Printed circuit board and light-emitting module

Abstract

The utility model discloses a printed circuit board, comprising a metal substrate which comprises a first surface and a second surface which are oppositely arranged; the heat-conducting insulating layer is arranged on the first surface of the metal substrate; the auxiliary layer is arranged on one side, far away from the metal substrate, of the heat-conducting insulating layer; and the printed circuit layer is positioned on one side, far away from the heat-conducting insulating layer, of the auxiliary layer, and is connected with the heat-conducting insulating layer through the auxiliary layer. According to the utility model, the auxiliary layer can effectively improve the defect of insufficient voltage withstanding of the heat-conducting insulating layer, and improves the voltage withstanding performance of the PCB. Compared with the prior art, the PCB provided by the utility model is not easy to have the problems of breakdown and short circuit in a high-voltage environment, so that the electrical performance of the PCB is improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of circuit board especially relates to a printed circuit board and light emitting module. BACKGROUND

[0002] In the field of electronic circuit manufacturing, printed circuit board (PCB) is an important electronic component, which provides mechanical support and signal transmission function for the circuit, and becomes an indispensable part of modern electronic equipment. The manufacturing process of PCB includes multiple steps, one of which is the formation of metal layer. The traditional aluminum substrate PCB process is to use the bonding method of heat-conducting insulation layer and copper layer, which can realize good electrical conductivity and thermal conductivity. However, with the development of electronic equipment towards high density, high speed and high power, the performance requirements of PCB are also getting higher and higher, and the traditional process method has been difficult to meet the demand.

[0003] The existing technical solution is to improve the bonding method of heat-conducting insulation layer and copper layer to improve the performance of PCB. One method is to use high temperature and high pressure lamination to make the heat-conducting insulation layer and copper layer tightly combined, so as to improve the adhesion and pressure resistance. However, this process requires expensive equipment and complex process flow, low production efficiency and high cost.

[0004] Although the existing technology improves the performance of PCB to some extent, there are still some problems and shortcomings. First, although the high temperature and high pressure lamination method can improve the adhesion and pressure resistance, it needs expensive equipment and complex process flow, low production efficiency and high cost, which is difficult to meet the needs of large-scale production. Secondly, the existing technology has poor bonding effect between the heat-conducting insulation layer and the copper layer, which is easy to cause delamination and delamination, affecting the reliability and service life of the PCB. In addition, the existing technology also has some shortcomings in the pressure resistance of the heat-conducting insulation layer, which is easy to cause breakdown and short circuit, affecting the electrical performance of the PCB.

[0005] Therefore, it is necessary to provide a new printed circuit board to solve the technical problems existing in the prior art. Utility model content

[0006] Therefore, it is necessary to provide a new printed circuit board to solve the technical problems existing in the prior art.

[0007] One of the technical solutions of the utility model is:

[0008] A printed circuit board, comprising:

[0009] A metal substrate, the metal substrate comprising a first surface and a second surface arranged opposite to each other;

[0010] A thermally conductive insulating layer is provided on a first surface of the metal substrate;

[0011] An auxiliary layer is provided on a side of the thermally conductive insulating layer away from the metal substrate;

[0012] A printed circuit layer is provided on a side of the auxiliary layer away from the thermally conductive insulating layer, and is connected to the thermally conductive insulating layer through the auxiliary layer.

[0013] As a further improvement of the utility model, the printed circuit layer comprises a polymer layer and a conductive circuit, the polymer layer is provided with a groove, and the conductive circuit is located in the groove.

[0014] As a further improvement of the utility model, the groove penetrates through the polymer layer, and the thickness of the conductive circuit is less than, equal to, or greater than the depth of the groove.

[0015] As a further improvement of the utility model, the groove comprises a top, a bottom, and two side walls, and the width of the top of the groove is not greater than the width of the bottom of the groove.

[0016] As a further improvement of the utility model, the two side walls of the groove are linear, or at least one of the two side walls of the groove is arc-shaped.

[0017] As a further improvement of the utility model, the side wall of the groove and the surface of the polymer layer facing the auxiliary layer form a chamfer at the intersection.

[0018] As a further improvement of the utility model, the conductive circuit comprises a first conductive circuit and a second conductive circuit, and the thickness of the first conductive circuit is greater than the thickness of the second conductive circuit.

