Wafer cutting device

Abstract

The embodiment of the utility model provides a wafer cutting device, and the device comprises an objective table which is used for loading a wafer to be cut; the cutting assembly comprises a tool apron and a slicing knife arranged on the tool apron; the cutter holder is arranged above the objective table, so that the slicing cutter faces a wafer to be cut; the driving device is connected with the cutter holder and used for driving the cutter holder to drive the slicing cutter to move so as to cut the wafer; the purging device is fixed on the tool apron of the cutting assembly and is provided with an air inlet end and a purging nozzle; the gas inlet end is communicated with an external gas supply bottle and the purging nozzle so as to convey gas to the purging nozzle; and the purging device is fixedly mounted on the tool apron at a position adjacent to the slicing knife and faces the wafer to be cut, so that the purging nozzle synchronously purges the wafer.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor technology, and in particular to a wafer dicing device. Background Technology

[0002] A wafer, a thin sheet used in semiconductor manufacturing, is typically made of silicon, silicon carbide, or other semiconductor materials. Currently, the main conventional wafer cutting methods are diamond wheel cutting and laser cutting.

[0003] Diamond wheel cutting refers to the cutting of wafers using sharp, high-hardness diamond abrasive particles protruding from the surface of a diamond wheel. During the cutting process, the diamond wheel cutting method generates wafer debris, which can lead to contamination of the wafer surface.

[0004] Laser cutting refers to the process of cutting a wafer by irradiating it with a focused, high-power-density laser beam. During the cutting process, laser cutting generates slag on the wafer, and the presence of slag can cause secondary contamination of the wafer surface.

[0005] In existing technologies, various debris and impurities are generated during the cutting process. These debris and impurities deposit on the wafer surface, causing wafer contamination. Simultaneously, the heat generated by friction between the diamond grinding wheel and the wafer, or the heat generated during laser cutting, can cause localized temperature increases in the wafer. Under thermal stress, stress damage may occur inside the wafer, leading to the risk of wafer chipping. Utility Model Content

[0006] The purpose of this utility model embodiment is to provide a wafer dicing apparatus to reduce wafer contamination caused by debris and impurities, and to lower the risk of wafer edge chipping. The specific technical solution is as follows:

[0007] This utility model provides a wafer dicing device, which includes: a stage for loading wafers to be diced;

[0008] A cutting assembly includes: a blade holder and a slicing blade disposed on the blade holder; the blade holder is disposed above a stage such that the slicing blade faces the wafer to be cut;

[0009] A driving device, connected to the blade holder, is used to drive the blade holder to move the slicing blade to cut the wafer;

[0010] A purging device, fixed on the blade holder of the cutting assembly, has an air inlet and a purging nozzle; the air inlet is connected to an external gas supply cylinder and the purging nozzle to supply gas to the purging nozzle; the purging device is fixedly installed on the blade holder, adjacent to the slicing blade, and facing the wafer to be cut, so that the purging nozzle synchronously purifies the wafer.

[0011] In some embodiments of this utility model, the driving device includes: a first driving slide rail and a sliding bracket;

[0012] The first drive slide rail is two in number, and is respectively arranged on both sides of the platform along the first direction X;

[0013] The sliding bracket is straddling two first drive slide rails, enabling it to slide along the first direction X of the platform on the first drive slide rails.

[0014] The sliding support includes: a second drive slide rail and two sliding columns; the two sliding columns are respectively slidably connected to two first drive slide rails; the second drive slide rail spans between the two sliding columns and has a first preset height H1 between it and the wafer to be cut;

[0015] The blade holder is slidably connected to the second drive slide rail, so that the cutting assembly can slide along the second direction Y of the stage on the second drive slide rail; the first direction X and the second direction Y are the width direction and length direction of the stage, respectively.

