Anti-bubble semiconductor film sticking machine

Abstract

The utility model relates to the technical field of semiconductor film sticking, in particular to an anti-bubble semiconductor film sticking machine, which comprises a semiconductor film sticking machine main body, a cylinder seat is arranged on the semiconductor film sticking machine main body, a support plate is clamped and fixed in the cylinder seat, and second exhaust holes are uniformly formed in the support plate at intervals. A vacuum pump and a second air cylinder are installed below the supporting plate, the air inlet end of the vacuum pump is communicated with the second exhaust hole, the air outlet end of the vacuum pump is communicated with the exterior of the barrel base, the upper end of the supporting plate is connected with a film covering supporting base and a semiconductor positioning base which are mutually clamped and fastened, and a gap is formed between the film covering supporting base and the semiconductor positioning base; and first exhaust holes are uniformly formed in the side surface of the film covering supporting seat and the gap at intervals. According to the anti-bubble semiconductor film sticking machine, through cooperative use of the elastic exhaust seat, the vacuum pump and the heating pipe, air between a film and a semiconductor can be quickly exhausted from the middle to the periphery, bubbles are prevented from being generated, and the film sticking efficiency is improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to semiconductor film pasting technical field, concretely is a kind of semiconductor film pasting machine of anti-bubble. BACKGROUND

[0002] Semiconductor film pasting machine is used to paste protective film or thin film with specific function to wafer or other semiconductor components in semiconductor manufacturing process, and it plays a key role in protecting product surface and endowing specific electrical or optical performance by making thin film flat, bubble-free and accurately adhering to specified position.

[0003] The existing semiconductor is usually made into circular structure, and film positioning treatment is carried out on semiconductor by mold, then scraping mechanism is reciprocated above semiconductor to discharge bubble, or vacuum adsorption system is used to create vacuum condition for semiconductor and thin film, to ensure that film sheet is closely adhered, but bubble cannot be quickly discharged, resulting in low film pasting efficiency. UTILITY MODEL CONTENTS

[0004] The utility model aims at providing a kind of semiconductor film pasting machine of anti-bubble to solve the problem that current semiconductor film pasting machine on market carries out bubble discharge treatment by scraping film and vacuum adsorption, but cannot quickly discharge bubble, resulting in low film pasting efficiency.

[0005] To achieve the above object, the utility model provides the following technical scheme: a kind of semiconductor film pasting machine of anti-bubble, including semiconductor film pasting machine main body, the barrel seat is equipped on the semiconductor film pasting machine main body, and the support plate is clamped and fixed in the barrel seat, and the second exhaust hole is evenly spaced apart on the support plate, the vacuum pump and the second cylinder are installed in the support plate below, the vacuum pump intake end is communicated with the second exhaust hole, and the vacuum pump outlet end is communicated with the outside of barrel seat, the film coating support seat and the semiconductor positioning seat that are mutually clamped and fastened are connected on the support plate upper end, and gap is set between the film coating support seat and the semiconductor positioning seat, and the first exhaust hole is evenly spaced apart on the side surface of film coating support seat and gap, the lifting plate connected with the second cylinder is clamped on the semiconductor positioning seat upper end, and the heating pipe is embedded and installed in the lifting plate, the box cover is equipped on the semiconductor film pasting machine main body, and the first cylinder is installed on the inside top of box cover, and the hard positioning seat is connected to the output end of first cylinder, the elastic exhaust seat is sleeved on the hard positioning seat bottom, and the elastic exhaust seat is positionally corresponding with semiconductor positioning seat.

[0006] Preferably, the bottom of the semiconductor film pasting machine main body is provided with a base, and a linear guide rail is fixed on the upper end of the base by screws symmetrically, and the base is sealingly clamped with the box cover.

[0007] Preferably, the bottom of the barrel seat is fixed with a bottom plate by screws, and the bottom plate is movably connected with the linear guide rail.

[0008] Preferably, the elastic exhaust seat bottom surface is arc-shaped, and the elastic exhaust seat upper end is protruded in the middle, and the hard positioning seat lower end is fixed with a supporting spring in close contact with the protruded part of the elastic exhaust seat.

[0009] Preferably, the film supporting seat upper end is provided with a coaxial annular groove, and the film supporting seat upper end surface is flush with the semiconductor positioning seat upper end surface.

[0010] Preferably, the first exhaust hole and the second exhaust hole are in corresponding positions, and the first exhaust hole is obliquely provided.

