Sunken double-row in-line fan heat dissipation module

Abstract

The utility model discloses a sinking type double-row in-line fan heat dissipation module which comprises a heat conduction assembly and a fan assembly arranged above the heat conduction assembly, the heat conduction assembly comprises a vapor chamber, a copper base and a plurality of first studs, the vapor chamber is welded to the lower end face of the copper base, a video memory heat dissipation base is arranged below the vapor chamber, and the first studs are welded to the lower end face of the copper base. A heat pipe module and a fin module are arranged above the copper base, the heat pipe module comprises a first heat pipe, a second heat pipe and a third heat pipe, the first heat pipe, the second heat pipe and the third heat pipe are all welded to the upper end face of the copper base, the fin module comprises a main fin, a first auxiliary fin and a third auxiliary fin, and the first auxiliary fin and the third auxiliary fin are arranged at the two ends of the main fin respectively. And a second auxiliary fin is arranged between the first auxiliary fin and the third auxiliary fin. According to the sinking type double-row in-line fan heat dissipation module, heat can be blown out more quickly, the heat dissipation efficiency is improved, all the fans can be kept at the low rotating speed, and therefore noise can be lowered.

Description

TECHNICAL FIELD

[0001] The utility model relates to a display card heat dissipation module, concretely is a sunken double-row straight-line fan heat dissipation module. BACKGROUND

[0002] The display card heat dissipation module refers to the component and design for helping the heat dissipation of the display card, and its main function is to effectively dissipate the heat generated in the working process of the display card through the cooperative work of various heat dissipation elements (such as heat dissipation fins, heat pipes, fans, etc.), so as to maintain the normal operating temperature of the display card and prevent the performance decline or damage caused by overheating.

[0003] At present, the display cards on the market are mostly products with two fans and three fans, and there are individual single fans. With the increasing heat dissipation power of chips, how to quickly solve the heat has become an urgent problem to be solved. The air cooling is a relatively mature and preferential solution in the current heat dissipation technology. The operation of the display card fan will produce noise, but the market personal electronic consumer goods will not reduce the requirement for noise with the increase of chip power dissipation. CONTENT OF THE UTILITY MODEL

[0004] The utility model aims at providing a sunken double-row straight-line fan heat dissipation module, which expands the overall width of the fins, so that the heat can be more dispersed. In combination with the design of two rows of fans, the two rows of fans can blow more fins, so that the heat can be blown out more quickly, the heat dissipation efficiency is improved, and all the fans can maintain a lower speed, thereby being beneficial to reducing the noise.

[0005] To achieve the above objectives, this utility model provides the following technical solution: a recessed dual-row inline fan cooling module, comprising a heat-conducting component and a fan assembly disposed above the heat-conducting component. The heat-conducting component includes a heat spreader, a copper base, and multiple first studs. A thermal paste layer is coated on the lower end surface of the heat spreader, and the heat spreader is welded to the lower end surface of the copper base. A memory heat sink is disposed below the heat spreader. A heat pipe module and a fin module are disposed above the copper base. The heat pipe module includes a first heat pipe, a second heat pipe, and a third heat pipe, all of which are welded to the upper end surface of the copper base. The fin module includes main fins and first studs respectively disposed at both ends of the main fins. The fan assembly includes a primary fin and a secondary fin, with a second secondary fin positioned between the first and third secondary fins. Multiple primary fins, first secondary fins, second secondary fins, and third secondary fins are provided and evenly spaced. The fan assembly includes a housing and a raised rubber cover fixed to the upper surface of the housing. Two rows of raised rubber covers are provided, with multiple covers in each row evenly spaced along a straight line. Each raised rubber cover contains a fan bearing housing, and each fan bearing housing is equipped with a fan. Placing two rows of fans within a limited space allows the fans to reach more heat dissipation fins, improving heat dissipation efficiency and enabling the two rows of fans to operate at lower speeds, thereby reducing noise.

[0006] Preferably, a first thermally conductive adhesive is adhered to the lower end surface of the memory heat sink, and the memory heat sink has a U-shaped design.

[0007] Preferably, four first studs are fixed on the lower end face of the copper base, and the memory heat sink is fixed on the four first studs.

