Compact substrate lifting module

Abstract

The utility model discloses a compact substrate lifting module, which relates to the technical field of semiconductor processing, and comprises a base, a platform deck and a driving mechanism are arranged on the base, and the platform deck is arranged at the top of the base; during processing, the module is arranged at a processing position on a material track path, and when a substrate is conveyed to the carrying table, the carrying table is driven by the driving mechanism to ascend, so that the substrate is arranged on the top surface of the base plate of the working table, the height adjustment of the substrate is completed, the integral ascending and descending of the track are not needed, and convenience and rapidness are realized; the heating sheet is arranged to heat the substrate on the base plate of the workbench, so that the height adjustment and heating of the substrate can be conveniently and quickly completed, and the adaptability of chip processing is improved; the auxiliary carrying tables are arranged on the two sides of the main carrying table, the substrates are preheated through the two auxiliary carrying tables, then the substrates are transferred to the main carrying table to be machined, and the machining efficiency is improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of semiconductor processing, concretely is a compact substrate lifting module. BACKGROUND

[0002] With the development of lead frame, the depth of lead frame is from 0-600um. When the chip mounter needs to import the substrate with different downset depth, the glue drawing work area and the chip mounting work area of the chip mounter need to be lifted to adjust the working height, so as to ensure that the working height of the glue drawing module and the chip mounting module is consistent. If the mounted chip is a large pressure sintering process power chip, the track needs to have a heating function when mounting. The track module of the ordinary chip mounter has no automatic lifting mechanism or the track is lifted as a whole. When replacing the lead frame with different depth, the equipment needs to be rechecked, and the process is complex. The track lifting as a whole will cause all the sub-modules mounted on the track to move up and down, which will greatly affect other modules, and a large power servo motor is needed to provide driving force. In addition, the ordinary chip mounter has no track heating function, and cannot mount sintering process power chips, so the mountable chip products are very limited.

[0003] Therefore, there is an urgent need for a compact substrate lifting module. CONTENT OF THE UTILITY MODEL

[0004] In view of the problems in the prior art, the utility model solves the problems by the following technical structure.

[0005] To achieve the above purpose, the utility model adopts the following technical scheme:

[0006] A compact substrate lifting module, comprising: a base, the base is provided with a loading platform and a driving mechanism, the loading platform is arranged on the top of the base;

[0007] The loading platform is provided with three, which are a main loading platform and two vice loading platforms arranged on both sides of the main loading platform, and the loading platform comprises a workbench pad, a mounting layer, a heating sheet and a sealing gasket arranged in sequence from top to bottom;

[0008] The driving mechanism is used for driving the three loading platforms to move up and down.

[0009] Further features are that,

[0010] The base is provided with a lifting plate, and the three loading platforms are arranged on the top surface of the lifting plate.

[0011] The driving mechanism comprises a cam, a cam follower and a driving part for driving the cam to rotate towards the horizontal direction, the cam is arranged in the base, the top end of the cam is uniformly provided with two wave-shaped convex parts in the circumference, the cam follower is arranged at the bottom of the lifting plate, and two ends of the cam follower are rotatably provided with rollers, and the two rollers are arranged at the top end of the cam.

[0012] The driving part comprises a frameless motor arranged on the base, the frameless motor is arranged on the ring side of the cam, and the cam is connected with the mover of the frameless motor.

[0013] The base is provided with a cylindrical roller bearing, and the cam is arranged on the cylindrical roller bearing.

[0014] The base is provided with a rotary encoder, and the cam is provided with an inductive magnet.

[0015] The bottom of the lifting plate is vertically provided with a plurality of guide rods, and the guide rods are arranged on the base.

[0016] The base comprises a ring plate and a bottom plate arranged at the bottom of the ring plate, and the driving mechanism is arranged on the inner side of the ring plate.

[0017] The bottom plate is fixed on the ring plate by bolts.

[0018] The workbench pad plate is provided with a plurality of vacuum adsorption holes.

[0019] The above structure of the utility model can achieve the following beneficial effects:

[0020] During processing, the module is placed at the processing position on the material track path, when the base plate is conveyed to the loading platform, the loading platform is driven to rise by the driving mechanism, the base plate is placed on the top surface of the workbench pad plate, the height adjustment of the base plate is completed, the whole track does not need to be lifted, which is convenient and fast; the setting of the heating piece heats the base plate on the workbench pad plate, so that the height adjustment and heating of the base plate are conveniently and quickly completed, the adaptability of chip processing is improved; and the auxiliary loading platforms are arranged on both sides of the main loading platform, the base plate is preheated by the two auxiliary loading platforms, and then is transferred to the main loading platform for processing, so that the processing efficiency is improved. BRIEF DESCRIPTION OF DRAWINGS

[0021] Figure 1 It is a structural schematic view of the embodiment;

[0022] Figure 2 It is a structural sectional view of part of the structure in the embodiment;

[0023] Figure 3 It is an exploded structural schematic view of the loading platform in the embodiment;

[0024] Figure 4The structure diagram of the cam and the cam follower in the embodiment.

