Blowing mechanism and processing equipment

Abstract

The utility model discloses an air blowing mechanism and processing equipment, which belong to the field of semiconductor processing technology, and the air blowing mechanism comprises a base, a lifting seat, a sliding seat, a nozzle and a dust remover, the lifting seat is arranged on the base in a sliding mode, the sliding seat is arranged on the lifting seat in a sliding mode, the nozzle is installed on the sliding seat in a sliding and rotating mode so as to adjust the spraying angle, the dust remover is provided with an adsorption end, the dust remover is installed on the base, and the adsorption end of the dust remover is located at the nozzle. The sliding direction of the lifting base, the sliding direction of the sliding base and the sliding direction of the nozzle are perpendicular to one another, and the rotating axis of the nozzle is parallel to the sliding direction of the nozzle. The blowing mechanism provided by the utility model can prevent the wafer from being damaged during laser cutting, and improves the wafer processing quality.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor processing technology, and in particular to an air blowing mechanism and processing equipment. Background Technology

[0002] In semiconductor manufacturing, wafer thinning processes include taiko thinning, which involves thinning the central region of the wafer while leaving the edge regions unthinned and acting as support rings. After thinning the central region, the support rings need to be cut off the wafer. Because molten solder spatter can splatter during laser cutting, if this spatter gets inside the wafer, it can damage the wafer and affect the processing quality. Utility Model Content

[0003] The purpose of this utility model embodiment is to provide an air blowing mechanism and processing equipment that can prevent damage to wafers during laser cutting and improve the quality of wafer processing.

[0004] To achieve the above objectives, the present invention adopts the following technical solution:

[0005] On the one hand, an air blowing mechanism is provided, comprising:

[0006] Base;

[0007] The lifting seat is slidably mounted on the base;

[0008] The sliding seat is slidably mounted on the lifting seat;

[0009] The nozzle is slidably and rotatably mounted on the sliding seat to adjust the spray angle;

[0010] as well as

[0011] Dust collector, with an adsorption end;

[0012] The dust collector is installed on the base and the adsorption end of the dust collector is located at the nozzle. The sliding direction of the lifting seat, the sliding direction of the sliding seat, and the sliding direction of the nozzle are all perpendicular to each other. The rotation axis of the nozzle is parallel to the sliding direction of the nozzle.

[0013] Optionally, the blowing mechanism further includes a probe; the nozzle has an air inlet, a spray channel, and a spray port connected in sequence, and the probe can be selectively installed on the nozzle and pass through the air inlet, the spray channel, and the spray port in sequence to ensure that the spray port of the nozzle is aligned with the dicing position on the wafer.

[0014] Optionally, the nozzle injection channel includes an air chamber, an air guide hole, and an air jet hole connected in sequence; the volume of the air guide hole and the volume of the air jet hole are both smaller than the volume of the air chamber, the air inlet is connected to the air chamber, and the injection port is connected to the air jet hole.

[0015] Optionally, the jet hole is a circular hole, the air guide hole is a frustum-shaped hole, and the diameter of the air guide hole gradually decreases along the direction close to the jet hole.

[0016] Optionally, the sliding seat is provided with a guide shaft, and a support seat is rotatably and slidably mounted on the guide shaft, and the nozzle is mounted on the support seat by threaded fasteners.

[0017] Optionally, the air blowing mechanism further includes a cylinder mounted on the lifting seat; the sliding direction of the cylinder's output rod is parallel to the sliding direction of the lifting seat, and the sliding seat is slidably mounted on the cylinder's output rod.

[0018] Optionally, the sliding seat is provided with a guide groove, the output rod of the cylinder is disposed in the guide groove, and the sliding seat is locked to the output rod of the cylinder by a threaded fastener.

[0019] Optionally, the base is provided with a plurality of first scale bars, which are spaced apart along the sliding direction of the lifting seat.

[0020] Optionally, the sliding seat is provided with a plurality of second scale bars, which are spaced apart along the sliding direction of the sliding seat.

[0021] On the other hand, a processing device is provided, including the aforementioned air blowing mechanism.

[0022] The beneficial effects of this invention are as follows: This air-blowing mechanism uses nozzles to blow away the welding slag generated during cutting, preventing damage to the wafer. The nozzles can not only slide and adjust their position in the vertical and horizontal directions, but also rotate to adjust the air jet angle, effectively ensuring that the nozzles blow air at the appropriate position and angle during each cut, thus keeping the welding slag during laser cutting within a reasonable range. Then, a dust collector promptly removes any rebounding gas and large pieces of welding slag, preventing secondary damage to the wafer and improving the quality of wafer processing.

