Heat dissipation structure and high-frequency switching power supply with same

Abstract

The utility model relates to the technical field of power supply heat dissipation, and discloses a heat dissipation structure and a high-frequency switching power supply with the heat dissipation structure. The heat dissipation air duct is arranged in the shell; the heat dissipation piece is arranged in the heat dissipation air channel; and the heat dissipation fan is arranged at the air outlet end of the heat dissipation air duct. According to the heat dissipation structure provided by the utility model, the integrated area of the electronic component is relatively isolated from the air channel for heat dissipation air cooling, so that when the heat dissipation fan inputs airflow into the air channel, a large amount of impurities such as external dust and acid gas are effectively prevented from entering the electronic component area, the corrosion and dust gathering risks are reduced, and the stability and the service life of the electronic component are guaranteed; meanwhile, the directional guide of the air duct enables the air flow to flow orderly, heat exchange is carried out more fully and efficiently, the heat dissipation effect is guaranteed, the reasonable temperature in the power supply is maintained, sensitive components are prevented from losing efficacy due to high temperature, and the working reliability of the switching power supply is improved.

Description

Technical Field

[0001] This utility model relates to the field of power supply heat dissipation technology, specifically to a heat dissipation structure and a high-frequency switching power supply having the same. Background Technology

[0002] The core function of a high-frequency switching power supply is to convert alternating current (AC) to direct current (DC). Its workflow involves first rectifying and filtering the common AC mains power to convert it into DC voltage. This DC voltage then enters a high-frequency inverter circuit, where it is converted into a high-frequency AC signal. Today, high-frequency switching power supplies are widely used in various electronic devices, and their power density continues to rise. In the design of switching power supplies, heat dissipation design is crucial, as it is key to ensuring their reliability. If the internal temperature of the switching power supply rises too high, temperature-sensitive semiconductor devices, electrolytic capacitors, and other components are prone to failure, and the failure rate increases exponentially when the temperature exceeds a certain value.

[0003] In existing technologies, most switching power supplies employ air cooling, which involves placing a fan inside or outside the high-frequency switching power supply and relying on the fan's rotation to generate airflow. This airflow can carry away heat from the heat-generating components and the surface of the heat sink, thereby accelerating the heat exchange process. However, this air cooling method has drawbacks. Under the action of air cooling circulation, external dust and acidic gases can freely enter the power supply, accelerating the corrosion of internal components and the accumulation of dust. Utility Model Content

[0004] In view of this, the present invention provides a heat dissipation structure and a high-frequency switching power supply having the same, in order to solve the problems of easy corrosion of internal components and easy accumulation of dust under air cooling.

[0005] In a first aspect, this utility model provides a heat dissipation structure, comprising:

[0006] case;

[0007] A heat dissipation duct is disposed inside the housing, and the air outlet and air inlet of the heat dissipation duct are respectively connected to the housing wall;

[0008] A heat sink is disposed in the heat dissipation duct, one end face of the heat sink is exposed in the heat dissipation duct and is suitable for mounting electronic devices, and the end face and the heat dissipation duct form a relatively enclosed space.

[0009] A cooling fan is disposed at the air outlet of the cooling duct, and the cooling fan is adapted to deliver airflow to the cooling duct.

[0010] Optionally, it also includes:

[0011] Multiple partitions are disposed inside the housing and surround the outer periphery of the heat sink, and the multiple partitions overlap with the heat sink to form the heat dissipation air duct.

[0012] Optionally, the partition is a corrosion-resistant partition.

[0013] Optionally, the air outlet of the heat dissipation duct is located on the side of the housing.

[0014] Optionally, the air inlet of the heat dissipation duct is located on the bottom surface of the housing.

[0015] Optionally, the heat sink is a fin, and the heat dissipation surface of the fin is placed in the heat dissipation duct.

