Thickness detection mechanism and wafer thinning equipment

Abstract

The utility model belongs to the technical field of thickness detection, and discloses a thickness detection mechanism and wafer thinning equipment. The thickness detection mechanism comprises a mounting base, a first contact detection module and a non-contact detection module. The first contact detection module is arranged on the mounting base and used for detecting the thickness of the workpiece in the first machining stage in real time. The non-contact detection module is arranged on the mounting base and used for detecting the thickness of the workpiece in the second machining stage in real time. The thickness detection mechanism has the advantages that the structure is independently designed and mounted, the structure is compact and stable, and the accuracy of a detection result can be improved by adopting different processing modes for workpieces at different processing stages. The wafer thinning equipment provided by the utility model uses the thickness detection mechanism, so that the surface of the wafer can be protected from being scratched.

Description

Technical Field

[0001] This utility model relates to the field of thickness detection technology, and in particular to a thickness detection mechanism and wafer thinning equipment. Background Technology

[0002] Wafer thinning is a front-end process in chip manufacturing. Its purpose is to reduce the thickness of the wafer using mechanical or chemical thinning / grinding methods to meet the thickness requirements of subsequent processes. In wafer processing, the turntable of the thinning equipment typically uses a vacuum source to hold the wafer on a chuck and then rotates it below the spindle of the grinding mechanism for processing. During wafer thinning, the wafer thickness needs to be monitored to provide feedback on whether the current wafer thickness meets the requirements.

[0003] Currently, in the wafer grinding process of semiconductor thinning equipment, when the equipment performs rough grinding and fine grinding on both Z1 and Z2 axes respectively (in the processing equipment, the main axis moving in the Z-axis direction is referred to as "Z", and according to the number, it is named Z1, Z2, Z3, etc. as specified by the designer), there is usually a problem of scattered detection mechanism and single detection mode, which leads to inaccurate detection results. In particular, when the wafer is thin, it will scratch the wafer surface, affect the processing quality, and damage the wafer surface shape. Summary of the Invention

[0004] The purpose of this invention is to provide a thickness detection mechanism and wafer thinning equipment. It adopts a composite detection method, making the thickness detection structure more compact and reasonable, and the measurement results more stable. The rough grinding process uses IPG (Interferometric Particle Image Velocimetry, a contact measuring instrument that measures thickness by direct contact between the probe and the wafer) detection, and the fine grinding process uses NCG (Non-Contact Gauge, a non-contact measuring instrument that measures the thickness of an object using non-contact methods such as laser or infrared light) detection, thus avoiding the problem of wafer scratching.

[0005] To achieve this objective, the present invention adopts the following technical solution:

[0006] A thickness detection mechanism includes: a mounting base; a first contact detection module disposed on the mounting base for real-time detection of the thickness of a workpiece in a first processing stage; and a non-contact detection module disposed on the mounting base for real-time detection of the thickness of the workpiece in a second processing stage.

[0007] Preferably, the system also includes a second contact detection module, which is symmetrically arranged on the mounting base with the first contact detection module. The non-contact detection module is disposed on the second contact detection module. Both the second contact detection module and the non-contact detection module are used to detect the thickness of the workpiece in the second processing stage in real time, and the non-contact detection module can move relative to the second contact detection module.

[0008] Preferably, both the first contact detection module and the second contact detection module are provided with a cleaning section for cleaning the workpiece.

[0009] Preferably, both the first contact detection module and the second contact detection module include: a base, which is fixedly connected to the mounting base; a first measuring element, which is disposed on the base and used to detect the thickness of the workpiece; and a cleaning unit disposed on the base and spaced apart from the first measuring element.

[0010] Preferably, the first measuring element includes: a first driving element disposed on the side of the base; a measuring rod connected to the output end of the first driving element; and a first probe disposed at the end of the measuring rod away from the first driving element; the first driving element is capable of driving the measuring rod to move so that the first probe selectively contacts the workpiece.

[0011] Preferably, both the first contact detection module and the second contact detection module further include: a valve block disposed on the base, the valve block having a plurality of valve body connectors; the cleaning section includes: a fixed seat fixedly connected to the base; a spray pipe disposed on the fixed seat for cooling the surfaces of the first measuring element and the workpiece; and a water spray pipe disposed on the fixed seat for rinsing the detection area of ​​the workpiece; wherein the spray pipe and the water spray pipe are connected to the corresponding valve body connectors.

[0012] Preferably, the non-contact detection module includes: a lifting drive unit fixedly connected to the second contact detection module; a rotation drive unit fixedly connected to the output end of the lifting drive unit; and a second measuring unit fixedly connected to the output end of the rotation drive unit, which can be driven by the lifting drive unit and the rotation drive unit to lift and rotate relative to the second contact detection module.

