Solder paste tin brushing device

Abstract

The utility model discloses a solder paste tin brushing device which comprises a machine body, a supporting assembly, a brush knife assembly and a conveying assembly, and the supporting assembly is arranged on the machine body and used for adsorbing and supporting a circuit board; the brush knife assembly is arranged above the supporting assembly and can move horizontally close to the circuit board when being driven so as to brush tin on the circuit board; the conveying assembly is arranged on the machine body, located between the supporting assembly and the brush knife assembly and used for conveying the circuit board. The circuit board can be conveyed to the position above the supporting assembly through the conveying assembly, the circuit board is adsorbed and supported through the supporting assembly, then the brush cutter assembly is driven to be close to the circuit board, horizontal movement is conducted, and the tin brushing action is completed, so that it is ensured that contact between the circuit board and a steel mesh is tighter; the circuit board is better in stability and more uniform in tin brushing.

Description

Technical Field

[0001] This utility model relates to the field of circuit board technology, specifically to a solder paste brushing device. Background Technology

[0002] The requirements for circuit board soldering technology are becoming increasingly stringent, and stencil soldering is a crucial step in the entire soldering process. Currently, the stencil soldering process typically involves clamping the circuit board before soldering, but this clamping often results in insufficient contact between the circuit board and the stencil, leading to uneven soldering and inadequate circuit board stability. Summary of the Invention

[0003] This utility model aims to at least partially solve one of the technical problems in related technologies. Therefore, one objective of this utility model is to provide a solder paste application device, comprising:

[0004] Organism;

[0005] A support assembly, which is disposed on the body, is used to magnetically support the circuit board;

[0006] A brushing assembly is disposed above the support assembly and can move horizontally close to the circuit board when driven to apply solder to the circuit board;

[0007] A conveying assembly is disposed on the machine body and located between the support assembly and the brush assembly for conveying the circuit board.

[0008] Preferably, the brush assembly includes:

[0009] A mounting bracket, which is mounted on the machine body;

[0010] A sliding rod, one end of which is connected to the fixed frame and the other end of which is connected to the machine body;

[0011] A movable frame, which is slidably mounted on the sliding rod;

[0012] A first cylinder is mounted on the fixed frame and connected to the movable frame to drive the movable frame to slide along the length of the sliding rod;

[0013] A brushing mechanism is mounted on the movable frame and is movable in the horizontal direction.

[0014] Preferably, the brushing mechanism includes:

[0015] The second cylinder is mounted on the movable frame;

[0016] A buffer frame, wherein the buffer frame is fixed to the second cylinder;

[0017] A soldering knife is mounted on the buffer frame and can move horizontally with the buffer frame when driven.

[0018] Preferably, the buffer mechanism includes:

[0019] A connecting seat, which is connected to the second cylinder;

[0020] A support plate, which is slidably connected to the connecting seat;

[0021] A connecting frame is provided, which is in clearance fit with the support plate via a connecting rod, and the solder brush is fixed to the connecting frame.

[0022] An elastic element is sleeved on the connecting rod and located between the connecting frame and the support plate.

[0023] Preferably, the support component includes:

[0024] The base has multiple fixing holes;

[0025] A vacuum adsorption component is detachably disposed within the fixing hole and communicates with the fixing hole.

[0026] Preferably, the vacuum adsorption component has an airflow channel that communicates with the fixing hole.

[0027] Preferably, the base has an air cavity that communicates with the plurality of fixing holes.

[0028] Preferably, the vacuum adsorption component has a sealing portion for abutting against the base to close the fixing hole.

[0029] Preferably, the conveying assembly includes:

[0030] A conveyor track, which is mounted on the machine body;

[0031] A conveyor belt, the transmission belt being disposed on the conveying track, is used to drive the circuit board to move along the length direction of the conveying track.

[0032] The above-described solution of this utility model has at least the following beneficial effects:

[0033] The solder paste brushing device provided by this utility model can transport the circuit board to the support component through the conveying component, and then the support component will adsorb and support the circuit board. Then, the brushing component will be driven to approach the circuit board and move horizontally to complete the soldering action, thereby ensuring a tighter contact between the circuit board and the stencil, better circuit board stability and more uniform soldering.

[0034] Additional aspects and advantages of this invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0035] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.

