Feeding device for semiconductor molding compound

Abstract

The utility model relates to the technical field of feeding devices, in particular to a feeding device for semiconductor molding compounds. According to the technical scheme, the device comprises a bottom plate, a frame is fixedly arranged on one side of the upper surface of the bottom plate, a hopper is fixedly installed on the upper surface of the frame, and a vibration disc used for conveying materials is fixedly arranged on the other side of the upper surface of the bottom plate; the material conveying rail is fixedly arranged on the upper surface of the bottom plate, and one end of the material conveying rail is located at an outlet of the vibration disc; a first conveying module used for grabbing and conveying materials is arranged above the material conveying rail, and a second conveying module used for conveying the materials is arranged under the first conveying module. According to the utility model, material transmission in a three-dimensional space can be realized, compared with manual feeding, the conveying position and speed of the material can be accurately controlled, the semiconductor plastic package material can be ensured to accurately reach a target position, the physical labor of workers is reduced, the labor intensity is reduced, and the safety and comfort of a working environment are improved.

Description

Technical Field

[0001] This utility model relates to the field of feeding device technology, and in particular to a feeding device for semiconductor molding compound. Background Technology

[0002] Semiconductor molding compound is a material used for packaging semiconductor devices. It typically consists of epoxy resin, hardener, filler, and other additives. The main function of semiconductor molding compound is to protect semiconductor chips from external environmental influences, while providing electrical insulation and mechanical support. During semiconductor manufacturing, semiconductor chips need to be encapsulated in molding compound to protect them and improve their reliability and stability. Currently, the loading of semiconductor molding compound is usually done manually, which is not only inefficient and requires a large investment of manpower and time, but also prone to waste and contamination of the molding compound. Furthermore, improper operation or negligence during manual loading can lead to spillage and loss of molding compound, increasing production costs. In addition, manual operation may introduce impurities and contaminants, affecting the quality and performance of the molding compound, and thus posing a potential threat to the quality of semiconductor products. Therefore, this invention proposes a semiconductor molding compound loading device to improve production efficiency and product quality. Utility Model Content

[0003] The purpose of this invention is to address the problem that in the background art, the loading of semiconductor molding compound is usually done manually, which is not only inefficient and requires a lot of manpower and time, but also prone to waste and contamination of molding compound. Moreover, during the manual loading process, improper operation or negligence may lead to spillage and loss of molding compound, increasing production costs. In addition, manual operation may also introduce impurities and contaminants, affecting the quality and performance of molding compound, and thus posing a potential threat to the quality of semiconductor products. Therefore, this invention proposes a semiconductor molding compound loading device.

[0004] The technical solution of this utility model is as follows: a feeding device for semiconductor molding compound, comprising: a base plate, a frame fixedly disposed on one side of the upper surface of the base plate, a hopper fixedly mounted on the upper surface of the frame, and a vibratory feeder for conveying materials fixedly disposed on the other side of the upper surface of the base plate; a conveying rail fixedly disposed on the upper surface of the base plate, with one end of the conveying rail located at the outlet of the vibratory feeder; a first conveying module for gripping and conveying materials disposed above the conveying rail, and a second conveying module for conveying materials disposed directly below the first conveying module.

[0005] Optionally, the first conveying module includes a first guide rail, a first linear motor is fixedly mounted at one end of the first guide rail, a first sliding block is slidably mounted on one side of the first guide rail, an electric push rod is fixedly connected to the upper end of the first sliding block, a mounting bracket is fixedly connected to the output end of the electric push rod, a mechanical gripper is fixedly mounted on the upper surface of the mounting bracket, and a first drag chain is slidably mounted on the upper surface of the first guide rail, the first drag chain being fixedly connected to the first sliding block.

[0006] Optionally, the second conveying module includes a second guide rail, a second linear motor is fixedly mounted on one end of the second guide rail, a second drag chain is slidably mounted on one side of the second linear motor, a second connecting block is slidably mounted on the upper surface of the second guide rail and connected to the second drag chain, a support frame is fixedly mounted on the upper surface of the second connecting block, and a plurality of placement trays for storing materials are fixedly mounted on the upper surface of the support frame.

[0007] Optionally, a controller is fixedly mounted on one side of the frame.

[0008] Optionally, a bracket is fixedly provided on the upper surface of the base plate, and a detection probe is fixedly installed at the upper end of the bracket, with the lower end of the detection probe extending into the vibrating plate.

[0009] Optionally, a guide hopper is inclinedly provided at the bottom outlet of the hopper, and one end of the guide hopper extends directly above the vibratory feeder.

[0010] In summary, this application includes at least one of the following beneficial technical effects:

[0011] This utility model, through the setting of a material conveying rail, a first conveying module, and a second conveying module, can realize material transfer in three-dimensional space. Compared with manual feeding, it can precisely control the conveying position and speed of the material, ensuring that the semiconductor molding compound can accurately reach the target position, reducing the physical labor of workers, reducing labor intensity, and improving the safety and comfort of the working environment.

