Step type PCB

Abstract

The utility model discloses a step type PCB board, comprising a PCB board body, the PCB board body comprises a first PCB board, a second PCB board, a third PCB board and a fourth PCB board, the upper surface of the first PCB board, the upper surface of the second PCB board, the upper surface of the third PCB board and the upper surface of the fourth PCB board are all provided with stacked holes which are arranged at equal intervals, the stacked holes are internally provided with copper columns, and the copper columns are connected with the first PCB board, the second PCB board, the third PCB board and the fourth PCB board. The bottom surface of the first PCB is fixedly connected with the upper surface of the second PCB, the bottom surface of the second PCB is fixedly connected with the upper surface of the third PCB, and a protective layer is arranged below the first PCB. According to the utility model, the blind holes are stacked to form the stacked hole, the copper surface is changed into the copper column, the depth-controlled forming is relatively simple, and the copper column is formed by stacking the laser holes, so that the allowable error during forming and cutting is increased, the conductivity is not influenced, the problem of large error during forming and cutting is solved, the conductivity is improved, the copper foil is prevented from being too thin, and the copper foil is prevented from being damaged. Technical control is difficult when a forming mode is used.

Description

TECHNICAL FIELD

[0001] The application relates to the field of PCB boards, in particular to a stepped PCB board. BACKGROUND

[0002] Some PCB products have stepped designs, and the steps have stacked holes, which are matched with SMT parts to realize the function of inner layer signal conduction. The production process mainly adopts the controlled depth forming processing mode to mill the base material above the stacked holes, and the stacked holes are exposed. However, when there are fine lines and line spacing designs, it is required that the surface copper thickness must be thin enough, such as 40um and 40um line width and line spacing, and the thickness of the stacked hole is required to be 15um. When the thickness of the stacked hole is only 15um, the controlled depth precision cannot meet the requirements. If the forming depth is too shallow, the stacked hole cannot be formed, and if the forming precision is too deep, the stacked hole will be milled directly.

[0003] Because the thickness of the copper foil is too thin, if the forming mode is used to expose this layer of copper foil, it is difficult to control technically, and therefore, when the forming and cutting are performed, a large error is prone to occur, and the conduction property is affected. CONTENT OF THE UTILITY MODEL

[0004] The utility model aims at providing a stepped PCB board to solve the problems in the background art.

[0005] The application embodiment adopts the following technical scheme:

[0006] A stepped PCB board comprises a PCB board body, the PCB board body comprises a first PCB board, a second PCB board, a third PCB board and a fourth PCB board, the upper surfaces of the first PCB board, the second PCB board, the third PCB board and the fourth PCB board are all provided with stacked holes arranged at equal distances, and the stacked holes are internally provided with copper columns.

[0007] Preferably, the bottom surface of the first PCB board is fixedly connected with the upper surface of the second PCB board, and the bottom surface of the second PCB board is fixedly connected with the upper surface of the third PCB board.

[0008] Preferably, a protective layer is arranged below the first PCB board, and the upper surface of the protective layer is fixedly connected with the bottom surface of the fourth PCB board.

[0009] Preferably, an installation ring is fixedly connected with the outer surface of the protective layer, and two installation holes are formed in the outer surface of the installation ring.

[0010] Preferably, a specification plate is fixedly connected with the bottom surface of the installation ring, and a protective film is brushed on the outer surface of the specification plate.

[0011] Preferably, the bottom surface of the third PCB plate is fixedly connected with the upper surface of the fourth PCB plate, and the bottom end of the copper column is fixedly connected with the inside of the stack hole.

[0012] The above-mentioned at least one technical solution adopted by the embodiment of the application can achieve the following beneficial effects:

[0013] The utility model discloses a blind hole stack forms the stack hole, makes copper surface become copper column, and the control depth forming is relatively simple, and the copper column is formed by the stack of laser hole, so that the allowable error of forming cutting is big, and the conductivity is not affected, thereby solve the problem of big error when forming cutting, and improve the conductivity, avoid the thickness of copper foil too thin, and the situation of difficult to control in technology is avoided. BRIEF DESCRIPTION OF DRAWINGS

[0014] The accompanying drawings, which are included to provide a further understanding of the application and are incorporated in and constitute a part of this application, illustrate embodiments of the application and serve to explain the principles of the application, and do not limit the application. In the drawings:

[0015] Figure 1 is: the overall perspective structure schematic diagram of the utility model;

[0016] Figure 2 is: the overall front view sectional structure schematic diagram of the utility model;

[0017] Figure 3 is: the overall perspective structure schematic diagram of the utility model from below;

[0018] Figure 4 is: the structure enlarged schematic diagram of the utility model in A place. Figure 1

[0019] In the drawing: 1, PCB plate body; 2, first PCB plate; 3, second PCB plate; 4, third PCB plate; 5, fourth PCB plate; 6, stack hole; 7, copper column; 8, protective layer; 9, mounting ring; 10, mounting hole; 11, specification plate. DETAILED DESCRIPTION

[0020] In order to make the purpose, technical scheme and advantage of the application more clear, the technical scheme of the application will be described clearly and completely below in conjunction with the specific embodiments of the application and corresponding drawings. Obviously, the described embodiments are only a part of the embodiments of the application, not all the embodiments. Based on the embodiments in the application, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the application.