[0013] Preferably, the lifting drive unit includes: a mounting bracket fixedly connected to the second contact detection module; a second drive member disposed on the mounting bracket; a lifting connecting block disposed at the output end of the second drive member and fixedly connected to the rotary drive unit; and a lifting limiting member disposed on the mounting bracket and located at both ends of the stroke of the lifting connecting block; wherein: the second drive member is used to drive the rotary drive unit to lift, and the lifting limiting member is used to limit the lifting stroke of the second drive member; and / or, the rotary drive unit includes: a rotary bearing seat externally connected to the lifting drive unit and internally provided with a rotary bearing; a third drive member disposed on the rotary bearing seat; a rotating shaft passing through the rotary bearing, one end of which is connected to the output end of the third drive member, and the other end of which is fixedly connected to the second measuring unit; and rotating limiting members disposed on both sides radially of the rotating shaft; wherein: the third drive member is used to drive the rotating shaft to rotate to drive the second measuring unit to rotate, and the rotating limiting member is used to limit the rotation angle of the rotating shaft.

[0014] Preferably, the second measuring unit includes: a connecting rod connected to the output end of the rotary drive unit; a lifting plate disposed on the connecting rod and whose position on the connecting rod is adjustable; and a second probe fixedly disposed on the lifting plate.

[0015] This utility model also provides a wafer thinning device, including a turntable, a chuck, and a grinding mechanism. The chuck is rotatably mounted on the turntable and is used to fix the wafer. The grinding mechanism is spaced apart from the turntable and is used to grind the wafer. It also includes the aforementioned thickness detection mechanism. The mounting base of the thickness detection mechanism is mounted on the turntable. The thickness detection mechanism is capable of detecting the thickness of the wafer processed by the grinding mechanism.

[0016] The beneficial effects of this utility model are:

[0017] The thickness detection mechanism of this utility model includes a mounting base, a first contact detection module, and a non-contact detection module. The first contact detection module is mounted on the mounting base and is used to detect the thickness of the workpiece in real time during the first processing stage. The non-contact detection module is mounted on the mounting base and is used to detect the thickness of the workpiece in real time during the second processing stage. The thickness detection mechanism of this utility model has an independently designed and installed structure that is compact and stable. By using different processing methods for workpieces at different processing stages, the accuracy of the detection results can be improved without scratching the workpiece surface.

[0018] The wafer thinning equipment of this utility model includes a turntable, a chuck, and a grinding mechanism. The chuck is rotatably mounted on the turntable and is used to fix the wafer. The grinding mechanism is spaced apart from the turntable and is used to grind the wafer. It also includes the aforementioned thickness detection mechanism. The mounting base of the thickness detection mechanism is mounted on the turntable. The thickness detection mechanism can detect the thickness of the wafer processed by the grinding mechanism, and can also ensure the accuracy of the wafer thinning process without scratching the wafer surface. Attached Figure Description

[0019] Figure 1 This is a three-dimensional structural diagram of the thickness detection device in an embodiment of this utility model;

[0020] Figure 2 yes Figure 1 Top view;

[0021] Figure 3 This is a schematic diagram of the thickness detection device in this embodiment of the present invention after the non-contact detection module has been removed;

[0022] Figure 4 yes Figure 3 A schematic diagram of the structure shown from another perspective;

[0023] Figure 5 yes Figure 3 A structural schematic diagram of the structure shown from another perspective;

[0024] Figure 6 yes Figure 3 A structural schematic diagram of the structure shown from another perspective;

[0025] Figure 7 This is a schematic diagram of the structure of the non-contact detection module of the thickness detection device in this embodiment of the present invention;

[0026] Figure 8 yes Figure 7 A schematic diagram of the structure shown from another perspective;

[0027] Figure 9 This is a cross-sectional schematic diagram of the non-contact detection module of the thickness detection device in this embodiment of the present invention;

[0028] Figure 10 yes Figure 7 A schematic diagram of the structure from another perspective.

[0029] In the picture:

[0030] 30. Install the base;

[0031] 311. Base;

[0032] 312. First measuring element; 3121. First driving element; 3122. Measuring rod; 3123. First probe;

[0033] 313. Cleaning section; 3131. Mounting base; 3132. Spray pipe; 3133. Water spray pipe; 31331. Nozzle;

[0034] 314. Connecting parts;

[0035] 315. Valve block; 3151. Cooling water valve connector; 3152. Cleaning water valve connector; 3153. Gas valve connector;

[0036] 32. Non-contact detection module;

[0037] 321. Lifting drive unit; 3211. Mounting bracket; 3212. Second drive component; 3213. Lifting connecting block; 3214. Lifting limit component; 3215. Lifting coupling; 3216. Linear actuator;

[0038] 322. Rotary drive unit; 3221. Rotary bearing housing; 3222. Third drive component; 3223. Rotating shaft; 3224. Rotary limiting component; 3225. Mounting base; 3226. Harmonic reducer; 3227. Reducer flange;

[0039] 323. Second measuring section; 3231. Connecting rod; 3232. Lifting plate; 3233. Second measuring head; 3234. Cable support component;

[0040] 100. Chuck. Detailed Implementation

[0041] The present invention will now be described in further detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present invention and not intended to limit it. Furthermore, it should be noted that, for ease of description, the accompanying drawings show only the parts relevant to the present invention, not the entire structure.

