Semiconductor silicon wafer separating device capable of stably trimming

Abstract

The utility model provides a semiconductor silicon wafer slicing device capable of stably trimming, which comprises a slicing assembly, and the slicing assembly comprises a bending module, a lifting module, a fixed support and a trimming module. In the bending and slicing state, the supporting frame moves downwards, the other adsorption blocks except the fixedly-connected adsorption blocks rotate downwards under the action of gravity, the multiple adsorption planes are not coplanar, every two opposite lower stop faces are adjacent, and an obtuse included angle is formed between the edge punching movement direction of the edge punching column and the adsorption plane of the adsorption block located on the edge. According to the scheme, the obtuse included angle is formed between the edge punching moving direction and the waste edge of the semiconductor silicon wafer, the edge punching angle is optimized, expansion of cracks is avoided, and the machining yield of products is increased. In addition, two waste edges can be punched through the multiple edge punching modules respectively, and the multiple edge punching modules are arranged on the same side, so that the edge punching efficiency is improved, the stress uniformity of single-edge punching is improved, and the edge punching stability can be further improved.

Description

Technical Field

[0001] This utility model relates to the field of solar semiconductor silicon wafer production technology, and in particular to a semiconductor silicon wafer slicing device for stable edge punching. Background Technology

[0002] The slitting device is mainly used to separate silicon wafers that have not been completely slitted after the dicing machine has diced them. At present, in the photovoltaic industry, with the different required sizes of semiconductor silicon wafers, it is necessary to design according to the specifications of semiconductor silicon wafers and the number of dicings, and at the same time, it is necessary to improve the efficiency of slitting.

[0003] In existing technologies, a whole semiconductor silicon wafer is first scratched to plan the dimensions of the required multiple silicon wafers. Then, waste edges will appear at the edges, which need to be punched off. The existing punching process usually involves punching the edges first, and then separating the individual silicon wafers. The punching angle is usually perpendicular to the semiconductor silicon wafer. Since the semiconductor silicon wafer itself is relatively brittle, the cracks are easily extended to the silicon wafers at the edges during punching, and may even affect the silicon wafers in the middle, thereby reducing the processing yield of the semiconductor silicon wafer. Utility Model Content

[0004] The purpose of this invention is to provide a semiconductor silicon wafer slicing device with stable edge punching.

[0005] To achieve the objective of this utility model, a semiconductor silicon wafer slitting device for stable edge punching is provided, comprising a slitting assembly, which includes a bending module, a lifting module, a fixing bracket, and an edge punching module. The bending module includes at least two adsorption blocks extending along the X-horizontal direction, with multiple adsorption blocks arranged along the Y-horizontal direction. Each adsorption block has an adsorption plane extending along the X-horizontal direction, with adsorption holes on the adsorption plane. An adsorption pipe communicating with the adsorption holes is provided within the adsorption block, and an interface is provided at the outer end of the adsorption pipe. Each adsorption block has a hinge portion at the edge of the adsorption plane along the Y-horizontal direction, extending along the X-horizontal direction, with adjacent hinge portions hinged together. The fixing bracket is fixedly connected to one of the adsorption blocks, while the other adsorption blocks rotate around the X-horizontal direction. Each adsorption block has a lower stop surface below the hinge portion. The lifting module includes a lifting drive device and a support frame. The frame extends horizontally along the Y-axis, with the support frame located below multiple adsorption blocks. The lifting drive device is connected to the support frame and drives it to move vertically along the Z-axis. The edge-punching module includes an edge-punching bracket, an edge-punching drive device, and an edge-punching column. The edge-punching drive device is fixedly connected to the edge-punching bracket and connected to the edge-punching column, driving it to move horizontally along the Y-axis. The edge-punching column is located on the side of the bending module based on the Y-axis. In the flat support state, the support frame moves upward to support multiple adsorption blocks, with multiple adsorption planes being horizontally coplanar and having a movable gap between two opposing lower stop surfaces. In the bending and segmenting state, the support frame moves downward, and the adsorption blocks other than the fixedly connected ones rotate downward under gravity. The multiple adsorption planes are not coplanar, with two opposing lower stop surfaces adjacent. The edge-punching movement direction of the edge-punching column forms an obtuse angle with the adsorption plane of the adsorption block located at the edge.

