Combined type heat dissipation device
By designing a composite heat dissipation device that combines a three-dimensional heat transfer device and a loop radiator, the problem of insufficient heat dissipation of the heat spreader under high heat conditions is solved by utilizing the thermosiphon effect, thus achieving efficient heat dissipation and a long lifespan for the device.
Patent Information
- Application Number
- CN202520206655.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-02-10
- Publication Date
- 2026-01-09
- Estimated Expiration
- 2035-02-10
AI Technical Summary
Existing heat spreaders are not efficient enough to dissipate heat under high-heat conditions, which can easily lead to excessive evaporation and dry burning of the cooling fluid, thus affecting the heat dissipation function.
A composite heat dissipation device is adopted, combining a three-dimensional heat transfer device and a loop radiator. It utilizes the thermosiphon effect of pulsed or thermosiphon heat pipes to enhance heat dissipation efficiency and avoid excessive evaporation of cooling fluid.
It improves heat dissipation efficiency, meets the heat dissipation needs of high-heat electronic devices, and extends the service life of the devices.
Smart Images
Figure CN223784694U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to a heat dissipation device, in particular to a composite heat dissipation device. BACKGROUND
[0002] In the process of electronic device operation, the heat generated by the processor needs to be quickly removed to keep the working temperature within the range recommended by the manufacturer. The heat generated by the processor in the electronic device is removed by the vapor chamber, which is the common way at present. Specifically, the vapor chamber mainly includes a cavity and a capillary structure. The cavity has a hollow chamber inside, and the hollow chamber is used to fill a working fluid. The capillary structure is arranged in the hollow chamber. The heated part of the cavity is called the evaporation zone. The part of the cavity dissipating heat is called the condensation zone. The liquid working fluid absorbs heat and vaporizes in the evaporation zone. The vaporized working fluid releases heat and condenses into liquid working fluid in the condensation zone. Then, the liquid working fluid returns to the evaporation zone through the capillary structure, forming a heat dissipation cycle.
[0003] With the development of technology, the operation efficiency of electronic devices is also getting higher and higher, so that the heat generated by the operation of electronic devices is also getting higher and higher. However, the heat dissipation efficiency of the current vapor chamber is still insufficient. That is, the current vapor chamber cannot effectively dissipate the high heat generated by the operation of electronic devices. As a result, when the heat generated by the operation of electronic devices is too high, the cooling fluid in the vapor chamber may be over-vaporized to cause dry burning, thereby reducing the heat dissipation function of the vapor chamber. Therefore, how to improve the heat dissipation efficiency of the vapor chamber to meet the heat dissipation needs of electronic devices generating high heat is one of the problems to be solved by researchers. SUMMARY
[0004] The utility model discloses a composite heat dissipation device, which improves the heat dissipation efficiency of the composite heat dissipation device to meet the heat dissipation needs of electronic devices generating high heat.
[0005] The composite heat dissipation device disclosed in an embodiment of the utility model is used to be in thermal contact with a heat source and includes a three-dimensional heat transfer device and a loop heat sink. The three-dimensional heat transfer device includes a vapor chamber and at least one vapor heat pipe. The vapor chamber has a vapor chamber and is used to be in thermal contact with the heat source. The at least one vapor heat pipe is arranged in the vapor chamber. The loop heat sink is thermally coupled to the vapor chamber.
[0006] The composite heat dissipation device described above, wherein the loop heat sink includes a loop cavity and at least one loop heat pipe, the loop cavity is thermally coupled to the vapor chamber, and the at least one loop heat pipe is arranged in the loop cavity.
[0007] The composite heat dissipating device, wherein the at least one loop heat pipe has an open end and a closed end, and the open end of the at least one loop heat pipe is disposed in the loop cavity.
[0008] The composite heat dissipating device, wherein the at least one loop heat pipe has two open ends, and the two open ends of the at least one loop heat pipe are disposed in the loop cavity.
[0009] The composite heat dissipating device, wherein the vapor chamber comprises a first heat conducting shell and a second heat conducting shell, the first heat conducting shell is in thermal contact with the heat source, and the second heat conducting shell is disposed in the first heat conducting shell so that the second heat conducting shell and the first heat conducting shell jointly surround the uniform temperature cavity.
[0010] The composite heat dissipating device, wherein the loop heat sink comprises at least one loop heat pipe, the at least one loop heat pipe forms a circulation flow channel and is thermally coupled to the vapor chamber.
[0011] The composite heat dissipating device, wherein the joint of the first heat conducting shell and the second heat conducting shell jointly forms at least one through hole, and the at least one loop heat pipe is located in the at least one through hole.
[0012] The composite heat dissipating device, wherein the first heat conducting shell comprises a bottom plate, a first convex structure protruding from the bottom plate away from the second heat conducting shell.
[0013] The composite heat dissipating device, wherein the first heat conducting shell further comprises a second convex structure protruding from the first convex structure away from the second heat conducting shell.
[0014] The composite heat dissipating device, wherein the loop heat sink comprises at least one loop heat pipe, and opposite ends of the at least one loop heat pipe are respectively communicated with the uniform temperature cavity of the vapor chamber.
[0015] The composite heat dissipating device, wherein the at least one loop heat pipe is a pulse heat pipe or a heat siphon heat pipe.