[0042] In the description of this utility model, unless otherwise explicitly specified and limited, the terms "connected," "linked," and "fixed" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0043] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0044] In the description of this embodiment, the terms "upper," "lower," "right," etc., refer to the orientation or positional relationship shown in the accompanying drawings. They are used only for ease of description and simplification of operation, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model. In addition, the terms "first" and "second" are only used for distinction in description and have no special meaning.

[0045] This utility model discloses a thickness detection mechanism, such as Figure 1 and Figure 2 As shown, the thickness detection mechanism includes a mounting base 30, a first contact detection module (IPG), and a non-contact detection module 32 (NPG). Both the first contact detection module and the non-contact detection module 32 are mounted on the mounting base 30. The first contact detection module is used to detect the thickness of the workpiece in real time during the first processing stage, while the non-contact detection module 32 is used to detect the thickness of the workpiece in real time during the second processing stage. The first contact detection module measures the thickness of the workpiece using a contact measurement method, while the non-contact detection module 32 can measure the thickness of the workpiece in a non-contact manner. It is understood that by using different processing methods for workpieces at different processing stages, the accuracy of the detection results can be improved without scratching the workpiece surface.

[0046] In some embodiments, during the second processing stage of the workpiece, the thickness of the workpiece is measured using both contact and non-contact measurement methods. Specifically, the thickness detection mechanism of this invention further includes a second contact detection module (IPG), which is symmetrically arranged on the mounting base 30 with the first contact detection module. A non-contact detection module 32 is disposed on the second contact detection module and is movable relative to the second contact detection module. Figure 1 , Figure 2 and Figure 7As shown in the figure, the maximum swing arm range of the non-contact detection module 32 is indicated by the dotted line. In field applications, its swing arm range can be reset according to actual needs. It is understood that the first processing stage can be a preliminary processing stage or a rough processing stage, and the second processing stage is a finishing stage. Measuring the thickness of a workpiece at different processing stages using different detection modules and different detection methods can save the cost of a thickness detection device for workpieces in the rough processing stage. Performing contact and non-contact detection on workpieces in the finishing stage ensures that the workpiece is not scratched by external structures when processing is almost complete. Furthermore, the non-contact detection module 32 can move relative to the second contact detection module, thereby increasing the detection range and making the detection results more accurate.

[0047] In some embodiments, since the first contact detection module detects the thickness of the workpiece in the first processing stage, namely the roughing stage, the surface protection requirements of the workpiece are relatively low at this time. Therefore, it is set as a contact detection structure to save device costs. At the same time, setting the first contact detection module to have the same structure as the second contact detection module can reduce the complexity of the overall structural design and save design costs.

[0048] In some embodiments, such as Figure 3 As shown, both the first contact detection module and the second contact detection module include a cleaning section 313 for cleaning the workpiece. It is understood that the cleaning section 313 effectively prevents the temperature of the workpiece and the probe from rising during workpiece processing, thus affecting the measurement and final processing results. It also specifically cleans the workpiece area corresponding to the probe of the first contact detection module and / or the second contact detection module, preventing impurities from depositing and interfering with the probe's detection.

[0049] In some embodiments, such as Figure 3 As shown, both the first contact detection module and the second contact detection module include a base 311 and a first measuring element 312. The base 311 is fixedly connected to the mounting base 30. The first measuring element 312 is disposed on the base 311 and is used to detect the thickness of the workpiece. The first measuring element 312 is disposed on the side of the base 311 and extends towards that side. The cleaning part 313 is disposed on the base 311 and is spaced apart from the first measuring element 312 in the vertical direction. In some specific embodiments, such as... Figure 3 and Figure 4As shown, the first measuring element 312 includes a first driving element 3121, a measuring rod 3122, and a first probe 3123. The first driving element 3121 is disposed on the side of the base 311. The measuring rod 3122 is connected to the output end of the first driving element 3121. The first probe 3123 is a contact probe, disposed at the end of the measuring rod 3122 away from the first driving element 3121. The first driving element 3121 can drive the measuring rod 3122 to move so that the first probe 3123 selectively contacts the workpiece. The first driving element 3121 can be a cylinder. One end of the measuring rod 3122 is rotatably connected to the cylinder. A spring is provided to raise the measuring rod 3122 to its initial position, disengaging it from the workpiece and placing it in a non-contact position. Air is blown by the cylinder to cause the measuring rod 3122 to rotate and fall to contact the workpiece, placing it in a contact position. By using a pneumatic cylinder to drive the first probe 3123, it can be lifted when encountering an obstacle. The pneumatic drive acts as a buffer, preventing damage to the first probe 3123 or scratches on the workpiece surface. It is understood that the specific configuration of the measuring rod 3122 and the cylinder structure is prior art and will not be elaborated upon here. In other embodiments, the first driving element 3121 can also be an electromagnet, hydraulic drive, or other types of driving source.