[0006] A further approach is to include multiple punching modules in the segmented assembly, with each punching module located on one side of the bending module in the Y-direction.

[0007] A further approach is to have at least two punching modules on the same side of the bending module based on the Y horizontal direction, with the at least two punching modules on the same side arranged along the X horizontal direction.

[0008] A further proposed solution is to extend the punching bracket vertically along the Z-axis, with the punching drive device located at the upper end of the punching bracket.

[0009] A further proposed solution is to arrange the lower stop surface at an acute angle to the vertical direction of the Z-axis.

[0010] A further proposed solution is that the semiconductor silicon wafer slicing device includes two slicing assemblies, in which the adsorption block of one slicing assembly rotates around the X horizontal direction and the edge-punching post of the slicing assembly moves along the Y horizontal direction; in the other slicing assembly, the adsorption block rotates around the Y horizontal direction and the edge-punching post of the slicing assembly moves along the X horizontal direction.

[0011] A further proposed solution is that the semiconductor silicon wafer slicing device is provided with a first slicing station and a second slicing station. A slicing assembly rotating around the X horizontal direction is located at the first slicing station, and a slicing assembly rotating around the Y horizontal direction is located at the second slicing station. The number of adsorption blocks of the slicing assembly at the second slicing station is greater than the number of adsorption blocks of the slicing assembly at the first slicing station. The number of edge-trimming modules of the slicing assembly at the second slicing station is greater than the number of edge-trimming modules of the slicing assembly at the first slicing station.

[0012] The beneficial effects of this invention are as follows: Based on a fixed adsorption block, other adsorption blocks rotate around the horizontal X direction. A semiconductor silicon wafer is placed on the adsorption plane and fixed by the adsorption holes. The adsorption block rotates downwards under gravity, allowing for the initial dicing of the scratched semiconductor silicon wafer. The lower stop surface then provides support when the wafer is being punched, limiting the rotation of the adsorption block and providing support as the punching post faces the semiconductor silicon wafer. Furthermore, by using an obtuse angle between the punching direction and the scrap edge of the semiconductor silicon wafer, the optimized punching angle prevents crack propagation and improves product yield. Additionally, multiple punching modules can punch two scrap edges separately. By setting multiple punching modules on the same side, punching efficiency is improved, and the force distribution on a single side is made more uniform, further enhancing punching stability.

[0013] Furthermore, by arranging the first and second slicing stations, slicing occurs along the X-axis at the first station and along the Y-axis at the second station. This separate slicing in the X and Y directions significantly improves slicing efficiency. Moreover, in the first slicing stage, the unsliced ​​piece has a large area and therefore relatively high resistance; thus, fewer adsorption blocks are used for slicing. In the second slicing stage, since the piece has already undergone one slicing stage, the area is smaller, and the resistance is correspondingly lower; therefore, more adsorption blocks are used for slicing, further improving efficiency. Additionally, two edge-punching columns along the X and Y-axis punch the edges of the waste material, and the use of multiple edge-punching columns further enhances punching efficiency. Attached Figure Description

[0014] Figure 1 This is a structural diagram of the semiconductor silicon wafer slicing and splitting equipment of this utility model.

[0015] Figure 2 This is a structural diagram of an embodiment of the semiconductor silicon wafer slicing device of this utility model.

[0016] Figure 3 This is a structural diagram of an embodiment of the semiconductor silicon wafer slicing device of this utility model from another perspective.

[0017] Figure 4This is a structural diagram of the slicing assembly at the first slicing station in an embodiment of the semiconductor silicon wafer slicing device of this utility model.

[0018] Figure 5 This is a structural diagram of the slicing assembly at the first slicing station in an embodiment of the semiconductor silicon wafer slicing device of this utility model, viewed from another perspective.