[0016] In some embodiments of this utility model, an auxiliary slide rail is also provided between the two sliding columns;

[0017] The tool holder is mounted on the second drive slide rail and the auxiliary slide rail;

[0018] The auxiliary slide rail is arranged parallel to and spaced apart from the second drive slide rail, and has a second preset height H2 between it and the wafer to be cut; the second drive slide rail and the auxiliary slide rail are used to support the tool holder and allow the tool holder to slide between the two sliding columns.

[0019] In some embodiments of this utility model, the slicing blade is slidably mounted on the blade holder along the height direction, so that the slicing blade can move up and down along the height direction on the blade holder to cut the wafer to be cut on the stage.

[0020] In some embodiments of this utility model, the purging device is a cold air purging device.

[0021] In some embodiments of this utility model, the stage has a wafer placement part and a fixing part, and the wafer placement part is detachably embedded in the fixing part;

[0022] The fixing part is provided with a fixing buckle for fixing the wafer placement part;

[0023] A scale line is also provided at the edge of the fixing part; the scale line is provided along the first direction X and the second direction Y.

[0024] In some embodiments of this utility model, the upper surface of the fixing part is also provided with a dust suction hole; the dust suction hole is connected to an external air suction device to suck up the debris generated during the cutting process.

[0025] In some embodiments of this utility model, the wafer placement part is provided with an air suction hole; the air suction hole is connected to an external air suction device to fix the wafer to be cut by suction.

[0026] In some embodiments of this utility model, the stage further includes a rotating component disposed below the wafer placement portion and connected to the wafer placement portion, for driving the wafer placement portion to rotate around the center position of the wafer placement portion.

[0027] In some embodiments of this utility model, the rotating assembly includes: a rotary motor and a rotating shaft;

[0028] The rotary motor is located below the wafer placement section and is fixedly connected to the fixing section;

[0029] The rotating shaft passes through the rotary motor and is fixedly connected to the wafer placement section;

[0030] The rotary motor drives the rotary shaft to rotate, and the rotary shaft causes the wafer placement section to rotate.

[0031] In some embodiments of this utility model, the wafer dicing device further includes a plurality of edge positioning plates, and the wafer to be diced is fixed on the stage by at least two edge positioning plates installed on the edge of the wafer to be diced;

[0032] The upper surface of the wafer placement part is also provided with a first positioning screw hole;

[0033] The edge positioning piece has a second positioning screw hole that extends through the thickness direction;

[0034] The screw passes through the second positioning screw hole and the first positioning screw hole to fix the side positioning piece to the upper surface of the stage.

[0035] In some embodiments of this utility model, the thickness of the edge positioning piece is 200μm-300μm;

[0036] The structure of the edge positioning piece can be linear, right-angled, or arc-shaped.

[0037] In some embodiments of this utility model, the side positioning piece is an adjustable positioning piece, which includes at least two fixed rotating pieces and at least one rotating shaft; wherein, each pair of fixed rotating pieces is connected to one rotating shaft; the two fixed rotating pieces can rotate around the rotating shaft to change the angle between the two fixed rotating pieces.

[0038] In some embodiments of this utility model, the wafer dicing device further includes: a host computer, which is communicatively connected to the dicing component, the driving device and the blowing device, and is used to drive the dicing component, the driving device and the blowing device to operate.

[0039] This invention provides a wafer dicing apparatus, in which a blowing device is provided on the dicing assembly, and the blowing device is arranged adjacent to the dicing blade in the dicing assembly. When the driving device moves the dicing assembly, the blowing device on the dicing assembly moves synchronously with the dicing blade. Therefore, when the dicing blade cuts the wafer on the stage, the adjacent blowing device can promptly and synchronously blow away the wafer surface, removing debris and slag generated during the dicing process, thus reducing wafer contamination caused by debris and impurities.

[0040] Meanwhile, the purging device purifies the wafer surface during the cutting process. The flowing air carries away the heat generated on the wafer surface by the cutting process, thereby effectively improving the internal stress damage caused by localized heating of the wafer and further reducing the risk of wafer edge breakage.

