchange assembly provided in the embodiment of the present application.

[0073] In combination Figure 5 and Figure 6 It can be seen that the adjusting device 82 of the embodiment of the present application can also be a liquid reservoir, and the liquid reservoir can be in communication with the cooling liquid tank 81.

[0074] The liquid level in the cooling liquid tank 81 is changed by leading the liquid in the cooling liquid tank 81 into the liquid reservoir or leading the liquid in the liquid reservoir into the cooling liquid tank 81, and then the contact area between the cooling liquid in the cooling liquid tank 81 and the heat-conducting fins 62 is changed.

[0075] The cooling liquid tank 81 and the liquid reservoir are in communication through a pipeline (not shown in the figure), and a switch valve (not shown in the figure) is arranged on the pipeline.

[0076] In combination Figure 7 and Figure 8 As shown in the figure, the adjusting device 82 comprises an elastic air bag 823 and a compressed air storage device 824.

[0077] The elastic air bag 823 is located in the cooling liquid tank 81, and the volume of the elastic air bag 823 can be changed. For example, the elastic air bag 823 is made of rubber. It should be noted that the maximum volume of the elastic air bag 823 is not specifically limited here, and the elastic air bag 823 is bonded or limited to the bottom of the cooling liquid tank 81 or the side wall of the cooling liquid tank 81.

[0078] The compressed air storage device 824 is located outside the cooling liquid tank 81, and the compressed air storage device 824 and the elastic air bag 823 can be in communication.

[0079] The compressed air storage device 824 comprises but is not limited to a box structure, and the compressed air storage device 824 and the elastic air bag 823 comprise but are not limited to being in communication through a pipeline, and an electromagnetic valve for controlling the opening and closing of the pipeline is arranged on the pipeline.

[0080] The opening and closing of the pipeline is controlled by the electromagnetic valve, which can realize automatic control, reduce the labor intensity of the operator, and improve the response speed of the liquid level control of the cooling liquid in the cooling liquid tank 81.

[0081] On the basis of the above technical solutions, in combination Figure 5 , Figure 6 and Figure 9 As shown in the figure, the heat exchange assembly 100 of some embodiments further comprises a controller 10, a liquid level sensor 11, a first temperature sensor 12 and a second temperature sensor 13.

[0082] The liquid level sensor 11 is used to detect the liquid level of the cooling liquid in the cooling liquid tank 81. For example, the liquid level sensor is installed on the cooling liquid tank 81 and located on the inner wall of the cooling liquid tank 81.

[0083] The first temperature sensor 12 is arranged between the first inlet 712 and the outlet of the cooling liquid tank 81, and is used to detect the temperature of the cooling liquid at the outlet of the cooling liquid tank 81. The second temperature sensor 13 is arranged between the first outlet 711 and the inlet of the cooling liquid tank 81, and is used to detect the temperature of the cooling liquid at the inlet of the cooling liquid tank 81.

[0084] The controller 10 is connected with the liquid level sensor 11, the first temperature sensor 12 and the second temperature sensor 13, for example, in a communication connection or an electrical connection.

[0085] The controller 10 is connected with the adjusting device 82, for example, in a communication connection or an electrical connection.

[0086] The controller 10 controls the adjusting device 82 to change the contact area between the cooling liquid in the cooling liquid tank 81 and the heat-conducting fins 62 according to the information detected by the liquid level sensor 11, the first temperature sensor 12 and the second temperature sensor 13.

[0087] In order to avoid the cooling liquid in the cooling liquid tank 81 from freezing due to the temperature being too low after heat exchange with the gasification pipeline 2, the first temperature sensor 12 and the second temperature sensor 13 are used to monitor the temperature of the cooling liquid in the cooling liquid tank 81. When the temperature of the cooling liquid in the cooling liquid tank 81 approaches the freezing point, the adjusting device 82 adjusts the height of the cooling liquid tank 81 relative to the heat-conducting fins 62, so as to reduce the contact area between the heat-conducting fins 62 and the cooling liquid in the cooling liquid tank 81, thereby relieving the problem of the temperature being too low in the cooling liquid tank 81. Conversely, when the first temperature sensor 12 and the second temperature sensor 13 detect that the temperature of the cooling liquid in the cooling liquid tank 81 is relatively high, the adjusting device 82 adjusts the height of the cooling liquid tank 81 relative to the heat-conducting fins 62, so as to increase the contact area between the heat-conducting fins 62 and the cooling liquid in the cooling liquid tank 81, thereby improving the heat exchange rate.

[0088] It should be noted that in some embodiments, a temperature sensor can also be arranged in the cooling liquid tank 81 to directly obtain the temperature in the cooling liquid tank 81. For example, a plurality of temperature sensors can be arranged along the depth of the cooling liquid in the cooling liquid tank 81 to improve the accuracy of temperature monitoring in the cooling liquid tank 81.

