Miniature probe and monitoring equipment

Abstract

The utility model discloses a miniature probe and monitoring equipment. The miniature probe comprises a shell, a PCB substrate, a middle carrier plate and a first sensor, a containing cavity and an opening communicated with the containing cavity are defined in the shell, the PCB substrate is arranged in the containing cavity, and the PCB substrate is provided with a first bonding pad; the middle carrier plate is provided with a second bonding pad and a third bonding pad which are electrically connected with each other, and the middle carrier plate is attached to the PCB substrate, so that the first bonding pad and the second bonding pad are correspondingly welded; the first sensor is arranged in the containing cavity and provided with a first surface and a second surface which are opposite, the first surface can be exposed out of the opening, the second surface is provided with a fourth bonding pad, the first sensor is attached to the middle carrier plate, and the fourth bonding pad and the third bonding pad are correspondingly welded. The miniature probe is switched through the middle carrier plate instead of the existing metal lead, so that the problem that the metal lead is corroded is avoided.

Description

Technical Field

[0001] This utility model relates to the field of medical devices, and in particular to a miniature probe and monitoring device. Background Technology

[0002] In clinical practice and medical research, the measurement of pressure and temperature within the human body plays a crucial role. For example, critically ill patients require direct measurement of intracranial pressure, coronary artery pressure, and renal artery pressure through surgical intervention or implantation during treatment to obtain more accurate and subtle changes in vital signs of human organs. However, these areas are relatively narrow, and the required pressure and temperature sensors must be miniaturized to reach the lesion site for measurement. Due to their small size, light weight, and low power consumption, microelectromechanical systems (MEMS) technology offers new possibilities for monitoring physiological parameters within the human body.

[0003] Most existing miniature probes use metal leads to electrically connect pressure sensors, temperature sensors, and a PCB substrate, and then encapsulate the probe tip with silicone. However, because the probe tip is constantly immersed in blood, the blood can slowly seep into the silicone and corrode the metal leads, causing malfunctions in the pressure or temperature sensors. Utility Model Content

[0004] This invention aims to solve at least one of the technical problems existing in the prior art. To this end, this invention proposes a miniature probe, in which the first sensor is packaged on an intermediate carrier board using wafer-level packaging technology, and the intermediate carrier board is used for connection instead of the existing metal leads, thus avoiding the problem of corrosion of the metal leads.

[0005] This utility model also proposes a monitoring device having the above-mentioned miniature probe.

[0006] The miniature probe according to a first aspect embodiment of the present invention includes:

[0007] A housing, the housing defining a receiving cavity and an opening communicating with the receiving cavity;

[0008] A PCB substrate, wherein the PCB substrate is disposed in the accommodating cavity, and the PCB substrate is provided with a first pad;

[0009] An intermediate carrier board is provided with a second pad and a third pad that are electrically connected to each other. The intermediate carrier board is attached to the PCB substrate so that the first pad and the second pad are correspondingly soldered.

[0010] A first sensor is disposed in the accommodating cavity. The first sensor has a first surface and a second surface opposite to each other. The first surface can be exposed through the opening. The second surface is provided with a fourth pad. The first sensor is attached to the intermediate carrier plate, and the fourth pad is soldered to the third pad.

[0011] The miniature probe according to the embodiments of this utility model has at least the following beneficial effects:

[0012] The miniature probe of this application replaces the wire bonding process in the prior art by using an intermediate carrier board for connection. The sensor and the intermediate carrier board are bonded and connected, which greatly reduces the possibility of the circuit being corroded by blood, thereby extending the working time of the miniature probe in the human body and improving the working stability of the miniature probe, which is beneficial for medical personnel to obtain accurate physiological parameters. Furthermore, since the embodiments of this application adopt advanced 3D-Sip system-in-package (3D-System-in-Package) technology, automated packaging can be achieved, which greatly improves the production efficiency of the miniature probe.