[0016] Beneficial effects

[0017] The heat dissipation structure provided by this utility model includes a housing; a heat dissipation duct disposed inside the housing, with its outlet and inlet ends connected to the housing wall; a heat sink disposed within the heat dissipation duct, one end of which is exposed to the duct for mounting electronic components, and this end face forms a relatively enclosed space with the duct; and a cooling fan disposed at the outlet end of the duct, adapted to deliver airflow into the duct. By relatively isolating the integrated area of ​​the electronic components from the cooling duct, when the cooling fan inputs airflow into the duct, it effectively prevents a large amount of external dust, acid gas, and other impurities from entering the electronic component area, reducing the risk of corrosion and dust accumulation, ensuring the stability and lifespan of the electronic components. Simultaneously, the directional guidance of the duct allows for orderly airflow, enabling more thorough and efficient heat exchange, ensuring heat dissipation, maintaining a reasonable internal temperature of the power supply, preventing sensitive components from failing due to high temperatures, and improving the reliability of the switching power supply.

[0018] Secondly, this utility model provides a high-frequency switching power supply, comprising:

[0019] The heat dissipation structure described above;

[0020] Electronic components are disposed on the side of the heat sink exposed in the heat dissipation duct.

[0021] Optionally, it also includes:

[0022] A handle is provided on the housing.

[0023] Optionally, it also includes:

[0024] Three display meters are mounted on the housing, and the three display meters are adapted to display the voltage, current and preset value of the high-frequency switching power supply. Attached Figure Description

[0025] To more clearly illustrate the specific embodiments of this utility model or the technical solutions in the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this utility model. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0026] Figure 1 This is an internal structural diagram of a high-frequency switching power supply according to an embodiment of the present invention;

[0027] Figure 2 This is a side view of a high-frequency switching power supply according to an embodiment of the present invention;

[0028] Figure 3 This is an exploded structural diagram of the heat dissipation duct according to an embodiment of the present utility model;

[0029] Figure 4 This is a schematic diagram of the heat dissipation duct structure according to an embodiment of the present utility model;

[0030] Explanation of reference numerals in the attached figures:

[0031] 1. Housing; 2. Heat dissipation duct; 3. Heat sink; 4. Cooling fan; 5. Partition; 6. Electronic components; 7. Handle; 8. Three-display head. Detailed Implementation

[0032] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of this utility model.

[0033] The following is combined Figures 1 to 4 The following describes embodiments of the present invention.

[0034] According to an embodiment of the present invention, a heat dissipation structure is provided, comprising:

[0035] Casing 1;

[0036] The heat dissipation duct 2 is located inside the housing 1, and the air outlet and air inlet of the heat dissipation duct 2 are respectively connected to the housing wall of the housing 1.

[0037] Heat sink 3 is disposed in heat dissipation duct 2. One end face of heat sink 3 is exposed outside heat dissipation duct 2 and is suitable for mounting electronic device 6. The end face and heat dissipation duct 2 form a relatively closed space.

[0038] Cooling fan 4 is located at the air outlet of cooling duct 2 and is adapted to deliver airflow to cooling duct 2.

[0039] Specifically, housing 1 is the housing of the entire high-frequency switching power supply, and its structural design takes into account the compatibility of the internal heat dissipation duct 2 with the layout of other components. In terms of shape, it is optimized based on the direction of the heat dissipation duct 2 and the installation position of the cooling fan 4 to ensure the rational layout of other electronic components 6 within housing 1. At the same time, the material selection for housing 1 balances strength and thermal conductivity requirements. On the one hand, sufficient strength can withstand possible external mechanical impacts, protecting the delicate internal heat dissipation structure and electronic components 6; on the other hand, appropriate thermal conductivity helps to further dissipate the heat transferred from the heat sink 3 to the surface of housing 1 into the surrounding environment, forming a multi-path heat dissipation mode, enhancing the overall heat dissipation performance of the high-frequency switching power supply, enabling it to operate stably under different operating loads and environmental conditions, extending the service life of the equipment and improving reliability.

[0040] It is easy to understand that the heat sink 3 is located in the middle of the housing 1, which facilitates the formation of a reasonable heat conduction path with the surrounding electronic components 6. The heat generated by the electronic components 6 can be transferred to the heat sink 3 more efficiently and then carried away by the airflow. Moreover, the heat sink 3 in the middle of the housing 1 can serve as a core hub for heat concentration and dissipation, avoiding local overheating or uneven heat dissipation caused by the offset position of the heat sink 3 or its proximity to the edge of the housing 1.

