Wafer plate heating equipment

Abstract

Wafer plate heating equipment comprises a rack assembly, a feeding and discharging port assembly, a clamping and carrying assembly and a plurality of heating table assemblies, and the feeding and discharging port assembly, the clamping and carrying assembly and the heating table assemblies are arranged on the rack assembly; the heating table assemblies are arranged in rows at intervals, the feeding and discharging port assembly is arranged at one end of one row of heating table assemblies, and the clamping and carrying assembly is located between the two rows of heating table assemblies. The feeding and discharging port assembly is used for feeding and discharging of wafer plates. The heating table assembly is used for heating the wafer plate; the clamping and carrying assembly can move in the length direction of the heating table assemblies in rows, can rotate and is used for carrying the wafer plates of the feeding and discharging port assemblies to the heating table assemblies to be heated and carrying the wafer plates heated by the heating table assemblies to the feeding and discharging port assemblies to be discharged. According to the invention, the heating efficiency and heating quality of the wafer plate are improved, and the labor intensity of workers is reduced.

Description

Technical Field

[0001] This invention belongs to the field of wafer heating, specifically referring to a wafer heating device. Background Technology

[0002] Currently, manual operation in the wafer heating process is inefficient. The specific steps are: a wafer is manually picked up, placed on the heating platform, and left to heat until completion. Then, the heated wafer is removed and placed on the wafer to be heated. This process suffers from low heating efficiency and unstable control of heating temperature and time. Heating devices have been developed for the market, such as the wafer heating device disclosed in Chinese patent application CN118676048A. This device has an adsorption disk mounted on a platform; a heating pad is installed in the pressure plate cavity at the top of the pressure plate below the adsorption disk, with the bottom of the adsorption disk in close contact with the heating pad; a lifting motor drives the upper lifting disk to move vertically; several guide rods are mounted on the lifting disk, and suction nozzles are installed at the top of the guide rods. This heating device uses suction nozzles to pick up and place wafers. While this avoids direct manual contact with the heated wafers, each heating device requires manual supervision, resulting in low heating efficiency and high labor intensity. Summary of the Invention

[0003] The technical problem to be solved by the present invention is to provide a wafer heating device that can automatically heat multiple wafers and place them on heating platforms of corresponding temperatures according to the different temperatures required by the wafers, thereby improving the heating efficiency and heating quality of the wafers and reducing the intensity of manual labor.

[0004] To solve the above-mentioned technical problems, the present invention provides a wafer heating device, including a frame assembly, a loading / unloading port assembly, a clamping and conveying assembly, and a plurality of heating stage assemblies, wherein: the loading / unloading port assembly, the clamping and conveying assembly, and the heating stage assemblies are disposed on the frame assembly; the heating stage assemblies are arranged in rows at intervals, the loading / unloading port assembly is disposed at one end of one row of heating stage assemblies, and the clamping and conveying assembly is located between two rows of heating stage assemblies; the loading / unloading port assembly is used for loading and unloading wafers; the heating stage assemblies are used for heating wafers; the clamping and conveying assembly is movable and rotatable along the length direction of the rows of heating stage assemblies, and is used to transport the wafers from the loading / unloading port assembly to the heating stage assembly for heating, and to transport the heated wafers from the heating stage assembly to the loading / unloading port assembly for unloading.

[0005] Preferably, the loading / unloading port assembly includes a loading / unloading port feeding plate, a loading port assembly, and a unloading port assembly. The loading port assembly includes a loading port and a loading port lifting mechanism, and the unloading port assembly includes a unloading port and a unloading port lifting mechanism. The loading port and the unloading port are spaced apart on the loading / unloading port feeding plate. The loading port lifting mechanism and the unloading port lifting mechanism pass through the loading port and the unloading port, respectively. The loading port lifting mechanism lifts the wafer plate placed on the loading port, and the unloading port lifting mechanism places the wafer plate placed thereon on the unloading port. The clamping and transporting assembly clamps and transports the wafer plate on the loading port lifting mechanism to the heating stage assembly, and the clamping and transporting assembly places the heated wafer plate on the unloading port lifting mechanism.