[0041] Of course, any product implementing this utility model does not necessarily need to achieve all of the advantages described above at the same time. Attached Figure Description

[0042] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings.

[0043] Figure 1 A schematic diagram of the structure of a wafer dicing device provided by this utility model;

[0044] Figure 2 for Figure 1A cross-sectional view of the first drive slide rail and the sliding bracket shown in the figure;

[0045] Figure 3 for Figure 1 The diagram shows the structure when the cutting assembly and the purging assembly are connected.

[0046] Figure 4 for Figure 3 The cutter and purge components shown are cross-sectional views.

[0047] Figure 5 A top view of the platform provided by this utility model;

[0048] Figure 6 A side view of the stage and rotating assembly provided by this utility model when connected;

[0049] Figure 7 A schematic diagram of the structure of the edge positioning piece provided by this utility model;

[0050] Figure 8 This is a schematic diagram of the adjustable positioning piece provided by this utility model;

[0051] Figure 9 for Figure 8 The side view of the adjustable positioning piece shown;

[0052] Figure 10 This is a schematic diagram of the structure when the adjustable positioning plate has 4 fixed rotating plates;

[0053] Figure 11 for Figure 5 The diagram shows a schematic of the structure when a regular wafer is loaded onto a stage.

[0054] Figure 12 for Figure 5 The diagram shows a structural schematic of an irregularly shaped wafer mounted on a stage.

[0055] Figure 13 This is a schematic diagram of a wafer dicing device controlled by a host computer, where the dicing blade is a quartz grinding wheel.

[0056] Figure 14 This is a schematic diagram of a wafer dicing device controlled by a host computer, where the dicing blade is a laser emitter.

[0057] Figure label:

[0058] Stage 1, wafer 10, wafer placement part 11, fixing part 12, fixing buckle 13, scale line 14, dust suction hole 15, air suction hole 16, first positioning screw hole 17, rotating assembly 18, rotating motor 181, rotating shaft 182.

[0059] Cutting assembly 2, slicing blade 21, blade holder 22, cutting motor 221, cutting slider 222, cutting lead screw 223, blade holder housing 224;

[0060] Drive device 3, first drive slide rail 31, first motor 311, first slider 312, first lead screw 313, first housing 314, sliding bracket 32, second drive slide rail 321, second motor 3211, second slider 3212, second lead screw 3213, second housing 3214, sliding column 322, auxiliary slide rail 323;

[0061] Purging device 4, air inlet 41, purging nozzle 42, pump body 43;

[0062] Side positioning plate 5, second positioning screw hole 51, fixing rotating plate 52, rotating shaft 53, host computer 6;

[0063] First direction X, second direction Y, first preset height H1, second preset height H2. Detailed Implementation

[0064] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art based on this application are within the protection scope of the present utility model.

[0065] This utility model provides a wafer dicing device, such as... Figure 1 As shown, Figure 1 This is a schematic diagram of a wafer dicing apparatus provided by the present invention. The wafer dicing apparatus includes: a stage 1 for loading a wafer 10 to be diced; a dicing assembly 2 including: a blade holder 22 and a dicing blade 21 disposed on the blade holder 22; the blade holder 22 is disposed above the stage 1, such that the dicing blade 21 faces the wafer 10 to be diced; a driving device 3 connected to the blade holder 22 for driving the blade holder 22 to move the dicing blade 21 to dic the wafer 10; and a purging device 4 fixed on the blade holder 22 of the dicing assembly 2, having an air inlet 41 and a purging nozzle 42; the air inlet 41 is connected to an external gas supply bottle and the purging nozzle 42 to supply gas to the purging nozzle 42; the purging device 4 is fixedly installed on the blade holder 22, adjacent to the dicing blade 21, and facing the wafer 10 to be diced, so that the purging nozzle 42 synchronously purifies the wafer 10 to be diced.