[0008] Preferably, both the first heat pipe and the third heat pipe are designed in a straight line, and multiple first heat pipes and multiple second heat pipes are provided. Multiple first heat pipes are fixed on the main fin, the first secondary fin, and the third secondary fin, multiple second heat pipes are fixed on the main fin, the first secondary fin, the second secondary fin, and the third secondary fin, and the third heat pipe is fixed on the main fin and the third secondary fin.

[0009] Preferably, multiple connecting pieces are fixed on the lower end face of the fin module, and a second thermally conductive adhesive is adhered to the lower end face of each of the multiple connecting pieces, and two first studs are fixed on each connecting piece.

[0010] Preferably, multiple fin screws are installed on the lower end face of the fin module, and all the fin screws are driven into the housing.

[0011] Preferably, each convex rubber cover is a cavity structure with openings at both ends and a hollow interior, and a fan base is fixed inside each convex rubber cover, with three second studs fixed on each fan base.

[0012] Preferably, each fan bearing housing is equipped with three fan screws, which are respectively driven into three second studs on one of the fan bases.

[0013] Compared with the prior art, the beneficial effects of this utility model are as follows:

[0014] 1. This utility model uses three different heat pipes positioned above a heat spreader to separately dissipate and disperse the heat from the two major heat-generating components, the GPU core and memory. Multiple secondary heat pipes are used to expand the overall width of the fins, allowing the heat to be more dispersed. Combined with the design of two rows of fans, the fans can reach more fins, thus allowing the heat to be blown away more quickly and improving the heat dissipation efficiency.

[0015] 2. This utility model, by setting up two rows of fans, can blow on a larger fin area when working, thus allowing all fans to maintain a lower speed, which helps to reduce noise. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of an embodiment of the present utility model;

[0017] Figure 2 This is a schematic diagram of the heat-conducting component of this utility model;

[0018] Figure 3 This is a bottom view of the present invention;

[0019] Figure 4 This is a schematic diagram of the heat pipe module and fin module of this utility model;

[0020] Figure 5 This utility model Figure 2 Enlarged view of A in the middle;

[0021] Figure 6 This is a schematic diagram of the fan assembly of this utility model.

[0022] The reference numerals and names in the figure are as follows: 1. Thermal conductive component; 11. Heat spreader; 111. Thermal paste layer; 12. Copper base; 13. First stud; 14. Memory heat sink; 141. First thermal adhesive; 15. Heat pipe module; 151. First heat pipe; 152. Second heat pipe; 153. Third heat pipe; 16. Fin module; 161. Main fin; 162. First secondary fin; 163. Second secondary fin; 164. Third secondary fin; 165. Fin bracket; 17. Connecting piece; 18. Second thermal adhesive; 19. Fin screw; 2. Fan assembly; 21. Housing; 22. Upper convex rubber cover; 23. Fan base; 24. Second stud; 25. Fan bearing housing; 26. Fan screw; 27. Fan. DETAILED DESCRIPTION

[0023] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the present application.

[0024] In the description of the embodiments of the present application, it should be understood that the terms "length", "width", "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the purpose of facilitating the description of the embodiments of the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the present application. In addition, the terms "first", "second" are only for the purpose of description, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the technical features indicated. Therefore, the features limited by "first", "second" can explicitly or implicitly include one or more of the features. In the description of the embodiments of the present application, the meaning of "multiple" is two or more, unless otherwise explicitly specified and limited.

[0025] In the embodiments of the present application, unless otherwise explicitly specified and limited, the terms "mounting", "connection", "connection", "fixing" and the like should be understood in a broad sense, for example, it can be fixedly connected, or it can be detachably connected, or it can be integrated; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium; it can be the communication or interaction relationship between two elements. For those skilled in the art, the specific meaning of the above terms in the embodiments of the present application can be understood according to the specific circumstances.

[0026] Please refer to Figure 1 The present application provides an embodiment: a sunken double-row inline fan heat dissipation module, comprising a heat conduction assembly 1 and a fan assembly 2 arranged above the heat conduction assembly 1.