[0006] Preferably, the lifting mechanism for the feeding port and the lifting mechanism for the discharging port have the same structure, including a lifting cylinder, a lifting connecting plate, and lifting blocks located below the feeding port and the discharging port. The lifting connecting plate is disposed on the slide table of the lifting cylinder, and a plurality of lifting blocks are arranged concentrically on the lifting connecting plate. Through slots are respectively opened on the feeding port and the discharging port at positions corresponding to the lifting blocks. The lifting blocks pass through the through slots. When the lifting cylinder extends, it drives the lifting blocks to pass through the feeding port and the discharging port, so that the upper end surface of the lifting blocks is above the feeding port and the discharging port. When the lifting cylinder retracts, the lifting blocks are lower than the upper surfaces of the feeding port and the discharging port.

[0007] Preferably, the heating stage assembly includes a heating plate, a wafer positioning frame, and a heating stage lifting mechanism. The wafer positioning frame is disposed on the heating plate, and a plurality of heating rods and temperature sensors are disposed in the heating plate. The heating power of the heating rods is set according to their position on the heating stage. The heating stage lifting mechanism is located below the heating plate, passes through the heating plate and the wafer positioning frame, and is used to lift and place the wafer.

[0008] Preferably, the heating platform lifting mechanism includes a lifting cylinder, a lifting connecting plate, and lifting blocks. The lifting connecting plate is disposed on the slide of the lifting cylinder, and a plurality of concentrically arranged lifting blocks are arranged on the lifting connecting plate. Through slots are respectively opened on the heating plate and the wafer positioning frame at the positions corresponding to the lifting blocks. The lifting blocks pass through the through slots. When the lifting cylinder extends, it drives the lifting blocks to pass through the heating plate and the wafer positioning frame, so that the upper end surface of the lifting blocks is above the heating plate and the wafer positioning frame. When the lifting cylinder retracts, the lifting blocks are lower than the upper surface of the heating plate and the wafer positioning frame.

[0009] Preferably, the lifting block has at least one lifting end. When there are multiple lifting ends, the lifting ends are concentrically arranged and spaced outwards from the center, and the height of the lifting ends increases sequentially from the center outwards. The upper surface of each lifting end is set as an L-shaped structure, and the vertical feature of the L-shaped structure is an inclined structure.

[0010] Preferably, the clamping and conveying assembly includes a linear displacement mechanism, a rotating mechanism, and a gripper mechanism. The rotating mechanism is mounted on the linear displacement mechanism, the gripper mechanism is mounted on the rotating mechanism, and the linear displacement mechanism is positioned between the two rows of heating platform assemblies.

[0011] Preferably, the linear displacement mechanism is a linear slide module, with sensors respectively provided at the front and rear ends of the linear slide module, the rotation mechanism being disposed on the slide of the linear slide module, and a buffer being provided on one side of the slide.

[0012] Preferably, the rotating mechanism includes a rotating cylinder connecting plate and a rotating cylinder. The rotating cylinder connecting plate is disposed on the slide of the linear slide module, the rotating cylinder is mounted on the rotating cylinder connecting plate, and the gripper mechanism is mounted on the rotating cylinder.

[0013] Preferably, the gripper mechanism includes two linear slide cylinders that are spaced apart from each other on the rotary cylinder. Each of the two linear slide cylinders has a gripper fixedly mounted on it. The two linear slide cylinders drive the two grippers to move relative to each other or away from each other. Each gripper has an arc-shaped stepped surface.

[0014] The wafer heating equipment of the present invention places the wafer on the heating table through a clamping and conveying component, and places the heated wafer on the unloading port. No manual contact with the heating table is required, which improves the safety of operation. Multiple wafers can be placed on the heating table at the required temperature for heating, which improves the efficiency and quality of operation. At the same time, wafers with different temperature requirements can be heated by heating tables with different heating temperatures, which expands the heating range and makes the application range wider. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of a wafer heating device.

[0016] Figure 2 This is a schematic diagram of the loading and unloading port assembly installed on the base plate 5.

[0017] Figure 3 This is a front view structural diagram of the loading and unloading port assembly.

[0018] Figure 4 This is a bottom view of the feed inlet / outlet assembly.

[0019] Figure 5 This is a structural diagram of the clamping and handling assembly and the base plate.

