Flexible electrode for electrolytic polishing of special-shaped semiconductor pipeline

Abstract

The utility model relates to the technical field of electrolytic polishing, and particularly discloses a flexible electrode for electrolytic polishing of a special-shaped semiconductor pipeline, which comprises a plurality of connectors arranged on a spring flexible shaft; the supporting assembly is rotationally installed on the periphery of the connector. According to the utility model, the spring flexible shaft and the flexible array electrode are supported by the supporting assembly, the supporting assembly abuts against the inner wall of the special-shaped semiconductor pipeline, and the supporting assembly is connected with the connector, so that the connector is not easy to bend and deform; in this way, the supporting assembly can abut against the inner wall of the special-shaped semiconductor pipeline all the time in the process of stretching into the special-shaped semiconductor pipeline, that is, the supporting assembly is flush with the section of the special-shaped semiconductor pipeline, and therefore the spring flexible shaft and the flexible array electrode are located in the center of the special-shaped semiconductor pipeline all the time. Therefore, the flexible array electrode is effectively prevented from being in contact with the inner wall of the special-shaped semiconductor pipeline to cause short circuit and burnout.

Description

TECHNICAL FIELD

[0001] The utility model belongs to electrolytic polishing technical field especially relates to a flexible electrode for electrolytic polishing of special-shaped semiconductor pipeline. BACKGROUND

[0002] Electrolytic polishing is to immerse the workpiece to be polished and the insoluble metal as cathode into the electrolytic tank at the same time, and to generate selective anode dissolution by direct current ionization reaction, so as to achieve the effect of removing fine burrs on the surface of the workpiece and increasing brightness.

[0003] At present, when electrolytic polishing is carried out on special-shaped semiconductor pipeline, the flexible electrode is generally inserted into the pipeline, and then electrolyte is continuously poured from one end of the pipeline, so as to achieve the purpose of electrolytic polishing, but the flexible electrode is easy to contact with the pipe wall and cause short circuit and burnout.

[0004] In view of the above technical problems, the applicant has searched some prior art to realize that the flexible electrode does not contact with the pipe wall during work, for example, the flexible twisted cathode and the method for electrochemical polishing of complex inner channel thereof disclosed in patent publication No. CN114959864B, the main technical means of which is that the non-conductive microfilament is clamped by N metal wires in the middle, and two metal wires are stretched out at both ends; the stretched segments of the multiple non-conductive microfilaments are consistent in length to realize the radial positioning of the metal wires in the inner channel of the workpiece, so as to keep the constant processing gap between the cathode and the inner surface of the inner channel; the multiple non-conductive microfilaments are arranged non-uniformly along the axial direction of the inner channel, and are arranged sparsely at the vertical position of the inner channel to improve the passing capacity of the polishing liquid, and are arranged closely at the curved position to increase the supporting force and prevent short circuit. Through the analysis of the applicant, the disadvantages of the technical scheme are that the non-conductive microfilament may be extruded by the inner wall of the curved part of the pipeline when it is inserted into the pipeline, which may cause the non-conductive microfilament to bend and deform, and the non-conductive microfilament may also bend and deform when the flexible shaft rotates, so that the flexible electrode is not at the center position of the pipeline, and if the non-conductive microfilament bends severely, it may still cause the electrode to touch the inner wall of the pipeline and cause short circuit and burnout. SUMMARY

[0005] The utility model aims at the deficiencies of the prior art, and provides a flexible electrode for electrolytic polishing of special-shaped semiconductor pipeline, so as to solve the technical problems that the non-conductive microfilament may be extruded by the inner wall of the curved part of the pipeline and bend and deform when the flexible electrode is inserted into the pipeline, which may cause the electrode to touch the inner wall of the pipeline and cause short circuit and burnout.

[0006] The purpose of the utility model can be realized by the following technical schemes:

[0007] A flexible electrode for electrolytic polishing of a special-shaped semiconductor pipeline, comprising a spring flexible shaft and a flexible array electrode arranged on the spring flexible shaft, the electrode further comprising:

[0008] A connecting head is arranged on the spring flexible shaft;

[0009] A support assembly is rotatably installed on the periphery of the connecting head.

[0010] As a preferred embodiment of the above technical solution, the support assembly comprises a movable ring rotatably sleeved on the periphery of the connecting head, a plurality of support rods movably installed on the periphery of the movable ring, and rollers installed at the ends of the support rods.

[0011] As a preferred embodiment of the above technical solution, the support assembly further comprises a connecting ring movably installed with a plurality of movable rods, and the other ends of the movable rods are rotatably connected with the support rods.