[0016] The composite heat dissipating device, further comprising a heat dissipation fin structure, the heat dissipation fin structure is thermally coupled to the at least one loop heat pipe.
[0017] The composite heat dissipating device, wherein the heat dissipation fin structure is thermally coupled to the at least one loop heat pipe.
[0018] The composite heat dissipating device, wherein the vapor chamber comprises a uniform temperature cavity and a heat absorption cavity, the at least one loop heat pipe is disposed in the uniform temperature cavity of the vapor chamber, and the heat absorption cavity protrudes from the uniform temperature cavity.
[0019] The composite heat dissipating device, wherein the loop heat sink is free of capillary structure.
[0020] The composite heat dissipating device, wherein the three-dimensional heat transfer device further comprises a capillary structure disposed on the vapor chamber.
[0021] The composite heat dissipating device, wherein the vapor chamber has a heat contact surface in thermal contact with the heat source, and the at least one primary heat conducting column is located in the vapor chamber and corresponds to an area within the heat contact surface of the vapor chamber, and the at least one secondary heat conducting column is located in the vapor chamber and corresponds to an area outside the heat contact surface of the vapor chamber.
[0022] The composite heat dissipating device, wherein the diameter of the at least one primary heat conducting column is greater than the diameter of the at least one secondary heat conducting column.
[0023] Another embodiment of the composite heat dissipating device is disclosed, which is in thermal contact with a heat source and comprises a first heat conducting shell, a second heat conducting shell, a third heat conducting shell, and a loop heat pipe. The first heat conducting shell is in thermal contact with the heat source. The second heat conducting shell is stacked on the first heat conducting shell and cooperates with the first heat conducting shell to surround a vapor chamber. The third heat conducting shell is stacked on the second heat conducting shell and cooperates with the second heat conducting shell to surround a loop chamber. The loop chamber and the vapor chamber are not in communication. The loop heat pipe is arranged through the third heat conducting shell and is in communication with the loop chamber.
[0024] The composite heat dissipating device, wherein the vapor chamber has a heat contact surface in thermal contact with the heat source, and the at least one primary heat conducting column is located in the vapor chamber and corresponds to an area within the heat contact surface of the vapor chamber, and the at least one secondary heat conducting column is located in the vapor chamber and corresponds to an area outside the heat contact surface of the vapor chamber.
[0025] Another embodiment of the composite heat dissipating device is disclosed, which is in thermal contact with a heat source and comprises a first heat conducting shell, a second heat conducting shell, a third heat conducting shell, and a loop heat pipe. The first heat conducting shell is in thermal contact with the heat source. The second heat conducting shell is stacked on the first heat conducting shell and cooperates with the first heat conducting shell to surround a vapor chamber. The third heat conducting shell is stacked on the second heat conducting shell and cooperates with the second heat conducting shell to surround a loop chamber. The loop chamber and the vapor chamber are not in communication. The loop heat pipe is arranged through the third heat conducting shell and is in communication with the loop chamber.
[0026] The composite heat dissipating device, wherein the at least one loop heat pipe is a pulse heat pipe or a thermal siphon heat pipe.
[0027] According to the composite heat dissipating device of the above embodiment, since the composite heat dissipating device is a composite three-dimensional heat transfer device and a loop heat sink, the composite heat dissipating device can further dissipate heat from the heat source through the heat siphon effect of the loop heat sink, thereby improving the heat dissipation efficiency to meet the heat dissipation requirements of high-heat heat sources. In this way, the over-evaporation of the cooling fluid in the composite heat dissipating device can be avoided to cause dry burning, thereby maintaining the service life of the composite heat dissipating device.
[0028] The above description of the present utility model and the following description of the embodiments are used to demonstrate and explain the principle of the present utility model, and to provide a further explanation of the scope of the patent application of the present utility model. Attached Figure Description
[0029] Figure 1 This is a perspective view of the composite heat dissipation device according to the first embodiment of the present invention.
[0030] Figure 2 for Figure 1 An exploded view of the composite heat dissipation device.
[0031] Figure 3 for Figure 1 A cross-sectional schematic diagram of a composite heat dissipation device.
[0032] Figure 4 for Figure 1 A cross-sectional schematic diagram showing the flow of cooling fluid within a composite heat dissipation device.
[0033] Figure 5 This is a perspective view of the composite heat dissipation device according to the second embodiment of the present invention.
[0034] Figure 6 for Figure 5 An exploded view of the composite heat dissipation device.
[0035] Figure 7 for Figure 5 A cross-sectional schematic diagram of a composite heat dissipation device.
[0036] Figure 8 This is a perspective view of the composite heat dissipation device according to the third embodiment of the present invention.
[0037] Figure 9 for Figure 8 An exploded view of the composite heat dissipation device.
[0038] Figure 10 for Figure 8 A cross-sectional schematic diagram of a composite heat dissipation device.
[0039] Figure 11 This is a perspective view of the composite heat dissipation device according to the fourth embodiment of the present invention.
[0040] Figure 12 for Figure 11 An exploded view of the composite heat dissipation device.
[0041] Figure 13 for Figure 11 A cross-sectional schematic diagram of a composite heat dissipation device.
[0042] Figure 14 A perspective view of a composite heat dissipating device according to the fifth embodiment of the present application.