[0066] In this embodiment, a blower 4 is provided in the wafer dicing apparatus, and the blower 4 is fixedly connected to the cutter holder 22. See also Figure 1The blowing nozzle 42 of the blowing device 4 is always oriented towards the position where the slicing blade 21 contacts the wafer 10. During the cutting process, the drive device 3 moves the cutting assembly 2. Since the blowing device 4 is fixedly installed on the blade holder 22, the blowing nozzle 42 can move synchronously with the slicing blade 21, and an external gas cylinder (not shown in the figure) is connected to the air inlet 41 of the blowing device 4 through a pipe to deliver gas to the blowing device 4 for synchronous blowing of the wafer 10. This allows the blowing nozzle 42 to promptly blow away the debris and slag generated during the cutting process from the upper surface of the wafer 10, thereby reducing wafer contamination caused by debris and impurities.

[0067] Meanwhile, the blowing device 4 blows the surface of the wafer 10 during the cutting process. The flowing air carries away the heat generated on the surface of the wafer 10 due to the cutting process, thereby effectively improving the internal stress damage of the wafer 10 caused by local heating and further reducing the risk of edge chipping of the wafer 10.

[0068] In some embodiments of this utility model, such as Figure 1 and Figure 2 As shown, Figure 2 for Figure 1 The diagram shows a cross-sectional view of the first drive slide rail and the sliding bracket. The drive device 3 includes: a first drive slide rail 31 and a sliding bracket 32; there are two first drive slide rails 31, respectively disposed on opposite sides of the stage 1 along the first direction X; the sliding bracket 32 ​​spans the two first drive slide rails 31, allowing it to slide along the first direction X of the stage 1 on the first drive slide rails 31; the sliding bracket 32 ​​includes: a second drive slide rail 321 and two sliding columns 322; the two sliding columns 322 are slidably connected to the two first drive slide rails 31 respectively; the second drive slide rail 321 spans between the two sliding columns 322 and has a first preset height H1 between it and the wafer 10 to be cut; the cutter holder 22 is slidably connected to the second drive slide rail 321, so that the cutting assembly 2 can slide along the second direction Y of the stage 1 on the second drive slide rail 321; the first direction X and the second direction Y are the width direction and length direction of the stage 1, respectively.

[0069] In this embodiment, two first drive slide rails 31 are respectively disposed on opposite sides of the stage 1 along the first direction X, and are slidably connected to the sliding column 322. During transmission, the sliding column 322 slides on the first drive slide rail 31, allowing the cutting assembly 2 to move along the first direction X. The second drive slide rail 321 has a first preset height H1 with respect to the wafer 10 to be cut, ensuring that the cutting assembly 2, slidably mounted on the second drive slide rail 321, does not directly contact the wafer 10. Furthermore, the cutting assembly 2 is slidably connected to the second drive slide rail 321, allowing the cutting assembly 2 to move along the second direction Y. This achieves precise cutting of the wafer 10 by the cutting device 2.

[0070] Specifically, the first drive slide rail 31 includes a first motor 311, a first slider 312, a first lead screw 313, and a first housing 314. The first motor 311, the first slider 312, and the first lead screw 313 are disposed inside the first housing 314. The first lead screw 313 is rotatably connected to the first motor 311, and its length direction is along a first direction X. The first slider 312 has a thread inside that engages with the first lead screw 313, and at least one side of the first slider 312 abuts against the first housing 314. During transmission, the first motor 311 drives the first lead screw 313 to rotate. Because one side of the first slider 312 abuts against the first housing 314, the first slider 312 moves along the first direction X through threaded engagement. A sliding column 322 is fixedly connected to the first slider 312, allowing the sliding column 322 to move along the first direction X.