[0012] As a preferred embodiment of the above technical solution, the connecting ring is provided with a fixing seat on the periphery, the fixing seat is connected with a connecting rope, and the fixing seats in the plurality of support assemblies are connected through the connecting rope.

[0013] As a preferred embodiment of the above technical solution, a liquid flushing pipe is installed in the spring flexible shaft, a plurality of spray heads are installed on the periphery of the liquid flushing pipe, and the spray heads are located at the gaps of the spring flexible shaft.

[0014] As a preferred embodiment of the above technical solution, the structures in the support assembly are made of insulating and insoluble materials.

[0015] The utility model discloses the beneficial effects are:

[0016] 1、 the utility model discloses, through support assembly supports spring flexible shaft and flexible array electrode, and support assembly is pressed against the inner wall of special-shaped semiconductor pipeline, because support assembly is connected with connecting head, and connecting head is not easy to bend and deform, so that support assembly can always be in contact with the inner wall of special-shaped semiconductor pipeline in the process of stretching into special-shaped semiconductor pipeline, that is, support assembly is flush with the cross section of special-shaped semiconductor pipeline, so that spring flexible shaft and flexible array electrode always locate the central position of special-shaped semiconductor pipeline, thereby effectively avoiding that flexible array electrode contacts the inner wall of special-shaped semiconductor pipeline and is short-circuited and burnt out;

[0017] 2. In the utility model, when the spring flexible shaft drives the flexible array electrode to rotate to electrolytic polish the inner wall of the special-shaped semiconductor pipeline, the support assembly rotates relative to the spring flexible shaft and the connecting head, so that the support assembly remains stationary when the spring flexible shaft and the connecting head rotate, so that the spring flexible shaft and the flexible array electrode are always located at the center position of the special-shaped semiconductor pipeline when the flexible array electrode rotates to electrolytic polish the inner wall of the special-shaped semiconductor pipeline, further effectively avoiding the flexible array electrode from short-circuiting and burning out by contacting the inner wall of the special-shaped semiconductor pipeline;

[0018] 3. In the utility model, when the support assembly extends into the special-shaped semiconductor pipeline, the spring flexible shaft can quickly extend into the special-shaped semiconductor pipeline through the support of the plurality of support rods and the rolling of the plurality of rollers. At the same time, when the support assembly extends into the special-shaped semiconductor pipeline, the rollers contact the inner wall of the special-shaped semiconductor pipeline, so that the roughness of the inner wall of the special-shaped semiconductor pipeline is not easily changed. The fine wire in the prior art is easy to scratch the inner wall of the pipeline when extending into the inner wall of the pipeline, resulting in a rougher inner wall of the pipeline, which reduces the polishing effect during subsequent electrolytic polishing. The rollers here can effectively prevent the inner wall of the special-shaped semiconductor pipeline from being scratched, so as to ensure that the roughness of the inner wall of the special-shaped semiconductor pipeline is not easily changed, and effectively prevent the electrolytic polishing effect of the special-shaped semiconductor pipeline from being reduced during electrolytic polishing. BRIEF DESCRIPTION OF DRAWINGS

[0019] Figure 1 It is a schematic diagram of the structure in the special-shaped semiconductor pipeline of the utility model;

[0020] Figure 2 It is a schematic diagram of part of the structure of the utility model;

[0021] Figure 3 It is a schematic diagram of the structure of the spring flexible shaft and the connecting head;

[0022] Figure 4 It is a schematic diagram of the structure of the support assembly.

[0023] In the drawing:

[0024] 1. Spring flexible shaft; 2. Connecting head; 3. Flexible array electrode; 4. Liquid flushing pipe; 41. Spray head; 5. Support assembly; 51. Movable ring; 52. Support rod; 53. Connecting ring; 54. Movable rod; 55. Roller; 56. Fixed seat; 57. Connecting rope. DETAILED DESCRIPTION

[0025] With reference to the drawings and embodiments of the present application, the technical solutions in the embodiments of the present application will be clearly and completely described. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments of the present application, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of the present application.

[0026] As shown in Figures 1-4 A flexible electrode for electrolytic polishing of a special-shaped semiconductor pipeline, comprising a spring flexible shaft 1 and a flexible array electrode 3 arranged on the spring flexible shaft 1, the electrode further comprises:

[0027] A connecting head 2 is arranged on the spring flexible shaft 1.

[0028] A support assembly 5 is rotatably installed on the periphery of the connecting head 2.

[0029] In one case of the present embodiment, the connecting head 2 is made of conductive material, so that the flexible array electrode 3 on the spring flexible shaft 1 can be connected.

