Round straight type heat pipe arrangement heat dissipation module
By using a heat dissipation module with a straight, circular heat pipe arrangement, the problem of reduced efficiency caused by heat pipe bending in existing technologies has been solved, achieving more efficient heat dissipation and cost control.
Patent Information
- Application Number
- CN202520306874.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-02-25
- Publication Date
- 2025-12-26
- Estimated Expiration
- 2035-02-25
AI Technical Summary
In existing graphics card cooling modules, as chip size decreases and heat generation increases, the bending and shaping of multiple heat pipes leads to reduced efficiency, making it difficult to meet high-performance cooling requirements.
The heat dissipation module adopts a circular straight heat pipe arrangement. By welding the heat pipes to the heat spreader without bending them, the heat pipe arrangement area is increased. Multiple straight heat pipes are used for heat transfer. Combined with the extended heat spreader and multiple fin structures, rapid heat conduction is achieved.
It improves heat dissipation efficiency, reduces heat pipe processing costs, and enhances heat dissipation performance without reducing the number of heat pipes.
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Figure CN223728214U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to a display card heat dissipation module, concretely is a round straight heat pipe arrangement heat dissipation module. BACKGROUND
[0002] With the maturity and re-development of display card industry, the performance of the existing display card is higher and higher, and the result is that the power consumption is higher and higher, so a larger and larger heat dissipation module is needed to meet the heat dissipation demand in the use process.
[0003] The heat dissipation module on the market at present is all single-layer heat pipe, under the background of the continuous improvement of chip process, the size of the chip is smaller and smaller, and the heat generation is larger and larger, under this premise, more heat pipes need to be formed into corresponding shapes for combination, when the number of heat pipes is more, the heat pipes need to be bent into different shapes for combination, according to the characteristics of the heat pipe, the efficiency of the heat pipe will also decrease with each additional bending and forming, which also causes the performance of the module to be difficult to improve. CONTENT OF THE UTILITY MODEL
[0004] The utility model aims at providing a round straight heat pipe arrangement heat dissipation module, the heat pipe can be successfully welded on the heat plate without bending, and the heat pipe can fully play the heat transfer performance without bending, so it is beneficial to faster heat conduction to obtain better heat dissipation effect.
[0005] To achieve the above object, the utility model provides the following technical scheme: a round straight heat pipe arrangement heat dissipation module, including heat conduction module and the convection module of setting on heat conduction module, heat conduction module includes the heat plate and the display memory heat conduction seat and copper bottom plate of setting on heat plate, heat plate has main heat zone and extension heat zone, display memory heat conduction seat includes seat body, seat body and copper bottom plate are welded on both ends of heat plate respectively, and seat body is designed in mouth character, heat conduction module still includes fin, and the fin includes main fin, edge fin and extension fin, and a plurality of heat pipes are fixed on the fin, main fin is welded on the one end of copper bottom plate far from heat plate, and a plurality of heat pipes all pass through main fin, edge fin and extension fin, so that the heat that edge fin absorbs from copper bottom plate can be transferred to main fin through heat pipe, and then is transferred to edge fin and extension fin, so that the heat is spread, and edge fin and extension fin are all fixed through a plurality of heat pipes, that is, edge fin and extension fin are hung on both ends of main fin, including fan seat, fan assembly and fixed assembly of setting on fan seat, fan seat includes two support plates, second copper column fixed on two support plates respectively and fan bearing seat setting on two support plates, fan bearing seat is provided with three, two support plates are all welded on the upper end surface of fin, specifically in any one of main fin, edge fin or extension fin, the length of two support plates is different, and there are two second copper columns on one support plate, and there is a second copper column on the other support plate, that is, a group of fan seats has three second copper columns, and fan assembly includes a shell, and a fan body is arranged on the shell.
[0006] Preferably, a plurality of auxiliary heat zones are arranged on the main heat zone, and a heat conduction paste layer is arranged on the lower end surface of the main heat zone.
[0007] Preferably, a plurality of first heat conduction adhesives are arranged on the lower end surface of the seat body, and four copper column perforations are arranged on the seat body.
[0008] Preferably, the heat pipe has a welding surface located at the end of the heat pipe in contact with the copper bottom plate.
[0009] Preferably, the plurality of heat pipes are distributed at equal intervals, and the plurality of heat pipes are all welded to the upper end surface of the copper bottom plate.