[0043] Figure 15 A perspective view of a composite heat dissipating device according to the fifth embodiment of the present application. Figure 14
[0044] Figure 16 A perspective view of a composite heat dissipating device according to the fifth embodiment of the present application. Figure 15
[0045] Figure 17 A perspective view of a composite heat dissipating device according to the sixth embodiment of the present application.
[0046] Figure 18 A perspective view of a composite heat dissipating device according to the sixth embodiment of the present application. Figure 17
[0047] Figure 19 A perspective view of a composite heat dissipating device according to the sixth embodiment of the present application. Figure 17
[0048] A perspective view of a composite heat dissipating device according to the sixth embodiment of the present application. Figure 20 Figure 17 A perspective view of a composite heat dissipating device according to the sixth embodiment of the present application.
[0049] In the drawings:
[0050] 10, 10A-10E: composite heat dissipating device
[0051] 11, 11A: three-dimensional heat dissipating device
[0052] 111, 111A: uniform temperature plate
[0053] 1111, 1111A: first heat conducting shell
[0054] 11111: bottom plate
[0055] 11112: first convex structure
[0056] 11113: second convex structure
[0057] 1112, 1112A: second heat conducting shell
[0058] 112: uniform temperature heat pipe
[0059] 113: capillary structure
[0060] 12, 12A, 12B, 12D: loop heat dissipater
[0061] 121, 121A-121E: loop heat pipe
[0062] 121B1, 121C1, 121D1: open end
[0063] 121C2: closed end
[0064] 122B, 122D: looped cavity
[0065] 13: main heat conducting column
[0066] 14: sub heat conducting column
[0067] 15: uniform temperature cavity
[0068] 16: heat absorption cavity
[0069] 17: third heat conducting shell
[0070] 18: heat dissipation fin structure
[0071] A ~ V: direction
[0072] H1: heat source
[0073] H2: perforation
[0074] P1: thermal contact surface
[0075] S1: uniform temperature cavity
[0076] S2: looped cavity DETAILED DESCRIPTION
[0077] Please refer to Figures 1 to 3 . Figure 1 is a perspective view of a composite heat dissipation device according to the first embodiment of the present application. Figure 2 is Figure 1 an exploded view of the composite heat dissipation device. Figure 3 is Figure 1 a sectional view of the composite heat dissipation device.
[0078] The composite heat dissipation device 10 of the present embodiment is used to be in thermal contact with a heat source (not shown) and comprises a three-dimensional heat transfer device 11 and a looped heat sink 12. The three-dimensional heat transfer device 11 comprises a uniform temperature plate 111, a plurality of uniform temperature heat pipes 112 and a capillary structure 113.
[0079] The uniform temperature plate 111 comprises a first heat conducting shell 1111 and a second heat conducting shell 1112. The first heat conducting shell 1111 is used to be in thermal contact with the heat source. The second heat conducting shell 1112 is arranged on the first heat conducting shell 1111 so that the second heat conducting shell 1112 and the first heat conducting shell 1111 jointly enclose a uniform temperature cavity S1. The uniform temperature cavity S1 is used to contain a cooling fluid (not shown).
[0080] In detail, the first heat-conductive shell 1111 includes a bottom plate 11111, a first convex structure 11112, and a second convex structure 11113. The first convex structure 11112 protrudes from the bottom plate 11111 in a direction away from the second heat-conductive shell 1112. The second convex structure 11113 has a thermal contact surface P1. The thermal contact surface P1 is in thermal contact with the heat source, so that the heat of the heat source is transferred to the cooling fluid through the thermal contact surface P1. The second convex structure 11113 protrudes from the first convex structure 11112 in a direction away from the second heat-conductive shell 1112.
[0081] The uniform temperature heat pipes 112 are arranged in the second heat-conductive shell 1112 and are in communication with the uniform temperature chamber S1. When the liquid cooling fluid absorbs the heat of the heat source and vaporizes, it will flow from the uniform temperature chamber S1 into the uniform temperature heat pipes 112. The capillary structure 113 is arranged in the uniform temperature plate 111. By arranging the capillary structure 113, the gaseous cooling fluid can release the heat of the heat source and condense, and then flow back to the uniform temperature chamber S1 through the capillary structure 113 from the uniform temperature heat pipes 112.
[0082] The loop heat sink 12 includes a plurality of loop heat pipes 121. The loop heat sink 12 is, for example, a pulse heat sink, and the loop heat pipes 121 are, for example, pulsating heat pipes (PHPs). The so-called pulse heat pipe is composed of a plurality of U-shaped tubes, for example, hollow U-shaped tubes, connected in series, and no capillary structure is arranged in the pulse heat pipe. In this way, the heat sink effect of the heat source can be further improved by the heat siphon effect of the pulse heat pipe, thereby improving the heat dissipation efficiency.
[0083] In the present embodiment, the loop heat sink 12 is a pulse heat sink, and the loop heat pipes 121 are pulse heat pipes, but this is not limiting. In other embodiments, the loop heat sink can also be, for example, a heat siphon heat sink, and the loop heat pipes can also be, for example, heat siphon heat pipes. The so-called heat siphon heat pipe is a whole pipe with a capillary structure. After the liquid cooling fluid is heated, it partially vaporizes to form a gas-liquid mixture, and the liquid cooling fluid and the gaseous cooling fluid are randomly distributed in the pipe of the loop heat pipe by the capillary force of the capillary structure. The density difference between the liquid cooling fluid and the gaseous cooling fluid serves as the driving force for the heat dissipation cycle. In detail, after the liquid cooling fluid is heated, it partially evaporates into gaseous cooling fluid. The gaseous cooling fluid pushes the liquid cooling fluid by its vapor pressure to serve as the driving force for the heat dissipation cycle.