[0020] Figure 6 This is a schematic diagram of the clamping and handling assembly.

[0021] Figure 7 for Figure 6 A magnified view of part II.

[0022] Figure 8 for Figure 6 A magnified view of part III.

[0023] Figure 9 for Figure 6 A magnified view of part IV.

[0024] Figure 10 This is a structural diagram of the heating platform assembly and the base plate.

[0025] Figure 11 This is a front view structural diagram of the heating platform assembly.

[0026] Figure 12 This is a bottom view of the heating platform assembly.

[0027] Figure label:

[0028] Frame assembly 1, Loading / unloading port assembly 2, Clamping and conveying assembly 3, Heating table assembly 4, Base plate (5, 20), Feeding plate support column 6, Wafer board loading lifting block 7, Loading port sensor 8, Loading / unloading port feeding plate 9, Wafer board unloading lifting block 10, Unloading port sensor 11, Unloading port lifting connecting plate 12, Unloading port cylinder fixing block 13, Unloading port cylinder buffer 14, Unloading port slide cylinder 15, Loading port cylinder fixing block 16, Loading port cylinder buffer 17, Loading port slide cylinder 18, Loading port lifting connecting plate 19, Cable chain 21, Linear slide module 22, Rotary cylinder pad block 25. Rotary cylinder 26. Rotary cylinder connecting plate 27. Slide table buffer 28. Gripper mounting plate 29. Front sensor 30. Rear sensor 31. Left gripper 34. Right gripper 35. Left slide table cylinder 38. Right slide table cylinder 39. Wafer positioning frame 41. Heating plate 42. Heating plate support column 43. Temperature sensor 44. Heating rod 45. Lifting block 47. Heating plate center 48. Lifting connecting plate 49. Cylinder fixing block 50. Cylinder buffer 51. Slide table cylinder 52. Material presence / absence sensor 53. Slide table cylinder top plate 54. Loading port 91. Unloading port 92. Detailed Implementation

[0029] Regarding the above technical solutions, preferred embodiments are now described in detail with reference to the figures, including a wafer heating device. Figures 1 to 12The system includes a frame assembly 1, a loading / unloading port assembly 2, a clamping and conveying assembly 3, and a heating table assembly 4. The loading / unloading port assembly 2, clamping and conveying assembly 3, and heating table assembly 4 are all placed on the frame assembly 1. Base plates (5, 20) are installed parallel to each other at intervals at the bottom of the frame assembly 1. The loading / unloading port assembly 2 and the heating table assembly 4 are respectively mounted on the base plates (5, 20). The loading / unloading port assembly 2 is located at one end of the base plate 5, and the clamping and conveying assembly 3 is located between the base plates (5, 20). The clamping and conveying assembly 3 clamps the wafer from the loading port assembly on the loading / unloading port assembly 2 and places it on the heating table at the corresponding temperature. After heating, the clamping and conveying assembly 3 then transports the heated wafer from the heating table to the unloading port assembly. Wherein:

[0030] For loading / unloading port assembly 2, see Figures 2 to 4 This includes a loading port assembly and a unloading port assembly. A loading / unloading port feeding plate 9 is installed above one end of the base plate 5, and the loading / unloading port feeding plate 9 is mounted on the base plate 5 via support columns 6. The loading / unloading port feeding plate 9 has a loading port 91 and a unloading port 92 spaced apart. The loading port 91 and the unloading port 92 each have annular stepped surfaces for placing wafers, and notches are provided on the side of the loading port 91 and the unloading port 92 away from the clamping and conveying assembly 3. A loading port lifting mechanism and a unloading port lifting mechanism are respectively provided below the loading port 91 and the unloading port 92.

[0031] The loading port lifting mechanism includes four wafer board loading lifting blocks 7, loading port sensor 8, loading port cylinder fixing block 16, loading port cylinder buffer 17, loading port slide cylinder 18, and loading port lifting connecting plate 19.

[0032] The unloading port lifting mechanism includes four wafer unloading lifting blocks 10, an unloading port sensor 11, an unloading port lifting connecting plate 12, an unloading port cylinder fixing block 13, an unloading port cylinder buffer 14, and an unloading port slide cylinder 15. The loading port lifting mechanism and the unloading port lifting mechanism have the same structure, and the structural relationship is explained using the loading port lifting mechanism as an example.

