Semiconductor chilling plate

Abstract

The utility model discloses a semiconductor chilling plate, which belongs to the technical field of chilling plates and comprises two chilling plate bodies, first heat conduction paste is arranged at the tops of the two chilling plate bodies, and second heat conduction paste is arranged at the bottoms of the two chilling plate bodies. A first heat dissipation block is connected between the bottoms of the two refrigeration sheet bodies in a threaded mode, a heat dissipation fan is installed in the installation groove, a second heat dissipation block is connected between the tops of the two refrigeration sheet bodies in a threaded mode, and a plurality of connecting holes are formed in the top of the second heat dissipation block. The cooling fin has good fluidity and filling performance, and can permeate into the small gaps, so that closer physical contact between the cooling fin and other parts is realized, the thermal resistance is greatly reduced, the heat transfer efficiency is improved, and heat can be more smoothly transferred from the hot end of the cooling fin to a cooling fin or from a cooled object to the cold end of the cooling fin.

Description

TECHNICAL FIELD

[0001] The utility model relates to refrigeration piece technical field especially relates to a semiconductor refrigeration piece. BACKGROUND

[0002] With the continuous development of modern science and technology, higher requirements are put forward for refrigeration technology, such as miniaturization, light weight, high efficiency, energy saving, environmental protection and fluorine free, and under this background, semiconductor refrigeration piece emerges as the times require, semiconductor refrigeration piece is based on peltier effect, that is, when direct current passes through the electric couple composed of two different semiconductor materials, heat will be absorbed and heat will be emitted at the two ends of the electric couple, refrigeration and heating functions can be realized, this refrigeration mode has many obvious advantages, after years of development, the performance of semiconductor refrigeration piece has been significantly improved, and the application field is also expanding, at present, semiconductor refrigeration piece has been widely used in electronic equipment heat dissipation, medical equipment refrigeration, food preservation, automobile air conditioning and many other fields, and with the continuous progress of technology, its application prospect will be more extensive.

[0003] The existing mechanical processing cannot make ideal flat surface, therefore there are many gullies or gaps between semiconductor refrigeration piece and radiator, air gap will seriously affect the heat dissipation efficiency, and the performance of the radiator is greatly reduced, so that the radiator cannot play a role.

[0004] Therefore, it is urgent to provide a semiconductor refrigeration piece to solve the above problems. INVENTION CONTENTS

[0005] The technical problem to be solved by the utility model is to overcome the defects of the prior art, and provide a semiconductor refrigeration piece.

[0006] To solve the above technical problems, one technical scheme of the utility model is to provide a semiconductor refrigeration piece, which comprises two refrigeration piece bodies, the top of each refrigeration piece body is provided with first heat-conducting paste, the bottom of each refrigeration piece body is provided with second heat-conducting paste, the bottoms of the two refrigeration piece bodies are threadedly connected with a first heat dissipation block, the top of the first heat dissipation block is provided with a plurality of fixing holes, the bottom of the first heat dissipation block is provided with a plurality of mounting grooves, a heat dissipation fan is mounted in each mounting groove, the tops of the two refrigeration piece bodies are threadedly connected with a second heat dissipation block, and the top of the second heat dissipation block is provided with a plurality of connecting holes.

[0007] The utility model is further provided as follows: the hot end and the cold end of the refrigeration piece body are horizontally arranged with corresponding first heat-conducting paste and second heat-conducting paste.

[0008] Through the technical scheme, the hot end and the cold end of the refrigeration fin body can be fully attached to the first and second heat-conducting pastes, the contact area between the hot end and the cold end of the refrigeration fin body and the first and second heat-conducting pastes is maximized, meanwhile, more heat can be transferred through the larger contact area, the thermal resistance is reduced, and the heat dissipation and refrigeration effects of the whole refrigeration system are improved.

[0009] The utility model further sets up: two refrigeration fin body top and bottom all utilize silk screen printing machine design steel net, first heat-conducting paste and second heat-conducting paste are coated in corresponding steel net inside respectively.

[0010] Through the technical scheme, the first and second heat-conducting pastes can be evenly distributed on the top and bottom of the refrigeration fin body, meanwhile, the first and second heat-conducting pastes can pass through the mesh holes evenly and cover the surface of the refrigeration fin body, which effectively avoids the situation that the first and second heat-conducting pastes are too thick or too thin in some areas, and ensures the uniformity of heat transfer.