[0084] The opposite ends of the loop heat pipes 121 are respectively in communication with the uniform temperature chamber S1 of the uniform temperature plate 111, so that the cooling fluid can flow in the loop of the uniform temperature plate 111 and the loop heat pipes 121 to perform the heat dissipation cycle for the heat source.
[0085] In the present embodiment, since the composite heat dissipation device 10 is the composite three-dimensional heat transfer device 11 and the loop heat sink 12, the composite heat dissipation device 10 can further dissipate heat from the heat source through the heat siphon effect of the loop heat sink 12, so as to improve the heat dissipation efficiency to meet the heat dissipation requirement of the high heat heat source. In this way, the over-evaporation of the cooling fluid in the composite heat dissipation device 10 can be avoided to cause dry burning, thereby maintaining the service life of the composite heat dissipation device 10.
[0086] In the present embodiment, the composite heat dissipation device 10 can further include a plurality of main heat conducting columns 13 and a plurality of auxiliary heat conducting columns 14. The main heat conducting columns 13 are located in the uniform temperature chamber S1 and correspond to the area within the thermal contact surface P1, and the auxiliary heat conducting columns 14 are located in the uniform temperature chamber S1 and correspond to the area outside the thermal contact surface P1. That is, the temperature of the main heat conducting columns 13 after being heated is greater than the temperature of the auxiliary heat conducting columns 14 after being heated. By arranging the main heat conducting columns 13 and the auxiliary heat conducting columns 14, the efficiency of heat transfer can be further improved. The diameter of the main heat conducting columns 13 is, for example, smaller than the diameter of the auxiliary heat conducting columns 14.
[0087] In the present embodiment, the diameter of the main heat conducting columns 13 is smaller than the diameter of the auxiliary heat conducting columns 14, but it is not limited thereto. In other embodiments, the diameter of the main heat conducting columns can be greater than or equal to the diameter of the auxiliary heat conducting columns.
[0088] Please refer to Figure 4 . Figure 4 For Figure 1 a cross-sectional view of the cooling fluid flowing in the composite heat dissipation device. In the present embodiment, when the heat generated by the heat source H1 is transferred to the liquid cooling fluid located in the uniform temperature chamber S1 through the first heat conducting shell 1111, the liquid cooling fluid will be vaporized and flow into the loop heat pipes 121 and the uniform temperature heat pipes 112 along directions A and B respectively from the uniform temperature chamber S1. Then, the gaseous cooling fluid condenses in the loop heat pipes 121 and the uniform temperature heat pipes 112 and then flows back to the uniform temperature chamber S1 along directions C and D respectively. In this way, the heat dissipation cycle of the cooling fluid to the heat source H1 can be completed.
[0089] Please refer to Figures 5 to 7 . Figure 5 for a three-dimensional view of the composite heat dissipation device according to the second embodiment of the present application. Figure 6 for Figure 5 an exploded view of the composite heat dissipation device. Figure 7 for Figure 5 a cross-sectional view of the composite heat dissipation device.
[0090] The composite heat dissipation device 10A of this embodiment is similar to the composite heat dissipation device 10 of the first embodiment. Therefore, the differences between this embodiment and the first embodiment will be described below, and the similarities will not be repeated. In this embodiment, the composite heat dissipation device 10A includes a three-dimensional heat transfer device 11A and a single-loop radiator 12. The three-dimensional heat transfer device 11A includes a heat spreader 111A and a plurality of heat pipes 112.
[0091] The heat spreader 111A includes a first heat-conducting shell 1111A and a second heat-conducting shell 1112A. The first heat-conducting shell 1111A is used for thermal contact with a heat source. The second heat-conducting shell 1112A is disposed on the first heat-conducting shell 1111A, such that the second heat-conducting shell 1112A and the first heat-conducting shell 1111A together surround a heat spreader chamber S1. The heat spreader chamber S1 is used to contain a first cooling fluid (not shown). These heat spreader heat pipes 112 are disposed on the second heat-conducting shell 1112A and are connected to the heat spreader chamber S1.
[0092] The loop-type radiator 12A includes a loop-type heat pipe 121A. The loop-type heat pipe 121A is, for example, a pulsed heat pipe, but is not limited thereto. In other embodiments, the loop-type heat pipe may also be, for example, a thermosiphon heat pipe. The loop-type heat pipe 121A is used to contain a second cooling fluid (not shown). The freezing point of the first cooling fluid is, for example, greater than the freezing point of the second cooling fluid, and the filling ratio of the first cooling fluid in the temperature-equalizing chamber S1 is, for example, less than the filling ratio of the second cooling fluid in the loop-type heat pipe 121A.
[0093] The junction of the first heat-conducting shell 1111A and the second heat-conducting shell 1112A together forms multiple perforations H2, and these loop-type heat pipes 121A are respectively located in these perforations H2. The loop-type heat pipes 121A are not connected to the heat spreader chamber S1, so that the loop-type heat pipes 121A form a circulation channel and are thermally coupled to the heat spreader plate 111A. In other words, the first cooling fluid and the second cooling fluid will not mix. Thus, the heat dissipation circulation of the first cooling fluid and the heat dissipation circulation of the second cooling fluid will not interfere with each other.