[0071] Meanwhile, the second drive slide rail 321 includes: a second motor 3211, a second slider 3212, a second lead screw 3213, and a second housing 3214. The second motor 3211, the second slider 3212, and the second lead screw 3213 are disposed inside the second housing 3214. The second lead screw 3213 is rotatably connected to the second motor 3211, and its length direction is along the second direction Y. The second slider 3212 has a thread inside that engages with the second lead screw 3213, and at least one side of the second slider 3212 abuts against the second housing 3214. During transmission, the second motor 3211 drives the second lead screw 3213 to rotate. Because one side of the second slider 3212 abuts against the second housing 3214, the second slider 3212 moves along the second direction Y through threaded engagement. The cutting assembly 2 is fixedly connected to the second slider 3212, enabling the cutting assembly 2 to move along the second direction Y.

[0072] In actual production, other transmission mechanisms can also be selected, as long as they can achieve precise cutting of wafer 10.

[0073] In some embodiments of this application, such as Figure 3 and Figure 4 As shown, Figure 3 for Figure 1 The diagram shows the structure when the cutting assembly and the purging assembly are connected. Figure 4 for Figure 3 The cutting assembly and the purging assembly are shown in cross-sectional view. The slicing blade 21 is slidably mounted on the blade holder 22 along the height direction, so that the slicing blade 21 can move up and down along the height direction on the blade holder 22 to cut the wafer 10 to be cut on the stage 1.

[0074] In this embodiment, see Figure 4The purging device 4 is also equipped with a pump body 43, which pressurizes the airflow flowing into the purging device 4, so that the airflow is output through the purging nozzle 42 to purge the surface of the wafer 10.

[0075] Also see Figure 3 The slicing blade 21 is slidably mounted on the blade holder 22 so that the slicing blade 21 can move up and down along the height direction on the blade holder 22. When the cutting position span between adjacent cutting steps is large, the slicing blade 21 rises to avoid damage to the surface of the wafer 10 during the movement of the slicing blade 21.

[0076] For details, see Figure 4 The blade holder 22 includes a cutting motor 221, a cutting slider 222, a cutting lead screw 223, and a blade holder housing 224. The cutting motor 221, cutting slider 222, and cutting lead screw 223 are disposed inside the blade holder housing 224. The cutting lead screw 223 is rotatably connected to the cutting motor 221, and its length direction is along the height direction of the stage 1. The cutting slider 222 has a thread inside that mates with the cutting lead screw 223, and at least one side of the cutting slider 222 abuts against the blade holder housing 224. During transmission, the cutting motor 221 drives the cutting lead screw 223 to rotate. Because one side of the cutting slider 222 abuts against the blade holder housing 224, the cutting slider 222 moves along the height direction through threaded engagement. The slicing blade 21 is fixedly connected to the cutting slider 222, allowing the slicing blade 21 to move along the height direction.

[0077] In actual production, other transmission mechanisms can also be selected, as long as they can avoid damage to the surface of the wafer 10 during the movement of the slicing blade 21 when the cutting position span between adjacent cutting steps is large.

[0078] In some embodiments of this utility model, such as Figure 1 and Figure 2 As shown. An auxiliary slide rail 323 is also provided between the two sliding columns 322; the tool holder 22 is mounted on the second drive slide rail 321 and the auxiliary slide rail 323; the auxiliary slide rail 323 is arranged parallel to and spaced apart from the second drive slide rail 321, and has a second preset height H2 between it and the wafer 10 to be cut; the second drive slide rail 321 and the auxiliary slide rail 323 are used to support the tool holder 22 and to allow the tool holder 22 to slide between the two sliding columns 322.

[0079] In this embodiment, an auxiliary slide rail 323 is provided between the two sliding columns 322, and the cutter holder 22 is simultaneously slidably mounted on the second drive slide rail 321 and the auxiliary slide rail 323. This ensures that during the transmission process, the cutting device 2 remains perpendicular to the surface of the wafer 10 and remains stable. This further guarantees the precise cutting of the wafer 10 by the wafer cutting device.