[0019] Figure 6 This is a structural diagram of the bending module in an embodiment of the semiconductor silicon wafer slicing device of this utility model.

[0020] Figure 7 This is an exploded view of the bending module in an embodiment of the semiconductor silicon wafer slicing device of this utility model.

[0021] Figure 8 This is a structural diagram of a semiconductor silicon wafer according to an embodiment of the semiconductor silicon wafer slicing device of this utility model.

[0022] Figure 9 This is a side view of the first slicing station in a flat support state in an embodiment of the semiconductor silicon wafer slicing device of this utility model.

[0023] Figure 10 This is a side view of the first slicing station in a bent slicing state in an embodiment of the semiconductor silicon wafer slicing device of this utility model.

[0024] Figure 11 This is a side view of the second slicing station in a flat support state in an embodiment of the semiconductor silicon wafer slicing device of this utility model.

[0025] Figure 12 This is a side view of the second slicing station in a bent slicing state in an embodiment of the semiconductor silicon wafer slicing device of this utility model.

[0026] The present invention will be further described below with reference to the accompanying drawings and embodiments. Detailed Implementation

[0027] Reference Figures 1 to 12 The semiconductor silicon wafer slicing and dicing equipment includes a dicing device, a robotic arm device 12, a semiconductor silicon wafer dicing device 10, and a feeding device 13. The dicing device is used to scribe the semiconductor silicon wafer 101 along the X-axis and Y-axis, thereby forming X-axis scribe lines 103 and Y-axis scribe lines 104, thus dicing multiple silicon wafers 102. The wafers have waste edges 105 on both sides of the X-axis and waste edges 106 on both sides of the Y-axis. After dicing, the wafers are transported by the robotic arm device 12 to the semiconductor silicon wafer dicing device 10 for dicing.

[0028] The semiconductor silicon wafer slitting device 10 includes a slitting assembly 2, a slitting assembly 4, and a flipping device 3. The device has a first slitting station and a second slitting station. The slitting assembly 2, which rotates horizontally in the X direction, is located at the first slitting station, and the slitting assembly 4, which rotates horizontally in the Y direction, is located at the second slitting station. The slitting structures and principles of the slitting assemblies 2 and 4 are similar, differing only in their rotation direction and the arrangement of the adsorption blocks. The slitting assemblies 2 and 4 are positioned at a 90° horizontal rotation. The following explanation primarily uses the slitting assembly 2 as an example.

[0029] The segmented assembly 2 includes a bending module 21, a lifting module 22, a fixing bracket 23, and four punching modules 24. The bending module 21 includes four adsorption blocks 211 and two tension springs 220. The adsorption blocks 211 extend along the X horizontal direction, and the multiple adsorption blocks 211 are arranged along the Y horizontal direction. The adsorption blocks 211 are provided with adsorption planes 212 extending along the X horizontal direction. The adsorption planes 212 are provided with adsorption holes 213. The adsorption blocks 211 are provided with adsorption pipes communicating with the adsorption holes 213. The outer end of the adsorption pipes is provided with an interface 217 for connecting to a vacuum generator. The adsorption block 211 has two hinged parts 214 on the edge of the adsorption plane 212 in the Y horizontal direction. The two hinged parts 214 are located at the ends in the X horizontal direction. A crossbar 215 is provided on the outside of the hinged parts 214 in the Y horizontal direction on the adsorption plane 212 of the adsorption block 211. The crossbar 215 of the adsorption block 211 in the middle protrudes outward in both sides in the Y horizontal direction, while the crossbar 215 of the adsorption block 211 at the end is only provided on one side and protrudes outward in the middle. The bottom surface of the protruding part of the crossbar 215 is provided with an upper stop surface 216 extending in the Y horizontal direction.