[0011] The utility model further sets up: first radiating piece and second radiating piece between through screw fixed, and every Fixed Hole all with connecting hole matching.

[0012] Through the technical scheme, the connection mode realized through the screw can effectively resist external force, ensure that the first and second radiating pieces will not relatively displace, maintain the structural integrity of the heat dissipation system, meanwhile, the design that the fixed holes all match the connecting holes reduces the installation difficulty and improves the installation efficiency.

[0013] The utility model further sets up: the top of radiating fan and the top of installation groove inner wall mutually fit, and installation groove and radiating fan all are at first radiating piece center.

[0014] Through the technical scheme, the wind force generated by the radiating fan can cover the surface of the first and second radiating pieces, the heat dissipation area of the first and second radiating pieces is used to the maximum extent, the heat dissipation performance of the first and second radiating pieces is improved, and the equipment can better control the temperature during operation.

[0015] The utility model further sets up: the phase change temperature of first heat-conducting paste and second heat-conducting paste is 45 DEG.

[0016] Through the technical scheme, the liquid first and second heat-conducting pastes can better fill the tiny gap between the refrigeration fin body and the heat dissipation component, increase the contact area, reduce the thermal resistance, thereby more efficiently transfer heat, and ensure that the heat of the hot end of the refrigeration fin body can be quickly dissipated.

[0017] The first and second heat-conducting pastes are solid at room temperature and are melted into liquid after being heated.

[0018] Through the above technical scheme, the solid first and second heat-conducting pastes have certain shape and viscosity, and the position and thickness of the pastes can be more easily controlled when the pastes are applied to the hot end and the cold end of the semiconductor refrigeration piece body.

[0019] The first heat-conducting paste on the top of the refrigeration piece body and the second heat-conducting paste on the bottom of the refrigeration piece body are both triangular in shape.

[0020] Through the above technical scheme, the length and angle relationship of the three sides can make the heat more evenly distributed on the top and the bottom of the refrigeration piece body in the heat conduction process, so that the temperature of each part of the refrigeration piece body is more uniform.

[0021] The top of the first heat-conducting paste and the bottom of the second heat-conducting paste are both closely attached to the bottom of the corresponding first heat-dissipating block and the top of the second heat-dissipating block.

[0022] Through the above technical scheme, the heat can rapidly spread from the contact point to the surrounding area, avoiding the accumulation of heat in a local area.

[0023] The two refrigeration piece bodies are both in the same plane and are parallel to each other.

[0024] Through the above technical scheme, uniform heat dissipation can be achieved, and local overheating can be avoided.

[0025] The beneficial effects of the present utility model are as follows:

[0026] 1. The first and second heat-conducting pastes have good fluidity and filling property, can penetrate into the small gaps, and can achieve closer physical contact between the refrigeration piece and other components, thereby greatly reducing the thermal resistance and improving the heat transfer efficiency.

[0027] 2. The utility model discloses a fixed hole and connecting hole are set up, can effectively resist external force, ensure that the relative displacement of first radiating block and second radiating block does not happen, maintain the structural integrity of heat dissipation system, meanwhile, the design that fixed hole all are matched with connecting hole has reduced the installation difficulty, improved the installation efficiency. BRIEF DESCRIPTION OF DRAWINGS

[0028] Figure 1 It is whole structure schematic diagram of the utility model;

[0029] Figure 2 It is plan view of the utility model;

[0030] Figure 3 It is bottom view of the utility model;

[0031] Figure 4 It is partial structure schematic diagram of the utility model;

[0032] Figure 5 It is Figure 1 Local enlarged view of A place in middle.

[0033] In the drawing: 1, refrigeration piece body;2, first heat conduction paste;3, second heat conduction paste;4, first radiating block;5, fixed hole;6, installation slot;7, heat dissipation fan;8, second radiating block;9, connecting hole. DETAILED DESCRIPTION

[0034] The preferred embodiments of the utility model are described in detail below in combination with the drawings, so that the advantages and characteristics of the utility model can be more easily understood by the person skilled in the art, and the protection scope of the utility model is defined more clearly and explicitly.