[0023] This processing equipment improves the processing quality of wafer laser cutting by adopting the aforementioned air blowing mechanism. Attached Figure Description

[0024] The present invention will now be described in further detail with reference to the accompanying drawings and embodiments.

[0025] Figure 1 This is a schematic diagram of the air blowing mechanism;

[0026] Figure 2 This is a side view of the air blowing mechanism;

[0027] Figure 3 This is a structural diagram of the base, lifting seat, sliding seat, and nozzle.

[0028] Figure 4 This is a schematic diagram of the nozzle structure.

[0029] Explanation of reference numerals in the attached figures:

[0030] 11. Base; 12. Lifting seat; 13. Sliding seat; 14. Nozzle; 15. Dust collector; 16. Probe; 17. Guide shaft; 18. Support seat; 19. Cylinder; 20. Bracket; 21. Laser; 22. Wafer;

[0031] 111. First scale bar;

[0032] 131. Guide groove; 132. Second graduation bar;

[0033] 141. Air inlet; 142. Injection channel; 143. Injection port; 144. Air chamber; 145. Air guide hole; 146. Injection port; 147. Connecting threaded hole. Detailed Implementation

[0034] To make the technical problems solved by this utility model, the technical solutions adopted, and the technical effects achieved clearer, the technical solutions of the embodiments of this utility model will be further described in detail below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, and not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of this utility model.

[0035] In the description of this utility model, unless otherwise explicitly specified and limited, the terms "connected," "fixed," "linked," "communicated," "abutting," "clamping," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0036] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0037] In the description herein, it should be understood that the terms "upper," "lower," "left," and "right," etc., refer to the orientation or positional relationships shown in the accompanying drawings, and are used only for ease of description and simplification of operation. They do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. Furthermore, the terms "first" and "second" are merely used for distinction in description and have no special meaning.

[0038] In the description of this specification, references to terms such as "an embodiment," "example," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, illustrative expressions of the above terms do not necessarily refer to the same embodiment or example.

[0039] Furthermore, it should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This narrative style of the specification is merely for clarity. Those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

[0040] Unless otherwise stated or defined, the term "and / or" as used in this invention includes any and all combinations of one or more of the associated listed items.

[0041] For ease of description, unless otherwise stated, the terms "up" and "down" in the following text refer to the same direction as "top" and "bottom". Figure 2 Its vertical direction is consistent with the horizontal direction mentioned below. Figure 2 Its left-right direction is consistent, and the front-back direction mentioned below is consistent with... Figure 2 Their projection directions are consistent.

[0042] like Figures 1 to 4As shown, this embodiment provides an air blowing mechanism, including a base 11, a lifting seat 12, a sliding seat 13, a nozzle 14, and a dust collector 15. The lifting seat 12 is slidably mounted on the base 11 in a vertical direction. The sliding seat 13 is slidably mounted on the lifting seat 12 in a horizontal direction, and slides back and forth relative to the lifting seat 12. The nozzle 14 is slidably and rotatably mounted on the sliding seat 13 to adjust the spray angle. The nozzle 14 is horizontally slidably mounted on the sliding seat 13 in a front-to-back direction.

[0043] The dust collector 15 has an adsorption end, which is an adsorption port that can form a negative pressure, allowing it to adsorb welding slag. The dust collector 15 can promptly remove the gas and welding slag blown out of the nozzle 14. The dust collector 15 is mounted on the base 11 via a bracket 20, and its negative pressure end is connected to a negative pressure pump or other negative pressure device. Because the gas blown out of the nozzle 14 during the laser cutting of the wafer 22 can bounce off the cutting path, and large pieces of welding slag may be carried by the bounced gas and fall onto the wafer 22, potentially damaging it, the dust collector 15 can promptly remove the bounced gas and large pieces of welding slag, preventing damage to the wafer 22.

[0044] The dust collector 15 is mounted on the base 11 via the bracket 20, and the adsorption end of the dust collector 15 is located at the nozzle 14. The position of the adsorption end of the dust collector 15 is adjustable, so the position of the adsorption end can be adjusted according to the position of the nozzle 14. The sliding directions of the lifting seat 12, the sliding seat 13, and the nozzle 14 are mutually perpendicular, and the rotation axis of the nozzle 14 is parallel to the sliding direction of the nozzle 14. Through the sliding cooperation of the lifting seat 12, the sliding seat 13, and the nozzle 14 itself, the nozzle 14 can move in three axes in the up-down, left-right, and front-back directions, realizing the position adjustment of the nozzle 14. The nozzle 14 can rotate relative to the sliding seat 13, thereby realizing the adjustment of the jet angle.