[0036] Figure 1 This is a schematic diagram of the solder paste brushing device provided in the embodiments of this utility model;

[0037] Figure 2 This is a schematic diagram of the structure of the support component, brush component and conveying component provided in the embodiments of this utility model;

[0038] Figure 3 This is a schematic diagram of the brush assembly provided in this embodiment of the utility model;

[0039] Figure 4 This is a cross-sectional view of the support component provided in the embodiment of this utility model;

[0040] Figure 5 This is a partial structural schematic diagram of the conveying assembly provided in the embodiments of this utility model;

[0041] Explanation of icon numbers:

[0042] 10. Body; 20. Support assembly; 21. Base; 211. Fixing hole; 212. Air cavity; 22. Vacuum adsorption component; 221. Airflow channel; 222. Sealing part; 30. Brush assembly; 31. Fixing frame; 32. Sliding rod; 33. Moving frame; 34. First cylinder; 351. Second cylinder; 352. Buffer mechanism; 3521. Connecting seat; 3522. Support plate; 3523. Connecting frame; 3524. Connecting rod; 3525. Elastic component; 353. Solder brush; 40. Conveying assembly; 41. Conveying track; 42. Drive belt; 50. Steel mesh.

[0043] The realization of the purpose, functional features and advantages of this utility model will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0044] The embodiments of this utility model are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain this utility model, and should not be construed as limiting this utility model. All other embodiments obtained by those skilled in the art based on the embodiments of this utility model without inventive effort are within the scope of protection of this utility model.

[0045] In the description of this utility model, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "circumferential", "radial", etc., indicating the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model.

[0046] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this utility model, "a plurality of" means two or more, unless otherwise explicitly specified.

[0047] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0048] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0049] The solder paste brushing device of this utility model embodiment is described in detail below with reference to the accompanying drawings.

[0050] Reference Figure 1 and Figure 2 As shown, the solder paste brushing device provided in this embodiment of the present invention includes: a body 10, a support component 20, a brush component 30, and a conveying component 40. The support component 20 is disposed on the body 10 and is used to absorb and support the circuit board. The brush component 30 is disposed above the support component 20 and can move horizontally close to the circuit board when driven to brush solder onto the circuit board. The conveying component 40 is disposed on the body 10 and is located between the support component 20 and the brush component 30 for conveying the circuit board.

[0051] The stencil 50 can be fixed on the brush assembly 30, so that it can move together with the brush assembly 30. When the brush assembly 30 approaches the circuit board, the stencil 50 can be in close contact with the circuit board and form a relative force through the support assembly 20, so as to ensure that the circuit board is more stable during the soldering process.

[0052] The solder paste brushing device provided by this utility model can transport the circuit board to the support component 20 through the conveying component 40, and the support component 20 can adsorb and support the circuit board. Then, the brushing component 30 is driven to approach the circuit board and move horizontally to complete the soldering action, thereby ensuring a tighter contact between the circuit board and the stencil 50, better circuit board stability, and more uniform soldering.

[0053] Reference Figure 3As shown, the brushing assembly 30 includes: a fixed frame 31, a sliding rod 32, a movable frame 33, a first cylinder 34, and a brushing mechanism. The fixed frame 31 is mounted on the machine body 10. One end of the sliding rod 32 is connected to the fixed frame 31, and the other end is connected to the machine body 10. The movable frame 33 is slidably mounted on the sliding rod 32. The first cylinder 34 is mounted on the fixed frame 31 and connected to the movable frame 33 to drive the movable frame 33 to slide along the length direction of the sliding rod 32. The brushing mechanism is mounted on the movable frame 33 and can move horizontally. Further, the brushing mechanism includes: a second cylinder 351, a buffer frame, and a soldering blade 353. The second cylinder 351 is mounted on the movable frame 33. The buffer frame is fixed to the second cylinder 351. The soldering blade 353 is mounted on the buffer frame and can move horizontally with the buffer frame when driven.

[0054] In this embodiment, the stencil 50 can be fixed on the movable frame 33, and the stencil 50 can hold solder paste. During the soldering process, the first cylinder 34 can drive the movable frame 33 to move downward, so that the stencil 50 is in close contact with the circuit board. Then, the second cylinder 351 drives the buffer frame to move horizontally, so that the soldering blade 353 can move horizontally on the stencil 50 and push the solder paste to move to complete the soldering action on the circuit board. This makes the soldering process of the circuit board simpler and more efficient.

[0055] Furthermore, the buffer mechanism 352 includes: a connecting seat 3521, a support plate, a connecting frame 3522 support plate; 3523 and an elastic element 3525. The connecting seat 3521 is connected to the second cylinder 351; the support plate is slidably connected to the connecting seat 3521; the connecting frame 3522 support plate; 3523 and the support plate are fitted with a connecting rod 3524 with a clearance, and the soldering knife 353 is fixed to the connecting frame 3522 support plate; 3523; the elastic element 3525 is sleeved on the connecting rod 3524 and is located between the connecting frame 3522 support plate; 3523 and the support plate.

[0056] In this embodiment, when the second cylinder 351 pushes the buffer to move horizontally, the soldering knife 353 can move horizontally on the stencil 50. Since the support plate and the connecting frame 3522 support plate 3523 form an elastic buffer through the elastic element 3525, the soldering knife 353 can form a certain buffer through the elastic force of the elastic element 3525 during the horizontal movement, avoiding damage to the stencil 50 and the soldering knife 353, thus improving safety.

