High-luminous-efficiency full-spectrum lamp bead

Abstract

The utility model provides a high luminous efficiency full spectrum lamp bead, which comprises an LED support and a light emitting structure arranged in the LED support, the light emitting structure comprises a base and a bowl wall annularly arranged on the base, the light emitting structure comprises purple light chips and blue light chips which are arranged on the base at intervals, the blue light chips adopt multi-crest chips, and the blue light chips adopt multi-crest chips. The blue light chip is arranged on the bowl wall, the surface of the blue light chip is covered with fluorescent glue, the fluorescent glue comprises an infrared fluorescent powder layer and a first flowing colloid layer which are mixed with each other, and packaging glue layers are arranged above the fluorescent glue and the blue light chip and in the bowl wall. The excitation efficiency is improved, namely the brightness and the lighting effect of the whole product are improved; the infrared powder is excited by a single area, the reabsorption of the infrared powder to exciting light of other fluorescent powder is reduced, the excitation efficiency of purple light is high, the use amount of the infrared powder can be effectively reduced through superposition of the effects of the infrared powder and the purple light, and the brightness is improved.

Description

TECHNICAL FIELD

[0001] The utility model discloses LED chip production and manufacturing technical field, especially relate to a high luminous efficiency full spectrum lamp bead. BACKGROUND

[0002] In prior art, when packaging LED, two wave bands of 440+460 are usually adopted to be connected in series, the blue light area width is enhanced through high-low wave mixing, and the spectral continuity is enhanced, and the chip is filled with fluorescent glue, and different types of fluorescent powder including red+green+yellow+blue+infrared are selected to enhance the spectral continuity, and the uniform mixed points are above the chip, the packaging mode makes the infrared powder excitation efficiency of LED low, seriously affects the luminous efficiency of full spectrum lamp bead, makes the brightness or light efficiency unable to reach the level of conventional lamp bead, and because the infrared powder excitation efficiency is low, the powder amount is high, further increases the cost of lamp bead. UTILITY MODEL CONTENTS

[0003] In view of the defects of prior art, the utility model discloses a high luminous efficiency full spectrum lamp bead, which aims at solving the technical problems that the infrared powder excitation efficiency of LED is low in prior art, seriously affects the luminous efficiency of full spectrum lamp bead, makes the brightness or light efficiency unable to reach the level of conventional lamp bead, and because the infrared powder excitation efficiency is low, the powder amount is high, further increases the cost of lamp bead.

[0004] In order to realize the above-mentioned purpose, the utility model is through following technical scheme to realize:

[0005] A high luminous efficiency full spectrum lamp bead, including LED support and the light emitting structure that is established in the LED support, the light emitting structure includes the base and the bowl wall that is arranged on the base, the light emitting structure includes the violet light chip and the blue light chip that are arranged at intervals on the base, the blue light chip adopts the multi-wave peak chip, the violet light chip surface is covered with the fluorescent glue layer, the fluorescent glue layer includes the infrared fluorescent powder layer and the first flow colloidal layer that mix with each other, the fluorescent glue layer and the blue light chip top and the bowl wall are equipped with the encapsulation glue layer.

[0006] According to one aspect of the above technical solution, the wave band of the violet light chip is less than 440nm.

[0007] According to one aspect of the above technical solution, the inner side of the bowl wall is arranged in a stepped manner, including the first gradient segment and the second gradient segment arranged above the first gradient segment, the first gradient segment and the second gradient segment are both arranged in a slope from inside to outside, and a platform is formed between the first gradient segment and the second gradient segment.

[0008] According to an aspect of the above technical solution, the first ladder section violet light chip and the blue light chip are provided with an isolation table for blocking light waves between the violet light chip and the blue light chip.

[0009] According to an aspect of the above technical solution, the fluorescent glue layer is arranged between the first ladder section and the isolation table, and the top surface of the fluorescent glue layer, the platform and the isolation table are at the same horizontal height.

[0010] According to an aspect of the above technical solution, the fluorescent glue layer is in a semicircular shape and covers the violet light chip, and the inner side of the bowl wall is inclined from inside to outside.