[0094] like Figure 7 As shown. In this embodiment, when the heat generated by the heat source H1 is transferred through the first heat-conducting shell 1111A to the liquid cooling fluid located in the temperature-equalizing chamber S1, the liquid first cooling fluid vaporizes and flows from the temperature-equalizing chamber S1 into the temperature-equalizing heat pipes 112 along direction E. Then, the gaseous first cooling fluid condenses in the temperature-equalizing heat pipes 112 and flows back to the temperature-equalizing chamber S1 along direction F. In addition, the second cooling fluid located in the loop heat pipe 121A vaporizes after being heated near the temperature-equalizing chamber S1 in the loop heat pipe 121A, and condenses in the loop heat pipe 121A away from the temperature-equalizing chamber S1, circulating along directions G and H. In this way, the heat dissipation cycle of the cooling fluid to the heat source H1 is completed.
[0095] Referring to Figures 8 to 10 . Figure 8 A perspective view of a composite heat dissipating device according to a third embodiment of the present application. Figure 9 A perspective view of a composite heat dissipating device according to a third embodiment of the present application. Figure 8 A perspective view of a composite heat dissipating device according to a third embodiment of the present application. Figure 10 A perspective view of a composite heat dissipating device according to a third embodiment of the present application. Figure 8 A perspective view of a composite heat dissipating device according to a third embodiment of the present application.
[0096] The composite heat dissipating device 10B of the present embodiment is similar to the composite heat dissipating device 10 of the first embodiment, and thus the differences between the present embodiment and the first embodiment will be described below, and the same parts will not be described again. In the present embodiment, the composite heat dissipating device 10B includes a three-dimensional heat dissipating device 11 and a loop heat sink 12B. The three-dimensional heat dissipating device 11 includes a vapor chamber 111 and a plurality of uniform heat pipes 112.
[0097] The vapor chamber 111 includes a first heat conducting shell 1111 and a second heat conducting shell 1112. The first heat conducting shell 1111 is used to be in thermal contact with a heat source. The second heat conducting shell 1112 is disposed on the first heat conducting shell 1111, so that the second heat conducting shell 1112 and the first heat conducting shell 1111 jointly surround a uniform chamber S1. The uniform chamber S1 is used to contain a first cooling fluid (not shown). The uniform heat pipes 112 are disposed on the second heat conducting shell 1112 and are in communication with the uniform chamber S1.
[0098] The loop heat sink 12B is used to contain a second cooling fluid (not shown) and includes a loop cavity 122B and a plurality of loop heat pipes 121B. The loop cavity 122B is thermally coupled to the second heat conducting shell 1112. The loop heat pipes 121B are, for example, pulse heat pipes. In which, the freezing point of the first cooling fluid is greater than the freezing point of the second cooling fluid, and the filling ratio of the first cooling fluid in the uniform chamber S1 is less than the filling ratio of the second cooling fluid in the loop heat pipes 121B.
[0099] Each of the loop heat pipes 121B has two open ends 121B1. The two open ends 121B1 are disposed in the loop cavity 122B. That is, the second cooling fluid can circulate and flow in the loop cavity 122B and the loop heat pipes 121B through the two open ends 121B1 to perform a heat dissipation cycle.
[0100] As Figure 10The first cooling fluid vaporizes and flows into the uniform heat pipes 112 along direction I from the uniform chamber S1. Then, the first cooling fluid condenses in the uniform heat pipes 112 and flows back to the uniform chamber S1 along direction J. In addition, the second cooling fluid vaporizes in the loop heat pipes 121B and flows into the loop heat pipes 121B along direction K from the loop chamber 122B. Then, the second cooling fluid condenses in the loop heat pipes 121B and flows back to the loop chamber 122B along direction L. In this way, the heat dissipation cycle of the cooling fluid to the heat source H1 is completed.
[0101] Please refer to Figures 11 to 13 . Figure 11 A perspective view of a composite heat dissipation device according to a fourth embodiment of the present application. Figure 12 A perspective view of Figure 11 a composite heat dissipation device. Figure 13 A cross-sectional view of Figure 11 a composite heat dissipation device.
[0102] The composite heat dissipation device 10C of the present embodiment is similar to the composite heat dissipation device 10 of the first embodiment, and thus the differences between the present embodiment and the first embodiment will be described below, and the same parts will not be described again. In the present embodiment, the composite heat dissipation device 10C includes a first heat-conducting shell 1111, a second heat-conducting shell 1112, a third heat-conducting shell 17, a plurality of loop heat pipes 121C, and a plurality of uniform heat pipes 112.
[0103] The first heat-conducting shell 1111 is in thermal contact with a heat source (not shown). The second heat-conducting shell 1112 is stacked on the first heat-conducting shell 1111 and cooperates with the first heat-conducting shell 1111 to surround a uniform chamber S1. The uniform chamber S1 is used to contain a cooling fluid (not shown). The third heat-conducting shell 17 is stacked on the second heat-conducting shell 1112 and cooperates with the second heat-conducting shell 1112 to surround a loop chamber S2. The loop chamber S2 is used to contain a second cooling fluid (not shown). The loop chamber S2 and the uniform chamber S1 are not in communication. That is, the first cooling fluid and the second cooling fluid do not mix. In this way, the heat dissipation cycle of the first cooling fluid and the heat dissipation cycle of the second cooling fluid do not interfere with each other.