[0013] According to some embodiments of the present invention, the intermediate carrier plate is made of monocrystalline silicon or silicon dioxide material.

[0014] According to some embodiments of the present invention, the first sensor and the PCB substrate are respectively attached to two opposite surfaces of the intermediate carrier plate. The intermediate carrier plate is provided with a through hole, and a conductive part is provided in the through hole. The second pad and the third pad are respectively provided at both ends of the through hole and are electrically connected through the conductive part.

[0015] According to some embodiments of the present invention, the first sensor and the PCB substrate are attached to the same surface of the intermediate carrier board, the intermediate carrier board is provided with printed circuits, and the second pad and the third pad are connected through the printed circuits.

[0016] According to some embodiments of the present invention, the first sensor is a pressure sensor, and the miniature probe further includes a temperature sensor, wherein the temperature sensor and the pressure sensor are communicatively connected.

[0017] According to some embodiments of the present invention, the pressure sensor is an absolute pressure sensor, which includes a first piezoresistive resistor, a second piezoresistive resistor, a third piezoresistive resistor, and a fourth piezoresistive resistor.

[0018] The first, second, third, and fourth piezoresistors are all located inside the absolute pressure sensor and form a Wheatstone full-bridge structure.

[0019] Alternatively, the first and second piezoresistors are located inside the absolute pressure sensor and form a Wheatstone half-bridge structure, while the third and fourth piezoresistors are located on the intermediate carrier board or the PCB substrate.

[0020] According to some embodiments of the present invention, the temperature sensor is a surface-mount thin-film resistor, which includes a substrate and a thermistor film, and the thermistor film is disposed on both opposite surfaces of the substrate.

[0021] According to some embodiments of the present invention, the micro probe further includes a conditioning chip, which is disposed on the intermediate carrier board and is communicatively connected to the pressure sensor and the temperature sensor, respectively.

[0022] According to some embodiments of the present invention, the accommodating cavity is filled with a first sealant and a second sealant. The second sealant covers at least a portion of the intermediate carrier plate and the PCB substrate to restrict the movement of the intermediate carrier plate and the PCB substrate in the accommodating cavity. The first sealant covers the first sensor and separates the second sealant from the opening to prevent external liquid from contacting the second sealant.

[0023] The monitoring device according to a second aspect of the present invention includes the miniature probe mentioned in the above embodiments.

[0024] Additional aspects and advantages of this invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0025] The present invention will be further described below with reference to the accompanying drawings and embodiments, wherein:

[0026] Figure 1 This is a schematic diagram of the structure of the miniature probe according to an embodiment of the present invention;

[0027] Figure 2 This is a partial exploded view of the miniature probe according to an embodiment of the present invention;

[0028] Figure 3 This is a schematic diagram of the structure of the first sensor according to an embodiment of the present invention;

[0029] Figure 4 This is a schematic diagram of the welding of the miniature probe according to an embodiment of the present invention;

[0030] Figure 5 This is another structural schematic diagram of the miniature probe according to an embodiment of the present invention.

[0031] Figure label:

[0032] 100mm shell; 110mm opening;

[0033] PCB substrate 200; First pad 210;

[0034] Intermediate carrier board 300; second pad 310; third pad 320; through-hole 330; printed circuit board 340;

[0035] First sensor 400; first surface 410; second surface 420; fourth pad 421; solder ball 422;

[0036] Temperature sensor 500; Substrate 510; Thermistor film 520;

[0037] Conditioning chip 600;

[0038] First sealant 700; Second sealant 710; Detailed Implementation

[0039] The embodiments of this utility model are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this utility model, and should not be construed as limiting this utility model.