[0080] In some embodiments of this invention, the purging device 4 is a cold air purging device. The cold air output by the purging device 4 has a temperature of 10℃-20℃. By using the cold air to purge the surface of the wafer 10, debris and slag are blown away from the surface of the wafer 10, while simultaneously reducing the surface temperature of the wafer 10. This effectively improves the situation of internal stress damage to the wafer 10 caused by localized overheating, and further reduces the risk of edge chipping of the wafer 10.

[0081] In some implementations of this application, such as Figure 5 As shown, Figure 5 This is a top view of the stage provided by the present invention. The stage 1 has a wafer placement part 11 and a fixing part 12. The wafer placement part 11 is detachably embedded in the fixing part 12. The fixing part 12 is provided with a fixing buckle 13 for fixing the wafer placement part 11. A scale line 14 is also provided at the edge of the fixing part 12. The scale line 14 is arranged along the first direction X and the second direction Y.

[0082] In this embodiment, the stage 1 is divided into two parts: a wafer placement section 11 and a fixing section 12, and the wafer placement section 11 is detachably embedded in the fixing section 12. See also Figure 5 A fixing buckle 13 is provided on the fixing part 12. When the wafer placement part 11 is embedded in the fixing part 12, the fixing buckle 13 fixes the wafer placement part 11 to the fixing part 12, thereby preventing the wafer placement part 11 from falling out.

[0083] Meanwhile, a scale line 14 is provided at the edge of the fixing part 12. During the cutting process, the movement of the cutting component 2 can be precisely controlled by the scale line 14, which further improves the accuracy of the wafer 10 cutting process.

[0084] In some implementations of this application, such as Figure 5 As shown. The upper surface of the fixing part 12 is also provided with a dust suction hole 15; the dust suction hole 15 is connected to an external suction device (not shown in the figure) to remove debris generated during the cutting process. The wafer placement part 11 is provided with a suction hole 16; the suction hole 16 is connected to an external suction device to fix the wafer 10 to be cut by suction.

[0085] A dust extraction hole 15 is provided on the upper surface of the fixing part, located near the wafer placement part 11 and connected to an external suction device. During the dicing process, the blowing device 4 blows debris and slag away from the surface of the wafer 10 and sucks them into the stage 1 through the dust extraction hole 15, thus avoiding the problem of difficult-to-handle debris and slag. At the same time, since the wafer placement part 11 is detachably embedded in the fixing part 12, when too much debris and slag are collected, the debris and slag inside the stage 1 can be cleaned by disassembling the wafer placement part 11.

[0086] Furthermore, the wafer placement section 11 is provided with an air suction hole 16 that communicates with an external air suction device. When the wafer 10 to be cut is placed in the wafer placement section 11, air is drawn through the air suction hole 16 so that the wafer 10 is fixed in the wafer placement section 11 under the action of suction.

[0087] In some implementations of this application, such as Figure 6 As shown, Figure 6 This is a side view of the stage and rotating assembly provided by this utility model when connected. The stage 1 also includes a rotating assembly 18, which is disposed below the wafer placement part 11 and connected to the wafer placement part 11, for driving the wafer placement part 11 to rotate around the center position of the wafer placement part 11. The rotating assembly 18 includes: a rotary motor 181 and a rotating shaft 182; the rotary motor 181 is disposed below the wafer placement part 11 and fixedly connected to the fixing part 12; the rotating shaft 182 passes through the rotary motor 181 and is fixedly connected to the wafer placement part 11; the rotary motor 181 drives the rotating shaft 182 to rotate, and the rotating shaft 182 drives the wafer placement part 11 to rotate.

[0088] In this embodiment, a rotating component 18 is provided below the wafer placement section 11, allowing the wafer placement section 11 to rotate under the drive of the rotating component 18. When arc cutting is required, the rotation of the wafer placement section 11 can form a smooth and continuous cutting path. This improves the problem of rough arc cutting paths that may result from controlling the slicing blade 21 to move in the first direction X and the second direction Y for arc cutting.