[0025] In the figure: 1, base; 2, main carrier; 3, auxiliary carrier; 4, workbench backing plate; 5, mounting layer; 6, heating sheet; 7, sealing gasket; 8, cam; 9, cam follower; 10, protruding part; 11, roller; 12, frameless motor; 13, lifting plate; 14, rotary encoder; 15, cylindrical roller bearing; 16, guide rod. DETAILED DESCRIPTION

[0026] In order to make the personnel in the technical field better understand the technical scheme of the present application, the technical scheme in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all the other embodiments obtained by the person skilled in the art without making creative efforts should belong to the protection scope of the present application.

[0027] It should be noted that the terms "include" and "have" and any variations thereof in the specification and claims of the present application and the above-mentioned drawings are intended to cover the non-exclusive inclusion, for example, a process, method, device, product or equipment containing a series of steps or units does not have to be limited to the clearly listed steps or units, but can include other steps or units that are not clearly listed or inherent to these processes, methods, products or equipment.

[0028] The above-mentioned embodiments are described in detail below in conjunction with the drawings. Figures 1-4 The present application is further described in detail.

[0029] Reference Figures 1-3As shown in one of the compact substrate lifting module, comprising: base 1, base 1 is provided with a platform and drive mechanism, the platform is provided on the top of base 1; The platform is provided with three, respectively, main platform 2 and set up on both sides of the main platform 2 vice platform 3, the platform includes from top to bottom in turn workbench pad plate 4, installation layer 5, heating piece 6 (using high temperature resistant PI heating piece, working temperature 250 DEG C) and sealing gasket 7; Drive mechanism for driving three platform to do lifting movement, so, when processing, the module is placed in the material track path on the processing position, when the substrate is transported to the platform, the platform is driven to rise by the drive mechanism, the substrate is placed on the top surface of the workbench pad plate 4, the height adjustment of the substrate is completed, without track overall lifting, convenient and fast; And the setting of heating piece 6, the substrate on the workbench pad plate 4 is heated, so as to conveniently and quickly complete the height adjustment and heating of the substrate, improve the adaptability of chip processing; And the two vice platforms 3 are arranged on both sides of the main platform 2, the substrate is preheated by the two vice platforms 3, and then is transferred to the main platform 2 for processing, thereby improving the processing efficiency.

[0030] As Figure 1 , Figure 2 and Figure 4 As shown, in order to realize the height adjustment of the three platforms, the base 1 is provided with a lifting plate 13, and the three platforms are arranged on the top surface of the lifting plate 13. The drive mechanism specifically comprises a cam 8, a cam follower 9 and a driving member for driving the cam 8 to rotate in the horizontal direction. The cam 8 is arranged in the base 1, and the top end of the cam 8 is uniformly provided with two wave-shaped protrusions 10 (as shown in Figure 4 ). The cam follower 9 is arranged at the bottom of the lifting plate 13, and the two ends of the cam follower 9 are rotatably provided with rollers 11. The two rollers 11 are arranged at the top end of the cam 8. Thus, by driving the cam 8 to rotate, the rollers 11 at the two ends of the cam follower 9 are located at different positions at the top end of the cam 8. When moving to the protrusion 10, the height of the cam follower 9 is lifted. When moving between the two protrusions 10, the height of the cam follower 9 is lowered, thereby completing the height adjustment of the lifting plate 13 and realizing the height adjustment of the substrate on the platform. In order to improve the smoothness of the rotation of the cam 8, the base 1 is provided with a cylindrical roller bearing 15, and the cam 8 is arranged on the cylindrical roller bearing 15. In order to reduce the friction resistance of the rotation of the cam 8 and reduce the load of the driving member, the base 1 is provided with a cylindrical roller bearing 15, and the cam 8 is arranged on the cylindrical roller bearing 15. In order to know the rotation angle of the cam 8 and achieve accurate adjustment, the base 1 is provided with a rotary encoder 14, and the cam 8 is provided with a sensing magnet. The rotary encoder 14 is installed on the motor mounting seat on the base 1, and the sensing magnet is fixed on the cam 8 by adhesive means. The rotary encoder 14 accurately feeds back the rotation angle of the cam 8.

[0031] Further optimization is as followsFigure 2 As shown, the driving member includes a frameless motor 12 arranged on the base 1, the frameless motor 12 is arranged on the ring side of the cam 8, the cam 8 is connected with the mover of the frameless motor 12, the cam 8 is rotated by rotating the mover of the frameless motor 12, the design that the frameless motor 12 is sleeved on the ring side of the cam 8 reduces the volume of the module, is convenient for installation, and improves the adaptability of the module.