[0027] Please refer to Figure 2The heat conduction assembly 1 comprises a vapor chamber 11, a copper base 12 and a plurality of first studs 13, a heat conduction paste layer 111 is coated on the lower end face of the vapor chamber 11, and the vapor chamber 11 is welded to the lower end face of the copper base 12, a graphics memory heat sink 14 is arranged below the vapor chamber 11, four first studs 13 are fixed on the lower end face of the copper base 12, the graphics memory heat sink 14 is fixed on the four first studs 13, the first studs 13 and the graphics memory heat sink 14 are fixed by welding, a first heat conduction adhesive 141 is adhered to the lower end face of the graphics memory heat sink 14, and the graphics memory heat sink 14 is designed in a mouth-shaped form, and a heat pipe module 15 and a fin module 16 are arranged above the copper base 12.

[0028] Please refer to Figure 3 The heat pipe module 15 comprises a first heat pipe 151, a second heat pipe 152 and a third heat pipe 153, and the first heat pipe 151, the second heat pipe 152 and the third heat pipe 153 are all welded to the upper end face of the copper base 12.

[0029] Please refer to Figure 4 The first heat pipe 151 and the third heat pipe 153 are both designed in a linear form, and the first heat pipe 151 and the second heat pipe 152 are both provided with a plurality of first heat pipes 151, a plurality of second heat pipes 152, the third heat pipe 153 is fixed on the main fin 161 and the third auxiliary fin 164, in the embodiment, the first heat pipe 151 is provided with four, the second heat pipe 152 is provided with three, and the third heat pipe 153 is provided with one, the fin module 16 comprises a main fin 161, a first auxiliary fin 162 and a third auxiliary fin 164 arranged at both ends of the main fin 161, a second auxiliary fin 163 is arranged between the first auxiliary fin 162 and the third auxiliary fin 164, and the fin module 16 further comprises two parallel fin supports 165, and the main fin 161, the first auxiliary fin 162, the second auxiliary fin 163 and the third auxiliary fin 164 are all provided with a plurality of fins and are distributed at equal intervals.

[0030] Please refer to Figure 5A plurality of connecting pieces 17 are fixed on the lower end surface of the fin module 16, the second heat-conducting glue 18 is adhered on the lower end surface of the plurality of connecting pieces 17, and two first threaded studs 13 are fixed on each connecting piece 17. In this embodiment, the first heat-conducting glue 141 and the second heat-conducting glue 18 are both of the model of Leyder 90000, the plurality of connecting pieces 17 are different in length and position, the openings corresponding to the plurality of first threaded studs 13 are arranged on the graphics card PCB, the graphics card PCB and the heat-conducting assembly 1 are fixed by penetrating the screws through the openings on the graphics card PCB and into the first threaded studs 13, and the plurality of fin screws 19 are installed on the lower end surface of the fin module 16, the plurality of fin screws 19 are respectively penetrated through the two fin supports 165 and into the shell 21, so that the fin module 16 is fixed below the shell 21 by means of the plurality of fin screws 19, and the heat-conducting assembly 1 and the fan assembly 2 become an integral whole.

[0031] Please refer to Figure 6 The fan assembly 2 comprises the shell 21 and the upper convex glue cover 22 fixed on the upper end surface of the shell 21. The upper convex glue cover 22 is provided with two rows, each row of the upper convex glue cover 22 is provided with a plurality of upper convex glue covers 22 and is equidistantly distributed along a straight line, each upper convex glue cover 22 is a cavity structure with openings at both ends and a hollow inside, and the fan base 23 is fixed in each upper convex glue cover 22. Three second threaded studs 24 are fixed on each fan base 23, the fan bearing seat 25 is arranged in each upper convex glue cover 22, the fan 27 is installed on each fan bearing seat 25, two rows of fans 27 are placed in the limited space, so that the fans 27 can blow more heat-dissipating fins, improve the heat-dissipating efficiency, and make the two rows of fans 27 operate at a lower speed, thereby reducing the noise. Three fan screws 26 are installed on each fan bearing seat 25, the three fan screws 26 are respectively penetrated into the three second threaded studs 24 on one of the fan bases 23, so that the fan 27 can be fixed in the cavity of the upper convex glue cover 22, the fan blades of the fan 27 are in the cavity of the upper convex glue cover 22, and the wind blown downward by the fan 27 is more concentrated and more effective.

