PCB (Printed Circuit Board) manufactured by adopting lamination method

Abstract

The utility model discloses a printed circuit board (PCB) manufactured by adopting a lamination method, which relates to the technical field of PCBs and comprises a PCB core board, the upper board surface and the lower board surface of the PCB core board are respectively provided with an insulating resin layer and a copper foil layer, the insulating resin layers and the copper foil layers are respectively provided with openings, the bottoms of the openings are communicated with circuit patterns of the PCB core board, and the circuit patterns of the PCB core board are communicated with the circuit patterns of the PCB core board. The copper foil layer outside the insulating resin layer is removed, a copper tooth layer of the copper foil is left, metal seed layers are deposited on the surface of the insulating resin layer with residual copper teeth and in the open hole, a dry film is attached to the outside of the metal seed layers, a groove and an opening are formed in the dry film, the opening is located at the top of the open hole, and the groove is communicated with the open hole. A conductive copper layer is formed on the metal seed layer in an electroplating mode, the interface adjusting layer and the metal seed layer are manufactured through a PVD method, PVD equipment is lower in price, free of waste water treatment and environmentally friendly, the total thickness of copper teeth and the metal seed layer of the PCB is smaller than 1500 nm, and a fine circuit with the line width / line distance smaller than 20 m / 20 m can be manufactured.

Description

TECHNICAL FIELD

[0001] The utility model relates to PCB board technical field, concretely is a kind of PCB board made by lamination method. BACKGROUND

[0002] Printed circuit board (PCB board), on the insulating plate of certain size, some conductive patterns are processed, and it is provided with metalized hole (such as blind hole, through hole etc.), and its chassis, the interconnection of component between can be realized wiring board. With the development of electronic products towards high performance, miniaturization, the line width / line spacing of printed circuit board is currently developed to 40 / 40um, 30 / 30um, 20 / 20um stage.

[0003] At present, the mainstream process adopted by domestic and foreign manufacturers is modified semi-additive process (MSAP process), and the etching amount of MSAP process is 4-6um, and the minimum line width / line spacing that can be processed is 25 / 25um, which has not reached the level of 20 / 20um. SUMMARY

[0004] The utility model aims at providing a kind of PCB board made by lamination method to solve the problems raised in the above background.

[0005] To achieve the above object, the utility model provides the following technical scheme:

[0006] A kind of PCB board made by lamination method, including PCB core board, the upper and lower board surface of the PCB core board is provided with insulating resin layer and copper foil layer, the insulating resin layer and copper foil layer are all provided with opening, the bottom of the opening is communicated with the circuit pattern of PCB core board, the copper tooth layer of copper foil layer is removed except the insulating resin layer outside, the surface of residual copper tooth insulating resin layer and opening inside are all deposited with metal seed layer, the dry film is attached to the outside of the metal seed layer, the dry film is provided with recess and opening, and the opening is located at the top of the opening, the metal seed layer is electroplated to form conductive copper layer, the conductive copper layer fills recess and opening, and the metal seed layer and copper tooth at the bottom of dry film are removed by etching after removing dry film.

[0007] On the basis of the above technical scheme, the utility model further provides the following optional technical scheme:

[0008] In an alternative scheme: the insulating resin layer is one of B sheet, epoxy resin, phenolic resin, cyan acid resin, the B sheet contains glass fiber, and the epoxy resin, phenolic resin, cyan acid resin all do not contain glass fiber.

[0009] In an alternative scheme: the insulating resin layer and copper foil layer are all opened by laser drilling method, and the laser light source is one of UV light source, green picosecond laser and CO2 laser.

[0010] In an alternative, the material of the metal seed layer is one of nickel, chromium, titanium, and copper, and the thickness of the material is 200-800 nm.

[0011] In an alternative, the method of manufacturing the metal seed layer is PVD, and the total thickness of the copper tooth and the metal seed layer is less than 1500 nm.

[0012] Compared with the prior art, the PCB board manufactured by the lamination method has the following advantages:

[0013] The PCB board manufactured by the lamination method is manufactured by the PVD method to form the interface adjustment layer and the metal seed layer, the PVD equipment is lower in price, has no waste water treatment, is friendly to the environment, the total thickness of the copper tooth and the metal seed layer of the PCB board is less than 1500 nm, the etching amount is small, and fine lines with a line width / line spacing of less than 20 µm / 20 µm can be manufactured. BRIEF DESCRIPTION OF DRAWINGS

[0014] Figure 1 FIG. 1 is a structural schematic diagram of a PCB board manufactured by a lamination method;

[0015] Figure 2 FIG. 2 is a manufacturing process schematic diagram of the PCB board manufactured by the lamination method;

[0016] Figure 3 FIG. 3 is a structural schematic diagram of a thin copper foil and an insulating resin layer;

[0017] Figure 4 FIG. 4 is a schematic diagram of the thin copper foil and the insulating resin layer after being laminated;

[0018] Figure 5 FIG. 5 is a schematic diagram of a copper tooth layer left after the thin copper foil is removed from the insulating resin layer;

[0019] The reference signs are annotated as follows: 1-PCB core board, 2-insulating resin layer, 3-copper foil layer, 4-opening, 5-metal seed layer, 6-dry film, 7-conductive copper layer, 8-PCB board body, 3A-copper foil layer of thin copper foil, 3B-copper tooth layer of thin copper foil. DETAILED DESCRIPTION

[0020] In order to make the purpose, technical scheme and advantages of the utility model more clearly, the following will be further explained in detail by combining with the drawings and examples; in the drawings or the description, similar or same parts use the same reference signs, and in the practical application, the shape, thickness or height of each component can be enlarged or reduced. The examples listed in the utility model are only used to illustrate the utility model, and are not used to limit the scope of the utility model. Any obvious modification or change made to the utility model does not deviate from the spirit and scope of the utility model.