[0011] According to an aspect of the above technical solution, the violet light chip and the base are connected by a first bonding wire, the blue light chip and the base are connected by a second bonding wire, and the violet light chip and the blue light chip are connected by a third bonding wire.

[0012] According to an aspect of the above technical solution, the packaging glue layer comprises a color fluorescent powder layer and a second flowable glue layer.

[0013] According to an aspect of the above technical solution, the refractive index of the second flowable glue layer is greater than that of the first flowable glue layer.

[0014] Compared with the prior art, the beneficial effects of the present application are as follows:

[0015] By using the violet light chip with the best excitation waveband of infrared powder, the fluorescent glue layer containing infrared powder is excited in a separate area, thereby improving the excitation efficiency and the brightness and light efficiency of the whole product; the infrared powder is excited in a separate area, the mixing of infrared powder and other powder is reduced, the violet light excitation efficiency is high, and the effects of the two are superimposed to effectively reduce the use amount of infrared powder; the proportion of infrared fluorescent powder can be conveniently adjusted according to the situation, the violet light is absorbed, the overflow of violet light to the product and human body is reduced, the bracket is divided into parts, the violet light excitation area is set up, which is beneficial to the process operation process, the first flowable glue layer adopts low-refraction glue, which is more resistant to violet light irradiation and can improve the product life. BRIEF DESCRIPTION OF DRAWINGS

[0016] Figure 1 It is a schematic diagram of the LED packaging structure in the prior art;

[0017] Figure 2 It is a structure schematic diagram of the high light efficiency full spectrum lamp bead in the first embodiment of the present application;

[0018] Figure 3 It is a structure schematic diagram of the high light efficiency full spectrum lamp bead in the second embodiment of the present application;

[0019] Main element symbol explanation:

[0020]

[0021] The following detailed description will further describe the present application in conjunction with the above-mentioned drawings. DETAILED DESCRIPTION

[0022] In order to facilitate the understanding of the present application, the present application will be described more fully below with reference to the accompanying drawings. The drawings show several embodiments of the present application. However, the present application can be realized in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present application more thorough and comprehensive.

[0023] It should be noted that when an element is referred to as being "fixedly attached" to another element, it can be directly on the other element or there can be intervening elements. When an element is referred to as being "connected" or "coupled" to another element, it can be directly connected or coupled to the other element or intervening elements can be present. The terms "vertical", "horizontal", "left", "right", and the like as used herein are for purposes of illustration only.

[0024] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used in the description of the application herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. As used herein, the term "and / or" includes any and all combinations of one or more of the associated listed items.

[0025] Referring to Figure 1 , the LED packaging structure in the prior art is shown.

[0026] Referring to Figure 2 , a high-efficiency full-spectrum lamp bead in the first embodiment of the present application is shown, which comprises an LED support and a light-emitting structure arranged in the LED support. The light-emitting structure comprises a base 10 and a bowl wall 16 arranged around the base 10. The light-emitting structure comprises a violet light chip 12 and a blue light chip 13 arranged on the base 10. The blue light chip 13 adopts a multi-peak chip. The surface of the violet light chip 12 is covered with a fluorescent glue layer 14, which contains an infrared fluorescent powder layer and a first flowable colloid layer mixed with each other. The fluorescent glue layer 14 and the blue light chip 13 are provided with a packaging glue layer 15 above and in the bowl wall 16.

[0027] It can be understood that the utility model discloses a purple light chip 12 that is best for exciting infrared powder is adopted, the fluorescent glue layer 14 containing infrared powder is excited in a separate area, and the excitation efficiency is improved, that is, the brightness and light efficiency of the whole product are improved.

[0028] Specifically, in the embodiment, the wavelength band of the purple light chip 12 is less than 440 nm, and the optimal excitation wavelength band is selected according to the infrared powder excitation spectrum.

[0029] It can be understood that the appropriate high-efficiency excitation wavelength band is selected for the purple light chip 12 to excite the low-efficiency infrared fluorescent powder layer, so that the excitation efficiency can be enhanced, and the brightness and light efficiency can be improved.