[0030] The hinge portion 214 extends along the X-horizontal direction. In this embodiment, the hinge portion 214 is arranged as a hinge hole. Two adjacent hinge portions 214 of two adjacent adsorption blocks 211 are hinged together. Two adjacent hinge portions 214 on the same side are connected along the X-horizontal direction and connected by a hinge post (not shown). Two adjacent crossbars 215 are staggered in the X-horizontal direction. The adsorption block 211 has a lower stop surface 218 below the hinge portion 214. The stop surface 218 extends along the X-horizontal direction and is arranged at an acute angle with the vertical direction of the Z-axis.

[0031] Two fixed supports 23 extend vertically along the Z-axis and are located at both ends of the bending module 21 in the X-horizontal direction. The fixed supports 23 are fixedly connected to an adsorption block 211 located in the middle of the Y-horizontal direction. The fixed supports 23 are fixedly connected to the two ends of the adsorption block 211 in the X-horizontal direction, and then the adsorption blocks 211 on the other two sides rotate around the X-horizontal direction. Tension springs 220 are connected between the two adsorption blocks 211 located on the two outer sides in the Y-horizontal direction. Tension springs 220 are located on the back side of the adsorption plane 212. The two tension springs 220 are located at both ends in the X-horizontal direction. By extending along the Y-horizontal direction through the tension springs 220, and using the central tension of the tension springs 220, an elastic external force is applied to drive the rotation of the adsorption block 211.

[0032] The lifting module 22 includes a lifting drive device 221 and a support frame 222. The support frame 222 extends along the Y horizontal direction and is located below a plurality of adsorption blocks 211. The lifting drive device 221 is connected to the support frame 222 and drives the support frame 222 to move along the Z vertical direction.

[0033] The punching module 24 includes a punching bracket 241, a punching drive device 242, and a punching column 243. The punching drive device 242 is fixedly connected to the punching bracket 241. The punching drive device 242 can be an electric or pneumatic drive device. The punching drive device 242 is connected to the punching column 243 and drives the punching column 243 to move along the Y horizontal direction. The punching column 243 is located on the side of the bending module based on the Y horizontal direction. Two punching modules 24 are respectively arranged on the side of the bending module based on the Y horizontal direction. The two punching modules 24 on the same side are arranged along the X horizontal direction. The punching bracket 241 extends vertically along the Z axis. The punching drive device 242 is located at the upper end of the punching bracket 241.

[0034] Reference Figure 9 In the flat support state, the support frame 222 moves upward to support multiple adsorption blocks 211, and multiple adsorption planes 212 are horizontal and coplanar. At this time, the semiconductor silicon wafer 101 can be placed on the adsorption plane 212 and adsorbed and fixed by the adsorption hole 213. The X-direction scratch 103 is aligned with the edge of the adsorption plane 212 in the Y-direction. The upper stop surface 216 of one adsorption block 211 is located above the adsorption plane 212 of the adjacent adsorption block 211 and is adjacent to the adsorption plane 212, realizing the upward rotation limit of the adsorption block 211. There is an active gap 219 between the two opposing lower stop surfaces 218.

[0035] Reference Figure 10In the bending and slicing state, the support frame 222 moves downward and loses its support function for the adsorption block 211. Except for the fixedly connected adsorption block 211, the other adsorption blocks 211 rotate downward under the action of gravity and tension spring 220. At this time, the multiple adsorption planes 212 are not coplanar. The upper stop surface 216 of one adsorption block 211 is located above the adsorption plane 212 of the adjacent adsorption block 211 and is separated from the adsorption plane 212. The two opposite lower stop surfaces 218 are adjacent. At this time, the slicing of the semiconductor silicon wafer 101 by the X-direction scratch 103 is completed. Then, the edge punching column 243 is driven to move along the Y horizontal direction. Since the edge punching movement direction of the edge punching column 243 is at an obtuse angle with the adsorption plane 212 of the adsorption block 211 located at the edge, the edge punching movement direction of the edge punching column 243 is at an obtuse angle with the waste edge 106. As the edge punching column 243 moves, the waste edge 106 is punched off and can fall into the waste tank below.

[0036] After the slicing and edge-trimming of the first slicing station are completed, the semiconductor silicon wafer 101 after one slicing and edge-trimming can be transferred to the slicing assembly 4 of the second slicing station by the robotic arm device 12 and the suction cup 121 located on the robotic arm device 12.