[0041] It should be noted that the cooling fan 4 can input or output airflow into the cooling duct 2. Specifically, in this embodiment, the cooling fan 4 is an exhaust fan, which operates with lower noise, reducing the impact on surrounding personnel and other acoustically sensitive equipment. In other embodiments, the cooling fan 4 can also be a blower fan, which can directly blow cool air onto the heat sink, rapidly cooling a local area and alleviating heat accumulation, but it has the disadvantage of higher noise. Compared with an exhaust fan, each has its advantages and disadvantages in different aspects, and the choice can be made flexibly according to the specific power supply design requirements and the usage environment in actual production.

[0042] Specifically, in this embodiment, a single cooling fan 4 is used, which can meet the basic heat dissipation requirements. Of course, in other alternative embodiments, two, three, or more cooling fans 4 can also be used. Using multiple cooling fans 4 can significantly enhance the heat dissipation capacity. In high-power applications, such as large high-frequency switching power supply systems, electronic devices 6 generate a large amount of heat, and multiple cooling fans 4 can provide a greater airflow.

[0043] The heat dissipation structure provided by this utility model isolates the integrated area of ​​electronic components from the heat dissipation and cooling air duct. When the cooling fan 4 delivers airflow to the air duct, it effectively prevents a large amount of external dust, acid gas and other impurities from entering the area of ​​electronic device 6, reducing the risk of corrosion and dust accumulation, ensuring the stability and lifespan of electronic device 6. At the same time, the directional guidance of the air duct allows the airflow to flow in an orderly manner, enabling more thorough and efficient heat exchange, ensuring the heat dissipation effect, maintaining a reasonable internal temperature of the power supply, preventing sensitive components from failing due to high temperature, and improving the reliability of the switching power supply.

[0044] Furthermore, it also includes:

[0045] Multiple partitions 5 are disposed inside the housing 1 and surround the outer periphery of the heat sink 3. The multiple partitions 5 overlap with the heat sink 3 to form a heat dissipation air duct 2.

[0046] It should be noted that the heat dissipation duct 2 constructed by the partition 5 allows for the planning of the duct's shape, size, and direction according to heat dissipation requirements. This ensures that the heat dissipation duct 2 is compatible with the layout of the heat sink 3 and electronic components 6, thereby optimizing the heat transfer path and improving heat dissipation efficiency. Secondly, the heat dissipation duct 2 structure formed by the overlap of the partition 5 and the heat sink 3 is relatively stable. It can maintain the integrity of the duct under different working environments and vibration conditions, ensuring stable airflow within the duct and preventing problems such as duct deformation or airflow short circuits due to external interference. This guarantees the reliability and continuity of heat dissipation, helps maintain the stable operation of the entire heat dissipation structure, extends its service life, and improves overall performance. Appropriate openings are provided at necessary locations on the partition to allow airflow in.

[0047] In an optional embodiment, a one-piece molded structure can be used instead of the partition 5 overlapping with the heat sink 3 to form the heat dissipation duct 2. For example, the heat sink 3 with a built-in duct structure can be achieved using special mold molding processes or 3D printing technology. Its advantages include reducing the number of parts, lowering assembly complexity and cost, reducing overlapping sealing and connection problems, and improving overall stability and reliability. However, the one-piece design lacks flexibility; once the duct structure is determined, it is difficult to modify; it requires high-level manufacturing processes and equipment; and it involves significant initial investment.

[0048] Furthermore, partition 5 is a corrosion-resistant partition.

[0049] It is easy to understand that, since the switching power supply environment may contain corrosive substances, corrosion-resistant partitions can resist erosion and maintain structural and performance stability. They can maintain the normal operation of the heat dissipation duct 2, ensuring smooth airflow and heat dissipation, avoiding heat dissipation structure failure or frequent maintenance due to corrosion, and extending service life. Of course, in other embodiments, polypropylene or metal materials can be selected as the partition material depending on the placement of the equipment.