[0050] In some specific embodiments, such as Figure 4 and Figure 5 As shown, two measuring rods 3122 and two first probes 3123 are provided, with each measuring rod 3122 connected to a first driving member 3121. It can be understood that the first driving member 3121 controls the descent of the two first probes 3123, with one first probe 3123 contacting the workpiece surface and the other first probe 3123 contacting the outer edge of the workpiece loading tool. The thickness change of the workpiece is calculated based on the thickness deviation measured by the two first probes 3123 during the processing.

[0051] In some embodiments, such as Figure 3 As shown, both the first contact detection module and the second contact detection module further include a valve block 315, and the cleaning part 313 is disposed on the connector 314; the valve block 315 is disposed on the base 311, and the valve block 315 is provided with multiple valve body connectors. In some specific embodiments, such as Figure 6As shown, the cleaning unit 313 includes a fixed base 3131, a spray pipe 3132, and a water spray pipe 3133. The fixed base 3131 is fixedly connected to the base 311 and is on the same side as the first measuring element 312. The spray pipe 3132 is disposed on the fixed base 3131 and located directly above the measuring rod 3122, used to cool the first measuring element 312 and the workpiece surface. The water spray pipe 3133 is disposed on the fixed base 3131 and used to rinse the detection area of ​​the workpiece. The spray pipe 3132 and the water spray pipe 3133 are connected to the corresponding valve body connectors. In other embodiments, both the first contact detection module and the second contact detection module also include a connector 314. The connector 314 is disposed above the base 311, and the valve block 315 is disposed on the base 311 through the connector 314. Both the connector 314 and the valve block 315 are provided with multiple connecting holes to connect the spray pipe 3132 and the water spray pipe 3133 to the corresponding valve body connectors. Understandably, the valve body connectors on the valve block 315 include at least a cooling water valve connector 3151 corresponding to the spray pipe 3132, a cleaning water valve connector 3152 corresponding to the spray pipe 3133, and a gas valve connector 3153 corresponding to the cylinder. The spray pipe 3132 has multiple spray holes to cool the workpiece. Liquids consisting of cooling water mixed with workpiece processing powder or grinding fluid mixed with workpiece powder can affect the detection results of the first probe 3123. Therefore, a spray pipe 3133 is added to specifically rinse the workpiece area to be inspected. In some specific embodiments, the end of the water spray pipe 3133 is provided with a nozzle 31331. The nozzle 31331 is angled to the vertical direction to avoid the first probe 3123 while precisely aiming at the part of the workpiece corresponding to the first probe 3123. Cleaning water is sprayed from the nozzle 31331 to rinse the detection part of the workpiece, thereby cleaning the part of the workpiece that is in contact with the first probe 3123. In other embodiments, the water spray pipe 3133 can also be configured as an air jet pipe to blow air onto the part to be detected, blowing away impurities.

[0052] In some embodiments, the first contact detection module and / or the second contact detection module further include a protective cover assembly, which serves as a housing to house the various parts. The protective cover assembly also has a perforated surface to ensure the normal operation of the first probe 3123 extending for detection and the spray pipe 3132 and the water spray pipe 3133.

[0053] In some embodiments, such as Figure 7As shown, the non-contact detection module 32 includes a lifting drive unit 321, a rotation drive unit 322, and a second measuring unit 323. The lifting drive unit 321 is fixedly connected to the second contact detection module, the rotation drive unit 322 is fixedly connected to the output end of the lifting drive unit 321, and the second measuring unit 323 is fixedly connected to the output end of the rotation drive unit 322. The second measuring unit 323 can be driven by the lifting drive unit 321 and the rotation drive unit 322 to lift and rotate relative to the second contact detection module. It can be understood that the second measuring unit 323, driven by the lifting drive unit 321 and the rotation drive unit 322, can lift and rotate on the workpiece surface to expand the detection range and increase the accuracy of the detection results.

[0054] In some embodiments, the lifting drive unit 321 includes a mounting bracket 3211, a second drive member 3212, a lifting connecting block 3213, and a lifting limit member 3214. One end of the mounting bracket 3211 is fixedly connected to the second contact detection module, and the other end of the mounting bracket 3211 is provided with the second drive member 3212. The mounting bracket 3211 is generally arranged in a Z-shape so that the lifting drive unit 321 avoids the second contact detection module. One end of the lifting connecting block 3213 is fixedly connected to the output end of the second drive member 3212, and the other end is fixedly connected to the rotary drive unit 322. The lifting limit member 3214 is disposed on the mounting bracket 3211 and located at both ends of the stroke of the lifting connecting block 3213. The second drive member 3212 is used to drive the rotary drive unit 322 to rise and fall, and the lifting limit member 3214 is used to limit the rising and falling stroke of the second drive member 3212. Understandably, the lifting limit component 3214 is provided to prevent excessive lifting from causing interference between the second measuring unit 323 and other structures, to avoid damage to the workpiece surface, and to facilitate the determination of the stroke position.