[0040] In the description of this utility model, it should be understood that the directional descriptions, such as up, down, front, back, left, right, etc., indicate the directional or positional relationship based on the directional or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0041] In the description of this utility model, "several" means one or more, "multiple" means two or more, "greater than," "less than," and "exceeding" are understood to exclude the stated number, while "above," "below," and "within" are understood to include the stated number. The use of "first" and "second" in the description is merely for distinguishing technical features and should not be construed as indicating or implying relative importance, or implicitly indicating the number of indicated technical features, or implicitly indicating the order of the indicated technical features.

[0042] In the description of this utility model, unless otherwise explicitly defined, terms such as "setting," "installation," and "connection" should be interpreted broadly, and those skilled in the art can reasonably determine the specific meaning of the above terms in this utility model in conjunction with the specific content of the technical solution.

[0043] In the description of this utility model, the terms "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., refer to specific features, structures, materials, or characteristics described in connection with that embodiment or example, which are included in at least one embodiment or example of this utility model. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0044] In clinical practice and medical research, the measurement of pressure and temperature within the human body plays a crucial role. For example, critically ill patients require direct measurement of intracranial pressure, coronary artery pressure, and renal artery pressure through surgical intervention or implantation during treatment to obtain more accurate and subtle changes in vital signs of human organs. However, these areas are relatively narrow, and the required pressure and temperature sensors must be miniaturized to reach the lesion site for measurement. Due to their small size, light weight, and low power consumption, microelectromechanical systems (MEMS) technology offers new possibilities for monitoring physiological parameters within the human body.

[0045] Most existing miniature probes use metal leads to electrically connect pressure sensors, temperature sensors, and a PCB substrate, and then encapsulate the probe tip with silicone. However, because the probe tip is constantly immersed in blood, the blood can slowly seep into the silicone and corrode the metal leads, causing malfunctions in the pressure or temperature sensors.

[0046] To address the problem of easy corrosion of metal lead connections in existing technologies, this application proposes a miniature probe, such as... Figures 1 to 4 As shown, the miniature probe includes a housing 100, a PCB substrate 200, an intermediate carrier plate 300, and a first sensor 400. The housing 100 is a hollow tubular structure that defines an internal cavity. The PCB substrate 200, the intermediate carrier plate 300, and the first sensor 400 are all disposed within the cavity. An opening 110 is provided at the end of the housing 100 that extends into the human body. The opening 110 communicates with the cavity to expose the first sensor 400 within the cavity. It is understood that a shielding layer is provided on the housing 100 to shield external electromagnetic signals. This shielding layer can be disposed on the cavity wall or on the outer peripheral surface of the housing 100.

[0047] The PCB substrate 200 is disposed within the accommodating cavity. It should be noted that, considering the need for flexibility in miniature probes, the PCB substrate 200 is often made of flexible materials. For example, the PCB substrate 200 may employ a flexible circuit board structure, allowing for a certain degree of bending. Understandably, flexible circuit boards are generally thinner and have relatively poorer mechanical properties. In existing technologies, sensors are directly soldered onto flexible circuit boards, which can easily lead to adverse effects on the zero drift and time drift of the sensor due to welding thermal stress, thereby affecting the product stability and production yield of the miniature probe.

[0048] In this embodiment, the first sensor 400 is disposed on an intermediate carrier board 300 and is connected via the intermediate carrier board 300. Specifically, the intermediate carrier board 300 is provided with a second pad 310 and a third pad 320 that are electrically connected to each other. Figure 2 and Figure 4 As shown, the intermediate carrier board 300 is bonded to the PCB substrate 200. The PCB substrate 200 has a first pad 210, which is in contact with the second pad 310 and is electrically connected through the soldering process. It should be noted that the flexible PCB substrate 200 is soldered to the intermediate carrier board 300 without the risk of thermal stress from the soldering damaging the first sensor 400.

[0049] The first sensor 400 can be one or more of the following: a temperature sensor 500, a pressure sensor, or other sensors, and can be adjusted according to the parameters to be detected by the miniature probe. In such cases... Figures 1 to 4 In the illustrated embodiment, the microprobe is primarily used to detect pressure at the lesion site; therefore, the microprobe includes at least a pressure sensor.

