Copper surface treatment device for circuit board processing

Abstract

The utility model relates to a copper surface processing device for circuit board processing. The copper surface processing device comprises a box body, a mounting frame, a fixing assembly and a polishing assembly, the mounting rack is arranged on the box body, the shape of the mounting rack is a hollow cuboid with the front side and the rear side missing, and the fixing assembly is arranged in the box body and used for fixing a circuit board. According to the copper surface treatment device for circuit board machining, through the design of a suction cup and an air pump in the fixing assembly, stable adsorption and fixing of a circuit board are achieved, shielding of the polished surface of the circuit board caused by traditional fixture or screw fixing is avoided, smooth proceeding of the polishing or machining process is ensured, the polishing assembly adopts an X-axis and Y-axis double-movement module, and the machining efficiency is improved. And by combining height adjustment of the air cylinder, the grinding disc can move two-dimensionally above the circuit board, so that the copper surface of the circuit board is comprehensively ground, the grinding efficiency is improved, and the uniformity and consistency of the grinding quality are ensured.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of circuit board processing, specifically to a copper surface treatment device for circuit board processing. BACKGROUND

[0002] The copper surface treatment device for circuit board processing is a device used to treat the copper surface of a circuit board, especially an integrated circuit board. These devices usually contain multiple functional modules designed to clean, grind, protect, or modify the copper surface of the circuit board to meet the requirements of subsequent manufacturing processes.

[0003] Currently, the copper surface treatment devices widely used in the circuit board processing industry generally rely on clamping mechanisms to secure the circuit board when treating the copper surface, to ensure the accuracy and stability of the processing process. However, these clamping devices often have limitations in their design, as they typically apply clamping force from both the top and bottom sides of the circuit board to secure it. While this approach meets the fixation needs of the processing process to some extent, it also presents a problem that cannot be ignored: the clamped areas inevitably block part of the copper surface when it is being polished, buffed, or subjected to other treatment processes.

[0004] Specifically, when the clamping device tightly clamps the top and bottom surfaces of the circuit board, these clamped areas cannot directly contact the polishing tool or treatment liquid, resulting in ineffective treatment of the copper surface in these areas. This not only affects the overall uniformity and consistency of the circuit board's copper surface, but also can cause quality problems such as uneven copper surface roughness, incomplete removal of the oxidation layer, etc., which in turn affect the electrical performance and long-term reliability of the circuit board.

[0005] In addition, the traditional clamping method can also cause physical damage to the circuit board, such as indentation, bending, or stress concentration, due to excessive clamping force. These problems also reduce the quality and usability of the circuit board. Therefore, how to design a copper surface treatment device that can effectively secure the circuit board while avoiding blocking the copper surface treatment area and reducing physical damage has become a technical problem that needs to be solved in the current circuit board processing field. The ideal solution may need to explore new clamping mechanisms, such as edge clamping, vacuum suction, or flexible clamps, to achieve efficient and precise processing of the circuit board without affecting the overall treatment of the copper surface. SUMMARY

[0006] To address the deficiencies of the prior art, the utility model provides a copper surface treatment device for circuit board processing, which solves the problems raised in the background art.

[0007] In order to achieve the above object, the utility model provides the following technical scheme: A copper surface treatment device for circuit board processing, it includes box, mounting frame, fixed component and polishing assembly,

[0008] The mounting frame is arranged on the box, the shape of the mounting frame is a hollow cuboid with both sides missing, the fixed component is arranged in the inside of the box for fixing the circuit board,

[0009] The polishing assembly is installed on the mounting frame for polishing the fixed circuit board,

[0010] The fixed component includes the shell installed in the inner bottom wall of the mounting frame, a plurality of support pipes are communicated with the upper end surface of the shell, the top end of the support pipe is communicated with the suction cup, the air pump is arranged on the inner bottom wall of the box, and the input end of the air pump is communicated with the connecting pipe with one end communicated with the shell.

[0011] Further, a plurality of support pipes are arranged in a rectangular array on the XY plane.

[0012] Further, the suction cup is made of elastic plastic.

[0013] Further, the inner bottom wall of the mounting frame is provided with a through hole for the connecting pipe to penetrate.

[0014] Further, the polishing assembly includes the X-axis motion module arranged on the inner top wall of the mounting frame, the Y-axis motion module is drivingly connected to the X-axis motion module, and the support frame is drivingly connected to the Y-axis motion module.