[0045] Due to the uncertainty of laser 21 parameters and air blowing angle during laser 21 processing, it is difficult to control the spatter of welding slag within a reasonable range when the nozzle 14 is fixedly installed. In this embodiment, the nozzle 14 of the air blowing mechanism is installed in a sliding and rotating manner, which can effectively control the spatter of welding slag within a reasonable range and avoid excessive spatter spatter range that could damage the wafer 22.

[0046] When the air blowing mechanism is working, the nozzle 14 can be connected to compressed air. By adjusting the position and spray angle of the nozzle 14, a suitable position can be found so that the sprayed gas is aligned with the intersection of the laser 21 emitted by the laser cutting equipment and the wafer 22, that is, the sprayed gas is aligned with the cutting position on the wafer 22. Specifically, sliding the nozzle 14 ensures that the gas blown from the nozzle 14 is always in the center of the laser 21, and rotating the nozzle 14 ensures that the gas blown from the nozzle 14 forms a certain angle with the cutting position, thus finding the suitable position. During the adjustment process, the gas blown from the nozzle 14 must always be blowing at the cutting position. However, changes in the rotation angle may cause the gas blown from the nozzle 14 to not coincide with the cutting position. At this time, the position of the lifting seat 12 and the sliding seat 13 can be adjusted to find a suitable air spray position, ensuring that the nozzle 14 does not collide with the wafer 22 during the angle adjustment process, thus avoiding damage to the wafer 22 caused by the nozzle 14.

[0047] Optionally, the blowing mechanism also includes a probe 16. The nozzle 14 has an air inlet 141, a jet channel 142, and a jet outlet 143 connected in sequence. The air inlet 141 is used to connect the air pipe of equipment such as a pump body. The probe 16 can be selectively installed on the nozzle 14 and passes through the air inlet 141, the jet channel 142, and the jet outlet 143 in sequence to ensure that the jet outlet 143 of the nozzle 14 is aligned with the dicing position on the wafer 22. In order to ensure that the gas blown out by the nozzle 14 is aligned with the dicing position after each rotation angle, the blowing mechanism of this embodiment can use the probe 16 to ensure that the gas blown out by the nozzle 14 is still aligned with the dicing position after the nozzle 14 rotates by an angle. Before each cut, disconnect the air tube from the pump body, and then use a probe 16 of appropriate size to pass through the air inlet 141, the jet channel 142, and the jet port 143 in sequence. Finally, adjust the position and angle of the nozzle 14 so that after the probe 16 is inserted, it extends directly to coincide with the laser 21, so that the nozzle 14 is aligned with the cutting position. After the nozzle 14 is aligned with the cutting position, the probe 16 is pulled out and connected to the air tube on the pump body.

[0048] Furthermore, the nozzle 14's injection channel 142 includes an air chamber 144, an air guide hole 145, and an air jet hole 146 connected in sequence. The volumes of the air guide hole 145 and the air jet hole 146 are both smaller than the volume of the air chamber 144, allowing more compressed air to enter the nozzle 14 and increasing the injection pressure. The air inlet 141 is connected to the air chamber 144, and the injection port 143 is connected to the air jet hole 146. The nozzle 14 has an overall conical structure to ensure its structural strength.

[0049] Furthermore, the jet nozzle 146 is a circular hole, and the air guide hole 145 is a frustum-shaped hole. The diameter of the air guide hole 145 gradually decreases along the direction close to the jet nozzle 146. When the air blowing mechanism needs to cut and remove dust, the pump body is turned on, and compressed air enters the air chamber 144. Then, the gas passes through the air guide hole 145 and the jet nozzle 146 in sequence, and finally exits from the spray port 143. The air guide hole 145 is a variable diameter hole, which can better guide the gas into the jet nozzle 146, and also facilitates the insertion of the probe 16 into the jet nozzle 146 when positioning the nozzle 14 and the laser 21.