[0050] It should be noted that in the existing technology, wire bonding is often used to electrically connect the sensor to the PCB board, which results in metal wires that are easily corroded. Furthermore, since the metal wires are prone to deformation and movement during soldering, manual soldering is often required, resulting in a low degree of automation.

[0051] In this embodiment, the first sensor 400 is packaged on an intermediate carrier 300 using wafer-level packaging technology, and the intermediate carrier 300 replaces the existing metal leads for interconnection. Specifically, the first sensor 400 has opposing first surfaces 410 and second surfaces 420, with the first surface 410 exposed through the opening 110; that is, the first sensor 400 is located in the accommodating cavity and positioned corresponding to the opening 110. Figure 1As shown, due to the piezoresistive pressure measurement principle of the pressure sensor, a first sealant 700 is potted in the end region of the accommodating cavity to fix and protect the first sensor 400. The first sealant 700 forms a groove corresponding to the opening 110, with the bottom of the groove corresponding to the first surface 410 of the first sensor 400. This allows bodily fluids such as blood and cerebrospinal fluid to enter the accommodating cavity through the opening 110 on the housing 100, move to a position close to the first surface 410, and transmit the pressure of the bodily fluid to the first sensor 400. The first sensor 400 then converts the bodily fluid pressure into an electrical signal output, ensuring that the pressure sensor can respond well to pressure changes while preventing blood or external environmental corrosion. A fourth pad 421 is provided on the second surface 420 of the first sensor 400. The first sensor 400 is attached to the intermediate carrier plate 300, and the fourth pad 421 contacts the third pad 320, achieving electrical conductivity through a welding process.

[0052] It is understandable that, such as Figure 3 and Figure 4 As shown, during the mounting and soldering process of the first sensor 400 and the intermediate carrier board 300, solder balls 422 can first be formed on the fourth pad 421 of the first sensor 400 using BGA ball-mounting technology, and then mounted onto the intermediate carrier board 300 using flip-chip packaging technology to form an integrated sensing component. Similarly, the pads on the intermediate carrier board 300 and the PCB substrate 200 can also be ball-mounted using laser ball-mounting technology to facilitate packaging and soldering.

[0053] Based on the above, it can be seen that the miniature probe of this application, through the connection of the intermediate carrier board 300, replaces the wire bonding process in the prior art. The sensor and the intermediate carrier board 300 are bonded and connected, thereby greatly reducing the possibility of the circuit being corroded by blood, thus extending the working time of the miniature probe in the human body, improving the working stability of the miniature probe, and helping medical personnel obtain accurate physiological parameters. Furthermore, since the embodiments of this application adopt the advanced 3D-Sip system packaging technology (3D-System-in-Package), automated packaging can be achieved, greatly improving the production efficiency of the miniature probe.

[0054] Furthermore, it should be noted that the intermediate carrier plate 300 is made of high-purity single-crystal silicon or silicon dioxide material, possessing characteristics such as stable mechanical properties, high thermal stability, high resistivity, and low electrical loss. Since its coefficient of thermal expansion is similar to that of the first sensor 400, it can undergo the same expansion change as the first sensor 400 when heated during packaging, thereby reducing the impact of the packaging process on the zero drift and time drift of the first sensor 400 and avoiding output drift problems caused by stress. Moreover, the intermediate carrier plate 300 is not easily corroded by blood, avoiding zero-point output drift problems caused by leakage current from metal leads. In addition, the intermediate carrier plate 300 can also be obtained through wafer fabrication or panel fabrication, enabling the manufacture of ultra-thin intermediate carrier plates 300 with a thickness as low as 50μm, thereby achieving miniaturized packaging of microprobes.

