CUP (central processing unit) air exhaust system of gluing machine

Abstract

The utility model discloses a gumming machine CUP air exhaust system which comprises a base, a CUP is installed on the base, the bottom of the CUP is connected with a glue discharging pipeline and an air exhaust pipeline, an inner ring, a wafer and a wafer connecting rod are installed at the inner bottom of the CUP, the gumming machine CUP air exhaust system further comprises a CUP cleaning system, the CUP cleaning system is used for spraying cleaning liquid to clean light resistance wires collected at the bottom of the CUP, and the CUP cleaning system is used for cleaning the light resistance wires collected at the bottom of the CUP. The CUP cleaning system comprises an annular cleaning pipeline surrounding the periphery of the inner ring and a liquid supply pipeline connected with the cleaning pipeline, and a liquid spraying structure is arranged on the cleaning pipeline. According to the utility model, the acetone cleaning pipeline is additionally arranged in the CUP, so that the problem that the air exhaust channel is blocked due to accumulation of photoresist wires is solved. After each wafer is spin-coated, the system can automatically spray acetone to clean the inner wall of the CUP so as to keep smooth air exhaust, so that the product yield is improved, the equipment maintenance frequency is reduced, and the equipment utilization rate is improved.

Description

Technical Field

[0001] This utility model relates to the field of DDI packaging bump process technology, specifically a CUP vacuum system for a glue coating machine. Background Technology

[0002] In DDI packaging bump processes, low-viscosity photoresists that form thin coatings are commonly used. Due to the high spin-coating speed, these photoresists easily form photoresist filaments, resembling marshmallow-like threads (e.g., ...). Figure 1 (As shown). These filaments, affected by the bottom suction of the CPU, will accumulate at the bottom of the CPU, causing blockage of the suction channel. Poor suction will lead to a decrease in product yield, and require frequent replacement of the CPU, increasing PM frequency and reducing equipment utilization.

[0003] Therefore, in order to correct the above-mentioned defects, we propose a CUP suction system for glue applicators. Utility Model Content

[0004] The technical problem solved by this utility model is to provide a CUP air extraction system for a glue applicator.

[0005] To achieve the above objectives, this utility model provides the following technical solution: a CUP suction system for a glue applicator, comprising a base, on which a CUP is mounted, with a glue discharge pipe and a suction pipe connected to the bottom of the CUP, an inner ring, a wafer, and a wafer connecting rod installed at the inner bottom of the CUP, and a CUP cleaning system. The CUP cleaning system is used to spray cleaning fluid to clean the photoresist fibers collected at the bottom of the CUP. The CUP cleaning system includes an annular cleaning pipe surrounding the inner ring and a liquid supply pipe connected to the cleaning pipe, and the cleaning pipe is provided with a liquid spraying structure.

[0006] Furthermore, the spray structure consists of several spray holes evenly distributed on the cleaning pipe.

[0007] Furthermore, the several spray holes on the cleaning pipe are divided into two groups, with the two groups facing different directions.

[0008] Furthermore, the spray structure consists of several fan-shaped nozzles evenly distributed on the cleaning pipe.

[0009] Furthermore, the cleaning solution is either acetone or a photoresist solvent.

[0010] Compared with existing technologies, the beneficial effects of this invention are as follows: This invention eliminates the problem of air extraction channel blockage caused by photoresist fiber accumulation by adding an acetone cleaning channel inside the CUP. After spin coating each wafer, the system automatically sprays acetone to clean the inner wall of the CUP to maintain smooth air extraction, thereby improving product yield, reducing equipment maintenance frequency, and increasing equipment utilization. Attached Figure Description

[0011] Figure 1 This is a schematic diagram of the structure of this utility model before modification;

[0012] Figure 2 This is a schematic diagram of the modified structure of this utility model;

[0013] Figure 3 This is a top view schematic diagram of the modified structure of this utility model.

[0014] Numbering on the map:

[0015] 1. Adhesive discharge pipe; 2. Air extraction pipe; 3. CUP; 4. Inner ring; 5. Wafer; 6. Wafer connecting rod; 7. Cleaning pipe; 8. Liquid supply pipe. Detailed Implementation

[0016] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0017] This utility model provides a technical solution:

[0018] Please see Figure 2-3 A CUP suction system for a glue applicator includes a base, on which a CUP3 is mounted. The bottom of the CUP3 is connected to a glue discharge pipe 1 and a suction pipe 2. An inner ring 4, a wafer 5, and a wafer connecting rod 6 are mounted on the inner bottom of the CUP3. The CUP3 is located above the inner ring 4. The wafer connecting rod 6 passes through the inner ring 4 and connects to the CUP3. The above parts are consistent with the CUP suction system in the prior art, and will not be described in detail in this case.

[0019] Unlike other inventions, this invention also includes a CUP cleaning system. The CUP cleaning system is used to spray cleaning fluid to clean the photoresist fibers collected at the bottom of the CUP3. The CUP cleaning system includes an annular cleaning pipe 7 surrounding the inner ring 4 and a liquid supply pipe 8 connected to the cleaning pipe 7. The liquid supply pipe 8 is connected to an external cleaning fluid tank. The cleaning system is linked with the automatic control system of the coating machine and can set the cleaning frequency and spray volume according to production needs. The cleaning pipe 7 is equipped with a spray structure. After each wafer 5 is spin-coated, the cleaning control system will automatically start, spraying cleaning fluid to clean the inner wall of the CUP3, dissolving and removing the photoresist fibers, and ensuring that the exhaust channel 2 is unobstructed. Through this solution, the replacement frequency of the CUP is greatly reduced and the production efficiency is significantly improved.

[0020] The cleaning pipe 7 surrounds the inner ring 4 to ensure comprehensive cleaning coverage without any blind spots.

[0021] The spray structure is designed with a multi-hole design or a fan-shaped nozzle design, which can uniformly spray acetone or photoresist solvent to clean the inner wall of the CUP.

[0022] The cleaning solution is either acetone or a photoresist solvent.

[0023] By adding an acetone cleaning pipe within the CUP and implementing an automatic cleaning function, the problem of poor air extraction caused by photoresist fiber buildup was effectively solved. This invention improves product yield, reduces equipment maintenance frequency, and significantly enhances equipment utilization.

[0024] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A CUP suction system for a glue applicator, comprising a base, on which a CUP (3) is mounted, the bottom of the CUP (3) being connected to a glue discharge pipe (1) and a suction pipe (2), and an inner ring (4), a wafer (5), and a wafer connecting rod (6) being mounted on the inner bottom of the CUP (3), characterized in that: It also includes a CUP cleaning system, which is used to spray cleaning fluid to clean the photoresist filaments gathered at the bottom of the CUP (3). The CUP cleaning system includes an annular cleaning pipe (7) surrounding the inner ring (4) and a liquid supply pipe (8) connected to the cleaning pipe (7). The cleaning pipe (7) is provided with a liquid spraying structure.

2. The CUP air extraction system for the glue applicator according to claim 1, characterized in that: The spray structure consists of several spray holes evenly distributed on the cleaning pipe (7).

3. The CUP air extraction system for the glue applicator according to claim 2, characterized in that: The cleaning pipe (7) has several spray holes divided into two groups, with the two groups facing different directions.

4. The CUP air extraction system for the glue applicator according to claim 1, characterized in that: The spray structure consists of several fan-shaped nozzles evenly distributed on the cleaning pipe (7).

5. The CUP air extraction system for the glue applicator according to claim 1, characterized in that: The cleaning solution is either acetone or a photoresist solvent.

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