[0055] In some specific embodiments, the second driving component 3212 is configured as a lifting servo motor, and the lifting limit component 3214 is configured as a lifting limit sensor. The lifting servo motor is mounted on the mounting bracket 3211 via a mounting flange, and the lifting limit sensor is mounted on the mounting bracket 3211 via a sensor mounting plate. The mounting flange is also equipped with a cooling water connector for the lifting servo motor to cool it.

[0056] In some embodiments, such as Figure 8 and Figure 9As shown, the lifting drive unit 321 also includes a lifting coupling 3215 and a linear actuator 3216. The second drive member 3212 is connected to the input end of the linear actuator 3216 via the lifting coupling 3215, and the output end of the linear actuator 3216 is connected to the lifting connecting block 3213. It can be understood that by setting the linear actuator 3216, the lifting connecting block 3213 can be controlled and driven to perform linear motion, and the linear actuator 3216 has the technical advantages of small size, simple structure, fast response speed, and high precision.

[0057] In some embodiments, such as Figures 7 to 10 As shown, the rotary drive unit 322 includes a rotary bearing housing 3221, a third drive member 3222, a rotating shaft 3223, and a rotating limiting member 3224. The rotary bearing housing 3221 is externally connected to the lifting connecting block 3213 of the lifting drive unit 321, meaning the rotary bearing housing 3221 is fixedly mounted on the lifting connecting block 3213, and a rotary bearing is disposed inside the rotary bearing housing 3221. The rotating shaft 3223 is rotatably connected to the rotary bearing, with one end connected to the output end of the third drive member 3222 and the other end fixedly connected to the second measuring unit 323. The axial direction of the rotating shaft 3223 is parallel to the lifting direction of the lifting connecting block 3213. The rotating limiting member 3224 is disposed on both radial sides of the rotating shaft 3223; the third drive member 3222 drives the rotating shaft 3223 to rotate, thereby rotating the second measuring unit 323, and the rotating limiting member 3224 limits the rotation angle of the rotating shaft 3223. In some specific embodiments, the specific location of the rotation limiting member 3224 can be adaptively adjusted, simply requiring it to be located on both sides of the radial direction of the rotation shaft 3223. A swing arm is provided on the circumferential side of the rotation shaft 3223. By positioning the swing arm between the rotation limiting members 3224 located on both sides of the rotation shaft 3223, the rotation angle of the rotation shaft 3223 is limited by the stroke of the swing arm between the rotation limiting members 3224. The rotation limiting member 3224 can be configured as a rotation limiting sensor to prevent rigid collisions of the swing arm. It is understood that by setting the rotation limiting member 3224, interference between the second measuring unit 323 and other structures can be prevented, and the second measuring unit 323 can swing within a certain range to expand the detection range.

[0058] In some specific embodiments, the rotating shaft 3223 is provided with a limiting part within the rotary bearing housing 3221. The limiting part can be a flange or an axial retaining ring provided on the rotating shaft 3223. A locking nut is provided on the rotating shaft 3223 outside the rotary bearing housing 3221. The locking nut is rotatably connected to the rotary bearing housing 3221, and the two cooperate to prevent the rotating shaft 3223 from displacing along its axial direction. It can be understood that the radial position of the rotating shaft 3223 is limited by the rotary bearing, thereby ensuring the stability of the position of the rotating shaft 3223.

[0059] In some embodiments, the third drive component 3222 is configured as a rotary servo motor, which is connected to a rotary bearing housing 3221 via a mounting base 3225. A harmonic reducer 3226 is also provided between the mounting base 3225 and the rotary servo motor. The output end of the rotary servo motor is connected to the input end of the harmonic reducer 3226, and the output end of the harmonic reducer 3226 is connected to a rotating shaft 3223. The harmonic reducer 3226 is fixedly mounted to the mounting base 3225. Optionally, a reducer flange 3227 is also provided between the harmonic reducer 3226 and the rotary servo motor, and the rotary servo motor is fixedly mounted to the harmonic reducer 3226 via the reducer flange 3227.

[0060] In some embodiments, such as Figure 7 and Figure 10 As shown, the second measuring unit 323 includes a connecting rod 3231, a lifting plate 3232, and a second probe 3233. One end of the connecting rod 3231 is connected to the output end of the rotary drive unit 322, i.e., to the rotating shaft 3223; the other end is connected to the lifting plate 3232, which is mounted on the connecting rod 3231 and its position on the connecting rod 3231 is adjustable. The second probe 3233 is fixedly mounted on the lifting plate 3232. It can be understood that the extension direction of the connecting rod 3231 is perpendicular to the axial direction of the rotating shaft 3223 to achieve a swinging effect. By adjusting the position of the lifting plate 3232 on the connecting rod 3231, the measuring radius of the second measuring unit 323 can be adjusted, enabling the detection of workpiece parts with different radii, and adapting to different application scenarios and workpiece types.