[0011] Compared with the prior art, the semiconductor film pasting machine with air bubble prevention function has the advantages that: the cooperation of the elastic exhaust seat, the vacuum pump and the heating pipe can quickly exhaust the air between the thin film and the semiconductor from the middle to the periphery, prevent air bubbles from being generated, and improve the film pasting efficiency. The bottom of the elastic exhaust seat is provided in an arc shape, and a spring is arranged in the middle of the inner side of the elastic exhaust seat for elastic support, so that the bottom surface of the elastic exhaust seat can gradually contact the thin film, thereby ensuring the air exhaust effect, and the exhaust holes are uniformly distributed on the outer side of the semiconductor positioning seat, so that the gas can be quickly exhausted. BRIEF DESCRIPTION OF DRAWINGS

[0012] Figure 1 It is a side view of the semiconductor film pasting machine with air bubble prevention function of the utility model;

[0013] Figure 2 It is a front view of the semiconductor film pasting machine with air bubble prevention function of the utility model;

[0014] Figure 3 It is a first exhaust hole and a second exhaust hole distribution structure schematic view of the semiconductor film pasting machine with air bubble prevention function of the utility model;

[0015] Figure 4 It is a film supporting seat relative to semiconductor positioning seat position structure schematic view of the semiconductor film pasting machine with air bubble prevention function of the utility model.

[0016] In the drawing: 1, semiconductor film pasting machine main body;2, box cover;3, hard positioning seat;301, supporting spring;302, elastic exhaust seat;4, base;5, first cylinder;6, film supporting seat;601, first exhaust hole;602, annular groove;7, semiconductor positioning seat;8, lifting plate;801, heating pipe;9, cylinder seat;901, bottom plate;902, supporting plate;903, second exhaust hole;10, vacuum pump;11, second cylinder;12, linear guide rail. DETAILED DESCRIPTION

[0017] Clearly, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments of the present application, all other embodiments obtained by those of ordinary skill in the art without creative labor fall within the scope of protection of the present application.

[0018] Please refer to Figures 1-4The utility model provides a technical scheme: a semiconductor film pasting machine of preventing air bubble, including semiconductor film pasting machine main part 1, be equipped with cylinder seat 9 on semiconductor film pasting machine main part 1, and the support plate 902 is clamped and fixed in cylinder seat 9, and the second exhaust hole 903 is evenly spaced apart on support plate 902, and vacuum pump 10 and second air cylinder 11 are installed below support plate 902, and the air inlet end of vacuum pump 10 is communicated with second exhaust hole 903, and the air outlet end of vacuum pump 10 is communicated with the outside of cylinder seat 9, and the upper end of support plate 902 is connected with the film coating support seat 6 and semiconductor positioning seat 7 of mutual clamping fastening, and the gap is set between film coating support seat 6 and semiconductor positioning seat 7, and the first exhaust hole 601 is evenly spaced apart and set on the side surface of film coating support seat 6 and the gap, and the upper end of semiconductor positioning seat 7 is clamped with the lifting plate 8 connected with second air cylinder 11, and the heating pipe 801 is embedded and installed in lifting plate 8, and the box cover 2 is equipped on semiconductor film pasting machine main part 1, and the base 4 is equipped at the bottom of semiconductor film pasting machine main part 1, and the linear guide 12 is fixed with symmetry screw on the upper end of base 4, and the base 4 is sealed and is clamped with box cover 2, and this structure makes semiconductor film pasting machine main part 1 form a relatively sealed dustproof structure with box cover 2 and base 4, so that when semiconductor film pasting, the pollution of impurities can be reduced, the bottom plate 901 is fixed with screw on the bottom of cylinder seat 9, and the bottom plate 901 is movably connected with linear guide 12, and this structure can make cylinder seat 9 move under the positioning of linear guide 12, so that semiconductor positioning seat 7 can move below elastic exhaust seat 302, so as to load and unload semiconductor and film pasting treatment, lifting plate 8 can easily demould semiconductor through lifting, and lifting plate 8 can properly heat semiconductor through built-in heating pipe 801, improve film pasting effect, and the first air cylinder 5 is installed on the inside top of box cover 2, and the hard positioning seat 3 is connected with the output end of first air cylinder 5, the hard positioning seat 3 is sleeved with elastic exhaust seat 302 on the bottom, and the elastic exhaust seat 302 corresponds with semiconductor positioning seat 7, the bottom surface of elastic exhaust seat 302 is arc surface, and the upper end of elastic exhaust seat 302 is convex to the middle part, and the hard positioning seat 3 is fixed with support spring 301 through bolt on the lower end and is in close contact with the convex part of elastic exhaust seat 302, this structure can make elastic exhaust seat 302 contact film in the middle area first through the arc structure of bottom surface, in the process of gradually moving down of elastic exhaust seat 302, the bottom surface of elastic exhaust seat 302 gradually contacts film, so that the gas between semiconductor and film can be exhausted from the middle to the periphery, the first exhaust hole 601 is evenly arranged and plays the role of high-efficiency vacuum adsorption, effectively reduces the formation of air bubble, the annular groove 602 of coaxial structure is set up on the upper end of film coating support seat 6, and the upper end surface of film coating support seat 6 is flush with the upper end surface of semiconductor positioning seat 7, this structure can avoid that film is completely pasted on film coating support seat 6, and the excess film is easily torn off, the first exhaust hole 601 and second exhaust hole 903 position correspond, and the first exhaust hole 601 is obliquely set up, this structure sets up through the oblique setting of first exhaust hole 601,The gas can be guided more easily, and the vacuum adsorption speed is improved.

