Up-down spraying cleaning structure

Abstract

The utility model relates to the technical field of semiconductor cleaning, in particular to an up-down spraying cleaning structure. According to the utility model, the conveying track conveys the wafer product to the cleaning station, after the positioning mechanism positions the wafer product on the conveying track, the driving assembly drives the spraying head to spray and clean the upper surface of the wafer product, and the spraying mechanism sprays and cleans the lower surface of the wafer product. According to the wafer cleaning device, the upper surface and the lower surface of a wafer product can be synchronously cleaned on line, the cleaning efficiency is greatly improved, the wafer product can be thoroughly cleaned without being overturned, and the wafer cleaning effect is optimal.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of semiconductor cleaning relates to a up and down spray cleaning structure. BACKGROUND

[0002] Wafer refers to the silicon semiconductor integrated circuit manufacturing silicon wafer, wafer cleaning is a vital step in the semiconductor manufacturing process, for removing the contaminants and impurities on the wafer surface.Wafer cleaning quality directly affects the performance and yield of semiconductor devices.

[0003] In the wafer cleaning process, often need to fix the wafer, then clean up. Because need to clean up both sides, in the cleaning process still need to turn over the wafer, wafer turn over again fixed wafer, cleaning effect is not good, resulting in low cleaning efficiency, poor cleaning effect. UTILITY MODEL CONTENT

[0004] The utility model solves the technical problem to provide a can on-line to the upper and lower surface of wafer product synchronous cleaning, greatly improved the cleaning efficiency, the cleaning effect of wafer reaches the up and down spray cleaning structure of best.

[0005] In order to solve the above technical problem, the technical scheme that the utility model solves its technical problem is:

[0006] A up and down spray cleaning structure, it includes:

[0007] Conveying track, its upper surface is provided with cleaning station, the conveying track is used to convey wafer product to the cleaning station;

[0008] Positioning mechanism, set up in the cleaning station, the positioning mechanism is used to position the wafer product on the conveying track;

[0009] Cleaning mechanism, set up above the cleaning station, the cleaning mechanism includes drive assembly and shower nozzle, the drive assembly is drivenly connected with the shower nozzle, the drive assembly is used to drive the shower nozzle and sprays the upper surface of wafer product;

[0010] Spray mechanism, set up below the cleaning station, the spray mechanism is used to spray the lower surface of wafer product.

[0011] In an embodiment of the utility model, the spray mechanism includes mounting bracket, the mounting bracket is provided with linear module, the linear module is drivenly connected with spray frame, the linear module is covered with waterproof cover, the spray frame is provided with spray assembly, the linear module drives the spray assembly on the spray frame reciprocating motion to clean the lower surface of wafer.

[0012] In an embodiment of the utility model, the spraying assembly includes a support plate, the support plate is arranged on the spraying frame, a spraying block is arranged on the support plate, a plurality of spraying holes are arranged on the spraying block, a nozzle is arranged on the spraying hole, and a liquid inlet pipe is arranged on the spraying block.

[0013] In an embodiment of the utility model, the conveying track includes a conveying frame, a plurality of conveying guide wheels are arranged on the conveying frame, the conveying guide wheels are connected through a conveying belt, the conveying guide wheels are drivingly connected with a conveying motor, and the conveying motor is used for driving the conveying guide wheels to rotate to convey the wafer product on the conveying belt.

[0014] In an embodiment of the utility model, the positioning mechanism includes a positioning plate, a hollow part is arranged on the positioning plate, the hollow part is arranged opposite to the cleaning position of the wafer product, a plurality of positioning blocks are arranged on the positioning plate, and the plurality of positioning blocks are arranged to form a positioning station matched with the wafer product.

[0015] In an embodiment of the utility model, a guide inclined surface is arranged on the positioning block, and the guide inclined surface is inclined to the hollow part.

[0016] In an embodiment of the utility model, the spraying head includes a fixed block, a plurality of spraying nozzles are arranged on the fixed block, the spraying nozzles are arranged opposite to the wafer product, the fixed block is drivingly connected with a rotating part, the rotating part is drivingly connected with a driving assembly, and the rotating part drives the fixed block to rotate.

[0017] In an embodiment of the utility model, the rotating part includes a rotating frame, both ends of the fixed block are rotatably arranged on the rotating frame, one end of the fixed block is provided with a rotating wheel, a rotating motor is arranged on the rotating frame, the rotating motor is drivingly connected with the rotating wheel, and the rotating motor drives the fixed block to rotate on the rotating frame.