[0032] It is apparent for those skilled in the art that the present application is not limited to the details of the above-described exemplary embodiments, but can be implemented in other concrete forms without departing from the spirit or essential characteristics of the present application. Therefore, the embodiments should be considered in all respects as illustrative and not restrictive, the scope of the present application being defined by the appended claims rather than the above description, and it is intended to embrace all changes and modifications that fall within the meaning and scope of equivalents of the claims. Any reference signs in the claims should not be construed as limiting the claims to which the reference signs belong.

Claims

1. A sinking type double-row inline fan heat dissipation module, comprising a heat conduction assembly (1) and a fan assembly (2) arranged above the heat conduction assembly (1), characterized in that: The heat-conducting assembly (1) comprises a vapor chamber (11), a copper base (12) and a plurality of first studs (13), the lower end surface of the vapor chamber (11) is coated with a layer of heat-conducting paste (111), and the vapor chamber (11) is welded to the lower end surface of the copper base (12), a graphics memory heat sink (14) is arranged below the vapor chamber (11), a heat pipe module (15) and a fin module (16) are arranged above the copper base (12), the heat pipe module (15) comprises a first heat pipe (151), a second heat pipe (152) and a third heat pipe (153), the first heat pipe (151), the second heat pipe (152) and the third heat pipe (153) are all welded to the upper end surface of the copper base (12), the fin module (16) comprises a main fin (161), a first auxiliary fin (162) and a third auxiliary fin (164) arranged at the two ends of the main fin (161) respectively, and a second auxiliary fin (163) is arranged between the first auxiliary fin (162) and the third auxiliary fin (164), the fan assembly (2) comprises a shell (21) and an upper convex rubber cover (22) fixed to the upper end surface of the shell (21), the upper convex rubber cover (22) is provided with two rows, each row of the upper convex rubber cover (22) is provided with a plurality of upper convex rubber covers (22) which are equally spaced along a straight line, each of the upper convex rubber covers (22) is provided with a fan bearing seat (25), and each of the fan bearing seats (25) is provided with a fan (27).

2. The sinking type double-row inline fan heat dissipation module according to claim 1, characterized in that: The lower end surface of the graphics memory heat sink (14) is adhered with a first heat-conducting adhesive (141), and the graphics memory heat sink (14) is designed in a mouth-shaped form.

3. The sinking type double-row inline fan heat dissipation module according to claim 1, characterized in that: The lower end surface of the copper base (12) is fixed with four first studs (13), and the graphics memory heat sink (14) is fixed on the four first studs (13).

4. The sinking type double-row inline fan heat dissipation module according to claim 1, characterized in that: The first heat pipe (151) and the third heat pipe (153) are designed in a linear form, and a plurality of first heat pipes (151) and a plurality of second heat pipes (152) are arranged, the plurality of first heat pipes (151) are fixed on the main fin (161), the first auxiliary fin (162) and the third auxiliary fin (164), the plurality of second heat pipes (152) are fixed on the main fin (161), the first auxiliary fin (162), the second auxiliary fin (163) and the third auxiliary fin (164), and the third heat pipe (153) is fixed on the main fin (161) and the third auxiliary fin (164).

5. The sinking type double-row inline fan heat dissipation module according to claim 1, characterized in that: The lower end surface of the fin module (16) is fixed with a plurality of connecting plates (17), the lower end surfaces of the plurality of connecting plates (17) are adhered with a second heat-conducting adhesive (18), and two first studs (13) are fixed on each connecting plate (17).

6. The sinking type double-row inline fan heat dissipation module according to claim 1, characterized in that: A plurality of fin screws (19) are mounted on the lower end surface of the fin module (16), and the plurality of fin screws (19) are screwed into the shell (21).

7. The sinking type double-row inline fan heat dissipation module according to claim 1, characterized in that: Each of the upper convex rubber covers (22) is a cavity structure with openings at both ends and a hollow interior, and each upper convex rubber cover (22) is fixed with a fan base (23), and each fan base (23) is fixed with three second studs (24).

8. The sinking type double-row inline fan heat dissipation module according to claim 7, characterized in that: Three fan screws (26) are installed on each fan bearing seat (25), and the three fan screws (26) are screwed into the three second studs (24) on the fan base (23) respectively.

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