[0061] In some embodiments, a cable support 3234 is also provided at the bottom of the connecting rod 3231 to fix the cable of the second probe 3233 connected to the outside and prevent the cable from interfering with the workpiece.

[0062] This utility model also provides a wafer thinning device, which includes a turntable, a chuck 100, and a grinding mechanism. The chuck 100 is rotatably mounted on the turntable and is used to fix the wafer. The grinding mechanism is spaced apart from the turntable and is used to grind the wafer. The device also includes the aforementioned thickness detection mechanism. The mounting base 30 of the thickness detection mechanism is mounted on the turntable, and the thickness detection mechanism can detect the thickness of the wafer processed by the grinding mechanism.

[0063] When the wafer thinning equipment starts processing, rough grinding is performed first. The chuck 100 rotates to the bottom of the first contact detection module. Gas is introduced through the gas valve connector 3153 of the first drive unit 3121, which is connected to the first contact detection module. The gas control valve of the first drive unit 3121 controls the descent of two contact probes. One contact probe contacts the wafer surface, and the other probe contacts the outer edge of the chuck 100. The wafer thickness change is calculated based on the thickness deviation measured by the two contact probes during the wafer thinning process, and the wafer thickness is fed back to... During the operation, the cooling water valve connector 3151 and the cleaning water valve connector 3152 of the spray pipe 3132 are connected to the cooling water valve connector 3152 of the spray pipe 3132, and water is sprayed out from the spray pipe 3132 and the spray pipe 3133 respectively. The spray pipe 3132 is set directly above the measuring rod 3122. The cooling water cools the contact probe and the wafer surface to ensure that the test results are not affected by temperature. The spray pipe 3133 washes the wafer surface near the contact probe to avoid the deposition of polishing fluid and interference with the contact probe test.

[0064] After the rough grinding is completed, the chuck 100 rotates to the bottom of the second contact detection module. The second contact detection module repeats the detection work of the first contact detection module. After thinning for a period of time, when the second contact detection module detects that the thickness has reached the set value, the non-contact detection module 32 is switched to work. The rotary servo motor of the non-contact detection module 32 operates, driving the rotating shaft 3223 to rotate via the harmonic reducer 3226, rotating the second measuring unit 323 above the chuck 100. At this time, the rotating limit sensor reacts and the swing arm stops. Subsequently, the lifting servo motor operates, driving the linear actuator 3216 via the lifting coupling 3215 to drive the lifting connecting block 3213, thereby controlling the rotary drive unit 322 to move vertically up and down. After the lifting limit sensor is triggered, the lifting drive unit 321 stops moving, and the second probe 3233 starts working, using optical non-contact detection to detect the subsequent processing of thinner wafers. This process can avoid the surface scratch problem caused by direct contact measurement of the thin wafer by the contact probe. During the detection process, the second measuring unit 323 can swing to measure multiple points, comprehensively detecting the thickness of the wafer and analyzing the surface texture processing. After the thinning process is completed, the rotary drive unit 322 and the lifting drive unit 321 are reset respectively, and the processing and detection ends.

[0065] The thickness detection mechanism of this utility model adopts different detection devices at different processing stages, and can measure the thickness of the workpiece in both contact and non-contact detection methods. The thickness detection mechanism of this utility model has an independently designed and installed structure that is compact and stable. The non-contact detection group can move relative to the second contact detection module, which can increase the detection range and improve the accuracy of the detection results.

[0066] This utility model discloses a wafer thinning device, including a turntable, chucks, and a grinding mechanism. Multiple chucks are provided and are mounted on the turntable. The device also includes the aforementioned thickness detection mechanism, with its mounting base on the turntable. The workpiece is a wafer. This device employs a combination of contact and non-contact detection methods to detect wafers at different processing stages. When the wafer thickness is relatively thick, contact detection is used, and when the thickness is reduced to a thinner level, non-contact detection is switched on. This protects the wafer surface from scratches and allows for the measurement of multiple points, comprehensively detecting the wafer thickness and analyzing the surface finish.

[0067] Obviously, the above embodiments of this utility model are merely examples for clearly illustrating the present utility model, and are not intended to limit the implementation of the present utility model. Those skilled in the art can make various obvious changes, readjustments, and substitutions without departing from the protection scope of this utility model. It is neither necessary nor possible to exhaustively describe all embodiments here. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this utility model should be included within the protection scope of the claims of this utility model.

Claims

1. A thickness detecting mechanism characterized by comprising: The utility model relates to a kind of contactless detection module and contact detection module for detecting the thickness of workpiece in real time. The utility model relates to a kind of contactless detection module and contact detection module for detecting the thickness of workpiece in real time. The utility model relates to a kind of contactless detection module and contact detection module for detecting the thickness of workpiece in real time. The utility model relates to a kind of contactless detection module and contact detection module for detecting the thickness of workpiece in real time.