[0055] In addition, the intermediate carrier 300 can be a TSV (Through Silicon Via) structure or a TGV (Through Glass Via) structure. The intermediate carrier 300 with TSV or TGV structure uses screen-printed wafer glass paste and sintering to form a sealed protective layer for the surface and internal circuits, avoiding corrosion of the circuits by the penetration of human tissue fluid during long-term testing in clinical use.

[0056] In some embodiments, the first sensor 400 and the PCB substrate 200 are respectively attached to two opposite surfaces of the intermediate carrier plate 300. The intermediate carrier plate 300 is provided with a through hole 330, and a conductive part is provided in the through hole 330. The second pad 310 and the third pad 320 are respectively provided at both ends of the through hole 330 and are electrically connected through the conductive part.

[0057] The aforementioned through-hole 330 can be formed by laser drilling, or it can be manufactured by laser-induced etching. Specifically, the laser-induced etching process first uses laser irradiation on the pre-drilled area of ​​the intermediate substrate 300 to change the microstructure of the material, weakening the structure of the pre-drilled area of ​​the intermediate substrate 300, thereby improving its processing performance and making it easier to be removed by the etching solution. This increases the etching rate of the pre-drilled area compared to the surrounding area, reducing the probability of cracks forming on the intermediate substrate during etching and improving the etching success rate. This process can form through-holes 330 with diameters from 20μm to 200μm, which is beneficial for miniaturizing vertical circuits.

[0058] It should be noted that the through-hole 330 is provided with a conductive part connecting the pads at both ends. The conductive part can be a metal layer attached to the wall of the through-hole 330 by a metal deposition process such as copper plating, or it can be a conductive material filled in the through-hole 330. It can directly connect the sensor and the PCB substrate 200, which are attached to the opposite surfaces of the intermediate carrier board 300, to realize the circuit transfer of the intermediate carrier board 300. It can be understood that the circuit structure of the intermediate carrier board 300 is formed inside the intermediate carrier board 300. The two ends of the through-hole 330 are respectively closed by the sensor and the PCB substrate 200, thus forming a relatively sealed environment, avoiding blood corrosion, and improving the long-term stability of the micro probe.

[0059] It should be noted that by using a straight conductive part to achieve electrical connection between the sensor and the PCB substrate 200, the data transmission distance is shorter, which helps to reduce the package size of the miniature probe, while also helping to reduce noise, parasitic capacitance, signal propagation delay and power consumption.

[0060] In other embodiments, such as Figure 5 As shown, the first sensor 400 and the PCB substrate 200 are attached to the same surface of the intermediate carrier board 300. A printed circuit 340 is disposed on the intermediate carrier board 300, and the second pad 310 and the third pad 320 are connected through the printed circuit 340. It can be understood that the printed circuit 340 is formed on the intermediate carrier board 300 through processes such as etching and electroplating, and a protective coating is applied to the printed circuit 340 to prevent corrosion. Furthermore, both ends of the printed circuit 340 extend to the underside of the first sensor 400 and the underside of the PCB substrate 200 respectively to achieve a tight seal, thereby also preventing corrosion from blood.

[0061] In such Figure 2 In the embodiment shown, a combination of printed circuit 340 and conductive via 330 is used. The printed circuit 340 enables interconnection between various sensors and chips, while the conductive via 330 enables connection between the chip and the PCB substrate 200.

[0062] Specifically, in such Figure 2In the illustrated embodiment, the first sensor 400 is a pressure sensor. It is understood that temperature changes significantly affect the accuracy of pressure detection during the pressure detection process. Therefore, the miniature probe of this application also includes a temperature sensor 500, and a communication connection between the temperature sensor 500 and the pressure sensor is achieved through an intermediate carrier plate 300. This allows the temperature data detected by the temperature sensor 500 to compensate for or correct the pressure data detected by the pressure sensor, thereby reducing the impact of temperature on the performance of the pressure sensor. It should be noted that the temperature sensor 500 can be a cylindrical or sheet-like NTC thermistor (Negative Temperature Coefficient Thermistor), which has advantages such as high sensitivity, small size, and good stability.