[0030] The single blue light chip 13 adopts multiple wave peaks, so that the spectral width can be widened, and the continuity of the blue light region can be enhanced.

[0031] It should be noted that the infrared fluorescent powder layer in the fluorescent glue layer 14 and the first flowing colloid layer are conventional collocation modes in the prior art, and the utility model does not belong to the improvement of the material. In addition, the proportion of the infrared fluorescent powder layer in the fluorescent glue layer 14 and the first flowing colloid layer needs to be adjusted to meet the demand of the full-spectrum infrared region. A higher proportion of infrared powder makes the purple light be fully absorbed, and the proportion of glue and powder is adjusted to further reduce the overflow of the purple light. The first flowing colloid layer uses low-refraction glue, which is more resistant to purple light than high-refraction glue, and the reliability is ensured.

[0032] Further, the inner side of the bowl wall 16 is arranged in a stepped manner and includes a first step 161 and a second step 162 arranged above the first step 161, the first step 161 and the second step 162 are both arranged in a slope from inside to outside, and a platform 163 is formed between the first step 161 and the second step 162; an isolation table 11 is arranged between the purple light chip 12 and the blue light chip 13 of the first step 161, and the isolation table 11 is used to block the light waves between the purple light chip 12 and the blue light chip 13; the fluorescent glue layer 14 is arranged between the first step 161 and the isolation table 11, and the top surface of the fluorescent glue layer 14, the platform 163 and the isolation table 11 are located at the same horizontal height.

[0033] It can be understood that the existence of the isolation table 11 can further reduce the problem of the light color excited by the blue light area being absorbed by the infrared powder of the purple light area, resulting in a decrease in brightness. At the same time, the isolation table 11 and the platform 163 can be used as a height calibration of the fluorescent glue layer 14, so that the fluorescent glue layer 14 completely covers the purple light chip 12 without being too thick. The light emitted by the purple light chip 12 can be reflected by the slope of the first step 161 after scattering in the fluorescent glue layer 14, thereby making the purple light in the fluorescent glue layer 14 more uniform, greatly improving the scattering efficiency. The light after the fluorescent glue layer 14 will be scattered in the packaging glue layer 15 and will be reflected again when it hits the slope of the first step 161, making the light in the packaging glue layer 15 more uniform, and finally greatly improving the scattering effect of the light from the packaging glue layer 15. In order to prevent the fluorescent glue layer 14 from overflowing the height of the isolation table 11, it can be briefly baked during preparation. The time is determined according to the characteristics of the first flow glue layer

[0034] Further, the purple light chip 12 and the base 10 are connected by a first bonding wire 17, the blue light chip 13 and the base 10 are connected by a second bonding wire 19, and the purple light chip 12 and the blue light chip 13 are connected by a third bonding wire 18.

[0035] It can be understood that the purple light chip 12 and the blue light chip 13 are connected in series, and the first bonding wire 17, the second bonding wire 19 and the third bonding wire 18 are all used to connect the purple light chip 12 and the blue light chip 13 with the substrate to provide power.

[0036] Further, the packaging glue layer 15 comprises a color fluorescent powder layer and a second flow glue layer mixed with each other; the refractive index of the second flow glue layer is greater than the refractive index of the first flow glue layer.

[0037] It can be understood that the color fluorescent powder layer uses conventional red / green / yellow / cyan fluorescent powder, which is mixed with the glue of the second flow glue layer in a certain proportion according to the color temperature color point display requirements; the glue of the second flow glue layer uses high-refraction packaging glue to improve the brightness output, the glue manufacturer of the second flow glue layer is consistent with the low-refraction glue, and the catalysts are the same, so as to avoid the catalyst poisoning and unable to solidify due to the common baking of different glues.