[0019] As a further improvement of the utility model, the surface of the conductive circuit facing the auxiliary layer is arc-shaped, and the other surface of the conductive circuit is planar.

[0020] As a further improvement of the utility model, the material of the conductive circuit is one of silver, copper, gold, and nickel.

[0021] The utility model further discloses a light-emitting module, which comprises the printed circuit board in any of the above claims.

[0022] The utility model has the advantages of:

[0023] 1. Improve the voltage withstand performance: the auxiliary layer of the utility model can effectively improve the defect of insufficient voltage withstand of the heat-conducting insulation layer, improve the voltage withstand performance of the PCB. Compared with the prior art, the PCB of the utility model is not prone to breakdown and short circuit under high voltage environment, thereby improving the electrical performance of the PCB;

[0024] 2. Improve production efficiency: the PCB process of the utility model does not need to pass through the high-temperature and high-pressure laminating machine, can directly use the auxiliary layer to bond the copper foil, simplifies the process flow, improves the production efficiency; compared with the prior art, the PCB process of the utility model is simpler and more economical, suitable for mass production, reduces the production cost;

[0025] 3. Environmental protection and energy saving: the PCB process of the utility model does not need expensive equipment and complex process flow, reduces energy consumption and environmental pollution, has good environmental protection benefit; compared with the prior art, the PCB process of the utility model is more environmentally friendly and energy-saving, meets the requirements of modern society for green manufacturing. BRIEF DESCRIPTION OF DRAWINGS

[0026] Figure 1 It is a printed circuit board cross section structure schematic view of the utility model.

[0027] Figure 2 It is another printed circuit board cross section structure schematic view of the utility model.

[0028] Figure 3 It is another printed circuit board cross section structure schematic view of the utility model.

[0029] Figure 4 It is another printed circuit board cross section structure schematic view of the utility model.

[0030] Figure 5 It is another printed circuit board cross section structure schematic view of the utility model.

[0031] Figure 6 It is another printed circuit board cross section structure schematic view of the utility model.

[0032] Figure 7 It is another printed circuit board cross section structure schematic view of the utility model. DETAILED DESCRIPTION

[0033] In order to facilitate understanding of the utility model, the utility model will be described more fully below with reference to the relevant drawings. The preferred embodiments of the utility model are shown in the drawings. However, the utility model can be realized in many different forms, and is not limited to the embodiments described below. On the contrary, the purpose of providing these embodiments is to make the disclosure of the utility model more thorough and comprehensive.

[0034] It is to be understood that when an element is referred to as being "on" another element, it can be directly on the other element or intervening elements can also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements can also be present. As used herein the terms "vertical", "horizontal", "left", "right" and similar expressions are used for explanation purposes only and do not indicate the only implementation.

[0035] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used in the description of the application herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. As used herein, the term "and / or" includes any and all combinations of one or more of the associated listed items.

[0036] A printed circuit board can be applied to MiniLED display, lighting system, electronic device, etc., characterized in that the printed circuit board comprises:

[0037] A metal substrate comprising a first surface and a second surface arranged opposite to each other; the metal substrate can be an aluminum substrate, so that the printed circuit board has a certain supporting property; before the printed circuit is prepared, the aluminum substrate needs to be cleaned and polished to make the surface of the aluminum substrate suitable for the preparation of the printed circuit; of course, the metal substrate can also be a metal material of other materials, and different metal substrate materials can be used according to different use fields;

[0038] A thermally conductive insulating layer is arranged on the first surface of the metal substrate; the thermally conductive insulating layer is mainly composed of organic material, because the bearing substrate is a metal material, the metal substrate and the printed circuit layer need to be insulated, and also need to have thermal conductivity;

[0039] An auxiliary layer is arranged on the side of the thermally conductive insulating layer away from the metal substrate; the auxiliary layer is located between the thermally conductive insulating layer and the printed circuit layer, and the auxiliary layer has a certain thickness, which can well increase the voltage resistance; the auxiliary layer can be selected from a polymer having a certain elasticity, and preferably a material having insulating properties;

[0040] A printed circuit layer is located on the side of the auxiliary layer far from the heat-conducting insulating layer and is connected with the heat-conducting insulating layer through the auxiliary layer, wherein the printed circuit layer comprises a polymer layer and a conductive circuit, the surface of the polymer layer is provided with a groove, and the conductive circuit is located in the groove; the polymer layer can be a thermoplastic material or a light-cured material; the groove on the surface of the polymer layer can be formed by means of embossing or etching, and then a conductive material is arranged in the groove to form the conductive circuit after curing, and the conductive material can be one of silver, copper, gold and nickel or a mixture of two or more of the above materials.