[0089] For details, see Figure 6 A rotary motor 181 is fixedly mounted on the fixing part 12, and a rotating shaft 182 passes through the rotary motor 181 and is fixedly connected to the wafer placement part 11. When the wafer placement part 11 needs to rotate, the rotary motor 181 drives the rotating shaft 182 to rotate. The rotating shaft 182 causes the wafer placement part 11 to rotate around the center position within the fixing part 12, and the wafer placement part 11 causes the wafer 10 placed on it to rotate around the center. This allows the dicing blade 21 to form a smooth and continuous cutting path on the wafer 10.

[0090] In some embodiments of this utility model, such as Figure 2 and Figure 7 As shown, Figure 7This is a schematic diagram of the edge positioning piece provided by this utility model. The wafer dicing apparatus also includes multiple edge positioning pieces 5. The wafer 10 to be diced is fixed to the stage by at least two edge positioning pieces 5 installed on the edge of the wafer 10. A first positioning screw hole 17 is also provided on the upper surface of the wafer placement part 11. The edge positioning piece 5 has a second positioning screw hole 51 that extends through along the thickness direction. Screws pass through the second positioning screw hole 51 and the first positioning screw hole 17 to fix the edge positioning piece 5 to the upper surface of the stage 1. The thickness of the edge positioning piece 5 is 200μm-300μm. The structure of the edge positioning piece 5 can be linear, right-angled, or arc-shaped. Figures 8 to 10 As shown, Figure 8 This is a schematic diagram of the adjustable positioning piece provided by this utility model; Figure 9 for Figure 8 The side view of the adjustable positioning piece shown; Figure 10 This is a schematic diagram of the structure of an adjustable positioning plate with four fixed rotating plates. The side positioning plate 5 can also be an angle-adjustable positioning plate, which includes at least two fixed rotating plates 52 and at least one rotating shaft 53; wherein, every two fixed rotating plates 52 are connected to one rotating shaft 53; the two fixed rotating plates 52 can rotate around the rotating shaft 53 to change the angle between the two fixed rotating plates 52.

[0091] In this embodiment, see Figure 2 By setting the edge positioning piece 5, the wafer 10 is fixed horizontally. When used in conjunction with the air intake 16, the wafer 10 can be fixed both horizontally and vertically. The edge positioning piece 5 has a thickness of 200μm-300μm, so that the inner sidewall of the edge positioning piece 5 can have a sufficiently large contact area with the sidewall of the wafer 10, thereby enhancing the fixing effect on the wafer 10.

[0092] See Figure 2 and Figure 7 A first positioning screw hole 17 is provided on the stage 1, and a second positioning screw hole 51 is provided on the side positioning piece. During use, the side positioning piece 5 is placed on the upper surface of the stage 1, with the second positioning screw hole 51 of the side positioning piece 5 corresponding to the first positioning screw hole 17 on the stage 1. Screws are then passed through the second positioning screw hole 51 and the first positioning screw hole 17 in sequence, thus fixing the side positioning piece 5 to the upper surface of the stage 1.

[0093] See Figure 7 The edge positioning piece 5 can be linear, right-angled, or arc-shaped, used to fix wafers 10 of different shapes. See also Figure 8 and Figure 9When the side positioning piece 5 is an angle-adjustable positioning piece, the fixing rotating piece 52 of the side positioning piece 5 can rotate around the rotation axis 53, thereby realizing the adjustment of the included angle of the side positioning piece 5. The angle adjustment range is 0°-180°.

[0094] Also see Figure 10 There are 4 fixed rotating plates 52. During use, they can be adjusted according to the shape of the irregular wafer 10 so that all or part of the fixed rotating plates 52 of the edge positioning plate 5 can be attached to the side wall of the irregular wafer 10. Multiple wafers 10 of different shapes can be fixed by one edge positioning plate 5, thereby improving the versatility of the edge positioning plate 5.