[0037] The segmented assembly 4 includes a bending module 41, a lifting module 44, a fixed bracket, and eight punching modules 44. The bending module 41 includes seven adsorption blocks 411. Based on the same principle as the segmented assembly 2, the seven adsorption blocks 411 are arranged and hinged along the X horizontal direction. The fixed bracket is fixedly connected to the adsorption block 411 in the middle, and the other adsorption blocks 411 rotate around the Y horizontal direction.

[0038] Reference Figure 11 When in a flat support state, the support frame 422 moves upward to support multiple adsorption blocks 411, and multiple adsorption planes are horizontal and coplanar. At this time, the semiconductor silicon wafer 101 can be placed on the adsorption plane and adsorbed and fixed by the adsorption holes, and the Y-direction scratch 104 is aligned with the edge of the adsorption plane in the X horizontal direction.

[0039] Reference Figure 12 When the wafer is in the bending and slicing state, the support frame 422 moves downward and loses its support function for the adsorption block 411. The other adsorption blocks, except for the fixedly connected adsorption blocks, rotate downward under the action of gravity and tension spring. At this time, the multiple adsorption planes are not coplanar, and then the slicing of the Y-direction scratch 104 of the semiconductor silicon wafer 101 is completed. Then, the edge-punching column of the driving edge-punching module 44 moves along the X horizontal direction. Since the edge-punching movement direction of the edge-punching column is at an obtuse angle with the adsorption plane of the adsorption block located at the edge, the edge-punching movement direction of the edge-punching column is at an obtuse angle with the waste edge 105. As the edge-punching column moves, the waste edge 105 is punched off and can fall into the waste trough below.

[0040] Then, the silicon wafers 102 are flipped towards the bending module 41 by the flipping device 3, and the adsorption blocks on the flipping device 3 are used to adsorb each silicon wafer 102. After flipping again, the orientation of the silicon wafers 102 can be flipped. Finally, the suction cups 121 on the robotic arm device 12 transfer each silicon wafer 102 to the material tray of the unloading device 13 and convey it outward.

[0041] Of course, the above embodiments are only preferred embodiments of this case. In specific applications, the number of adsorption blocks and edge-punching modules can be set according to the actual situation, including but not limited to two or more, and the specific number arrangement of edge-punching modules can also be set according to the actual situation. Furthermore, the setting of the upper stop surface and the lower stop surface can be switched between a flat support state and a bent segmented state by raising and lowering the support frame. The setting of the upper stop surface and the lower stop surface is selective.

[0042] As can be seen above, based on a fixed adsorption block, multiple other adsorption blocks rotate around the X-axis. Semiconductor silicon wafers are placed on the adsorption plane and fixed by the adsorption holes. The adsorption blocks rotate downwards under gravity, thus enabling the slicing of scratched semiconductor silicon wafers. Furthermore, the vertical position of the support frame can be precisely controlled, allowing the bending module to switch accurately between two states, improving slicing accuracy. Moreover, the arrangement of the lower and upper stop surfaces, the placement of the hinges at both ends, and the staggered arrangement of the crossbars ensure positional stability of the bending module in both the flat support state and the bending slicing state. The staggered arrangement also brings the hinges closer to the edge of the adsorption block, allowing the slicing scratches to align more precisely with the hinge position, further improving slicing accuracy. Additionally, the adjacent positioning using the lower stop surface not only limits the rotation of the adsorption block but also provides support when the punching post punches the semiconductor silicon wafer.

[0043] Furthermore, by arranging the first and second slicing stations, slicing is performed along the X-axis at the first slicing station and along the Y-axis at the second slicing station. This separate slicing in the X and Y directions greatly improves the slicing efficiency. Moreover, in the first slicing, since the whole piece is not sliced ​​and has a large area, the resistance is relatively large. Therefore, fewer adsorption blocks are used for slicing. In the second slicing, since it has already been sliced ​​once, the area is smaller and the resistance is correspondingly smaller. Therefore, more adsorption blocks are used for slicing to improve the slicing efficiency.