[0030] In actual application, the spring flexible shaft 1 is inserted into the special-shaped semiconductor pipeline together with the support assembly 5, and the spring flexible shaft 1 and the flexible array electrode 3 are supported by the support assembly 5, and the support assembly 5 abuts against the inner wall of the special-shaped semiconductor pipeline. Since the support assembly 5 is connected with the connecting head 2, and the connecting head 2 is not easy to bend and deform, the support assembly 5 can always abut against the inner wall of the special-shaped semiconductor pipeline during the insertion process, that is, the support assembly 5 is flush with the cross section of the special-shaped semiconductor pipeline. In this way, the spring flexible shaft 1 and the flexible array electrode 3 are always located at the center position of the special-shaped semiconductor pipeline, thereby effectively avoiding the flexible array electrode 3 from contacting the inner wall of the special-shaped semiconductor pipeline and being short-circuited and burned out.

[0031] When the spring flexible shaft 1 drives the flexible array electrode 3 to rotate to electrolytically polish the inner wall of the special-shaped semiconductor pipeline, since the support assembly 5 rotates relative to the spring flexible shaft 1 and the connecting head 2, the support assembly 5 remains stationary when the spring flexible shaft 1 and the connecting head 2 rotate. Therefore, when the flexible array electrode 3 rotates to electrolytically polish the inner wall of the special-shaped semiconductor pipeline, the spring flexible shaft 1 and the flexible array electrode 3 are always located at the center position of the special-shaped semiconductor pipeline, further effectively avoiding the flexible array electrode 3 from contacting the inner wall of the special-shaped semiconductor pipeline and being short-circuited and burned out.

[0032] Further, the support assembly 5 comprises a movable ring 51 rotatably sleeved on the periphery of the connecting head 2, a plurality of support rods 52 movably installed on the periphery of the movable ring 51, and rollers 55 installed at the ends of the support rods 52.

[0033] In one case of the embodiment, the rollers 55 roll radially along the inner wall of the pipe.

[0034] In actual application, when the support assembly 5 extends into the special-shaped semiconductor pipe, the spring flexible shaft 1 can quickly extend into the special-shaped semiconductor pipe through the support of the support rods 52 and the rolling of the rollers 55. At the same time, when the support assembly 5 extends into the special-shaped semiconductor pipe, the rollers 55 are in contact with the inner wall of the special-shaped semiconductor pipe, so that the roughness of the inner wall of the special-shaped semiconductor pipe is not easily changed. In the prior art, the filaments are easily scratched when extending into the inner wall of the pipe, which causes the inner wall of the pipe to be more rough, and reduces the polishing effect during subsequent electrolytic polishing. The rollers 55 can effectively prevent the inner wall of the special-shaped semiconductor pipe from being scratched, so as to ensure that the roughness of the inner wall of the special-shaped semiconductor pipe is not easily changed, and effectively prevent the electrolytic polishing effect of the special-shaped semiconductor pipe from being reduced during electrolytic polishing.

[0035] When the spring flexible shaft 1 drives the flexible array electrode 3 to rotate, the rollers 55 are in radial contact with the inner wall of the special-shaped semiconductor pipe, so that the support rods 52 can be kept stable by the rollers 55, thereby ensuring that the spring flexible shaft 1 and the flexible array electrode 3 are always located at the center position of the special-shaped semiconductor pipe when the flexible array electrode 3 rotates to perform electrolytic polishing on the inner wall of the special-shaped semiconductor pipe, thereby further effectively preventing the flexible array electrode 3 from being short-circuited and burned out by contacting the inner wall of the special-shaped semiconductor pipe.

[0036] Further, the support assembly 5 further comprises a connecting ring 53, a plurality of movable rods 54 are movably mounted on the periphery of the connecting ring 53, and the other end of the movable rod 54 is rotatably connected with the support rod 52.

[0037] Further, the connecting ring 53 is provided with a fixed seat 56 on the periphery, the fixed seat 56 is connected with a connecting rope 57, and the fixed seats 56 in the plurality of support assemblies 5 are connected through the connecting rope 57.

[0038] In actual application, by moving the position of the connecting ring 53, the movable rods 54 can drive the support rods 52 to expand or contract synchronously, so that the support assembly 5 can adapt to special-shaped semiconductor pipes with different inner diameters, thereby improving the practicability. At the same time, by expanding the support rods 52 synchronously, the support rods 52 can maintain a relatively stable state after expansion, thereby ensuring that the spring flexible shaft 1 and the flexible array electrode 3 are always located at the center position of the special-shaped semiconductor pipe.