[0104] The loop heat pipes 121C are, for example, pulse-type heat pipes, but are not limited thereto. In other embodiments, the loop heat pipes can also be, for example, thermosyphon heat pipes. The loop heat pipes 121C are, for example, integrally formed in the third heat-conductive shell 17. Each of the loop heat pipes 121C has an open end 121C1 and a closed end 121C2. The open end 121C1 is disposed in and communicates with the loop chamber S2, so that the second cooling fluid circulates in the loop chamber S2. The uniform heat pipes 112 pass through the third heat-conductive shell 17 and the second heat-conductive shell 1112 and communicate with the uniform chamber S1, so that the first cooling fluid circulates in the uniform chamber S1.
[0105] In the present embodiment, the loop heat pipes 121C are integrally formed in the third heat-conductive shell 17, but are not limited thereto. In other embodiments, the loop heat pipes and the third heat-conductive shell can also be, for example, separable individual elements, and the loop heat pipes are disposed in the third heat-conductive shell.
[0106] As shown in Figure 13 , when the heat generated by the heat source H1 is transferred to the liquid cooling fluid in the uniform chamber S1 through the first heat-conductive shell 1111, the liquid first cooling fluid is vaporized and flows into the uniform heat pipes 112 from the uniform chamber S1 in the direction M. Then, the gaseous first cooling fluid condenses in the uniform heat pipes 112 and flows back to the uniform chamber S1 in the direction N. In addition, the liquid second cooling fluid in the loop chamber S2 is vaporized in the loop chamber S2 and flows into the loop heat pipes 121C from the loop chamber S2 in the direction O. Then, the gaseous second cooling fluid condenses in the loop heat pipes 121C and flows back to the loop chamber S2 in the direction P. In this way, the heat dissipation cycle of the cooling fluid to the heat source H1 is completed.
[0107] Please refer to Figures 14 to 16 . Figure 14 It is a perspective view of the composite heat dissipation device according to the fifth embodiment of the present application. Figure 15 It is an exploded view of the composite heat dissipation device according to the fifth embodiment of the present application. Figure 14 It is a cross-sectional view of the composite heat dissipation device according to the fifth embodiment of the present application. Figure 16 It is a cross-sectional view of the composite heat dissipation device according to the fifth embodiment of the present application. Figure 14 It is a cross-sectional view of the composite heat dissipation device according to the fifth embodiment of the present application.
[0108] The composite heat dissipation device 10D of the present embodiment is similar to the composite heat dissipation device 10 of the first embodiment, and therefore the differences between the present embodiment and the first embodiment will be described below, and the same parts will not be described again. In the present embodiment, the composite heat dissipation device 10D comprises a three-dimensional heat transfer device 11, a loop heat sink 12, and a heat dissipation fin structure 18. The three-dimensional heat transfer device 11 comprises a uniform plate 111 and a plurality of uniform heat pipes 112.
[0109] The vapor chamber 111 includes a first heat conductive shell 1111 and a second heat conductive shell 1112. The first heat conductive shell 1111 is used to thermally contact the heat source. The second heat conductive shell 1112 is disposed on the first heat conductive shell 1111, so that the second heat conductive shell 1112 and the first heat conductive shell 1111 jointly enclose a vapor chamber S1. The vapor chamber S1 is used to accommodate a first cooling fluid (not shown). The vapor chamber heat pipes 112 are disposed on the second heat conductive shell 1112 and are in communication with the vapor chamber S1, so that the first cooling fluid circulates in the vapor chamber S1.
[0110] The loop heat sink 12D is used to accommodate a second cooling fluid (not shown) and includes a loop cavity 122D and a plurality of loop heat pipes 121D. The loop cavity 122D is thermally coupled to the second heat conductive shell 1112. The loop cavity 122D is not in communication with the vapor chamber S1. That is, the first cooling fluid and the second cooling fluid do not mix. In this way, the heat dissipation cycle of the first cooling fluid and the heat dissipation cycle of the second cooling fluid do not interfere with each other. In addition, the loop cavity 122D has a through hole 122D1. The second cooling fluid can be injected into the loop cavity 122D through the through hole 122D1.
[0111] For example, the freezing point of the first cooling fluid is greater than the freezing point of the second cooling fluid, and the filling ratio of the first cooling fluid in the vapor chamber S1 is less than the filling ratio of the second cooling fluid in the loop heat pipes 121D. For example, the loop heat pipes 121D are pulse heat pipes, but are not limited thereto. In other embodiments, the loop heat pipes can be, for example, thermosyphon heat pipes. Each of the loop heat pipes 121D has two open ends 121D1. The two open ends 121D1 are disposed in the loop cavity 122D, so that the second cooling fluid circulates in the loop cavity 122D.
[0112] The heat dissipation fin structure 18 is thermally coupled to the vapor chamber heat pipes 112 and the loop heat pipes 121D. In this way, the heat dissipation region formed by the vapor chamber heat pipes 112 and the heat dissipation region formed by the loop heat pipes 121D can be further heat dissipated by the heat dissipation fin structure 18.