2. The thickness detecting mechanism according to claim 1, wherein The utility model relates to a kind of contactless detection module and contact detection module for detecting the thickness of workpiece in real time. The utility model relates to a kind of contactless detection module and contact detection module for detecting the thickness of workpiece in real time.

3. The thickness detecting mechanism according to claim 2, wherein The utility model relates to a kind of contactless detection module and contact detection module for detecting the thickness of workpiece in real time.

4. The thickness detecting mechanism according to claim 3, wherein The utility model relates to a kind of contactless detection module and contact detection module for detecting the thickness of workpiece in real time. The utility model relates to a kind of contactless detection module and contact detection module for detecting the thickness of workpiece in real time. The utility model relates to a kind of contactless detection module and contact detection module for detecting the thickness of workpiece in real time. The utility model relates to a kind of contactless detection module and contact detection module for detecting the thickness of workpiece in real time.

5. The thickness detecting mechanism according to claim 4, wherein The utility model relates to a kind of contactless detection module and contact detection module for detecting the thickness of workpiece in real time. The utility model relates to a kind of contactless detection module and contact detection module for detecting the thickness of workpiece in real time. The utility model relates to a kind of contactless detection module and contact detection module for detecting the thickness of workpiece in real time. The utility model relates to a kind of contactless detection module and contact detection module for detecting the thickness of workpiece in real time. The utility model relates to a kind of contactless detection module and contact detection module for detecting the thickness of workpiece in real time.

6. The thickness detecting mechanism according to claim 4, wherein The utility model relates to a kind of contactless detection module and contact detection module for detecting the thickness of workpiece in real time. The utility model relates to a kind of contactless detection module and contact detection module for detecting the thickness of workpiece in real time. The utility model relates to a kind of contactless detection module and contact detection module for detecting the thickness of workpiece in real time. The utility model relates to a kind of contactless detection module and contact detection module for detecting the thickness of workpiece in real time. The utility model relates to a kind of contactless detection module and contact detection module for detecting the thickness of workpiece in real time. The utility model relates to a kind of contactless detection module and contact detection module for detecting the thickness of workpiece in real time. The utility model relates to a kind of contactless detection module and contact detection module for detecting the thickness of workpiece in real time.