[0057] Reference Figure 4 As shown, the support assembly 20 includes: a base 21 and a vacuum adsorption component 22. The base 21 has a plurality of fixing holes 211. The vacuum adsorption component 22 is detachably disposed in the fixing holes 211 and communicates with the fixing holes 211. Furthermore, the vacuum adsorption component 22 has an airflow channel 221, which is used to communicate with the fixing holes 211.

[0058] In this embodiment, the base 21 has an air cavity 212, which is connected to multiple fixing holes 211. The base 21 can be connected to a vacuum pump via an air pipe, allowing the vacuum pump to communicate with the air cavity 212. The vacuum pump then extracts air from the air cavity 212 and the fixing holes 211, creating a negative pressure in the airflow channel 221 inside the vacuum adsorption component 22. When the circuit board moves above the vacuum adsorption component 22, the base 21 can be raised by means of a cylinder or similar means, forcing the vacuum adsorption component 22 to come into contact with the circuit board. The vacuum pump then draws air into the airflow channel 221 to a negative pressure state, so that the circuit board is adsorbed and fixed on the vacuum adsorption component 22. This allows the circuit board to be stably supported without clamping, ensuring a tighter contact between the circuit board and the stencil 50, better stability of the circuit board, and more uniform soldering. Optionally, the top of the vacuum adsorption component 22 can be made of a tapered rubber part to ensure more stable and reliable support.

[0059] Furthermore, the vacuum adsorption component 22 has a sealing portion 222, which is used to abut against the base 21 to close the fixing hole 211. The vacuum adsorption component 22 can be threadedly fixed to the fixing hole 211, allowing the sealing portion 222 to fit tightly against the base 21, thereby ensuring that the gap between the fixing hole 211 and the vacuum adsorption component 22 can be closed, resulting in better sealing during vacuuming.

[0060] Reference Figure 5 As shown, the conveying assembly 40 includes: a conveying track 41 and a conveyor belt. The conveying track 41 is disposed on the machine body 10; the transmission belt 42 is disposed on the conveying track 41 and is used to drive the circuit board to move along the length direction of the conveying track 41.

[0061] In this embodiment, the spacing of the conveyor track 41 can be adjusted by means of a lead screw module or the like to suit different circuit boards. Rollers can be set on the conveyor track 41 to drive the transmission belt 42 to rotate, thereby enabling the transmission belt 42 to convey the circuit board and improve the soldering efficiency.

[0062] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.

[0063] The above description is only a preferred embodiment of the present utility model and does not limit the patent scope of the present utility model. All equivalent structural transformations made under the inventive concept of the present utility model using the contents of the present utility model specification and drawings, or direct / indirect applications in other related technical fields, are included within the patent protection scope of the present utility model.

Claims

1. A tin paste brush tin device, characterized by, The utility model relates to a circuit board tin brushing machine, which comprises a machine body, a support assembly arranged on the machine body for adsorbing and supporting a circuit board, a brush blade assembly arranged above the support assembly and horizontally movable to brush tin on the circuit board when driven, and a conveying assembly arranged on the machine body between the support assembly and the brush blade assembly for conveying the circuit board. The brush blade assembly comprises a fixing frame arranged on the machine body, a sliding rod with one end connected to the fixing frame and the other end connected to the machine body, a moving frame slidably arranged on the sliding rod, a first air cylinder arranged on the fixing frame and connected to the moving frame to drive the moving frame to slide along the length direction of the sliding rod, and a brush blade mechanism arranged on the moving frame and movable in the horizontal direction. The brush blade mechanism comprises a second air cylinder arranged on the moving frame, a buffer frame fixed to the second air cylinder, and a brush tin blade arranged on the buffer frame and horizontally movable with the buffer frame when driven. The support assembly comprises a base with a plurality of fixing holes, and a vacuum suction accessory detachably arranged in the fixing holes and in communication with the fixing holes. The vacuum suction accessory has an air flow channel in communication with the fixing holes. The base has an air cavity in communication with the plurality of fixing holes. The vacuum suction accessory has a sealing part for abutting against the base to close the fixing holes. The conveying assembly comprises a conveying track arranged on the machine body, and a conveyor belt arranged on the conveying track for driving the circuit board to move along the length direction of the conveying track. ​ ​ ​ ​ 2. The tin paste brush tin apparatus of claim 1, wherein, ​ ​ ​ ​ 3. The tin paste brush tin apparatus of claim 1, wherein, ​ ​ ​ 4. The tin paste brush tin apparatus of claim 3, wherein, ​ 5. The tin paste brush tin apparatus of claim 3, wherein, ​ 6. The tin paste brush tin apparatus of claim 3, wherein, ​ 7. The tin paste brush tin apparatus of claim 1, wherein, ​ ​ ​

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