[0035] Please refer to Figure 1 - Figure 5The utility model provides a semiconductor refrigeration piece, including two refrigeration piece bodies 1, first heat conduction paste 2 is arranged in the top of two refrigeration piece bodies 1, and two refrigeration piece bodies 1 are in the same plane, and two refrigeration piece bodies 1 are parallel to each other, can realize uniform heat dissipation, avoids local overheating phenomenon, and also, two refrigeration piece bodies 1 cold end can in similar mode from the heat absorption of cooled object, guarantees the temperature of cooled object each part uniform reduction, improves the consistency of refrigeration effect, second heat conduction paste 3 is arranged in the bottom of two refrigeration piece bodies 1, and the hot end and cold end of refrigeration piece body 1 are with corresponding first heat conduction paste 2 and second heat conduction paste 3 horizontal arrangement, can make the hot end and cold end of refrigeration piece body 1 and first heat conduction paste 2 and second heat conduction paste 3 fully adhere, let the contact area between both reach maximum, and simultaneously, more heat can be transferred through the larger contact area, reduces the thermal resistance, thereby improves the heat dissipation and refrigeration effect of whole refrigeration system, the top and bottom of two refrigeration piece bodies 1 are designed steel screen with silk-screen machine, and first heat conduction paste 2 and second heat conduction paste 3 are coated in the corresponding inside of steel screen respectively, can make first heat conduction paste 2 and second heat conduction paste 3 evenly distribute in the top and bottom of refrigeration piece body 1, and simultaneously, first heat conduction paste 2 and second heat conduction paste 3 can evenly pass through the mesh, cover on the surface of refrigeration piece body 1, this effectively avoids the situation that first heat conduction paste 2 and second heat conduction paste 3 are locally too thick or too thin, guarantees the uniformity of heat transfer, the phase transition temperature of first heat conduction paste 2 and second heat conduction paste 3 is 45 DEG, and liquid first heat conduction paste 2 and second heat conduction paste 3 can better fill the tiny gap between refrigeration piece body 1 and heat dissipation component, increase the contact area, reduce the thermal resistance, thereby more efficiently transfer heat, guarantee the heat of hot end of refrigeration piece body 1 can be quickly dissipated, first heat conduction paste 2 and second heat conduction paste 3 are solid at room temperature, and melt into liquid after temperature rise, solid first heat conduction paste 2 and second heat conduction paste 3 have certain shape and viscosity, when being daubed to the hot end and cold end of semiconductor refrigeration piece body 1, can more easily control the position and thickness of daubing, and first heat conduction paste 2 of the top of two refrigeration piece bodies 1 and second heat conduction paste 3 of the bottom are all set up in triangular shape, the length and angle relation of three sides, heat can be more evenly distributed in the top and bottom of refrigeration piece body 1 in the process of conduction, makes the temperature of each part of refrigeration piece body 1 more uniform,

[0036] As Figure 3 , Figure 4 and Figure 5As shown, the first heat dissipation block 4 is threadedly connected between the bottoms of the two refrigeration fin bodies 1, a plurality of fixing holes 5 are formed in the top of the first heat dissipation block 4, a plurality of mounting grooves 6 are formed in the bottom of the first heat dissipation block 4, a heat dissipation fan 7 is mounted in the mounting groove 6, the second heat dissipation block 8 is threadedly connected between the tops of the two refrigeration fin bodies 1, the top of the heat dissipation fan 7 and the top of the inner wall of the mounting groove 6 are matched with each other, and the mounting groove 6 and the heat dissipation fan 7 are both located at the center of the first heat dissipation block 4; the wind power generated by the heat dissipation fan 7 can cover the surfaces of the first heat dissipation block 4 and the second heat dissipation block 8, the heat dissipation area of the first heat dissipation block 4 and the second heat dissipation block 8 is used to the maximum extent, the heat dissipation performance of the first heat dissipation block 4 and the second heat dissipation block 8 is improved, the temperature of the equipment during operation can be better controlled, a plurality of connecting holes 9 are formed in the top of the second heat dissipation block 8, the first heat dissipation block 4 and the second heat dissipation block 8 are fixed through screws, and each fixing hole 5 is matched with a connecting hole 9; the connecting mode realized through the screws can effectively resist external force, so that the relative displacement between the first heat dissipation block 4 and the second heat dissipation block 8 is prevented, and the structural integrity of the heat dissipation system is maintained; at the same time, the design that the fixing holes 5 are matched with the connecting holes 9 reduces the installation difficulty and improves the installation efficiency, the top of the two first heat-conducting pastes 2 and the bottom of the second heat-conducting paste 3 are tightly attached to the bottom of the corresponding first heat dissipation block 4 and the top of the corresponding second heat dissipation block 8; heat can rapidly spread to the surrounding from the contact point, and heat accumulation in a local part is avoided; at the same time, when the first heat dissipation block 4 is tightly attached to the first heat-conducting paste 2, the heat generated by the hot end of the refrigeration fin body 1 can be evenly dispersed to the first heat dissipation block 4, so that the surface temperature of the first heat dissipation block 4 is more uniform, and the second heat dissipation block 8 can also realize uniform temperature distribution.