[0018] In an embodiment of the utility model, the driving assembly includes a driving frame, a moving frame is slidably arranged on the driving frame, the moving frame is drivingly connected with a linear motion module, a linear motor is arranged on the moving frame, the linear motor is drivingly connected with a guide frame, the guide frame is slidably arranged on the moving frame, and the spraying head is arranged on the guide frame.

[0019] In an embodiment of the utility model, the number of spraying heads on the guide frame is at least two, and the plurality of spraying heads are arranged on the guide frame at intervals.

[0020] The utility model discloses beneficial effects are as follows:

[0021] The utility model discloses a conveying track transports wafer product to the cleaning station, and after the positioning mechanism position positioning wafer product on the conveying track, the drive component drives the shower head to spray and wash the upper surface of wafer product, and the spray mechanism sprays and washes the lower surface of wafer product, can synchronously clean the upper and lower surfaces of wafer product on line, greatly improves the cleaning efficiency, and wafer product can be completely cleaned without turning over, makes the cleaning effect of wafer reach the best. BRIEF DESCRIPTION OF DRAWINGS

[0022] Figure 1 It is a kind of up and down shower cleaning structure schematic diagram of the utility model.

[0023] Figure 2 It is the positioning mechanism schematic diagram of the utility model.

[0024] Figure 3 It is the shower head schematic diagram of the utility model.

[0025] Figure 4 It is the rotating component schematic diagram of the utility model.

[0026] Figure 5 It is the spray mechanism schematic diagram of the utility model.

[0027] Mark number explanation in drawing:1, conveying track;11, conveying frame;12, conveying guide wheel;13, conveying belt;14, conveying motor;15, cleaning station;2, positioning mechanism;21, positioning plate;22, hollow part;23, positioning block;24, guide inclined plane;3, spray mechanism;31, mounting frame;32, spray frame;33, waterproof cover;34, support plate;35, spray block;36, nozzle;37, liquid inlet pipe;4, shower head;41, fixed block;42, spray nozzle;5, drive component;51, drive frame;52, linear motion module;53, guide frame;54, linear motor;6, rotating component;61, rotating frame;62, rotating motor;63, runner. DETAILED DESCRIPTION

[0028] The utility model makes further explanation in combination with the drawing and specific embodiment to the utility model, so that the person skilled in the art can better understand the utility model and can be implemented, but the embodiment is not as the limitation to the utility model.

[0029] Referring to Figures 1-5 As shown in the figure, a kind of up and down shower cleaning structure, comprising:

[0030] Conveying track 1, is provided with cleaning station 15 on it, the conveying track 1 is used to convey wafer product to cleaning station 15;

[0031] Positioning mechanism 2, provided on the cleaning station 15, the positioning mechanism 2 is used for position positioning of wafer products on the conveying track 1;

[0032] Cleaning mechanism, provided above the cleaning station 15, the cleaning mechanism includes drive assembly 5 and shower head 4, the drive assembly 5 is drivenly connected with the shower head 4, the drive assembly 5 is used to drive the shower head 4 to spray and clean the upper surface of wafer products;

[0033] Spraying mechanism 3, provided below the cleaning station 15, the spraying mechanism 3 is used for spraying and cleaning the lower surface of wafer products.

[0034] The utility model discloses a conveying track 1 conveys wafer products to the cleaning station 15, and after the positioning mechanism 2 position positions wafer products on the conveying track 1, the drive assembly 5 drives the shower head 4 to spray and clean the upper surface of wafer products, and the spraying mechanism 3 sprays and cleans the lower surface of wafer products, can be on line synchronous cleaning the upper and lower surfaces of wafer products, greatly improve the cleaning efficiency, and wafer products can be completely cleaned without turning over, make the cleaning effect of wafer reach the best.

[0035] In an embodiment of the utility model, the spraying mechanism 3 includes mounting bracket 31, be provided with linear module on the mounting bracket, linear module with spray frame 32 drive connection, the waterproof cover 33 is covered on linear module, be provided with spray assembly on spray frame 32, linear module drives spray assembly on spray frame 32 reciprocating motion to clean the lower surface of wafer.

[0036] Specifically, linear module drives spray assembly on spray frame 32 reciprocating motion below wafer products, and the cleaning liquid is sprayed through nozzle 36 via inlet pipe 37 to clean the lower surface of wafer, and the upper and lower surfaces of wafer products are cleaned simultaneously, which greatly improves the cleaning efficiency.

[0037] In an embodiment of the utility model, the spray assembly includes support plate 34, the support plate 34 is arranged on the spray frame 32, the support plate 34 is provided with spray block 35, a plurality of spray holes are arranged on the spray block 35, the nozzle 36 is arranged on the spray hole, the inlet pipe 37 is arranged on the spray block 35, and the cleaning liquid is sprayed through the nozzle 36 via the inlet pipe 37 to clean the lower surface of wafer, and a plurality of nozzles 36 can increase the cleaning surface and improve the cleaning efficiency.