[0010] Preferably, an aluminum bottom plate is welded to the lower end surface of the main fin, the edge fin, and the extension fin, and the aluminum bottom plate is provided with three in total.
[0011] Preferably, a plurality of first copper columns are fixed to the lower end surface of the copper bottom plate and the lower end surface of the fin, the plurality of first copper columns are evenly distributed on the copper bottom plate and the fin, screw holes corresponding to the plurality of first copper columns are arranged on the graphics card PCB, the screw holes pass through the screw holes on the graphics card PCB and are screwed into the first copper columns, thereby fixing the heat conduction module to the graphics card PCB.
[0012] Preferably, three fan screws are installed on the fan bearing seat, the three fan screws are distributed in the circumferential direction of the fan bearing seat, and the three fan screws are respectively installed in the three second copper columns.
[0013] Preferably, two through holes are arranged on the shell, two fan bodies are arranged, and the two fan bodies are respectively located in the two through holes and are respectively installed on the two fan bearing seats.
[0014] Compared with the prior art, the utility model has the beneficial effects as follows:
[0015] 1. The utility model discloses a heat conduction module, which comprises a main heat equalizing area and an expansion heat equalizing area arranged on one side of the main heat equalizing area.
[0016] 2. The utility model discloses a heat conduction module, which comprises a main heat equalizing area and an expansion heat equalizing area arranged on one side of the main heat equalizing area. BRIEF DESCRIPTION OF DRAWINGS
[0017] Figure 1 It is the whole schematic view of the embodiment of the utility model;
[0018] Figure 2 It is the schematic view of the heat conduction module of the utility model;
[0019] Figure 3 It is the schematic view of the heat conduction module of the utility model;
[0020] Figure 4 It is the schematic view of the utility model;
[0021] Figure 5 It is the schematic view of the utility model Figure 2 It is the enlarged view of the utility model;
[0022] Figure 6 It is the schematic view of the utility model;
[0023] Figure 7 It is the schematic view of the utility model.
[0024] The reference signs and names in the figure are as follows: 1, heat conduction module; 11, heat conduction plate; 111, main heat conduction area; 112, auxiliary heat conduction area; 113, extended heat conduction area; 114, heat conduction paste layer; 12, display memory heat conduction seat; 121, seat body; 122, first heat conduction glue; 123, copper column through hole; 13, copper bottom plate; 14, heat dissipation fin; 141, main fin; 142, edge fin; 143, extended fin; 15, heat pipe; 151, welding surface; 16, aluminum bottom plate; 17, second heat conduction glue; 18, first copper column; 2, convection module; 21, fan seat; 211, support plate; 212, second copper column; 213, fan bearing seat; 214, fan screw; 22, fan assembly; 221, shell; 222, fan body. DETAILED DESCRIPTION
[0025] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the present application.
[0026] In the description of the embodiments of the present application, it should be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the embodiments of the present application and simplifying the description, and therefore cannot be understood as indicating or implying that the devices or elements indicated must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the present application. In addition, the terms "first", "second" are only for the purpose of description, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the technical features indicated. Therefore, the features limited by "first", "second" can explicitly or implicitly include one or more of the features. In the description of the embodiments of the present application, the meaning of "multiple" is two or more, unless otherwise specifically limited.
[0027] In the embodiments of the present application, unless otherwise specifically defined and limited, the terms "mounting", "connection", "connection", "fixing" and the like should be understood in a broad sense, for example, it can be fixedly connected, or it can be detachably connected, or it can be integrated; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium; it can be the communication or interaction relationship between two elements. For those skilled in the art, the specific meaning of the above terms in the embodiments of the present application can be understood according to the specific circumstances.
[0028] Referring to Figure 1 The utility model provides a kind of embodiment: a circular straight heat pipe arrangement heat dissipation module, for giving video card heat dissipation, including heat conduction module 1 and being set on heat conduction module 1 on convection module 2.