[0037] In use, the heat sink generates a large amount of heat after long-time use, when the temperature reaches a specified value, the first heat-conducting paste 2 and the second heat-conducting paste 3 change from solid state to viscous state, at this time, the first heat-conducting paste 2 and the second heat-conducting paste 3 fill the micro gap between the semiconductor refrigeration fin and the heat sink, and the first heat-conducting paste 2 and the second heat-conducting paste 3 change from viscous state to solid state again after the equipment stops running.

[0038] The above is only an embodiment of the present application, and does not limit the patent range of the present application, and any equivalent structure or equivalent process transformation in the content of the present application specification and drawings, or direct or indirect application in other related technical fields, are also included in the patent protection range of the present application.

Claims

1. A semiconductor cooling plate comprising two cooling plate bodies (1), characterized in that: Two said refrigeration fin body (1) top are provided with first thermal paste (2), two said refrigeration fin body (1) bottom are provided with second thermal paste (3), two said refrigeration fin body (1) bottom are threadedly connected with first heat sink (4), the top of first heat sink (4) is provided with a plurality of fixing holes (5), the bottom of first heat sink (4) is provided with a plurality of mounting grooves (6), the mounting groove (6) is internally provided with a cooling fan (7), two said refrigeration fin body (1) top are threadedly connected with second heat sink (8), the top of second heat sink (8) is provided with a plurality of connecting holes (9).

2. The semiconductor refrigeration sheet according to claim 1, characterized by: The hot end and the cold end of the refrigeration fin body (1) are horizontally provided with corresponding first thermal paste (2) and second thermal paste (3).

3. The semiconductor refrigeration sheet according to claim 1, characterized by: The top and bottom of two said refrigeration fin body (1) are designed with steel mesh by screen printing machine, and the first thermal paste (2) and the second thermal paste (3) are coated in the corresponding steel mesh.

4. The semiconductor refrigeration sheet according to claim 1, characterized by: The first heat sink (4) and the second heat sink (8) are fixed by screws, and each said fixing hole (5) is matched with the connecting hole (9).

5. The semiconductor refrigeration sheet according to claim 1, characterized by: The top of the cooling fan (7) and the top of the inner wall of the mounting groove (6) are matched with each other, and the mounting groove (6) and the cooling fan (7) are located at the center of the first heat sink (4).

6. The semiconductor refrigeration sheet according to claim 1, characterized by: The phase transition temperature of the first thermal paste (2) and the second thermal paste (3) is 45°.

7. The semiconductor refrigeration sheet of claim 1, wherein: The first thermal paste (2) and the second thermal paste (3) are solid at room temperature, and melt into liquid state after heating.

8. The semiconductor refrigeration sheet of claim 1, wherein: The first thermal paste (2) on the top of two said refrigeration fin body (1) and the second thermal paste (3) on the bottom are triangularly arranged.

9. The semiconductor refrigeration sheet of claim 1, wherein: The top of two said first thermal paste (2) and the bottom of second thermal paste (3) are tightly attached to the bottom of corresponding first heat sink (4) and the top of second heat sink (8).

10. The semiconductor refrigeration sheet of claim 1, wherein: Two said refrigeration fin body (1) are in the same plane, and two refrigeration fin bodies (1) are parallel to each other.

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