[0038] In an embodiment of the utility model, the conveying track 1 includes conveying frame 11, be provided with a plurality of conveying guide pulley 12 on the conveying frame 11, the conveying guide pulley 12 is connected through conveying belt 13, the conveying guide pulley 12 is drivenly connected with conveying motor 14, the conveying motor 14 is used to drive the conveying guide pulley 12 rotation to carry out transmission to the wafer product on conveying belt 13.

[0039] Specifically, the both ends of the wafer product are placed on the conveying belt 13, the wafer product includes a wafer and a carrier loading the wafer, the conveying motor 14 drives the conveying guide pulley 12 to rotate to transmit the wafer product on the conveying belt 13 to the cleaning station 15, the transmission is convenient and accurate, and the conveying efficiency is improved.

[0040] In an embodiment of the utility model, the positioning mechanism 2 includes positioning plate 21, be provided with the hollow part 22 on the positioning plate 21, the hollow part 22 is oppositely arranged with the cleaning position of wafer product, be provided with a plurality of positioning blocks 23 on the positioning plate 21, and a plurality of positioning blocks 23 are surrounded and form the positioning station matched with wafer product.

[0041] Specifically, the wafer product is blanked on the positioning station, can be quickly positioned, the hollow part 22 leaks out the cleaning position of wafer product, can be convenient to spray the upper and lower surfaces of wafer product, and the spraying efficiency is improved.

[0042] In an embodiment of the utility model, the positioning block 23 is provided with the guide inclined plane 24, the guide inclined plane 24 is inclined to the hollow part 22, can guide when the wafer product blanking, guarantees the wafer product accurate blanking on the positioning station, and the positioning precision is improved.

[0043] In an embodiment of the utility model, the spray head 4 includes fixed block 41, be provided with a plurality of spray nozzles 42 on the fixed block 41, the spray nozzle 42 is oppositely arranged with wafer product, the fixed block 41 is drivenly connected with rotating part 6, the rotating part 6 is drivenly connected with drive assembly 5, the rotating part 6 drives the fixed block 41 rotation, and the spray nozzle 42 on spray head 4 sprays cleaning fluid to clean the upper surface of wafer product, guarantees cleaning effect, the rotating part 6 drives the fixed block 41 rotation, can change the spray angle of spray nozzle 42, can increase the cleaning surface, improves cleaning efficiency, and can quickly clean the impurities in small area irregular area.

[0044] In an embodiment of the utility model, the rotating part 6 includes rotating frame 61, both ends of fixed block 41 are arranged on rotating frame 61, one end of fixed block 41 is provided with runner 63, rotating frame 61 is provided with rotating motor 62, rotating motor 62 is drivenly connected with runner 63, rotating motor 62 drives fixed block 41 to rotate on rotating frame 61.

[0045] Specifically, rotating motor 62 drives fixed block 41 to rotate on rotating frame 61, so that the spray nozzle 42 can multi-angle spray cleaning fluid, improve the cleaning effect of wafer product, can produce the spray rotating water flow of constantly changing angle, strengthen the cleaning ability.

[0046] In an embodiment of the utility model, the drive assembly 5 includes drive frame 51, the drive frame 51 is slidably provided with moving frame, the moving frame is drivenly connected with linear motion module 52, the moving frame is provided with linear motor 54, linear motor 54 is drivenly connected with guide frame 53, guide frame 53 is slidably arranged on the moving frame, the shower head 4 is arranged on the guide frame 53.

[0047] Specifically, linear motion module 52 and linear motor 54 form two-axis motion module, can drive the shower head 4 on guide frame 53 to move in space, so that the spray nozzle 42 on shower head 4 sprays cleaning fluid to clean the upper surface of wafer product, the cleaning position is accurate, greatly guarantees the cleaning efficiency.

[0048] In an embodiment of the utility model, the number of shower head 4 on guide frame 53 is at least two, and multiple shower heads 4 are arranged at intervals on guide frame 53.

[0049] Specifically, multiple shower heads 4 are arranged at intervals on guide frame 53, which can greatly increase the spraying area, be suitable for cleaning wafer products of multiple specifications, greatly improve the cleaning efficiency, and have wide application range.