[0033] The structural relationship of the loading port lifting mechanism: The H-shaped loading port lifting connecting plate 19 is horizontally located below the loading port 91 of the loading port plate 9. A wafer board loading lifting block 7 is set at each of the four corners of the loading port lifting connecting plate 19. The wafer board loading lifting block 7 has a U-shaped structure and has two lifting ends with different heights set at intervals. The end face of each lifting end is set as a backrest-shaped L-shaped structure. The vertical feature of the L-shaped structure of the lifting end is a sloping structure. A through slot is provided in the loading port 91 for the lifting end to pass through. Two wafer board loading lifting blocks 7 at one end of the loading port lifting connecting plate 19 are inserted into the through slot of the loading port 91. The other two wafer board loading lifting blocks 7 are located at the notch of the loading port 91. The lifting end of the wafer board loading lifting block 7 with the lower height is located on the inside, and the lifting end with the higher height is located on the outside. The lifting ends of the four wafer board loading lifting blocks 7 located inside the loading port 91 with the lower height are located on the same annular surface, and the lifting ends of the four wafer board loading lifting blocks 7 located outside the loading port 91 with the higher height are located on the same annular surface, so as to facilitate the lifting of wafer boards of different diameter specifications. A mounting hole is provided on the base plate 5. The loading port cylinder fixing block 16 is installed on the upper side of the mounting hole on the base plate 5. A loading port slide cylinder 18 is installed on the loading port cylinder fixing block 16. The lower end of the loading port slide cylinder 18 passes through the mounting hole and is located below the base plate 5, while the upper end is located above the base plate 5. The loading port lifting connecting plate 19 is fixedly installed on the slider of the loading port slide cylinder 18. A loading port cylinder buffer 17 is provided on the loading port cylinder fixing block 16 to buffer the impact force when the slider descends. The loading port sensor 8 is located at the notch of the loading port 91.

[0034] The loading port operation principle of the loading port assembly 2 is as follows: First, the wafer to be heated is manually placed into the left loading port of the loading port plate 9 (which can accommodate two different sizes of wafers, such as 8-inch and 6-inch wafers). The loading port sensor 8 detects the presence of a wafer and triggers the clamping and conveying assembly 3 to move above the wafer. When the clamping and conveying assembly 3 is in place and the grippers extend, the loading port slide cylinder 18 is activated, pushing out the loading port lifting connecting plate 19, thus driving the loading. The lifting block 7 moves upward along the left loading slot on the loading plate 9. The wafer is then positioned and pushed out into place by the lifting block 7. The loading port slide cylinder sensor responds and stops, waiting for the clamping and transporting assembly 3 to clamp and transport the wafer. The loading port sensor 8 detects no wafer and triggers the loading port slide cylinder 18 to move the loading port lifting connecting plate 19 and the lifting block 7 downward back to their original positions. The loading process ends here.

[0035] The unloading port operates as follows: After the wafer is heated by the heating stage assembly 4, the clamping and conveying assembly 3 transports it to the upper part of the unloading port on the right side of the unloading port plate 9. The unloading port sensor 11 detects the presence of material and triggers the unloading port slide cylinder 15 to push out the unloading port lifting connecting plate 12, which in turn moves the unloading lifting blocks 10 (4 blocks) upward along the right unloading port through groove on the unloading port plate 9. Then, the unloading lifting block 7 is pushed out into place, clamping the wafer into the support positioning plane. The clamping and conveying assembly 3 extends its grippers, and the unloading port slide cylinder 15 moves downward, causing the unloading port lifting connecting plate 12 and the loading lifting block 10 to return to their original positions. This causes the wafer to fall into the unloading port on the right side of the unloading port plate 9, thus ending the unloading process.