Claims

1. A semiconductor silicon wafer slicing device for stable edge punching, characterized in that, The assembly includes a segmentation module, which comprises a bending module, a lifting module, a fixing bracket, and a punching module. The bending module includes at least two adsorption blocks extending along the X horizontal direction, and multiple adsorption blocks arranged along the Y horizontal direction. Each adsorption block has an adsorption plane extending along the X horizontal direction, and adsorption holes are provided on the adsorption plane. An adsorption pipe communicating with the adsorption holes is provided inside the adsorption block, and an interface is provided at the outer end of the adsorption pipe. Each adsorption block has a hinge portion at the edge of the adsorption plane along the Y horizontal direction, extending along the X horizontal direction. Two adjacent hinge portions are hinged together. A fixed bracket is fixedly connected to one of the adsorption blocks, and the other adsorption blocks rotate around the X horizontal direction. Each adsorption block has a lower stop surface below the hinge portion. The lifting module includes a lifting drive device and a support frame. The support frame extends along the Y-axis and is located below the plurality of adsorption blocks. The lifting drive device is connected to the support frame and drives the support frame to move along the Z-axis vertical direction. The edge punching module includes an edge punching bracket, an edge punching drive device, and an edge punching column. The edge punching drive device is fixedly connected to the edge punching bracket. The edge punching drive device is connected to the edge punching column and drives the edge punching column to move along the Y horizontal direction. The edge punching column is located on the side of the bending module based on the Y horizontal direction. In the flat support state, the support frame moves upward to support the multiple adsorption blocks, the multiple adsorption planes are horizontal and coplanar, and there is an movable gap between the two opposing lower stop surfaces; When in the bent and segmented state, the support frame moves downward, and the other adsorption blocks except for the fixedly connected adsorption blocks rotate downward under the action of gravity. The multiple adsorption planes are not coplanar, and the two opposing lower stop surfaces are adjacent. The punching movement direction of the punching column forms an obtuse angle with the adsorption plane of the adsorption block located at the edge.

2. The semiconductor silicon wafer slicing apparatus according to claim 1, characterized in that: The segmentation assembly includes multiple edge-punching modules, which are respectively located on both sides of the bending module based on the Y-horizontal direction.

3. The semiconductor silicon wafer slicing apparatus according to claim 2, characterized in that: The bending module has at least two edge-punching modules on the same side based on the Y horizontal direction, and the at least two edge-punching modules on the same side are arranged along the X horizontal direction.

4. The semiconductor silicon wafer slicing apparatus according to claim 1, characterized in that: The punching bracket extends vertically along the Z-axis, and the punching drive device is located at the upper end of the punching bracket.

5. The semiconductor silicon wafer slicing apparatus according to claim 1, characterized in that: The lower stop surface is arranged at an acute angle to the vertical direction of the Z-axis.

6. The semiconductor silicon wafer slicing apparatus according to any one of claims 1 to 5, characterized in that: The semiconductor silicon wafer slitting device includes two slitting components, wherein the adsorption block of one of the slitting components rotates about the X horizontal direction, and the punching post of the slitting component moves along the Y horizontal direction; The adsorption block of another segmented assembly rotates about the Y horizontal direction, and the punching post of the segmented assembly moves along the X horizontal direction.

7. The semiconductor silicon wafer slicing apparatus according to claim 6, characterized in that: The semiconductor silicon wafer slicing device is provided with a first slicing station and a second slicing station. The slicing assembly that rotates around the X horizontal direction is located at the first slicing station, and the slicing assembly that rotates around the Y horizontal direction is located at the second slicing station. The number of adsorption blocks in the slicing assembly of the second slicing station is greater than the number of adsorption blocks in the slicing assembly of the first slicing station; The number of edge-punching modules in the slicing assembly of the second slicing station is greater than the number of edge-punching modules in the slicing assembly of the first slicing station.

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