[0113] In this embodiment, the heat dissipation fin structure 18 is thermally coupled to the vapor chamber heat pipes 112 and the loop heat pipes 121D, but is not limited thereto. In other embodiments, the heat dissipation fin structure can be thermally coupled to only the vapor chamber heat pipes or only the loop heat pipes.
[0114] As shown in FIG. 1, the heat dissipation fin structure 18 is thermally coupled to the vapor chamber heat pipes 112 and the loop heat pipes 121D. In this way, the heat dissipation region formed by the vapor chamber heat pipes 112 and the heat dissipation region formed by the loop heat pipes 121D can be further heat dissipated by the heat dissipation fin structure 18. Figure 16The first cooling fluid in the uniform temperature chamber S1 is vaporized and flows into the uniform heat pipes 112 in the direction Q. Then, the vaporized first cooling fluid condenses in the uniform heat pipes 112 and flows back to the uniform temperature chamber S1 in the direction R. In addition, the second cooling fluid in the loop heat sink 12D is vaporized and flows into the loop heat pipes 121D in the direction S from the loop cavity 122D. Then, the vaporized second cooling fluid condenses in the loop heat pipes 121D and flows back to the loop cavity 122D in the direction T. In this way, the heat dissipation cycle of the cooling fluid to the heat source H1 is completed.
[0115] Please refer to Figures 17 to 20 . Figure 17 FIG. 6 is a perspective view of a composite heat dissipation device according to a sixth embodiment of the present application. Figure 18 FIG. 7 is an exploded view of the composite heat dissipation device of Figure 17 FIG. 8 is a sectional view of the composite heat dissipation device of Figure 19 FIG. 9 is a sectional view of the composite heat dissipation device of Figure 17 FIG. 10 is a sectional view of the composite heat dissipation device of Figure 20 FIG. 11 is a sectional view of the composite heat dissipation device of Figure 17 FIG. 12 is a sectional view of the composite heat dissipation device of
[0116] The composite heat dissipation device 10E of the present embodiment is similar to the composite heat dissipation device 10 of the first embodiment. Therefore, the differences between the present embodiment and the first embodiment will be described below, and the same parts will not be described again. In the present embodiment, the composite heat dissipation device 10E includes a uniform temperature cavity 15, a heat absorbing cavity 16, and a plurality of loop heat pipes 121E.
[0117] The uniform temperature cavity 15 has a uniform temperature chamber S1. The uniform temperature chamber S1 is used to accommodate a first cooling fluid (not shown). The heat absorbing cavity 16 is thermally coupled to one side of the uniform temperature cavity 15, and the uniform temperature cavity 15 and the heat absorbing cavity 16 are not in communication. The heat absorbing cavity 16 is used to be in thermal contact with a heat source, so that the heat generated by the heat source is transmitted to the uniform temperature cavity 15 through the heat absorbing cavity 16. The loop heat pipes 121E are, for example, pulse heat pipes, but are not limited thereto. In other embodiments, the loop heat pipes can also be, for example, thermosyphon heat pipes. The loop heat pipes 121E are provided in the uniform temperature cavity 15. The loop heat pipes 121E are used to accommodate a second cooling fluid (not shown). The loop heat pipes 121E are not in communication with the uniform temperature chamber S1, so that the loop heat pipes 121E form a circulating flow channel. That is, the first cooling fluid and the second cooling fluid do not flow together. In this way, the heat dissipation cycle of the first cooling fluid and the heat dissipation cycle of the second cooling fluid do not interfere with each other.
[0118] In the embodiment, the heat absorption cavity 16 is thermally coupled to one side of the uniform temperature cavity 15, and the structure design that the uniform temperature cavity 15 and the heat absorption cavity 16 are not communicated can also be applied to the first embodiment to the fifth embodiment.
[0119] As shown in Figure 20 In the embodiment, when the heat generated by the heat source H1 is transmitted to the liquid cooling fluid in the uniform temperature chamber S1 through the heat absorption cavity 16, the liquid cooling fluid is vaporized and flows into the loop heat pipes 121E from the uniform temperature chamber S1 along the direction U. Then, the gaseous cooling fluid is condensed in the loop heat pipes 121E and flows back to the uniform temperature chamber S1 along the direction V. In this way, the heat dissipation cycle of the cooling fluid to the heat source H1 can be completed.
[0120] According to the composite heat dissipation device of the above-mentioned embodiments, since the composite heat dissipation device is a composite three-dimensional heat transfer device and a loop heat sink, the composite heat dissipation device can further dissipate heat from the heat source through the thermosyphon effect of the loop heat sink, so as to improve the heat dissipation efficiency to meet the heat dissipation requirement of the high-heat heat source. In this way, the over-evaporation of the cooling fluid in the composite heat dissipation device can be avoided to cause dry burning, thereby maintaining the service life of the composite heat dissipation device.
[0121] Although the utility model has been disclosed as above through the above-mentioned embodiments, it is not used to limit the utility model, and any person skilled in the related art can make some changes and decorations without departing from the spirit and scope of the utility model, so the patent protection scope of the utility model should be limited by the protection scope of the claims attached to the application.
Claims
1. A composite heat dissipating device, characterized by comprising: The composite heat dissipating device is used to be in thermal contact with a heat source, and comprises: A three-dimensional heat transfer device, comprising: A uniform temperature plate, having a uniform temperature chamber and being used to be in thermal contact with the heat source; and At least one uniform temperature heat pipe, disposed in the uniform temperature plate; and A loop heat sink, thermally coupled to the uniform temperature plate.