[0036] The clamping and conveying assembly 7 includes a linear displacement mechanism, a rotary mechanism, and a gripper mechanism. The rotary mechanism is mounted on the linear displacement mechanism, and the gripper mechanism is mounted on the rotary mechanism. (See attached image) Figures 5 to 9 The linear displacement mechanism includes a cable chain 21, a linear slide module 22, a slide seat buffer 28, a front sensor 30, and a rear sensor 31; the rotation mechanism includes a rotary cylinder pad 25, a rotary cylinder 26, and a rotary cylinder connecting plate 27; the gripper mechanism includes a gripper mounting plate 29, a left gripper 34, a right gripper 35, a left slide cylinder 38, and a right slide cylinder 39; wherein:

[0037] A linear slide module 22 is arranged along its length between base plates (5, 20). A rotary cylinder connecting plate 27 is mounted on the slide base of the linear slide module 22, and a rotary cylinder 26 is mounted on the rotary cylinder connecting plate 27. A rotary cylinder pad 25 and a gripper mounting plate 29 are sequentially mounted on the rotary cylinder 26. Slide cylinders (38, 39) are arranged at intervals on the gripper mounting plate 29, and grippers (34, 35) are respectively mounted on the slide cylinders (38, 39), with two layers of arc-shaped stepped surfaces on the grippers (34, 35). A front sensor 30 and a rear sensor 31 are respectively arranged at the front and rear ends of the linear slide module 22. A slide base buffer 28 is mounted on the slide base. A drag chain 21 is mounted on the rotary cylinder connecting plate 27. The linear slide module 22 is driven by a slide module motor.

[0038] The operating principle of the clamping and handling assembly 7 is as follows: When the loading port sensor 8 detects a wafer board, it triggers the rotary cylinder 26 to rotate the rotary cylinder connecting plate 27 and the grippers (34, 35) mounted on it by 180°. Then, the slide module motor actuates, driving the slide base to move towards the loading port position, causing the rotary cylinder connecting plate 27 to move the rotary grippers forward. When it reaches above the loading port, the slide module motor stops moving, and the cylinder sensors on the left slide cylinder 38 and the right slide cylinder 39 respond. The left and right grippers 34 and 35 are moved outward to open their grippers. When the loading and unloading port assembly 2 pushes the wafer into place, the cylinder sensors on the left and right slide cylinders 38 and 39 respond, causing the left and right grippers 34 and 35 to move inward to clamp the wafer. Then, the loading port slide cylinder 18 of the loading and unloading port assembly 2 moves downward to return to its original position. The wafer clamped by the clamping and transporting assembly 3 is transported and placed to the designated heating stage position according to the required temperature and heating time set by the customer.

[0039] When the wafer board is directly above the center 48 of the heating plate of the heating stage assembly 4, the sensor 53 detects the presence of the wafer board and triggers the sliding cylinder 52 in the heating stage assembly to move, causing the lifting connecting plate 49 and the lifting block 47 mounted on it to extend upwards simultaneously. When the lifting block 47 extends into place, its upper surface and side surface fit and position the wafer board. The left jaw 34 and right jaw 35 of the clamping and transporting assembly 3 move outwards to open the jaws. Then, the sliding cylinder 52 in the heating stage assembly 4 moves, causing the lifting connecting plate 49, the lifting block 47 mounted on it, and the wafer board to move downwards. When the wafer board falls into the wafer positioning frame 41, the heating stage starts working, and the clamping and transporting assembly 3 continues to repeat the work. The unloading and loading movements are similar, and the clamping and transporting process ends here.

[0040] There are multiple heating platform assemblies 4; in this embodiment, there are eight, which are spaced apart and arranged on the base plate (5, 20). See also Figures 10 to 12 The heating stage assembly 4 includes a heating stage and a heating stage lifting mechanism. The heating stage includes a wafer positioning frame 41, a heating plate 42, a heating plate support column 43, a temperature sensor 44, a heating rod 45, and a heating plate center 48; the heating stage lifting mechanism includes a lifting block 47, a lifting connecting plate 49, a cylinder fixing block 50, a cylinder buffer 51, a slide cylinder 52, a material presence / absence sensor 53, and a slide cylinder top plate 54.