[0012] Furthermore, by setting up a support frame and a placement tray, semiconductor molding compounds can be neatly placed. After loading, it is convenient to move multiple semiconductor molding compounds into the mold at the same time for molding operations, thereby improving production efficiency. Attached Figure Description

[0013] Figure 1 A schematic diagram of a semiconductor molding compound feeding device is provided;

[0014] Figure 2 It is an indication Figure 1 Schematic diagram of the structure of the vibratory feeder;

[0015] Figure 3 It is an indication Figure 1A schematic diagram of the structure of the first transmission module.

[0016] Figure label:

[0017] 1. Base plate; 2. Frame; 3. Hopper; 4. Vibratory feeder; 5. Conveying rail;

[0018] 6. First conveyor module; 61. First guide rail; 62. First linear motor; 63. First sliding block; 64. Electric push rod; 65. Mounting bracket; 66. Mechanical gripper; 67. First cable chain;

[0019] 7. Second conveyor module; 71. Second guide rail; 72. Second linear motor; 73. Second cable chain; 74. Second connecting block; 75. Support frame; 76. Placement tray;

[0020] 8. Controller; 9. Support; 10. Detection probe; 11. Feed hopper. Detailed Implementation

[0021] The technical solution of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are some embodiments of this utility model, but not all embodiments.

[0022] The components of the present invention embodiments described and shown in the accompanying drawings can typically be arranged and designed in a variety of different configurations. Therefore, the following detailed description of the embodiments of the present invention provided in the drawings is not intended to limit the scope of the claimed invention, but merely to illustrate selected embodiments of the invention.

[0023] Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this utility model.

[0024] In the description of this utility model, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the accompanying drawings and are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0025] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0026] Example

[0027] like Figure 1 As shown, the present invention proposes a semiconductor molding compound feeding device, comprising: a base plate 1, a frame 2 fixedly mounted on one side of the upper surface of the base plate 1, and the base plate 1 and the frame 2 being integrally formed to improve the stability of the frame 2 support; a hopper 3 fixedly mounted on the upper surface of the frame 2; and a vibratory feeder 4 for conveying materials fixedly mounted on the other side of the upper surface of the base plate 1, which can neatly arrange and convey the semiconductor molding compound; a conveying rail 5 fixedly mounted on the upper surface of the base plate 1, with one end of the conveying rail 5 located at the outlet of the vibratory feeder 4, facilitating the horizontal conveying of the semiconductor molding compound from the vibratory feeder 4; a first conveying module 6 for gripping and conveying materials located above the conveying rail 5, facilitating the horizontal conveying of the semiconductor molding compound; and a second conveying module 7 for conveying materials located directly below the first conveying module 6, which can realize three-dimensional material transmission of the semiconductor molding compound and improve the accuracy of material conveying.

[0028] like Figure 1 and Figure 3 As shown, the first conveying module 6 includes a first guide rail 61, and the upper surface and side surface of the first guide rail 61 are provided with sliding grooves. A first linear motor 62 is fixedly installed at one end of the first guide rail 61 to provide stable power. A first sliding block 63 is slidably installed on one side of the first guide rail 61. The sliding groove can stably guide the first sliding block 63. An electric push rod 64 is fixedly connected to the upper end of the first sliding block 63. A mounting frame 65 is fixedly connected to the output end of the electric push rod 64 to facilitate pushing the mounting frame 65 to move vertically up and down. A mechanical gripper 66 is fixedly installed on the upper surface of the mounting frame 65. The mechanical gripper 66 is a double-claw gripper to improve the speed of material gripping. A first drag chain 67 is slidably installed on the upper surface of the first guide rail 61. The first drag chain 67 is fixedly connected to the first sliding block 63 and can drive the mechanical gripper 66 to move horizontally, thereby stably conveying the gripped semiconductor molding compound.

[0029] like Figure 1As shown, the second conveying module 7 includes a second guide rail 71, and guide grooves are respectively provided on the upper surface and side surface of the second guide rail 71. A second linear motor 72 is fixedly installed at one end of the second guide rail 71 to provide power. A second drag chain 73 is slidably installed on one side of the second linear motor 72. The guide groove can stably guide the second drag chain 73. A second connecting block 74 is slidably installed on the upper surface of the second guide rail 71. The guide groove can stably guide the second connecting block 74. The second connecting block 74 is connected to the second drag chain 73 to facilitate the horizontal movement of the second connecting block 74. A support frame 75 is fixedly installed on the upper surface of the second connecting block 74. Multiple placement trays 76 for storing materials are fixedly installed on the upper surface of the support frame 75, which can simultaneously store multiple semiconductor molding materials for easy and rapid handling.

[0030] Furthermore, a controller 8 is fixedly installed on one side of the frame 2, and the controller 8 is electrically connected to the vibratory feeder 4, the conveyor rail 5, the first linear motor 62, the electric push rod 64, the mechanical gripper 66, and the second linear motor 72, so as to facilitate its control.

[0031] Secondly, a bracket 9 is fixedly installed on the upper surface of the base plate 1, and a detection probe 10 is fixedly installed on the upper end of the bracket 9. The lower end of the detection probe 10 extends into the vibrating plate 4, which facilitates the detection of whether there is material inside the vibrating plate 4.