[0015] The inside of the support frame is provided with an air cylinder, the output end of the air cylinder is drivingly connected with the mounting cylinder, the inside of the mounting cylinder is provided with a motor, and the output end of the motor is drivingly connected with the polishing disc.

[0016] Further, the polishing disc is located above the shell.

[0017] Compared with the prior art, the technical scheme of the application has the following beneficial effects:

[0018] The copper surface treatment device for circuit board processing realizes stable adsorption and fixation of the circuit board through the design of the suction cup and the air pump in the fixed component, avoids the shielding of the polishing surface of the circuit board caused by the traditional clamp or screw fixation, ensures the smooth progress of the polishing or processing process, the polishing assembly adopts X-axis and Y-axis double motion modules, and the height adjustment of the air cylinder makes the polishing disc move in two dimensions above the circuit board, so that the copper surface of the circuit board is polished comprehensively, not only the polishing efficiency is improved, but also the uniformity and consistency of the polishing quality are ensured. BRIEF DESCRIPTION OF DRAWINGS

[0019] Figure 1 It is a structure schematic view of the utility model;

[0020] Figure 2 It is a structure schematic view of the utility model fixed assembly;

[0021] Figure 3 It is a structure schematic view of the utility model polishing assembly;

[0022] Figure 4 It is a structure schematic view of the utility model polishing assembly from the top;

[0023] Figure 5 It is a structure schematic view of the utility model installation cylinder and motor connection.

[0024] In the figure: 1, box body;2, mounting frame;3, fixed assembly;301, shell;302, support pipe;303, suction cup;304, air pump;305, connecting pipe;4, polishing assembly;401, X-axis movement module;402, Y-axis movement module;403, support frame;404, air cylinder;405, installation cylinder;406, motor;407, polishing disc. DETAILED DESCRIPTION

[0025] The technical solutions in the embodiments of the utility model will be clearly and completely described below with reference to the drawings in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, rather than all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the utility model.

[0026] Please refer to Figure 1 The copper surface treatment device for circuit board processing in the embodiment can fix the circuit board and will not cause the upper and lower surfaces of the circuit board to be shielded, so that the copper surface on the circuit board can be effectively polished.

[0027] Specifically, it comprises a box body 1, a mounting frame 2, a fixed assembly 3 and a polishing assembly 4. The mounting frame 2 is arranged on the box body 1, and the mounting frame 2 is in the shape of a hollow cuboid with the front and rear sides missing. The fixed assembly 3 is arranged in the interior of the box body 1 to fix the circuit board. The polishing assembly 4 is installed on the mounting frame 2 to polish the fixed circuit board.

[0028] In actual use, the circuit board is placed on the fixed assembly 3, and the fixed assembly 3 is used to fix the circuit board, so that the copper surface of the circuit board faces the direction of the polishing assembly 4, and the polishing assembly 4 is used to polish the copper surface of the circuit board.

[0029] Please refer to Figure 2In order to fix the circuit board, the fixing assembly 3 in the embodiment includes a shell 301 mounted on the inner bottom wall of the mounting frame 2, a plurality of support pipes 302 communicated with the upper end surface of the shell 301, suction cups 303 communicated with the top ends of the support pipes 302, a gas pump 304 arranged on the inner bottom wall of the box body 1, a connecting pipe 305 with one end communicated with the shell 301 communicated with the input end of the gas pump 304, and a through hole for the connecting pipe 305 to penetrate arranged on the inner bottom wall of the mounting frame 2.

[0030] In actual use, the circuit board is placed above the suction cups 303, the air inside the support pipes 302 is extracted by the operation of the gas pump 304, so that the support pipes 302 and the suction cups 303 are in a state of negative pressure, thereby adsorbing and fixing the lower surface of the circuit board. This fixing method avoids the shielding of the polished surface of the circuit board caused by the traditional clamp or screw fixing, and ensures the smooth progress of the polishing or processing process.

[0031] In actual setting, the plurality of support pipes 302 are arranged in a rectangular array on the XY plane, which can ensure that the circuit board is uniformly supported by the plurality of support pipes 302, avoid the situation that the local pressure is too large or the support is insufficient, thereby protecting the circuit board from being damaged, and the plurality of support pipes 302 are uniformly distributed, which can more effectively disperse the weight of the circuit board and the force generated during processing, improve the stability of the fixing, and prevent the circuit board from moving or deforming during processing.

[0032] Further, the suction cups 303 are made of elastic plastic, so that the suction cups 303 have a certain flexibility and can adapt to circuit boards of different shapes and sizes, improving the flexibility and versatility of the fixing.