[0050] Furthermore, the air outlet of the heat dissipation duct 2 is located on the side of the housing 1.

[0051] It is easy to understand that by placing the air outlet of the heat dissipation duct 2 on the side of the housing 1, the airflow can be guided to be output evenly, reducing the phenomenon of turbulence and stagnation, so that all parts of the heat dissipation component 3 can be fully scoured by the airflow, improving the heat dissipation efficiency and uniformity, stabilizing the internal temperature, and ensuring the reliable operation of the equipment.

[0052] Furthermore, the air inlet of the heat dissipation duct 2 is located on the bottom surface of the housing 1.

[0053] In a straightforward manner, placing the air inlet of the cooling duct 2 on the bottom surface of the housing 1 allows cold air to enter from the bottom. Due to the rising properties of hot air, this creates a stronger negative pressure within the cooling duct 2, accelerating the flow of cold air from the outlet, enhancing air convection, and improving heat dissipation efficiency. Furthermore, bottom-mounted air outlets prevent hot air from being directly discharged into surrounding equipment or the operator's work area, reducing the thermal impact and potential interference on the external environment. Of course, the positions of the air outlet and inlet of the cooling duct can be interchanged or arranged relative to each other; no specific restrictions are imposed here.

[0054] Furthermore, the heat sink 3 is a finned component, and the heat dissipation surface of the finned component is placed in the heat dissipation duct 2.

[0055] It should be noted that by using fins as heat sink 3 and placing their heat dissipation surface in the heat dissipation duct 2, the fins can significantly increase the contact area with the airflow. When the airflow flows in the heat dissipation duct 2, more heat can be transferred from the surface of the fins to the interior, greatly improving the heat exchange efficiency. This allows the heat generated by the electronic device 6 to be dissipated quickly, effectively reducing the operating temperature of the electronic device 6, enhancing the heat dissipation performance of the switching power supply, ensuring its stability and reliability under high load operation, reducing the risk of component damage due to overheating, and extending the service life of the switching power supply.

[0056] According to an embodiment of the present invention, another aspect provides a high-frequency switching power supply, comprising:

[0057] The heat dissipation structure described above;

[0058] Electronic device 6 is disposed on one side of heat sink 3 exposed to heat dissipation duct 2.

[0059] Specifically, electronic components 6 include rectifier tubes and current-conducting tubes. The rectifier tubes convert alternating current to direct current. They generate heat during operation and are attached to the heat sink 3 to transfer heat to the heat sink 3, where it is dissipated by airflow through the cooling duct 2. The current-conducting tubes guide the current along a predetermined path. Due to their high resistance, they also generate heat; their close proximity to the heat sink 3 prevents performance degradation due to heat loss. With these heat dissipation measures in place, these electronic components 6 improve efficiency, reliability, and lifespan, ensure stable power conversion, reduce the probability of thermal failures, maintenance costs, and downtime, and increase the system's economy and practicality.

[0060] Furthermore, it also includes:

[0061] Handle 7 is provided on housing 1.

[0062] It is easy to understand that the installation of handle 7 makes it convenient to move.

[0063] Furthermore, it also includes:

[0064] The three-display meter 8 is mounted on the housing 1 and is suitable for displaying the voltage, current and preset values ​​of the high-frequency switching power supply.

[0065] As is easily understood, the three-display meter 8 is mounted on the housing 1, which can intuitively display the voltage, current, and preset values ​​of the high-frequency switching power supply, bringing great convenience to the user. Users can quickly and accurately know the key operating parameters of the power supply without relying on additional complex testing equipment, thus promptly determining whether the power supply is operating normally.

[0066] Although embodiments of the present invention have been described in conjunction with the accompanying drawings, those skilled in the art can make various modifications and variations without departing from the spirit and scope of the present invention, and such modifications and variations all fall within the scope defined by the appended claims.

Claims

1. A heat dissipating structure, characterized by comprising: The application relates to a heat dissipation structure. The application relates to a heat dissipation structure. The application relates to a heat dissipation structure. The application relates to a heat dissipation structure. The application relates to a heat dissipation structure.