[0029] Referring to Figure 2 Heat conduction module 1 includes heat plate 11 and being set on heat plate 11 on video memory heat conduction seat 12, copper bottom plate 13 and fin 14, multiple heat pipes 15 are fixed on fin 14, multiple heat pipes 15 are equidistant distribution, and multiple heat pipes 15 are all welded on the upper end surface of copper bottom plate 13, main fin 141 is welded on the end of copper bottom plate 13 away from heat plate 11, multiple heat pipes 15 all pass through main fin 141, edge fin 142 and extension fin 143, so that the heat absorbed by edge fin 142 from copper bottom plate 13 can be transmitted to main fin 141 by heat pipe 15, then transmitted to edge fin 142 and extension fin 143, so that heat is spread, and edge fin 142 and extension fin 143 are fixed by multiple heat pipes 15, that is, edge fin 142 and extension fin 143 are hung on the two ends of main fin 141, and aluminum bottom plate 16 is welded on the lower end surface of main fin 141, edge fin 142 and extension fin 143, and the lower end surface of two aluminum bottom plates 16 is provided with second heat conduction glue 17, for giving part of electronic components on video card PCB heat conduction, which can be power mos tube, and second heat conduction glue 17 is made of the same material as first heat conduction glue 122, multiple first copper columns 18 are fixed on the lower end surface of copper bottom plate 13 and fin 14, and multiple first copper columns 18 are evenly distributed on copper bottom plate 13 and fin 14, and screw hole corresponding to multiple first copper columns 18 is provided on video card PCB, and first copper column 18 is attacked into screw hole from the screw hole on video card PCB, so that heat conduction module 1 can be fixed with video card PCB.
[0030] Referring to Figure 3 Heat plate 11 has main heat zone 111 and extension heat zone 113 located on one side of main heat zone 111, multiple auxiliary heat zones 112 are provided on main heat zone 111, and heat paste layer 114 is provided on the lower end surface of main heat zone 111, in the embodiment, three auxiliary heat zones 112 are provided and distributed in three different directions of main heat zone 111, main heat zone 111 is used for heat conduction to GPU core, and auxiliary heat zone 112 is used for heat conduction to video memory, and fin 14 includes main fin 141, edge fin 142 and extension fin 143.
[0031] Referring to Figure 4The heat conduction seat 12 of the graphics memory includes a seat body 121, the seat body 121 and the copper bottom plate 13 are respectively welded at two ends of the vapor chamber 11, and the seat body 121 is designed in a mouth shape, a plurality of first heat conduction glues 122 are arranged on the lower end surface of the seat body 121, and four copper column through holes 123 are arranged on the seat body 121, in the embodiment, the plurality of first heat conduction glues 122 are of a model of Leierde 90000, which is of a soft material, and mainly functions to directly contact the graphics memory, absorb heat of the graphics memory and transfer the heat to the seat body 121, the first heat conduction glue 122 has a certain viscosity, and can be directly adhered to the lower end surface of the seat body 121, and the four copper column through holes 123 are respectively used for allowing four first copper columns 18 to pass through.
[0032] Please refer to Figure 5 The heat pipe 15 has a welding surface 151 located at one end of the heat pipe 15 in contact with the copper bottom plate 13.
[0033] Please refer to Figure 6 The convection module 2 includes a fan seat 21, a fan assembly 22 arranged above the fan seat 21 and a fixing assembly 23.
[0034] Please refer to Figure 7 The fan seat 21 includes two support plates 211, second copper columns 212 respectively fixed on the two support plates 211 and fan bearing seats 213 arranged on the two support plates 211, the fan bearing seats 213 are arranged in three, the two support plates 211 are welded on the upper end surface of the heat dissipation fin 14, specifically any one of the main fin 141, the edge fin 142 or the extended fin 143, the lengths of the two support plates 211 are different, there are two second copper columns 212 on one support plate 211, and there is one second copper column 212 on the other support plate 211, that is, one set of fan seats 21 has three second copper columns 212, in the embodiment, the fan seat 21 is arranged in two sets in total, and actually one set or three sets can also be arranged, three fan screws 214 are installed on the fan bearing seat 213, the three fan screws 214 are distributed in the circumferential direction of the fan bearing seat 213, and the three fan screws 214 are respectively installed in the three second copper columns 212, the fan assembly 22 includes an outer shell 221, a fan body 222 is arranged on the outer shell 221, two through holes are arranged on the outer shell 221, the fan body 222 is arranged in two, the two fan bodies 222 are respectively located in the two through holes, and the two fan bodies 222 are respectively installed on the two fan bearing seats 213, a strip-shaped support 231 is welded on both sides of the upper end surface of the heat dissipation fin 14, a plurality of fin screws 232 are installed on the lower end surface of the strip-shaped support 231, and the plurality of fin screws 232 respectively penetrate the lower end surface of the outer shell 221, so that the convection module 2 can be fixed on the heat conduction module 1.