[0033] Please refer to Figures 3-5 In order to achieve comprehensive polishing effect on the copper surface of the circuit board, the polishing assembly 4 in the embodiment includes an X-axis motion module 401 arranged on the inner top wall of the mounting frame 2, a Y-axis motion module 402 movably connected to the X-axis motion module 401, and a support frame 403 movably connected to the Y-axis motion module 402.

[0034] The support frame 403 is provided with a gas cylinder 404, the output end of the gas cylinder 404 is drivingly connected with a mounting cylinder 405, the mounting cylinder 405 is provided with a motor 406, and the output end of the motor 406 is drivingly connected with a polishing disc 407.

[0035] It should be noted that the polishing disc 407 is located above the shell 301.

[0036] In actual use, first, the X-axis movement module 401 and the Y-axis movement module 402 work together to realize movement in a two-dimensional plane through transmission connection, the X-axis movement module 401 is responsible for movement in the X-axis direction, and the Y-axis movement module 402 is responsible for movement in the Y-axis direction, so that the polishing assembly 4 mounted thereon can move freely above the entire circuit board.

[0037] Further, when the output end of the air cylinder 404 extends, the mounting cylinder 405 and the motor 406 and the polishing disc 407 inside it are pushed to move downward until the polishing disc 407 contacts the copper surface of the circuit board, when the motor 406 starts, it will drive the polishing disc 407 to rotate at high speed through transmission connection, the rotating polishing disc 407 contacts the copper surface of the circuit board, and the copper surface is polished through friction.

[0038] Further, through the coordinated movement of the double movement modules and the height adjustment of the air cylinder 404, the polishing disc 407 can move in two dimensions on the circuit board, so as to realize overall polishing of the copper surface of the circuit board, which not only improves the polishing efficiency, but also ensures the uniformity and consistency of the polishing quality.

[0039] In addition, during the entire polishing process, the fixed assembly 3 stably adsorbs and fixes the circuit board through the suction cup 303, prevents the circuit board from moving or deforming during the polishing process, not only improves the polishing accuracy, but also protects the circuit board from being damaged, and prevents the polishing surface from being blocked.

[0040] Although the embodiments of the utility model have been shown and described, it can be understood by those skilled in the art that various changes, modifications, replacements and variations can be made to these embodiments without departing from the principles and spirits of the utility model, the scope of the utility model is defined by the appended claims and their equivalents.

Claims

1. A copper surface treatment device for circuit board processing, characterized in that: The utility model provides a circuit board polishing device, including box (1), mounting frame (2), fixed assembly (3) and polishing assembly (4); The mounting frame (2) is provided on the box (1), the mounting frame (2) is the long cuboid of inside hollow and both sides of front and back are missing, the fixed assembly (3) is provided in the inside of the box (1), is used to fix circuit board; The polishing assembly (4) is installed on the mounting frame (2), is used to polish the fixed circuit board; The fixed assembly (3) includes the casing (301) installed in the inner bottom wall of the mounting frame (2), a plurality of support tubes (302) are communicated with the upper end surface of the casing (301), the top end of the support tube (302) is communicated with the suction disc (303), the air pump (304) is arranged on the inner bottom wall of the box (1), the input end of the air pump (304) is communicated with the connecting pipe (305) one end with the casing (301) communication.

2. The copper surface processing apparatus for processing a circuit board according to claim 1, characterized by: A plurality of support tubes (302) are arranged in a rectangular array on the XY plane.

3. The copper surface processing apparatus for processing a circuit board according to claim 1, characterized by: The suction disc (303) is made of elastic plastic.

4. The copper surface processing apparatus for processing a circuit board according to Claim 1, wherein: A through hole is formed in the inner bottom wall of the mounting frame (2) for the connecting pipe (305) to pass through.

5. The copper surface processing apparatus for processing a circuit board according to Claim 1, wherein: The polishing assembly (4) includes an X-axis motion module (401) arranged on the inner top wall of the mounting frame (2), a Y-axis motion module (402) is drivingly connected to the X-axis motion module (401), and a support frame (403) is drivingly connected to the Y-axis motion module (402). The support frame (403) is provided with an air cylinder (404) inside, the output end of the air cylinder (404) is drivingly connected with a mounting cylinder (405), the inside of the mounting cylinder (405) is provided with a motor (406), and the output end of the motor (406) is drivingly connected with a polishing disc (407).

6. The copper surface processing apparatus for processing a circuit board according to claim 5, characterized by: The polishing disc (407) is located above the casing (301).

Images