7. The thickness detecting mechanism according to any one of claims 2 to 6, characterized by The utility model relates to a kind of contactless detection module and contact detection module for detecting the thickness of workpiece in real time. The utility model relates to a kind of contactless detection module and contact detection module for detecting the thickness of workpiece in real time. The utility model relates to a kind of contactless detection module and contact detection module for detecting the thickness of workpiece in real time. The utility model relates to a kind of contactless detection module and contact detection module for detecting the thickness of workpiece in real time. The utility model relates to a kind of contactless detection module and contact detection module for detecting the thickness of workpiece in real time. The utility model relates to a kind of contactless detection module and contact detection module for detecting the thickness of workpiece in real time. The utility model relates to a kind of contactless detection module and contact detection module for detecting the thickness of workpiece in real time. The utility model relates to a kind of contactless detection module and contact detection module for detecting the thickness of workpiece in real time. The utility model relates to a kind of contactless detection module and contact detection module for detecting the thickness of workpiece in real time. The utility model relates to a kind of contactless detection module and contact detection module for detecting the thickness of workpiece in real time. The utility model relates to a kind of contactless detection module and contact detection module for detecting the thickness of workpiece in real time. The utility model relates to a kind of contactless detection module and contact detection module for detecting the thickness of workpiece in real time. The utility model relates to a kind of contactless detection module and contact detection module for detecting the thickness of workpiece in real time. The utility model relates to a kind of contactless detection module and contact detection module for detecting the thickness of workpiece in real time. The utility model relates to a kind of contactless detection module and contact detection module for detecting the thickness of workpiece in real time. The utility model relates to a kind of contactless detection module and contact detection module for detecting the thickness of workpiece in real time. The utility model relates to a kind of contactless detection module and contact detection module for detecting the thickness of workpiece in real time. The utility model relates to a kind of contactless detection module and contact detection module for detecting the thickness of workpiece in real time. The utility model relates to a kind of contactless detection module and contact detection module for detecting the thickness of workpiece in real time. The utility model relates to a kind of contactless detection module and contact detection module for detecting the thickness of workpiece in real time. The utility model relates to a kind of contactless detection module and contact detection module for detecting the thickness of workpiece in real time. The utility model relates to a kind of contactless detection module and contact detection module for detecting the thickness of workpiece in real time. The utility model relates to a kind of contactless detection module and contact detection module for detecting the thickness of workpiece in real time. The utility model relates to a kind of contactless detection module and contact detection module for detecting the thickness of workpiece in real time. The utility model relates to a kind of contactless detection module and contact detection module for detecting the thickness of workpiece in real time. The utility model relates to a kind of contactless detection module and contact detection module for detecting the thickness of workpiece in real time. The utility model relates to a kind of contactless detection module and contact detection module for detecting the thickness of workpiece in real time. The utility model relates to a kind of contactless detection module and contact detection module for detecting the thickness of workpiece in real time. The utility model relates to a kind of contactless detection module and contact detection module for detecting the thickness of workpiece in real time. The utility model relates to a kind of contactless detection module and contact detection module for detecting the thickness of workpiece in real time. The utility model relates to a kind of contactless detection module and contact detection module for detecting the thickness of workpiece in real time. The utility model relates to a kind of contactless detection module and contact detection module for detecting the thickness of workpiece in real time. The utility model relates to a kind of contactless detection module and contact detection module for detecting the thickness of workpiece in real time. The utility model relates to a kind of contactless detection module and contact detection module for detecting the thickness of workpiece in real time. The utility model relates to a kind of contactless detection module and contact detection module for detecting the thickness of workpiece in real time. The utility model relates to a kind of contactless detection module and contact detection module for detecting the thickness of workpiece in real time. The utility model relates to a kind of contactless detection module and contact detection module for detecting the thickness of workpiece in real time. The utility model relates to a kind of contactless detection module and contact detection module for detecting the thickness of workpiece in real time. The utility model relates to a kind of contactless detection module and contact detection module for detecting the thickness of workpiece in real time. The utility model relates to a kind of contactless detection module and contact detection module for detecting the thickness of workpiece in real time. The utility model relates to a kind of contactless detection module and contact detection module for detecting the thickness of workpiece in real time. The utility model relates to a kind of contactless detection module and contact detection module for detecting the thickness of workpiece in real time. The utility model relates to a kind of contactless detection module and contact detection module for detecting the thickness of workpiece in real time. The utility model relates to a kind of contactless detection module and contact detection module for detecting the thickness of workpiece in real time. The utility model relates to a kind of contactless detection module and contact detection module for detecting the thickness of workpiece in real time. The utility model relates to a kind of contactless detection module and contact detection module for detecting the thickness of workpiece in real time. The utility model relates to a kind of contactless detection module and contact detection module for detecting the thickness of workpiece in real time. The utility model relates to a kind of contactless detection module and contact detection module for detecting the thickness of workpiece in real time. The utility model relates to a kind of contactless detection module and contact detection module for detecting the thickness of workpiece in real time. The utility model relates to a kind of contactless detection module and contact detection module for detecting the thickness of workpiece in real time. The utility model relates to a kind of contactless detection module and contact detection module for detecting the thickness of workpiece in real time. The utility model relates to a kind of contactless detection module and contact detection module for detecting the thickness of workpiece in real time. The utility model relates to a kind of contactless detection module and contact detection module for detecting the thickness of workpiece The second measuring part (323) is fixedly connected with the output end of the rotating driving part (322) and can be driven by the lifting driving part (321) and the rotating driving part (322) to lift and rotate relative to the second contact detection module.

8. The thickness detecting mechanism according to claim 7, wherein The lifting driving part (321) comprises: a mounting bracket (3211) fixedly connected with the second contact detection module; a second driving member (3212) arranged on the mounting bracket (3211); a lifting connecting block (3213) arranged at the output end of the second driving member (3212) and fixedly connected with the rotating driving part (322); a lifting limiting member (3214) arranged on the mounting bracket (3211) and located at both ends of the lifting stroke of the lifting connecting block (3213); wherein: the second driving member (3212) is used to drive the rotating driving part (322) to lift, and the lifting limiting member (3214) is used to limit the lifting stroke of the second driving member (3212); and / or, the rotating driving part (322) comprises: a rotating bearing seat (3221) connected with the lifting driving part (321) on the outside and provided with a rotating bearing on the inside; a third driving member (3222) arranged on the rotating bearing seat (3221); a rotating shaft (3223) penetrating through the rotating bearing and having one end connected with the output end of the third driving member (3222) and the other end fixedly connected with the second measuring part (323); a rotating limiting member (3224) arranged on both sides of the rotating shaft (3223) in the radial direction; wherein:

9. The thickness detecting mechanism according to claim 7, wherein the third driving member (3222) is used to drive the rotating shaft (3223) to rotate to drive the second measuring part (323) to rotate, and the rotating limiting member (3224) is used to limit the rotation angle of the rotating shaft (3223). The second measuring part (323) comprises: a connecting rod (3231) connected with the output end of the rotating driving part (322); a lifting piece (3232) arranged on the connecting rod (3231) and adjustable in position on the connecting rod (3231); 10. A wafer thinning apparatus comprising a turntable, a chuck (100) rotatably disposed on the turntable and used to fix a wafer, and a polishing mechanism disposed apart from the turntable and used to polish the wafer, characterized in that, a second measuring head (3233) fixedly arranged on the lifting piece (3232). Further comprising the thickness detection mechanism according to any one of claims 1-9, wherein a mounting base (30) of the thickness detection mechanism is arranged on the rotary table, and the thickness detection mechanism is capable of detecting the thickness of the wafer processed by the grinding mechanism.

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