[0050] In one embodiment, the sliding seat 13 is provided with a guide shaft 17, and a support seat 18 is rotatably and slidably mounted on the guide shaft 17. The nozzle 14 is mounted on the support seat 18 by threaded fasteners. The nozzle 14 is provided with two threaded holes 147, through which the nozzle 14 is fixed to the support seat 18. There are two lifting seats 12 located on the front and rear sides of the base 11, and two sliding seats 13 spaced apart. One sliding seat 13 is slidably mounted on one of the lifting seats 12, and the other sliding seat 13 is slidably mounted on the other lifting seat 12. The two ends of the guide shaft 17 are respectively connected to the two sliding seats 13. The support seat 18 is rotatably and slidably mounted on the guide shaft 17, and the support seat 18 slides and rotates between the two sliding seats 13.

[0051] Optionally, the air blowing mechanism also includes a cylinder 19 mounted on the lifting seat 12. The direction of movement of the output rod of the cylinder 19 is parallel to the sliding direction of the lifting seat 12, and the sliding seat 13 is slidably mounted on the output rod of the cylinder 19. The cylinder 19 can drive the sliding seat 13 to move up and down, and the sliding seat 13 can slide left and right relative to the cylinder 19. Specifically, each of the two lifting seats 12 is equipped with a cylinder 19, and the two cylinders 19 correspond one-to-one with the two sliding seats 13.

[0052] Because the angle of the nozzle 14 needs to be adjusted before wafer 22 is cut, the nozzle 14 may be very close to the wafer 22. The position and angle of the nozzle 14 are adjusted manually by moving the lifting seat 12 up and down, the sliding seat 13 left and right, and rotating and sliding the nozzle 14 back and forth. After wafer 22 is cut, the positioning and transfer mechanism that holds wafer 22 will lift it upwards a certain distance, which could cause the nozzle 14 to collide with the wafer 22. At this point, the cylinder 19 automatically lifts the sliding seat 13 and the nozzle 14 as a whole to avoid the collision.

[0053] Furthermore, the sliding seat 13 is provided with a guide groove 131, and the output rod of the cylinder 19 is located in the guide groove 131. The sliding seat 13 is fitted onto the output rod of the cylinder 19 through the guide groove 131, allowing the sliding seat 13 to slide left and right relative to the cylinder 19. The sliding seat 13 is locked to the output rod of the cylinder 19 by threaded fasteners. Each cylinder 19 has multiple output rods with threaded holes, which are threadedly connected to the threaded fasteners. The guide groove 131 is a countersunk groove. When adjusting the sliding seat 13, first loosen the bolts and other threaded fasteners to drive the sliding seat 13 to slide left and right. After adjustment, tighten the threaded fasteners, and the head of the threaded fasteners abuts against the inner wall of the guide groove 131 to achieve locking.

[0054] In one embodiment, the base 11 is provided with a plurality of first scale bars 111, which are arranged at intervals along the sliding direction of the lifting seat 12. The height of the lifting seat 12 sliding up and down can be accurately adjusted by means of the first scale bars 111.

[0055] Optionally, the sliding seat 13 is provided with a plurality of second scale bars 132, which are arranged at intervals along the sliding direction of the sliding seat 13. The distance of left and right sliding of the sliding seat 13 can be accurately adjusted by means of the second scale bars 132.

[0056] Both the base 11 and the sliding seat 13 have scales, which can be recorded each time the position of the nozzle 14 is adjusted, making it convenient to reproduce the position when processing the same wafer 22 in the future.

[0057] When using the air blowing mechanism, the wafer 22 is positioned before laser 21 processing. Then, the lifting seat 12 and sliding seat 13 are driven to position the nozzle 14 at a suitable height. The air pipe is disconnected and the probe 16 is inserted. The position and rotation angle of the nozzle 14 on the guide shaft 17 are then adjusted, and the probe 16 is used to ensure that the air blowing nozzle 14 and laser 21 are in the correct position. If the position is not suitable, the position of the lifting seat 12 and sliding seat 13 can be adjusted, and the probe 16 can be used to find the correct position. When the nozzle 14 is in the correct position, the probe 16 is removed, the air pipe is connected to the nozzle 14, and the pump body is turned on. At the same time, the dust collector 15 is turned on, and the above parameters are recorded. After cutting, the cylinder 19 rises, and the wafer 22 is removed. The cutting spatter is checked to see if it is within a reasonable range. If it is, the position of the nozzle 14 can be fixed for a long time. If the spatter range is not within a reasonable range, the above operation is repeated to adjust the nozzle 14, and the laser 21 cutting parameters are changed to repeat the experiment until the spatter is controlled within a reasonable range.