[0041] According to a further improved technical scheme of the utility model, the groove penetrates the polymer layer, and the thickness of the conductive circuit is smaller than, equal to or greater than the depth of the groove.

[0042] According to a further improved technical scheme of the utility model, the groove comprises a top, a bottom and two side walls, and the width of the top of the groove is not greater than the width of the bottom of the groove; at this time, the cross section of the groove is similar to a trapezoid, and the opening is small and the bottom is large; according to a further improved technical scheme of the utility model, the two side walls of the groove are linear, and according to a further improved technical scheme, at least one of the two side walls of the groove is arc-shaped.

[0043] According to a further improved technical scheme of the utility model, the side wall of the groove and the surface of the polymer layer facing the auxiliary layer form a chamfer at the intersection; that is, the edge of the bottom of the groove and the surface of the polymer layer facing the auxiliary layer form a circular chamfer; in this way, when the printed circuit layer is prepared and stacked with the auxiliary layer, the light will not change sharply at the corner, and when the thickness of the conductive circuit is smaller than the depth of the groove, the existence of bubbles can be reduced, which is more conducive to the discharge of gas.

[0044] According to a further improved technical scheme of the utility model, the conductive circuit comprises a first conductive circuit and a second conductive circuit, and the thickness of the first conductive circuit is greater than the thickness of the second conductive circuit; that is, the thickness of the conductive circuit in different regions is not the same, and the width of the conductive circuit in different regions can also be different; according to a further improved technical scheme of the utility model, the surface of the conductive circuit facing the auxiliary layer is arc-shaped, and the other surface of the conductive circuit is planar.

[0045] The utility model also discloses a light-emitting module, and the light-emitting module comprises the printed circuit board.

[0046] Please refer to Figure 1A printed circuit board, comprising an aluminum substrate 10, a heat-conducting insulating layer 20, an auxiliary layer 30 and a printed circuit layer, the aluminum substrate 10 comprising a first surface and a second surface arranged oppositely, the heat-conducting insulating layer 20, the auxiliary layer 30 and the printed circuit layer being stacked on the first surface of the aluminum substrate 10 in sequence, the printed circuit layer comprising a polymer layer 40 and a conductive circuit 50, the polymer layer 40 being provided with a groove on a side surface away from the auxiliary layer 30, and the conductive circuit 50 being located in the groove, the conductive circuit 50 being in a regular grid or a random grid, or being a plurality of lines, and the material of the conductive circuit 50 being gold, silver, copper, nickel or the like, wherein the thickness of the conductive circuit 50 is equal to the depth of the groove.

[0047] Please refer to Figure 2 , another printed circuit board, the printed circuit layer comprising a polymer layer 40 and a conductive circuit 51, the polymer layer 40 being provided with a groove on a side surface away from the auxiliary layer 30, the conductive circuit 51 being located in the groove, the groove penetrating through the polymer layer 40, and the thickness of the conductive circuit 51 being equal to the depth of the groove, at this time, the conductive circuit 51 directly contacts the auxiliary layer 30, so the material of the auxiliary layer 30 is preferably an insulating material, and the auxiliary layer 30 can also have certain adhesive properties.

[0048] Please refer to Figure 3 , Figure 4 and Figure 5 , a printed circuit board, the printed circuit layer comprising a polymer layer 40 and a conductive circuit 52, the polymer layer 40 being provided with a groove on a side surface away from the auxiliary layer 30, the conductive circuit 52 being located in the groove, the groove comprising a top, a bottom and two side walls, the width of the top of the groove being not greater than the width of the bottom of the groove; please refer to Figure 4 , the height of the conductive circuit 53 being less than the depth of the groove, Figure 4 , the groove in the same trapezoidal shape, the two side walls being linear, so that part of the material of the auxiliary layer 30 fills into the groove; please refer to Figure 5 , the conductive circuit 54 comprising a first conductive circuit and a second conductive circuit, as can be seen from the figure, the thickness of the first conductive circuit and the second conductive circuit is different, of course, the width of the conductive circuit in different areas can also be different; as can be seen from Figure 4 and Figure 5 , the top of the conductive circuit 53, 54 is planar, and the bottom is arc-shaped.