[0039] Pull the connecting rope 57 outside the special-shaped semiconductor pipeline to drive the connecting rope 57 to move a plurality of fixing bases 56, thereby moving a plurality of connecting rings 53, and then control a plurality of supporting rods 52 to expand or shrink synchronously, which is controlled by the connecting rope 57, and the connecting rope 57 is separately arranged with the spring flexible shaft 1, so that the connecting rope 57 is not affected when the spring flexible shaft 1 rotates, thereby improving the practical operability of the utility model.

[0040] As shown in Figure 2 and Figure 3 , the spring flexible shaft 1 is internally provided with a liquid flushing pipe 4, and a plurality of spray heads 41 are arranged on the periphery of the liquid flushing pipe 4, and the spray heads 41 are located at the interspace of the spring flexible shaft 1.

[0041] In actual application, the special-shaped semiconductor pipeline is placed in an inclined state, the spring flexible shaft 1, the flexible array electrode 3 and the supporting assembly 5 are inserted into the special-shaped semiconductor pipeline, electrolyte is continuously poured at the highest end of the special-shaped semiconductor pipeline, electrolyte is poured into the liquid flushing pipe 4 at the same time, the electrolyte is sprayed from the spray heads 41, and the electrolyte poured from the pipeline port is combined, so that the electrolyte can fully contact the inner wall of the special-shaped semiconductor pipeline, thereby improving the electrolytic polishing efficiency, and the spring flexible shaft 1 drives the flexible array electrode 3 and the liquid flushing pipe 4 to rotate, so that the electrolyte sprayed from the spray heads 41 can flush the inner wall of the special-shaped semiconductor pipeline, thereby further improving the electrolytic polishing efficiency.

[0042] As shown in Figures 1-4 , the structures in the supporting assembly 5 are insulating and insoluble materials.

[0043] In actual application, the structural material in the supporting assembly 5 can be a carbon fiber material, or other insulating and insoluble materials, and the structural material in the supporting assembly 5 is insulated and insoluble, so that the structures in the supporting assembly 5 do not easily affect the normal electrolytic polishing of the flexible array electrode 3, thereby ensuring the electrolytic polishing effect, and the supporting assembly 5 has insolubility, so that the supporting assembly 5 can work normally in the electrolyte, and the service life of the supporting assembly 5 is ensured.

[0044] The basic principle, main features and advantages of the utility model are shown and described above. It should be understood by those skilled in the art that the utility model is not limited by the above examples, and the above examples and descriptions in the specification are only to illustrate the principle of the utility model, and various changes and improvements can be made without departing from the spirit and scope of the utility model, and these changes and improvements all fall within the scope of the utility model claimed.

Claims

1. A flexible electrode for profiled semiconductor tube electropolishing, comprising a spring mandrel (1) and a flexible array electrode (3) arranged on the spring mandrel (1), characterized in that, The electrode further comprises: A plurality of connecting heads (2) are arranged on the spring flexible shaft (1); A support assembly (5) is rotatably installed on the periphery of the connecting head (2).

2. The flexible electrode for electrolytic polishing of a profiled semiconductor pipe according to claim 1, characterized in that The support assembly (5) comprises a movable ring (51) rotatably sleeved on the periphery of the connecting head (2), a plurality of support rods (52) movably installed on the periphery of the movable ring (51), and rollers (55) installed at the ends of the support rods (52).

3. The flexible electrode for electrolytic polishing of a profiled semiconductor pipe according to claim 2, characterized in that The support assembly (5) further comprises a connecting ring (53) movably installed with a plurality of movable rods (54) on the periphery thereof, and the other ends of the movable rods (54) are rotatably connected with the support rods (52).

4. The flexible electrode for electrolytic polishing of a profiled semiconductor pipe according to claim 3, characterized in that A fixing seat (56) is arranged on the periphery of the connecting ring (53), a connecting rope (57) is connected to the fixing seat (56), and the fixing seats (56) in the plurality of support assemblies (5) are connected through the connecting rope (57).

5. The flexible electrode for electrolytic polishing of a profiled semiconductor pipe according to claim 1, characterized in that A flushing pipe (4) is installed in the spring flexible shaft (1), a plurality of nozzles (41) are installed on the periphery of the flushing pipe (4), and the nozzles (41) are located at the gaps of the spring flexible shaft (1).

6. The flexible electrode for electrolytic polishing of a profiled semiconductor pipe according to claim 1, characterized in that The structures in the support assembly (5) are made of insulating and insoluble materials.

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