[0019] Working principle: when using the anti-bubble semiconductor film pasting machine, first, the base 4 supports and positions the semiconductor film pasting machine body 1, opens the box cover of the box cover 2, places the semiconductor in the semiconductor positioning seat 7, and then covers the film on the film supporting seat 6. The heating pipe 801 built in the lifting plate 8 heats the semiconductor, ensures better adhesion of the film, and then moves the cylinder seat 9 on the linear guide rail 12 through the bottom plate 901, moves the semiconductor positioning seat 7 to the bottom of the hard positioning seat 3, then the hard positioning seat 3 is driven to move downward by the first cylinder 5, and the vacuum pump 10 is started. The air between the semiconductor and the film is sucked away through the gap between the film supporting seat 6 and the semiconductor positioning seat 7, and the lower end of the elastic exhaust seat 302 contacts the film first. In the process of gradually moving down the elastic exhaust seat 302, the bottom side of the elastic exhaust seat 302 gradually contacts the film, ensuring that the air between the semiconductor and the film is exhausted from the middle to the periphery, effectively avoiding the generation of bubbles. The supporting spring 301 elastically supports the middle position of the elastic exhaust seat 302, so that the bottom surface of the elastic exhaust seat 302 can be completely attached to the film, ensuring the film pasting effect. After the film coating is completed, the box cover of the box cover 2 is opened, and the cylinder seat 9 is moved to the opening position. At this time, the excess film is cut. Due to the setting of the annular groove 602, the film and the film supporting seat 6 are not completely attached, which facilitates the tearing of the film. Then the second cylinder 11 is started, the lifting plate 8 is pushed upward, the semiconductor is moved from the semiconductor positioning seat 7, the supporting plate 902 is used for supporting and fixing the semiconductor positioning seat 7, thereby completing a series of work.

[0020] Although the utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions recorded in the foregoing embodiments, or make equivalent replacement to part of the technical features, and any modification, equivalent replacement, improvement, etc. within the spirit and principles of the utility model should be included in the protection scope of the utility model.

Claims

1. An anti-bubble semiconductor film pasting machine comprising a semiconductor film pasting machine main body (1), characterized in that: The semiconductor film pasting machine body (1) is provided with a cylinder seat (9), and the cylinder seat (9) is clamped and fixed with a supporting plate (902), and the supporting plate (902) is uniformly and interval provided with a second exhaust hole (903), and a vacuum pump (10) and a second cylinder (11) are installed below the supporting plate (902), and the air inlet end of the vacuum pump (10) is communicated with the second exhaust hole (903), and the air outlet end of the vacuum pump (10) is communicated with the outside of the cylinder seat (9), the supporting plate (902) is connected with a film supporting seat (6) and a semiconductor positioning seat (7) which are clamped and fastened with each other at the upper end, and a gap is arranged between the film supporting seat (6) and the semiconductor positioning seat (7), and the first exhaust hole (601) is uniformly and interval provided on the side surface of the film supporting seat (6) and the gap, the semiconductor positioning seat (7) is clamped with a lifting plate (8) connected with the second cylinder (11) at the upper end, and a heating pipe (801) is embedded and installed in the lifting plate (8), the semiconductor film pasting machine body (1) is provided with a box cover (2), and a first cylinder (5) is installed on the inner side top of the box cover (2), and a hard positioning seat (3) is connected with the output end of the first cylinder (5), and the hard positioning seat (3) is sleeved with an elastic exhaust seat (302) at the bottom, and the elastic exhaust seat (302) corresponds to the position of the semiconductor positioning seat (7).

2. The anti-bubble semiconductor laminating machine according to claim 1, wherein: The bottom of the semiconductor film pasting machine body (1) is provided with a base (4), and the linear guide rails (12) are fixed on the base (4) by screws symmetrically, and the base (4) is sealingly clamped with the box cover (2).

3. The anti-bubble semiconductor laminating machine according to claim 2, characterized in that: The bottom of the cylinder seat (9) is fixed with a bottom plate (901) by screws, and the bottom plate (901) is movably connected with the linear guide rails (12).

4. The anti-bubble semiconductor laminating machine according to claim 1, wherein: The bottom surface of the elastic exhaust seat (302) is an arc surface, the upper end of the elastic exhaust seat (302) is protruded upward in the middle, and the hard positioning seat (3) is fixed with a supporting spring (301) which is in close contact with the protruded part of the elastic exhaust seat (302) by bolts at the lower end.

5. The anti-bubble semiconductor laminating machine according to claim 1, wherein: The upper end of the film supporting seat (6) is provided with an annular groove (602) of coaxial structure, and the upper end surface of the film supporting seat (6) is flush with the upper end surface of the semiconductor positioning seat (7).

6. The anti-bubble semiconductor laminating machine according to claim 1, wherein: The first exhaust hole (601) and the second exhaust hole (903) correspond in position, and the first exhaust hole (601) is inclined.

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