[0032] As shown in the figure, Figure 2 As shown, in order to improve the stability of the movement of the lifting plate 13, the bottom of the lifting plate 13 is vertically provided with a plurality of guide rods 16, the plurality of guide rods 16 are all arranged on the base 1, and the movement of the lifting plate 13 is guided and limited by the plurality of guide rods 16.

[0033] As shown in the figure, Figure 2 As shown, in order to facilitate disassembly and maintenance, the base 1 includes a ring plate and a bottom plate arranged at the bottom of the ring plate, the driving mechanism is arranged on the inner side of the ring plate, and the bottom plate is fixed on the ring plate by bolts, so that the devices inside the ring plate can be repaired and maintained by removing the bottom plate.

[0034] Further optimization is that, in order to fix the substrate on the carrier, a plurality of vacuum adsorption holes are arranged on the workbench pad 4, since the workbench pad 4 is a chip mounting work area, the vacuum adsorption holes are arranged for adsorbing lead frames.

[0035] Further optimization is that, the lifting plate 13 is processed with a heat dissipation air groove for structural heat dissipation, so as to ensure that the working environment temperature of the frameless motor 12 does not exceed 60 DEG C.

[0036] In summary, during processing, the module is placed at a processing position on the material track path, when the substrate is conveyed to the carrier, the carrier is driven to rise by the driving mechanism, so that the substrate is placed on the top surface of the workbench pad 4, and the height adjustment of the substrate is completed, without the need of overall lifting of the track, which is convenient and fast; the arrangement of the heating piece 6 heats the substrate on the workbench pad 4, so that the height adjustment and heating of the substrate are conveniently and quickly completed, and the adaptability of chip processing is improved; and the secondary carriers 3 are arranged on both sides of the main carrier 2, the substrate is preheated by the two secondary carriers 3, and then is transferred to the main carrier 2 for processing, so that the processing efficiency is improved.

[0037] The frameless motor 12, the cam 8, the cylindrical roller bearing 15 and the rotary encoder 14 in the module adopt a nested layout design, which greatly reduces the size of the module, and requires a smaller track installation surface.

[0038] The above is only the preferred embodiment of the present application, and the present application is not limited to the above embodiments. It can be understood that other improvements and changes directly derived or thought by those skilled in the art without departing from the spirit and concept of the present application should be considered to be included in the protection scope of the present application.

Claims

1. A compact substrate lift module, characterized by, The utility model relates to a three -dimensional printing device, including: Base (1), be provided with the stage and drive mechanism on base (1), the stage is set up in the top of base (1); The stage is provided with three, is main stage (2) and the vice stage (3) of setting up in the two sides of main stage (2) respectively, and the stage includes workbench backing plate (4), installation layer (5), heating piece (6) and sealing gasket (7) that are sequentially set up from top to bottom; The drive mechanism is used for driving three stages to do lifting motion.

2. The compact substrate lift module of claim 1, wherein: Base (1) is provided with lifting plate (13), and three stages are all set up in the top surface of lifting plate (13).

3. The compact substrate lift module of claim 2, wherein: The drive mechanism includes cam (8), cam follower (9) and the drive piece for driving cam (8) to rotate towards horizontal direction, cam (8) is set up in base (1), and the top end of cam (8) is evenly provided with two wave-shaped convex parts (10) in circumference, cam follower (9) is set up in the bottom of lifting plate (13), and the both ends of cam follower (9) are rotatably provided with roller (11), and two roller (11) are set up in the top end of cam (8).

4. The compact substrate lift module of claim 3, wherein: The drive piece includes frameless motor (12) set up on base (1), frameless motor (12) is set up in the ring side of cam (8), and cam (8) is connected with the mover of frameless motor (12).

5. The compact substrate lift module of claim 3, wherein: Base (1) is provided with cylindrical roller bearing (15), and cam (8) is set up on cylindrical roller bearing (15).

6. The compact substrate lift module of claim 3, wherein: Base (1) is provided with rotary encoder (14), and inductive magnet is set up on cam (8).

7. The compact substrate lift module of claim 2, wherein: The bottom of lifting plate (13) is vertically provided with a plurality of guide rods (16), and a plurality of guide rods (16) are all penetrated on base (1).

8. The compact substrate lift module of claim 3, wherein: Base (1) includes ring plate and bottom plate set up in the bottom of ring plate, and drive mechanism is set up in the inner side of ring plate.

9. The compact substrate lift module of claim 8, wherein: The bottom plate is fixed on the ring plate by bolt.

10. The compact substrate lift module of claim 1, wherein: Workbench backing plate (4) is provided with a plurality of vacuum adsorption holes.

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