2. The heat dissipating structure according to claim 1, wherein The application relates to a heat dissipation structure. The application relates to a heat dissipation structure.

3. The heat dissipating structure according to claim 2, wherein The application relates to a heat dissipation structure.

4. The heat dissipating structure according to any one of claims 1 to 3, characterized in that, The application relates to a heat dissipation structure.

5. The heat dissipating structure according to claim 4, wherein The application relates to a heat dissipation structure.

6. The heat dissipating structure according to any one of claims 1 to 3, wherein The application relates to a heat dissipation structure.

7. A high frequency switching power supply, characterized by comprising: The application relates to a heat dissipation structure. The application relates to a heat dissipation structure. The application relates to a heat dissipation structure.

8. The high frequency switching power supply of claim 7, wherein, The application relates to a heat dissipation structure. The application relates to a heat dissipation structure.

9. The high frequency switching power supply of claim 8, wherein, The application relates to a heat dissipation structure. The application relates to a heat dissipation structure. The application relates to a heat dissipation structure. The application relates to a heat dissipation structure. The application relates to a heat dissipation structure. The application relates to a heat dissipation structure. The application relates to a heat dissipation structure. The application relates to a heat dissipation structure. The application relates to a heat dissipation structure. The application relates to a heat dissipation structure. The application relates to a heat dissipation structure. The application relates to a heat dissipation structure. The application relates to a heat dissipation structure. The application relates to a heat dissipation structure. The application relates to a heat dissipation structure. The application relates to a heat dissipation structure. The application relates to a heat dissipation structure. The application relates to a heat dissipation structure. The application relates to a heat dissipation structure. The application relates to a heat dissipation structure. The application relates to a heat dissipation structure. The application relates to a heat dissipation structure. The application relates to a heat dissipation structure. The application relates to a heat dissipation structure. The application relates to a heat dissipation structure. The application relates to a heat dissipation structure. The application relates to a heat dissipation structure. The application relates to a heat dissipation structure. The application relates to a heat dissipation structure. The application relates to a heat dissipation structure. The application relates to a heat dissipation structure. The application relates to a heat dissipation structure. The application relates to a heat dissipation structure. The application relates to a heat dissipation structure. The application relates to a heat dissipation structure. The application relates to a heat dissipation structure. The application relates to a heat dissipation structure. The application relates to a heat dissipation structure. The application relates to a heat dissipation structure. The application relates to a heat dissipation structure. The application relates to a heat dissipation structure. The application relates to a heat dissipation structure. The application relates to a heat dissipation structure. The application relates to a heat dissipation structure. The application relates to a heat dissipation structure. The application relates to a heat dissipation structure. The application relates to a heat dissipation structure. The application relates to a heat dissipation structure. The application relates to a heat dissipation structure. The application relates to a heat dissipation structure. The application relates to a heat dissipation structure. The application relates to a heat dissipation structure. The application relates to a heat dissipation structure. The application relates to a heat dissipation structure. The application relates to a heat dissipation structure. The application relates to a heat dissipation structure. The application relates to a heat dissipation structure. The application relates to a heat dissipation structure. The application relates to a heat dissipation structure. The application relates to a heat dissipation structure. The application relates to a heat dissipation structure. The application relates to a heat dissipation structure. The application relates to a heat dissipation structure. The application relates to a heat dissipation structure. The application relates to a heat dissipation structure. The application relates to a heat dissipation structure. The application relates to a heat dissipation structure. The application relates to a heat dissipation structure. The application relates to a heat dissipation structure. The application relates to a heat dissipation structure. The application relates to a heat dissipation structure. The application relates to a heat dissipation structure. The application relates to a heat dissipation structure. The application relates to a heat dissipation structure. The application relates to a heat dissipation structure. The application relates to a heat dissipation structure. The application relates to a heat dissipation structure. The application relates to a heat dissipation structure. The application relates to a heat dissipation structure. The application relates to a heat dissipation structure. The application relates to a heat dissipation structure. The application relates to a heat dissipation structure. The application relates to a heat dissipation

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