2. The composite heat dissipating device according to claim 1, wherein The loop heat sink comprises a loop chamber and at least one loop heat pipe, the loop chamber is thermally coupled to the uniform temperature plate, and the at least one loop heat pipe is disposed in the loop chamber.
3. The composite heat dissipating device according to claim 2, wherein The at least one loop heat pipe has an open end and a closed end, and the open end of the at least one loop heat pipe is disposed in the loop chamber.
4. The composite heat dissipating device according to claim 2, wherein The at least one loop heat pipe has two open ends, and the two open ends of the at least one loop heat pipe are both disposed in the loop chamber.
5. The composite heat dissipating device of claim 1, wherein The uniform temperature plate comprises a first heat conduction shell and a second heat conduction shell, the first heat conduction shell is used to be in thermal contact with the heat source, and the second heat conduction shell is disposed in the first heat conduction shell so that the second heat conduction shell and the first heat conduction shell jointly surround the uniform temperature chamber.
6. The composite heat dissipating device according to claim 5, wherein The loop heat sink comprises at least one loop heat pipe, the at least one loop heat pipe constitutes a circulating flow channel, and is thermally coupled to the uniform temperature plate.
7. The composite heat dissipating device according to claim 6, wherein The junction of the first heat conduction shell and the second heat conduction shell jointly constitutes at least one through hole, and the at least one loop heat pipe is located in the at least one through hole.
8. The composite heat dissipating device of claim 5, wherein The first heat conduction shell comprises a bottom plate, a first convex structure, and the first convex structure is convex from the bottom plate away from the second heat conduction shell.
9. The composite heat dissipating device of claim 8, wherein The first heat conduction shell further comprises a second convex structure, and the second convex structure is convex from the first convex structure away from the second heat conduction shell.
10. The composite heat dissipating device of claim 1, wherein The loop heat sink comprises at least one loop heat pipe, and opposite ends of the at least one loop heat pipe are respectively communicated with the uniform temperature chamber of the uniform temperature plate.
11. The composite heat dissipating device according to claim 2, 6 or 10, wherein The at least one loop heat pipe is a pulse heat pipe or a thermosyphon heat pipe.
12. The composite heat dissipating device of claim 2, wherein Further comprising a heat dissipation fin structure, the heat dissipation fin structure is thermally coupled to the at least one uniform temperature heat pipe.
13. The composite heat dissipating device of claim 12, wherein The heat dissipation fin structure is thermally coupled to the at least one loop heat pipe.
14. The composite heat dissipating device of claim 1, wherein The uniform temperature plate comprises a uniform temperature chamber and a heat absorption chamber, the at least one uniform temperature heat pipe is disposed in the uniform temperature chamber of the uniform temperature plate, and the heat absorption chamber is convex from the uniform temperature chamber.
15. The composite heat dissipating device of claim 1, wherein The loop heat sink is free of capillary structure.
16. The composite heat dissipating device of claim 1, wherein The three-dimensional heat transfer device further comprises a capillary structure, disposed in the uniform temperature plate.
17. The composite heat dissipating device of claim 1, wherein Further comprising at least one main heat conduction column and at least one auxiliary heat conduction column, the uniform temperature plate has a thermal contact surface, the thermal contact surface is in thermal contact with the heat source, the at least one main heat conduction column is located in the uniform temperature chamber and corresponds to an area within the thermal contact surface of the uniform temperature plate, and the at least one auxiliary heat conduction column is located in the uniform temperature chamber and corresponds to an area outside the thermal contact surface of the uniform temperature plate.
18. The composite heat dissipating device of claim 17, wherein The diameter of the at least one main heat conduction column is greater than the diameter of the at least one auxiliary heat conduction column.
19. A hybrid heat spreader, comprising: The composite heat dissipating device is used to be in thermal contact with a heat source, and comprises: A first heat conduction shell, used to be in thermal contact with the heat source; A second heat conduction shell, stacked on the first heat conduction shell and jointly surrounding a uniform temperature chamber with the first heat conduction shell; A third heat conduction shell, stacked on the second heat conduction shell and jointly surrounding a loop chamber with the second heat conduction shell, the loop chamber is not communicated with the uniform temperature chamber; and A fourth heat conduction shell, stacked on the third heat conduction shell and jointly surrounding a loop chamber with the third heat conduction shell, the loop chamber is not communicated with the uniform temperature chamber. A loop heat pipe is disposed in the third heat-conductive shell and is in communication with the loop chamber.
20. The composite heat dissipating device of claim 19, wherein, A uniform heat pipe is disposed in the third heat-conductive shell and the second heat-conductive shell and is in communication with the uniform chamber.
21. A hybrid heat spreader, comprising: The composite heat-dissipating device is in thermal contact with a heat source and comprises: A uniform chamber is provided in the uniform heat-conductive shell. A heat-absorbing chamber is thermally coupled to one side of the uniform heat-conductive shell and is in thermal contact with the heat source. A loop heat pipe is disposed in the uniform heat-conductive shell and is in communication with the uniform chamber.
22. The composite heat dissipating device of claim 21, wherein The at least one loop heat pipe is a pulse heat pipe or a thermosyphon heat pipe.