[0035] It is apparent for a person skilled in the art that the present application is not restricted to the details of the above exemplary embodiments, but that it can be implemented in other concrete forms without departing from the spirit or the essential characteristics of the present application. Therefore, the embodiments should be considered as exemplary only, and not limiting, the scope of the present application being defined by the appended claims rather than the above description, and all changes coming within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference signs in the claims should not be construed as limiting the claims concerned.
Claims
1. A round straight heat pipe arrangement heat dissipation module, comprising a heat conduction module (1) and a convection module (2) arranged on the heat conduction module (1), characterized in that: The heat conduction module (1) comprises a vapor chamber (11), a display memory heat conduction seat (12) and a copper bottom plate (13) arranged on the vapor chamber (11), the vapor chamber (11) has a main heat conduction area (111) and an extended heat conduction area (113), the display memory heat conduction seat (12) comprises a seat body (121), the seat body (121) and the copper bottom plate (13) are respectively welded at two ends of the vapor chamber (11), and the seat body (121) is designed in a mouth shape, the heat conduction module (1) further comprises a heat dissipation fin (14), the heat dissipation fin (14) comprises a main fin (141), an edge fin (142) and an extended fin (143), and a plurality of heat pipes (15) are fixed on the heat dissipation fin (14), the main fin (141) is welded at one end of the copper bottom plate (13) away from the vapor chamber (11), the plurality of heat pipes (15) all pass through the main fin (141), the edge fin (142) and the extended fin (143), the edge fin (142) and the extended fin (143) are fixed through the plurality of heat pipes (15), the convection module (2) comprises a fan seat (21), a fan assembly (22) arranged above the fan seat (21) and a fixing assembly (23), the fan seat (21) comprises two supporting plates (211), a second copper column (212) fixed on each supporting plate (211) and a fan bearing seat (213) arranged on the two supporting plates (211), each group of fan seats (21) has three fan bearing seats (213), the two supporting plates (211) are welded on the upper end surface of the heat dissipation fin (14), each group of fan seats (21) has three second copper columns (212), the fan assembly (22) comprises a shell (221), and a fan body (222) is arranged on the shell (221).
2. The heat dissipating module of claim 1, wherein the heat pipes are arranged in a circular pattern. A plurality of auxiliary heat conduction areas (112) are arranged on the main heat conduction area (111), and a heat conduction paste layer (114) is arranged on the lower end surface of the main heat conduction area (111).
3. The heat dissipating module of claim 1, wherein the heat pipes are arranged in a circular pattern. A plurality of first heat conduction adhesives (122) are arranged on the lower end surface of the seat body (121), and four copper column perforations (123) are arranged on the seat body (121).
4. The heat dissipating module of claim 1, wherein the heat pipes are arranged in a circular pattern. The heat pipe (15) has a welding surface (151), and the welding surface (151) is located at one end of the heat pipe (15) in contact with the copper bottom plate (13).
5. The heat dissipating module of claim 1, wherein the heat pipe is arranged in a circular straight pattern. The plurality of heat pipes (15) are distributed at equal intervals, and the plurality of heat pipes (15) are welded on the upper end surface of the copper bottom plate (13).
6. The heat dissipating module of claim 1, wherein the heat pipe is arranged in a circular straight pattern. An aluminum bottom plate (16) is welded on the lower end surface of each of the main fin (141), the edge fin (142) and the extended fin (143), and three aluminum bottom plates (16) are arranged in total.
7. The heat dissipating module of claim 1, wherein the heat pipe is arranged in a circular straight pattern. A plurality of first copper columns (18) are fixed on the lower end surface of the copper bottom plate (13) and the lower end surface of the heat dissipation fin (14), and the plurality of first copper columns (18) are uniformly distributed on the copper bottom plate (13) and the heat dissipation fin (14).
8. The heat dissipating module of claim 1, wherein the heat pipe is arranged in a circular straight pattern. Three fan screws (214) are installed on the fan bearing seat (213), the three fan screws (214) are distributed in the circumferential direction of the fan bearing seat (213), and the three fan screws (214) are respectively installed in the three second copper columns (212).
9. The heat dissipating module of claim 1, wherein the heat pipe is arranged in a circular straight pattern. Two through holes are arranged on the shell (221), two fan bodies (222) are arranged in total, the two fan bodies (222) are respectively located in the two through holes, and the two fan bodies (222) are respectively installed on the two fan bearing seats (213).