[0063] In some embodiments, the pressure sensor is an absolute pressure sensor. Based on crystalline silicon micromachining technology, the absolute pressure sensor measures the minute effect of pressure on the flexural deformation of a crystalline silicon microbeam, converting this deformation into a standard electrical signal output to achieve accurate pressure measurement. It uses a vacuum reference as the reference point for the measured object, thereby eliminating the influence of ambient pressure on the output signal. The absolute pressure sensor includes a first piezoresistive resistor, a second piezoresistive resistor, a third piezoresistive resistor, and a fourth piezoresistive resistor. These four piezoresistive resistors are all located inside the absolute pressure sensor and form a Wheatstone full-bridge structure. All four arms of this structure are connected to the measured quantity, forming a differential full-bridge operation with high measurement accuracy and sensitivity. In other embodiments, the first and second piezoresistive resistors are located inside the absolute pressure sensor and form a Wheatstone half-bridge structure. The third and fourth piezoresistive resistors are located on an intermediate carrier plate 300 or on a PCB substrate 200, forming another Wheatstone half-bridge structure. This helps to reduce the size of the sensor and, consequently, the package size of the probe.

[0064] In some embodiments, such as Figure 2 As shown, the temperature sensor 500 is a surface-mount thin-film resistor, which includes a substrate 510 and a thermistor 520. Thermistors 520 are disposed on both opposite surfaces of the substrate 510. Preferably, platinum films are printed on both sides of the ceramic substrate 510, and solder is applied symmetrically at both ends to meet the requirements of surface-mount packaging. The temperature sensor 500 can be soldered to the pads of the intermediate carrier board 300 using SMT (Surface Mount Technology) surface mount technology.

[0065] In some embodiments, the miniature probe further includes a conditioning chip 600, which is disposed on an intermediate carrier board 300 and communicates with the pressure sensor and temperature sensor 500 respectively via the printed circuit 340 of the intermediate carrier board 300. This conditioning chip is used to compensate and process the sensor signals, further improving the sensor performance. The conditioning chip 600 can receive weak sensitive signals and perform amplification, zero-point calibration, linear compensation, and temperature drift compensation, thereby outputting a purer digital signal with better linearity. This signal is then transmitted to an external controller via the internal circuitry of the intermediate carrier board 300, the circuitry on the PCB substrate 200, or wires, ensuring signal transmission quality while achieving miniaturization.

[0066] In some embodiments, the accommodating cavity is filled with a first sealant 700 and a second sealant 710. The second sealant 710 covers at least a portion of the intermediate carrier plate 300 and the PCB substrate 200 to restrict the movement of the intermediate carrier plate 300 and the PCB substrate 200 within the accommodating cavity. The first sealant 700 covers the first sensor 400. In this embodiment, both the temperature sensor 500 and the pressure sensor are covered by the first sealant 700. Figure 1 As shown, the first sealant 700 separates the second sealant 710 from the opening 110, thereby preventing external liquids from contacting the second sealant 710. It is understood that the first sealant 700 is preferably a material with good biocompatibility, insulation, good water and vapor permeability, and no significant stress, such as a two-component epoxy resin, silicone resin, or greenhouse-cured silicone rubber. The second sealant 710, while meeting biocompatibility requirements, also possesses high tensile strength, and is preferably a medical-grade UV adhesive or epoxy resin.

[0067] The second aspect of this application also proposes a monitoring device, which includes the miniature probe mentioned in the above embodiments. Since the monitoring device adopts the technical solutions in the above embodiments, it has at least all the beneficial effects brought about by the technical solutions in the above embodiments, which will not be described in detail here.