[0089] The controller 10 can obtain the liquid level height in the cooling liquid tank 81 according to the liquid level sensor 11, and remind whether the liquid level height in the cooling liquid tank 81 needs to be adjusted according to the detected information, so as to prevent the liquid level in the cooling liquid tank 81 from being too low to affect heat exchange.

[0090] In addition, the controller 10 can also be connected with the circulating pump 9, and the circulating flow rate of the cooling liquid between the cooling liquid tank 81 and the first side 71 and the circulating flow rate of the cooling liquid between the second side 72 and the heat dissipation device 5 can be changed by controlling the power of the circulating pump 9.

[0091] The various embodiments described in this specification are intended to be illustrative only and in no way limit the scope of the application. Changes and modifications can be made to these embodiments without departing from the spirit or scope of the application. Accordingly, the specification is to be regarded in an illustrative rather than a restrictive sense, and all such modifications are intended to be included within the scope of the present application.

[0092] The above description of disclosed embodiments is intended to be illustrative only and not limiting of the scope of the application. Many modifications of the embodiments described herein will be readily apparent to those skilled in the art and the general principles defined herein can be applied to other embodiments without departing from the spirit or scope of the application. Accordingly, the specification is to be regarded as illustrative only and not restrictive of the scope of the present application.

Claims

1. A liquid gas gasification heat transfer absorption apparatus, comprising: The application relates to a heat exchange assembly (100) for a liquid gas storage device (1) and a heat generating device (5). The heat exchange assembly (100) comprises: a heat conducting member (6) in contact with the gasification pipeline (2) for heat conduction; a heat exchanger (7) with a first side (71) connected to the heat conducting member (6) and a second side (72) in communication with the heat generating device (5); the first side (71) and the second side (72) of the heat exchanger (7) are in contact for heat conduction. The heat exchange assembly (100) further comprises: a heat transfer device (8) in contact with the heat conducting member (6) for heat conduction, and the heat transfer area of the heat conducting member (6) and the heat transfer device (8) is adjustable.

2. The liquid gas gasification heat transfer absorption apparatus of claim 1, wherein, The heat conducting member (6) comprises: a sleeve (61) sleeved on the outside of the gasification pipeline (2), and the inner wall of the sleeve (61) is attached to the outer wall of the gasification pipeline (2); heat conducting fins (62) connected to the sleeve (61), and the heat transfer area of the heat conducting fins (62) and the heat transfer device (8) is adjustable.

3. The liquid gas gasification heat transfer absorption apparatus of claim 2, wherein, The heat transfer device (8) comprises: a cooling liquid tank (81) containing cooling liquid, and the heat conducting fins (62) extend into the cooling liquid tank (81); 4. The liquid gas gasification heat transfer absorbing apparatus of claim 3, wherein, an adjusting device (82) for adjusting the relative position of the heat conducting fins (62) and the liquid level in the cooling liquid tank (81), wherein the relative position is the relative position along the extension direction of the heat conducting fins (62). The adjusting device (82) comprises a telescopic air cylinder; alternatively, the adjusting device (82) is a liquid storage device in intermittent communication with the cooling liquid tank (81), and the cooling liquid in the cooling liquid tank (81) can enter the liquid storage device; 5. The liquid gas gasification heat transfer absorption apparatus of claim 4, wherein, alternatively, the adjusting device (82) comprises an elastic air bag (823) in the cooling liquid tank (81) and a compressed air storage device (824) outside the cooling liquid tank (81), and the compressed air storage device (824) is in intermittent communication with the elastic air bag (823). A first circulating liquid path in communication with the cooling liquid tank (81) is arranged in the first side (71) of the heat exchanger (7); A second circulating liquid path in heat exchange with the heat generating device (5) is arranged in the second side (72) of the heat exchanger (7).

6. The liquid gas gasification heat transfer absorption apparatus of claim 5, wherein, The heat exchange assembly (100) further comprises: a temperature sensor for detecting the temperature of the cooling liquid in the cooling liquid tank (81); ​ 7. The liquid gas gasification heat transfer absorbing apparatus of claim 5 wherein, ​ ​ 8. The liquid gas gasification heat transfer absorbing apparatus of claim 5 wherein, ​ ​ A controller (10) is connected with the temperature sensor and the adjusting device (82), and can control the operation of the adjusting device (82).

9. The liquid gas gasification heat transfer absorbing apparatus of claim 8, wherein, The temperature sensor is installed in the cooling liquid tank (81); Alternatively, the temperature sensor comprises a first temperature sensor (12) and a second temperature sensor (13), the first temperature sensor is used for detecting the temperature of the cooling liquid at the outlet of the cooling liquid tank (81), and the second temperature sensor is used for detecting the temperature of the cooling liquid at the inlet of the cooling liquid tank (81).

10. The liquid gas gasification heat transfer removal absorption apparatus according to claim 8 or 9, wherein, The heat exchange assembly (100) further comprises: A liquid level sensor (11) is used for detecting the liquid level in the cooling liquid tank (81), and the liquid level sensor (11) is connected with the controller (10).

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