[0041] The heating plate 42 is square and has a certain thickness, and is mounted on the base 5 or base 20 via support columns 43. The wafer positioning frame 41 has a ring-shaped structure, with limiting protrusions protruding from the outer circumference on opposite sides of the ring-shaped structure, and a circular through hole in the center. A receiving groove for accommodating the wafer positioning frame 41 is provided on the upper surface of the heating plate 42, and notches communicating with the receiving groove are provided on opposite sides of the heating plate 42. The wafer positioning frame 41 is installed in the receiving groove of the heating plate 42, and the limiting protrusions of the wafer positioning frame 41 are respectively engaged in the notches of the heating plate 42, thus positioning the wafer positioning frame 41. The center 42 of the heating plate is exposed in the circular through hole of the wafer positioning frame 41. With this structure, most of the wafer can be directly positioned above the heating plate 42.

[0042] Several heating rods 45 are inserted through the thickness of the heating plate 42 to heat the heating plate 42 and the wafer positioning frame 41. The heating power of the heating rods 45 is determined according to their position on the heating stage. For example, the heating rods located at the center of the heating stage have lower power, while those located on the outer edges have higher power. By controlling the power of the heating rods and using temperature sensors, the heating temperature of the heating stage is controlled within a reasonable range. A temperature sensor 44 is also inserted through the thickness of the heating plate 42 to sense its temperature. Since the temperatures of different heating stage components may vary, the power of the heating rods may also vary depending on the temperature setting.

[0043] Heating table lifting mechanism: A cylinder fixing block 50 is provided below the heating plate 42. A sliding cylinder 52 is installed on the cylinder fixing block 50. A cylinder buffer 51 is provided below the sliding cylinder 52. A sliding cylinder top plate 54 is fixedly connected to the sliding surface of the sliding cylinder 52. An H-shaped lifting connecting plate 49 is provided on the sliding cylinder top plate 54. Lifting blocks 47 are respectively provided at the four corners of the lifting connecting plate 49. Each lifting block 47 has two lifting ends with different heights spaced apart. The end face of each lifting end is set as a backrest-shaped L-shaped structure. The vertical feature of the L-shaped structure of the lifting end is a sloping structure. The lifting block 47 passes through the heating plate 42 and can move linearly up and down relative to the heating plate. The structure of the heating table lifting mechanism is the same as that of the feeding port lifting mechanism.

[0044] The heating temperature of each heating stage assembly can be set as needed, and different heating stage assemblies may have different temperatures. When placing the wafer onto the heating stage assembly, the wafer is placed on the corresponding heating stage assembly that can increase the required heating temperature, according to the temperature temperature required for that wafer. Multiple heating stage assemblies can provide heating for multiple temperature requirements at once. Therefore, multiple sets of heating stage assemblies improve heating efficiency and provide a wide heating range.

[0045] The operating principle is as follows: When the material arrives, sensor 53 responds, triggering the sliding cylinder 52 to move, which drives the lifting connecting plate 49 and the four lifting blocks 47 installed on it to move upward. After reaching the position, the lifting blocks 47 support and position the wafer. Then, the sliding cylinder 52 returns to its original position. When the wafer falls to the wafer positioning frame 41 along with the lifting blocks 47, the heating rod 45 starts to work. When the temperature and heating time reach the set values, temperature sensor 44 responds, heating rod 45 stops working, and sliding cylinder 52 moves, driving the lifting connecting plate 49, the lifting blocks 47 installed on it, and the heated wafer to move upward. After reaching the position, it waits for the clamping and handling assembly 3 to pick it up. The operating principle of the other 7 heating stations is the same. The heating temperature and time are set by the customer to determine which heating station the wafer is working on. The heating process ends here.

[0046] The motion control and heating control of the aforementioned clamping and conveying components, heating table components, and loading / unloading port components are all controlled by a PLC.

[0047] The overall workflow of this invention:

[0048] 1) Turn on the power switch, connect the air source, and manually set the required temperature and time for the heating table. Place the wafer board into the left loading port of the loading plate 9. The loading port sensor 8 detects the presence of the wafer board and triggers the rotary cylinder 26 to rotate 180°, causing the rotary cylinder connecting plate 27 and the left and right grippers 34 and 35 mounted on it to rotate. Then, the slide module motor moves, driving the slide base to move towards the loading port position, causing the rotary cylinder connecting plate 27 to move the rotary grippers forward. When it reaches above the loading port, the motor 32 stops moving, and the cylinder sensors on the left and right slide cylinders 38 and 39 respond, causing the left and right grippers 34 and 35 to move outward and open to the desired position. When the loading port slide cylinder 18 actuates, it pushes out the loading port lifting connecting plate 19, causing the loading lifting block 7 to move upward along the left loading port through slot on the loading and unloading port plate 9. Then, the wafer is positioned and supported by the loading lifting block 7 and pushed into place. The cylinder sensors on the left slide cylinder 38 and the right slide cylinder 39 respond, causing the left gripper 34 and the right gripper 35 to move inward to clamp the wafer. Then, the loading port slide cylinder 18 of the loading and unloading port assembly 2 moves downward to return to its original position. The wafer clamped by the clamping and transporting assembly 3 is transported and placed to the designated heating platform position according to the required temperature and heating time set by the customer. When the clamping and transporting assembly 3 places the wafer directly above the center 48 of the heating plate of the heating platform assembly 4, the sensor... The device 53 detects a wafer board and triggers the sliding cylinder 52 in the heating stage assembly to move, causing the lifting connecting plate 49 and the lifting block 47 mounted on it to extend upwards simultaneously. When the lifting block 47 extends into position, its upper surface and side surface fit and position the wafer board. The left and right grippers 34 and 35 of the clamping and transporting assembly 3 move outwards to open the grippers. Then, the sliding cylinder 52 in the heating stage assembly 4 moves, causing the lifting connecting plate 49, the lifting block 47 mounted on it, and the wafer board to move downwards. When the wafer board falls into the wafer positioning frame 41, the heating rod 45 starts working. When the temperature and heating time reach the set values, the temperature sensor 44 responds, the heating rod 45 stops working, and the sliding cylinder 52 moves, causing the wafer board to extend upwards. The lifting connecting plate 49, the lifting block 47 mounted on it, and the heated wafer move upwards. Once in position, they await the clamping and transporting assembly 3 to move them to another heating platform for further heating or to the right unloading port of the loading / unloading port plate 9. When the clamping and transporting assembly 3 clamps the heated wafer and moves it directly above the right unloading port of the loading / unloading port plate 9, the unloading port sensor 11 detects the incoming material response and triggers the unloading port slide cylinder 15 to move upwards, driving the unloading port lifting plate 12 and the unloading lifting block 10 to move upwards. When the unloading lifting block 10 is in position and supports the heated wafer, the left gripper 34 and right gripper 35 of the clamping and transporting assembly 3 move outwards. After the grippers open and are in position, the unloading port slide cylinder 15 is triggered to move.The lifting plate 12 and the lifting block 10 at the feeding port support the positioned wafer board as it moves downwards. When the cylinder 15 of the feeding port slide returns to its position, the heated wafer board falls into the feeding port on the right side of the feeding plate 9, awaiting manual removal. The other seven heating stations operate on the same principle. All eight heating stations can work simultaneously, and the operator can set eight different heating temperatures and times. This concludes the introduction to the workflow of a wafer board heating device.

Claims

1. A wafer heating device, characterized in that, Includes a frame assembly, loading and unloading port assembly, clamping and conveying assembly, and several heating table assemblies, wherein: The loading / unloading port assembly, the clamping and conveying assembly, and the heating table assembly are mounted on the frame assembly; the heating table assemblies are arranged in rows at intervals, the loading / unloading port assembly is located at one end of one row of heating table assemblies, and the clamping and conveying assembly is located between two rows of heating table assemblies. The loading and unloading port assembly is used for loading and unloading wafers; The heating stage assembly is used to heat the wafer plate, and several heating stage assemblies may have the same or different heating temperatures; The clamping and conveying assembly is movable and rotatable along the length of the row of heating stage assemblies, and is used to transport the wafer board of the loading and unloading port assembly to the heating stage assembly at the corresponding heating temperature for heating, and to transport the heated wafer board of the heating stage assembly to the loading and unloading port assembly for unloading.

2. The wafer heating equipment according to claim 1, characterized in that, The loading / unloading port assembly includes a loading / unloading port feeding plate, a loading port assembly, and a unloading port assembly. The loading port assembly includes a loading port and a loading port lifting mechanism, and the unloading port assembly includes a unloading port and a unloading port lifting mechanism. The loading port and the unloading port are spaced apart on the loading / unloading port feeding plate. The loading port lifting mechanism and the unloading port lifting mechanism pass through the loading port and the unloading port, respectively. The loading port lifting mechanism lifts the wafer placed on the loading port, and the unloading port lifting mechanism places the wafer placed on it onto the unloading port. The clamping and transporting assembly clamps and transports the wafer from the loading port lifting mechanism to the heating stage assembly, and the clamping and transporting assembly places the heated wafer from the heating stage assembly onto the unloading port lifting mechanism.