[0050] Use process

[0051] The two ends of the wafer product including a wafer and a carrier loaded with the wafer are placed on the conveying belt 13, the conveying motor 14 drives the conveying guide wheel 12 to rotate to convey the wafer product on the conveying belt 13 to the cleaning station 15, the conveying frame 11 is connected with a lifting device (not shown) such as a pneumatic cylinder, and the wafer product is dropped on the positioning station under the driving of the lifting device, after the hollow part 22 leaks the cleaning position of the wafer product, the linear motion module 52 and the linear motor 54 drive the spray head 4 on the guide frame 53 to move, so that the spray nozzle 42 on the spray head 4 sprays the cleaning liquid to clean the upper surface of the wafer product, the rotary motor 62 drives the fixed block 41 to rotate on the rotary frame 61, so that the spray nozzle 42 can spray the cleaning liquid at multiple angles, improving the cleaning effect of the wafer product, at the same time, the linear module drives the spray assembly on the spray frame 32 to reciprocate below the wafer product, the cleaning liquid is sprayed out through the nozzle 36 by the inlet pipe 37 to clean the lower surface of the wafer, so as to synchronously clean the upper and lower surfaces of the wafer product, greatly improving the cleaning efficiency, after cleaning, the conveying frame 11 is lifted under the driving of the lifting device to lift the wafer product to the conveying belt 13 and is conveyed to the next process.

[0052] The above-described embodiments are only preferred embodiments for fully illustrating the present application, and the protection scope of the present application is not limited thereto. Any equivalent replacement or transformation of the present application based on the present application is within the protection scope of the present application. The protection scope of the present application is subject to the claims.

Claims

1. An up and down spray cleaning structure, characterized by, The utility model relates to a kind of wafer cleaning device, including: Conveying track is provided with cleaning station on it, the conveying track is used to convey wafer product to cleaning station; Positioning mechanism is arranged on the cleaning station, the positioning mechanism is used to position wafer product on conveying track; Cleaning mechanism is arranged above the cleaning station, and the cleaning mechanism includes drive assembly and shower head, the drive assembly is drivingly connected with the shower head, and the drive assembly is used to drive the shower head to spray and clean the upper surface of wafer product; Spraying mechanism is arranged below the cleaning station, and the spraying mechanism is used to spray and clean the lower surface of wafer product.

2. The up and down spray cleaning structure according to claim 1, wherein, The spraying mechanism includes mounting bracket, the mounting bracket is provided with linear module, the linear module is drivingly connected with spraying frame, the linear module is covered with waterproof cover, the spraying frame is provided with spraying assembly, and the linear module drives the reciprocating motion of the spraying assembly on the spraying frame to clean the lower surface of wafer.

3. The up and down spray cleaning structure according to claim 2, wherein The spraying assembly includes support plate, the support plate is arranged on the spraying frame, the support plate is provided with spraying block, the spraying block is provided with a plurality of spraying holes, the spraying hole is provided with nozzle, and the spraying block is provided with liquid inlet pipe.

4. The up and down spray cleaning structure according to claim 1, wherein The conveying track includes conveying frame, the conveying frame is provided with a plurality of conveying guide wheels, the conveying guide wheels are connected by conveying belt, the conveying guide wheels are drivingly connected with conveying motor, and the conveying motor is used to drive the rotation of conveying guide wheel to transmit wafer product on conveying belt.

5. The up and down spray cleaning structure according to claim 1, wherein The positioning mechanism includes positioning plate, the positioning plate is provided with hollow part, the hollow part is arranged opposite the cleaning position of wafer product, and the positioning plate is provided with a plurality of positioning blocks, and the plurality of positioning blocks are arranged to form positioning station matched with wafer product.

6. The up and down spray cleaning structure according to claim 5, wherein The positioning block is provided with guide slope, and the guide slope is inclined to the hollow part.

7. The up and down spray cleaning structure according to claim 1, wherein The shower head includes fixed block, the fixed block is provided with a plurality of spraying nozzles, the spraying nozzle is arranged opposite wafer product, the fixed block is drivingly connected with rotating part, the rotating part is drivingly connected with drive assembly, and the rotating part drives the rotation of the fixed block.

8. The up and down spray cleaning structure according to claim 7, wherein The rotating part includes rotating frame, both ends of the fixed block are rotatably arranged on the rotating frame, one end of the fixed block is provided with rotating wheel, the rotating frame is provided with rotating motor, the rotating motor is drivingly connected with rotating wheel, and the rotating motor drives the rotation of the fixed block on the rotating frame.

9. The up and down spray cleaning structure according to claim 1, wherein The drive assembly includes drive frame, the moving frame is slidably arranged on the drive frame, the moving frame is drivingly connected with linear motion module, the moving frame is provided with linear motor, the linear motor is drivingly connected with guide frame, the guide frame is slidably arranged on the moving frame, and the shower head is arranged on the guide frame.

10. The up and down spray cleaning structure according to claim 9, wherein, The number of shower heads on the guide frame is at least two, and a plurality of shower heads are arranged on the guide frame.

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