[0068] Furthermore, existing miniature probes used in MRI (Magnetic Resonance Imaging) examinations are accompanied by radiofrequency heating, displacement force, torque force, and artifacts, posing significant safety risks to patients and affecting doctors' judgment. Since the miniature probes in the first embodiment of this application are made of materials free of iron or nickel and other magnetic materials, they meet the safety requirements for use at field strengths of 1.5T and 3.0T, do not generate excessive heat due to electromagnetic induction, and will not experience displacement or damage. This avoids safety accidents caused by damage to the miniature probe during MRI examinations and does not affect the quality of MRI imaging.

[0069] The embodiments of the present invention have been described in detail above with reference to the accompanying drawings. However, the present invention is not limited to the above embodiments. Within the scope of knowledge possessed by those skilled in the art, various changes can be made without departing from the spirit of the present invention. Furthermore, the embodiments of the present invention and the features thereof can be combined with each other unless otherwise specified.

Claims

1. A miniature probe, characterized in that, include: A housing, the housing defining a receiving cavity and an opening communicating with the receiving cavity; A PCB substrate, wherein the PCB substrate is disposed in the accommodating cavity, and the PCB substrate is provided with a first pad; An intermediate carrier board is provided with a second pad and a third pad that are electrically connected to each other. The intermediate carrier board is attached to the PCB substrate so that the first pad and the second pad are correspondingly soldered. A first sensor is disposed in the accommodating cavity. The first sensor has a first surface and a second surface opposite to each other. The first surface can be exposed through the opening. The second surface is provided with a fourth pad. The first sensor is attached to the intermediate carrier plate, and the fourth pad is soldered to the third pad.

2. The miniature probe according to claim 1, characterized in that, The intermediate carrier plate is made of monocrystalline silicon or silicon dioxide material.

3. The miniature probe according to claim 1, characterized in that, The first sensor and the PCB substrate are respectively attached to two opposite surfaces of the intermediate carrier plate. The intermediate carrier plate is provided with a through hole, and a conductive part is provided in the through hole. The second pad and the third pad are respectively provided at both ends of the through hole and are electrically connected through the conductive part.

4. The miniature probe according to claim 1, characterized in that, The first sensor and the PCB substrate are attached to the same surface of the intermediate carrier board, which is provided with printed circuits. The second pad and the third pad are connected through the printed circuits.

5. The miniature probe according to claim 1, characterized in that, The first sensor is a pressure sensor, and the miniature probe also includes a temperature sensor, which is communicatively connected to the pressure sensor.

6. The miniature probe according to claim 5, characterized in that, The pressure sensor is an absolute pressure sensor, which includes a first piezoresistive resistor, a second piezoresistive resistor, a third piezoresistive resistor, and a fourth piezoresistive resistor. The first, second, third, and fourth piezoresistors are all located inside the absolute pressure sensor and form a Wheatstone full-bridge structure. Alternatively, the first and second piezoresistors are located inside the absolute pressure sensor and form a Wheatstone half-bridge structure, while the third and fourth piezoresistors are located on the intermediate carrier board or the PCB substrate.

7. The miniature probe according to claim 5, characterized in that, The temperature sensor is a surface-mount thin-film resistor, which includes a substrate and a thermistor film. The thermistor film is disposed on both opposite surfaces of the substrate.

8. The miniature probe according to claim 5, characterized in that, The micro probe also includes a conditioning chip, which is disposed on the intermediate carrier board and is communicatively connected to the pressure sensor and the temperature sensor, respectively.

9. The miniature probe according to claim 1, characterized in that, The accommodating cavity is filled with a first sealant and a second sealant. The second sealant covers at least a portion of the intermediate carrier plate and the PCB substrate to restrict the movement of the intermediate carrier plate and the PCB substrate in the accommodating cavity. The first sealant covers the first sensor and separates the second sealant from the opening to prevent external liquid from contacting the second sealant.

10. Monitoring equipment, characterized in that, include: The miniature probe as described in any one of claims 1 to 9.

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