[0058] The nozzle 14 of this air blowing mechanism has adjustable air jet angle and air volume, and the suction power of the dust collector 15 is also adjustable, which can effectively change the spatter from cutting. Both the base 11 and the sliding seat 13 of the air blowing mechanism have graduations, which can effectively record the position of each adjustment for easy replication in subsequent adjustments. The probe 16 effectively ensures that the nozzle 14 is in the appropriate position relative to the cutting position during each adjustment. The dust collector 15 can promptly remove the blown-out rebound gas and large pieces of solder slag, preventing secondary damage to the wafer 22.

[0059] In other embodiments, the dust collector 15 can be mounted on the lifting seat 12 to achieve lifting, which can ensure that the nozzle 14 is away from the surface of the wafer 22 after each processing, preventing secondary damage to the wafer 22 in subsequent operations.

[0060] This embodiment also provides a processing device, including the aforementioned air blowing mechanism. Specifically, the processing device further includes a base and a cutting mechanism, which are mounted on the base.

[0061] The technical principles of this utility model have been described above with reference to specific embodiments. These descriptions are merely for explaining the principles of this utility model and should not be construed as limiting the scope of protection of this utility model in any way. Based on this explanation, those skilled in the art can readily conceive of other specific embodiments of this utility model without any inventive effort, and these embodiments will all fall within the scope of protection of this utility model.

Claims

1. An air blowing mechanism, characterized in that, include: Base (11); The lifting seat (12) is slidably mounted on the base (11); A sliding seat (13) is slidably mounted on the lifting seat (12); The nozzle (14) is slidably and rotatably mounted on the sliding seat (13) to adjust the spray angle; as well as Dust collector (15) has an adsorption end; The dust collector (15) is installed on the base (11) and the adsorption end of the dust collector (15) is located at the nozzle (14). The sliding direction of the lifting seat (12), the sliding direction of the sliding seat (13), and the sliding direction of the nozzle (14) are perpendicular to each other. The rotation axis of the nozzle (14) is parallel to the sliding direction of the nozzle (14).

2. The air blowing mechanism according to claim 1, characterized in that, It also includes a probe (16); the nozzle (14) has an air inlet (141), an injection channel (142), and an injection port (143) connected in sequence. The probe (16) can be selectively installed on the nozzle (14) and passes through the air inlet (141), the injection channel (142), and the injection port (143) in sequence to ensure that the injection port (143) of the nozzle (14) is aligned with the dicing position on the wafer (22).

3. The air blowing mechanism according to claim 2, characterized in that, The nozzle (14) injection channel (142) includes an air chamber (144), an air guide hole (145), and an air jet hole (146) connected in sequence; the volume of the air guide hole (145) and the volume of the air jet hole (146) are both smaller than the volume of the air chamber (144), the air inlet (141) is connected to the air chamber (144), and the injection port (143) is connected to the air jet hole (146).

4. The air blowing mechanism according to claim 3, characterized in that, The jet hole (146) is a circular hole, and the air guide hole (145) is a frustum-shaped hole. The diameter of the air guide hole (145) gradually decreases along the direction close to the jet hole (146).

5. The air blowing mechanism according to any one of claims 1 to 4, characterized in that, The sliding seat (13) is provided with a guide shaft (17), and a support seat (18) is rotatably and slidably mounted on the guide shaft (17). The nozzle (14) is mounted on the support seat (18) by threaded fasteners.

6. The air blowing mechanism according to any one of claims 1 to 4, characterized in that, It also includes a cylinder (19) installed on the lifting seat (12); the sliding direction of the output rod of the cylinder (19) is parallel to the sliding direction of the lifting seat (12), and the sliding seat (13) is slidably mounted on the output rod of the cylinder (19).

7. The air blowing mechanism according to claim 6, characterized in that, The sliding seat (13) is provided with a guide groove (131), and the output rod of the cylinder (19) is located in the guide groove (131). The sliding seat (13) is locked to the output rod of the cylinder (19) by a threaded fastener.

8. The air blowing mechanism according to any one of claims 1 to 4, characterized in that, The base (11) is provided with a plurality of first scale bars (111), and the plurality of first scale bars (111) are arranged at intervals along the sliding direction of the lifting seat (12).

9. The air blowing mechanism according to any one of claims 1 to 4, characterized in that, The sliding seat (13) is provided with a plurality of second scale bars (132), and the plurality of second scale bars (132) are arranged at intervals along the sliding direction of the sliding seat (13).

10. A processing device, characterized in that, Includes the air blowing mechanism as described in any one of claims 1 to 9.

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