3. The wafer heating equipment according to claim 2, characterized in that, The lifting mechanism for the feeding port and the lifting mechanism for the discharging port have the same structure, including a lifting cylinder, a lifting connecting plate, and lifting blocks located below the feeding port and the discharging port, respectively. The lifting connecting plate is set on the slide table of the lifting cylinder, and a plurality of lifting blocks are arranged concentrically on the lifting connecting plate. Through slots are respectively opened on the feeding port and the discharging port at the positions corresponding to the lifting blocks. The lifting blocks pass through the through slots. When the lifting cylinder extends, it drives the lifting blocks to pass through the feeding port and the discharging port, so that the upper end surface of the lifting block is above the feeding port and the discharging port. When the lifting cylinder retracts, the lifting blocks are lower than the upper surface of the feeding port and the discharging port.

4. The wafer heating equipment according to claim 1, characterized in that, The heating stage assembly includes a heating plate, a wafer positioning frame, and a heating stage lifting mechanism. The wafer positioning frame is disposed on the heating plate, and a plurality of heating rods and temperature sensors are disposed in the heating plate. The heating power of the heating rods is set according to their position on the heating stage. The heating stage lifting mechanism is located below the heating plate, passes through the heating plate and the wafer positioning frame, and is used to lift and place the wafer.

5. The wafer heating equipment according to claim 4, characterized in that, The heating platform lifting mechanism includes a lifting cylinder, a lifting connecting plate, and lifting blocks. The lifting connecting plate is disposed on the slide of the lifting cylinder, and a plurality of concentrically arranged lifting blocks are disposed on the lifting connecting plate. Through slots are respectively opened on the heating plate and the wafer positioning frame at the positions corresponding to the lifting blocks. The lifting blocks pass through the through slots. When the lifting cylinder extends, it drives the lifting blocks to pass through the heating plate and the wafer positioning frame, so that the upper end surface of the lifting blocks is above the heating plate and the wafer positioning frame. When the lifting cylinder retracts, the lifting blocks are lower than the upper surface of the heating plate and the wafer positioning frame.

6. The wafer heating equipment according to claim 3 or 5, characterized in that, The lifting block has at least one lifting end. When there are multiple lifting ends, the lifting ends are concentrically arranged and arranged sequentially from the center outwards at intervals, and the height of the lifting ends increases sequentially from the center outwards. The upper surface of each lifting end is set as an L-shaped structure, and the vertical feature of the L-shaped structure is an inclined structure.

7. The wafer heating equipment according to claim 1, characterized in that, The clamping and conveying assembly includes a linear displacement mechanism, a rotating mechanism, and a gripper mechanism. The rotating mechanism is mounted on the linear displacement mechanism, the gripper mechanism is mounted on the rotating mechanism, and the linear displacement mechanism is positioned between the two rows of heating platform assemblies.

8. The wafer heating equipment according to claim 7, characterized in that, The linear displacement mechanism is a linear slide module. Sensors are respectively installed at the front and rear ends of the linear slide module. The rotation mechanism is installed on the slide of the linear slide module, and a buffer is installed on one side of the slide.

9. The wafer heating device according to claim 8, characterized in that, The rotating mechanism includes a rotating cylinder connecting plate and a rotating cylinder. The rotating cylinder connecting plate is disposed on the slide of the linear slide module, the rotating cylinder is mounted on the rotating cylinder connecting plate, and the gripper mechanism is mounted on the rotating cylinder.

10. The wafer heating device according to claim 9, characterized in that, The gripper mechanism includes two linear slide cylinders that are spaced apart from each other on the rotary cylinder. Each of the two linear slide cylinders has a gripper fixedly mounted on it. The two linear slide cylinders drive the two grippers to move relative to each other or away from each other. Each gripper has an arc-shaped stepped surface.

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