[0032] Furthermore, a guide hopper 11 is inclinedly provided at the bottom outlet of the hopper 3, and one end of the guide hopper 11 extends directly above the vibrating plate 4, so as to facilitate the transfer of materials in the hopper 3 to the vibrating plate 4.

[0033] The working principle of this embodiment is as follows: the semiconductor molding compound is added into the hopper 3 and rolled into the vibratory feeder 4 through the guide hopper 11. The vibratory feeder 4 is started by the controller 8. The vibratory feeder 4 vibrates and arranges the semiconductor molding compound inside and conveys it out. The conveyed semiconductor molding compound enters the conveying rail 5 and is conveyed to the bottom of the mechanical gripper 66 through the conveying rail 5.

[0034] Subsequently, the controller 8 starts the first linear motor 62, which drives the first cable chain 67 to move. The first cable chain 67 drives the electric push rod 64 to slide horizontally via the first sliding block 63. The electric push rod 64 drives the mechanical gripper 66 to move directly below one end of the feed rail 5. The electric push rod 64 is then started, which pushes the mounting bracket 65 to move vertically downward. The mounting bracket 65 drives the mechanical gripper 66 to move vertically downward, clamping the semiconductor molding compound on the feed rail 5 as it moves vertically downward. After clamping the semiconductor molding compound, the first linear motor 62 is started again, driving the first cable chain 67 to move. The first cable chain 67 drives the first sliding block 63 to move horizontally, which drives the electric push rod 64 to move. The electric push rod 64 drives the mechanical gripper 66 and the clamped semiconductor molding compound to move horizontally directly below the placement tray 76, neatly placing and loading the semiconductor molding compound.

[0035] After the placement tray 76 is loaded, the second linear motor 72 is started. The second linear motor 72 drives the second drag chain 73 to move, and the second drag chain 73 drives the second connecting block 74 to move horizontally. The second connecting block 74 drives the placement tray 76 and the semiconductor molding compound loaded on the placement tray 76 to move horizontally through the support frame 75, which can quickly transport the semiconductor molding compound. It can realize material transfer in three-dimensional space. Compared with manual loading, it can accurately control the material's conveying position and speed, ensuring that the semiconductor molding compound can accurately reach the target position, reducing the physical labor of workers, reducing labor intensity, and improving the safety and comfort of the working environment.

[0036] The above specific embodiments are merely several optional embodiments of this utility model. Based on the technical solution of this utility model and the relevant teachings of the above embodiments, those skilled in the art can make various alternative improvements and combinations to the above specific embodiments.

Claims

1. A semiconductor molding compound feeding device, characterized in that, include: A base plate (1) is provided with a frame (2) fixedly installed on one side of the upper surface of the base plate (1), and a hopper (3) is fixedly installed on the upper surface of the frame (2). A vibrating plate (4) for conveying materials is fixedly installed on the other side of the upper surface of the base plate (1). The material conveying rail (5) is fixedly installed on the upper surface of the base plate (1), and one end of the material conveying rail (5) is located at the outlet of the vibrating plate (4); A first conveying module (6) for gripping and conveying materials is provided above the conveying rail (5), and a second conveying module (7) for conveying materials is provided directly below the first conveying module (6).

2. The semiconductor molding compound feeding device according to claim 1, characterized in that, The first transmission module (6) includes a first guide rail (61), a first linear motor (62) is fixedly installed at one end of the first guide rail (61), a first sliding block (63) is slidably installed on one side of the first guide rail (61), an electric push rod (64) is fixedly connected to the upper end of the first sliding block (63), a mounting bracket (65) is fixedly connected to the output end of the electric push rod (64), a mechanical gripper (66) is fixedly installed on the upper surface of the mounting bracket (65), a first drag chain (67) is slidably installed on the upper surface of the first guide rail (61), and the first drag chain (67) is fixedly connected to the first sliding block (63).

3. The semiconductor molding compound feeding device according to claim 1, characterized in that, The second conveying module (7) includes a second guide rail (71), a second linear motor (72) is fixedly installed at one end of the second guide rail (71), a second drag chain (73) is slidably installed on one side of the second linear motor (72), a second connecting block (74) is slidably installed on the upper surface of the second guide rail (71), and the second connecting block (74) is connected to the second drag chain (73). A support frame (75) is fixedly installed on the upper surface of the second connecting block (74), and a plurality of placement trays (76) for storing materials are fixedly installed on the upper surface of the support frame (75).

4. The semiconductor molding compound feeding device according to claim 1, characterized in that, A controller (8) is fixedly installed on one side of the frame (2).

5. The semiconductor molding compound feeding device according to claim 1, characterized in that, A bracket (9) is fixedly installed on the upper surface of the base plate (1), and a detection probe (10) is fixedly installed on the upper end of the bracket (9), and the lower end of the detection probe (10) extends into the vibrating plate (4).

6. The semiconductor molding compound feeding device according to claim 1, characterized in that, The bottom outlet of the hopper (3) is provided with a guide hopper (11) at an angle, and one end of the guide hopper (11) extends directly above the vibrating plate (4).

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