[0038] In summary, the high light efficiency full spectrum lamp bead in the above-mentioned embodiments of the utility model, through adopting the purple light chip 12 of the best excitation wave band of infrared powder, taking the single area to excite the fluorescent glue layer 14 containing infrared powder, improves its excitation efficiency, namely improves the brightness and light efficiency of the whole product, the single area excites infrared powder, reduces the mixing of infrared powder and other powder, and the purple light excitation efficiency is high, the effect of the two is superimposed, which can effectively reduce the use amount of infrared powder, the proportion of suitable infrared fluorescent powder can be more conveniently adjusted according to the situation, the purple light is absorbed, and the harm of purple light overflow to the product and human body is reduced, the inner part of the support is partitioned, the purple light single excitation area is set up, which is beneficial to the process operation process, and the first flow colloidal layer adopts low-refraction glue, which is more resistant to purple light irradiation and can improve the product life.

[0039] Please refer to Figure 3 The high light efficiency full spectrum lamp bead in the second embodiment of the utility model is shown in the figure, and the difference between the high light efficiency full spectrum lamp bead in the second embodiment and the first embodiment is that:

[0040] The fluorescent glue layer 14 is semicircular and covers the upper side of the purple light chip 12, and the inner side of the bowl wall 16 is inclined from inside to outside. Since the isolation table 11 is not provided, the bowl wall 16 does not need to be provided with the first step 161 and the second step 162, and can be directly arranged as an inclined surface, which adopts low-flowability glue + infrared fluorescent powder, points the fluorescent glue layer 14 to the chip surface, and also achieves the local excitation effect, but the process requires high precision and the process is more difficult than using the partition support.

[0041] In the description of the present specification, the description of the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the utility model. In the present specification, the illustrative description of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0042] The above-described embodiments only express several implementation manners of the utility model, the description is more specific and detailed, but it cannot be understood as the limitation of the scope of the utility model patent. It should be noted that for ordinary skilled persons in the art, without departing from the concept of the utility model, a number of modifications and improvements can be made, which belong to the protection scope of the utility model. Therefore, the protection scope of the utility model patent should be subject to the appended claims.

Claims

1. A high luminous efficacy full spectrum lamp bead, characterized in that, The application relates to an LED support and a light-emitting structure arranged in the LED support, wherein the light-emitting structure comprises a base and a bowl wall arranged around the base, the light-emitting structure comprises a purple light chip and a blue light chip arranged on the base, the blue light chip adopts a multi-wave peak chip, the surface of the purple light chip is covered with a fluorescent glue layer, the fluorescent glue layer comprises an infrared fluorescent powder layer and a first flowable colloid layer mixed with each other, and a packaging glue layer is arranged above the fluorescent glue layer and the blue light chip and in the bowl wall.

2. The high-photopic full-spectrum lamp bead according to claim 1, wherein, The wave band of the purple light chip is less than 440 nm.

3. The high-photopic full-spectrum lamp of claim 1, wherein, The inner side of the bowl wall is arranged in a stepped mode and comprises a first step and a second step arranged above the first step, the first step and the second step are arranged in a slope mode from inside to outside, and a platform is formed between the first step and the second step.

4. The high-photopic full-spectrum lamp of claim 3, wherein, An isolation table is arranged between the first step purple light chip and the blue light chip, and the isolation table is used for blocking the light wave between the purple light chip and the blue light chip.

5. The high-photopic full-spectrum lamp of claim 4, wherein, The fluorescent glue layer is arranged between the first step and the isolation table, the top surface of the fluorescent glue layer, the platform and the isolation table are located at the same horizontal height.

6. The high-photopic full-spectrum lamp of claim 1, wherein, The fluorescent glue layer is in a semicircular shape and covers the purple light chip, and the inner side of the bowl wall is arranged in a slope mode from inside to outside.

7. The high-photopic full-spectrum lamp of claim 1, wherein, The purple light chip and the base are connected through a first bonding wire, the blue light chip and the base are connected through a second bonding wire, and the purple light chip and the blue light chip are connected through a third bonding wire.

8. The high-photopic full-spectrum lamp of claim 1, wherein, The packaging glue layer comprises a color fluorescent powder layer and a second flowable colloid layer mixed with each other.

9. The high-photopic full-spectrum lamp claim 8, wherein, The refractive index of the second flowable colloid layer is greater than that of the first flowable colloid layer.

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