[0021] In one embodiment, as shown in Figures 1-2 A PCB board made by lamination method comprises a PCB core board 1, an insulating resin layer 2 and a thin copper foil layer 3 are laminated on the upper and lower surfaces of the PCB core board 1, a hole is drilled on the thin copper foil and the insulating resin layer 2 by laser, the bottom of the hole 4 is communicated with the circuit pattern of the PCB core board 1, the copper foil layer 3A of the thin copper foil is removed by etching method, leaving all or part of the copper tooth layer 3B, a metal seed layer 5 is deposited on the surface of the insulating resin layer 2 including the inside of the hole 4, a dry film 6 is laminated on the metal seed layer 5, a circuit groove and an opening are made on the dry film 6 by exposure and development, the opening is located at the top of the hole 4, a metal conductive copper layer 7 is formed on the metal seed layer 5 by electroplating, the conductive copper layer 7 fills the groove and the hole, forming a circuit and a blind hole, after removing the dry film layer, the metal seed layer 5 at the bottom of the dry film layer is removed by etching, obtaining a PCB board body 8, and the total thickness of the copper tooth 3B and the metal seed layer 5 is less than 1500nm.

[0022] In one embodiment, as shown in Figure 1 The insulating resin layer 2 is a B sheet containing glass fiber or an epoxy resin, a phenolic resin or a cyan acid resin without glass fiber, the total thickness of the thin copper foil is 1000-4000nm, and the thickness of the copper tooth is 600-1300nm.

[0023] In one embodiment, as shown in Figure 1 The insulating resin layer 2 and the copper foil layer 3 are both drilled by laser drilling method, and the laser light source is one of UV light source, green picosecond laser and CO2 laser.

[0024] In one embodiment, as shown in Figure 1 The material of the metal seed layer is nickel, chromium, titanium or copper, and the thickness is 200-800nm

[0025] In one embodiment, as shown in Figure 2 The manufacturing method of the metal seed layer is PVD method, and the total thickness of the copper tooth and the metal seed layer is less than 1500nm.

[0026] In the above embodiment of the utility model, the manufacturing method of the interface adjustment layer and the metal seed layer 5 is PVD method, compared with the conventional chemical plating method, the PVD equipment is lower in price, the PVD method has no waste water treatment and is friendly to the environment, the total thickness of the copper tooth and the metal seed layer 5 is less than 1500nm, the etching amount is less than 3.0 um, and the circuit with a line width / line spacing of less than 20 / 20 um can be processed.

[0027] The above merely provides the specific implementation of the present disclosure, but the protection scope of the present disclosure is not limited thereto, any person skilled in the art can easily think of the changes or replacements within the technical range disclosed by the present disclosure, which should be covered within the protection scope of the present disclosure. Therefore, the protection scope of the present disclosure should be subject to the protection scope of the claims.

Claims

1. A PCB board made by a build-up method, comprising a PCB core board, characterized in that, The upper and lower surfaces of the PCB core plate are provided with insulating resin layers and copper foil layers, the insulating resin layers and the copper foil layers are provided with openings, the bottoms of the openings are communicated with the circuit patterns of the PCB core plate, the copper tooth layers of the copper foil layers are left after removing the copper foil layers outside the insulating resin layers, the surfaces of the insulating resin layers with the copper tooth layers are deposited with metal seed layers, the metal seed layers are externally attached with dry films, the dry films are provided with grooves and openings, the openings are located at the tops of the openings, the metal seed layers are electroplated with conductive copper layers, the conductive copper layers fill the grooves and the openings, the dry films are removed and the metal seed layers and the copper tooth layers at the bottoms of the dry films are removed by etching.

2. The PCB made by the build-up method according to claim 1, wherein, The insulating resin layer is one of B sheet, epoxy resin, phenolic resin and cyan acid resin, the B sheet contains glass fiber, and the epoxy resin, the phenolic resin and the cyan acid resin do not contain glass fiber.

3. The PCB made by the build-up method according to claim 1, wherein, The insulating resin layer and the copper foil layer are both opened by laser drilling method, and the laser light source is one of UV light source, green picosecond laser and CO2 laser.

4. The PCB made by the build-up process according to claim 1, wherein, The material of the metal seed layer is one of nickel, chromium, titanium and copper, and the material thickness is 200-800 nm.

5. The PCB made by the build-up method according to claim 4, wherein, The metal seed layer is made by PVD method, and the total thickness of the copper tooth and the metal seed layer is less than 1500 nm.

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