[0021] The technical scheme provided by each embodiment of the application will be described in detail below in conjunction with the drawings.

[0022] ​Please refer to Figures 1-4 The utility model provides a step type PCB board technical scheme:

[0023] A step type PCB board, including PCB board body 1, PCB board body 1 includes first PCB board 2, second PCB board 3, third PCB board 4 and fourth PCB board 5, the upper surface of first PCB board 2, the upper surface of second PCB board 3, the upper surface of third PCB board 4 and the upper surface of fourth PCB board 5 all are set up with the hole 6 of stacking of equidistance arrangement, the inside of hole 6 is equipped with copper column 7, specifically, utilize blind hole stacking to form hole 6, make copper surface become copper column 7, control depth forming is relatively simple, copper column 7 is by laser hole superposition and forms, like this the allowable error of forming cutting is changed greatly, also does not affect the conductivity, to solve the problem of big error when forming cutting, and improve the conductivity, avoid the thickness of copper foil too thin, it is difficult to control in the use of forming mode technology,

[0024] In the embodiment, the bottom surface of the first PCB board 2 is fixedly connected with the upper surface of the second PCB board 3, and the bottom surface of the second PCB board 3 is fixedly connected with the upper surface of the third PCB board 4; a protective layer 8 is arranged below the first PCB board 2, and the upper surface of the protective layer 8 is fixedly connected with the bottom surface of the fourth PCB board 5; specifically, the protective layer 8 is arranged to improve the protection of the bottom surface of the PCB board body 1.

[0025] In the embodiment, the outer surface of the protective layer 8 is fixedly connected with a mounting ring 9, two mounting holes 10 are formed in the outer surface of the mounting ring 9; a specification plate 11 is fixedly connected with the bottom surface of the mounting ring 9, and the outer surface of the specification plate 11 is coated with a protective film; the bottom surface of the third PCB board 4 is fixedly connected with the upper surface of the fourth PCB board 5, and the bottom end of the copper column 7 is fixedly connected with the inside of the hole 6; specifically, the mounting ring 9 and the mounting hole 10 are arranged to improve the stability of the PCB board body 1 during installation, and the specification plate 11 is arranged to facilitate the user to distinguish the PCB board body 1 according to the specification.

[0026] Working principle: when the step type PCB board is used, the blind hole is stacked to form the hole 6, the copper surface is changed into the copper column 7, the control depth forming is relatively simple, the copper column 7 is formed by laser hole superposition, so that the allowable error of forming cutting is changed greatly, and the conductivity is not affected, and the problem of big error during forming cutting is solved.

[0027] The above description is only an embodiment of the application and is not used to limit the application. Those skilled in the art can make various changes and modifications to the application. Any modification, equivalent replacement, improvement, etc. made within the spirit and principles of the application shall be included in the scope of the claims of the application.

Claims

1. A stepped PCB board comprising a PCB board body (1), characterized in that: The PCB plate body (1) comprises a first PCB plate (2), a second PCB plate (3), a third PCB plate (4) and a fourth PCB plate (5), the upper surface of the first PCB plate (2), the upper surface of the second PCB plate (3), the upper surface of the third PCB plate (4) and the upper surface of the fourth PCB plate (5) are all provided with equidistantly arranged stacking holes (6), and the stacking holes (6) are internally provided with copper columns (7).

2. The stepped PCB of claim 1, wherein: The bottom surface of the first PCB plate (2) is fixedly connected with the upper surface of the second PCB plate (3), and the bottom surface of the second PCB plate (3) is fixedly connected with the upper surface of the third PCB plate (4).

3. The stepped PCB of claim 1, wherein: The lower portion of the first PCB plate (2) is provided with a protective layer (8), and the upper surface of the protective layer (8) is fixedly connected with the bottom surface of the fourth PCB plate (5).

4. The stepped PCB of claim 3, wherein: The outer surface of the protective layer (8) is fixedly connected with a mounting ring (9), and the outer surface of the mounting ring (9) is provided with two mounting holes (10).

5. The stepped PCB of claim 4, wherein: The bottom surface of the mounting ring (9) is fixedly connected with a specification plate (11), and the outer surface of the specification plate (11) is coated with a protective film.

6. The stepped PCB of claim 1, wherein: The bottom surface of the third PCB plate (4) is fixedly connected with the upper surface of the fourth PCB plate (5), and the bottom end of the copper column (7) is fixedly connected with the interior of the stacking hole (6).

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