[0049] Please refer to Figure 6A printed circuit layer, the printed circuit layer comprises a polymer layer 40 and a conductive circuit 55, the polymer layer 40 is provided with a groove away from the side surface of the auxiliary layer 30, the conductive circuit 55 is located in the groove, the groove comprises a top, a bottom and two side walls, the side wall is arc-shaped, the thickness of the conductive circuit 55 is greater than the depth of the groove, the conductive circuit 55 has been embedded into the auxiliary layer 30, but the height of the conductive circuit 55 embedded into the auxiliary layer 30 cannot be greater than one third of the thickness of the auxiliary layer 30.

[0050] Please refer to Figure 7 The printed circuit layer comprises a polymer layer 40 and a conductive circuit 56, the polymer layer 40 is provided with a groove away from the side surface of the auxiliary layer 30, the conductive circuit 56 is located in the groove, the groove comprises a top, a bottom and two side walls, the intersection of the groove side wall and the surface of the polymer layer 40 towards the auxiliary layer 30 forms a chamfer 41, the chamfer 41 is circular arc-shaped, the setting mode of the chamfer 41 better improves the yield of preparation.

[0051] In order to make the above-mentioned purpose, features and advantages of the present application more obvious and easy to understand, the specific embodiments of the present application are described in detail above in combination with the drawings. In the above description, many specific details are set forth in order to fully understand the present application. However, the present application can be implemented in many other ways different from the above description, and those skilled in the art can make similar improvements without departing from the concept of the present application, therefore the present application is not limited by the above disclosed specific embodiments. Moreover, each technical feature of the above described embodiments can be combined arbitrarily, in order to make the description concise, each technical feature in the above described embodiments is not described in all possible combinations, however, as long as the combination of these technical features does not exist contradictory, it should be considered as the scope of the present application.

[0052] The above described embodiments only express several implementation ways of the present application, the description is more specific and detailed, but it should not be understood as the limitation of the patent scope of the present application. It should be pointed out that for those skilled in the art, without departing from the concept of the present application, several modifications and improvements can be made, which all belong to the protection scope of the present application. Therefore, the protection scope of the present application patent should be subject to the appended claims.

Claims

1. A printed circuit board, characterized by, The application relates to a printed circuit board, comprising: a metal substrate, which comprises a first surface and a second surface arranged oppositely; a heat-conducting insulation layer arranged on the first surface of the metal substrate; an auxiliary layer arranged on the side of the heat-conducting insulation layer away from the metal substrate; and a printed circuit layer arranged on the side of the auxiliary layer away from the heat-conducting insulation layer and connected to the heat-conducting insulation layer through the auxiliary layer. The printed circuit layer comprises a polymer layer and a conductive circuit, wherein the surface of the polymer layer is provided with a groove, and the conductive circuit is arranged in the groove. The groove penetrates through the polymer layer, and the thickness of the conductive circuit is smaller than, equal to or greater than the depth of the groove. The groove comprises a top, a bottom and two side walls, and the width of the top of the groove is not greater than the width of the bottom of the groove. The two side walls of the groove are linear, or at least one of the two side walls of the groove is arc-shaped.

2. A printed circuit board according to claim 1, characterized in that The side wall of the groove intersects with the surface of the polymer layer towards the auxiliary layer to form a chamfer.

3. A printed circuit board as claimed in claim 2, characterized in that The conductive circuit comprises a first conductive circuit and a second conductive circuit, and the thickness of the first conductive circuit is greater than that of the second conductive circuit.

4. A printed circuit board as claimed in claim 2, characterized in that The surface of the conductive circuit towards the auxiliary layer is arc-shaped, and the other surface of the conductive circuit is planar.

5. A printed circuit board as claimed in claim 4, characterized in that The material of the conductive circuit is one of silver, copper, gold and nickel.

6. A printed circuit board as claimed in claim 4, characterized in that The light-emitting module comprises the printed circuit board according to any one of claims 1-9.

7. A printed circuit board as claimed in claim 2, wherein, ​ 8. A printed circuit board as claimed in claim 2, characterized in that ​ 9. A printed circuit board as claimed in claim 2, wherein, ​ 10. A light emitting module, characterized in that ​

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