[0095] See Figure 11 , Figure 11 for Figure 5 The diagram shows a structural schematic of a stage for loading a regular-shaped wafer. When fixing a regular-shaped wafer 10, edge positioning tabs of a conventional shape (e.g., arc-shaped) are used to fix the wafer 10.

[0096] See Figure 12 , Figure 12 for Figure 5 The diagram shows a schematic of the stage when loading an irregular wafer. When fixing the irregular wafer 10, edge positioning pieces of other shapes can be used. For example, right-angled edge positioning pieces 5 can be used to fix the angular positions of the wafer 10, while arc-shaped edge positioning pieces 5 can be used to fix the relatively regular positions of the wafer 10. Compared to the prior art where irregular wafers 10 can only be cut manually, this embodiment uses edge positioning pieces with different structures to fix both regular and irregular wafers 10, enabling the wafer dicing device to cut the irregular wafer.

[0097] In some embodiments of this utility model, such as Figure 13 and Figure 14 As shown, Figure 13 This is a schematic diagram of a wafer dicing device controlled by a host computer, where the dicing blade is a quartz grinding wheel. Figure 14 This is a schematic diagram of a wafer dicing apparatus controlled by a host computer, where the dicing blade is a laser emitter. The wafer dicing apparatus also includes: a host computer 6 communicatively connected to the dicing assembly 2, the drive unit 3, and the blowing unit 4, used to drive the operation of these components. Simultaneously, the host computer 6 also communicates with external suction devices connected to the dust suction port 15 and the air suction port 16 to control the suction of air from these ports. The host computer 6 is also communicatively connected to the rotating assembly 18 to control the rotating motor 181 to drive the rotating shaft 182 to rotate.

[0098] In this embodiment, the host computer 6 controls the first drive slide rail 31, the second drive slide rail 321, the cutter holder 22, the blowing device 4, and the external suction device to achieve automated cutting.

[0099] Specifically, when the wafer 10 is placed on the stage 1, the host computer 6 controls the external suction device connected to the suction hole 16 to suction air from the suction hole 16. Under the action of suction, the wafer 10 is fixed to the stage 1. The suction hole 16 and the edge positioning piece 5 form a double fixation for the wafer 10.

[0100] When cutting the regular wafer 10, a fully automatic cutting method can be adopted. That is, a complete preset route is set in the host computer 6, and the cutting of the preset route is completed continuously under the control of the host computer 6.

[0101] When dicing the irregular wafer 10, a semi-automatic dicing method can be adopted. That is, a preset route is set before each dicing, and the dicing of the entire preset route is completed in batches under the control of the host computer 6.

[0102] Meanwhile, during the cutting process, the host computer 6 controls the blowing device 4 and the dust suction hole 15 to blow and suction dust, collecting the debris and slag on the surface of the wafer 10.

[0103] In practical use, such as Figure 13 and Figure 14 As shown, the host computer 6 can be connected to the above-mentioned devices via data cables. Figure 13 and Figure 14 The data connection cables shown are for reference only. In actual use, the host computer 6 needs to be connected to each controlled device via data connection cables. The host computer 6 can also be connected to the aforementioned devices wirelessly.

[0104] The above description is merely a preferred embodiment of this utility model and is not intended to limit the scope of protection of this utility model. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this utility model are included within the scope of protection of this utility model.

Claims

1. A wafer cutting apparatus characterized by comprising: The cutting device comprises a carrier table (1) for loading a wafer (10) to be cut; a cutting assembly (2) comprising a knife seat (22) and a slicing knife (21) arranged on the knife seat (22); the knife seat (22) is arranged above the carrier table (1) so that the slicing knife (21) faces the wafer (10) to be cut; a driving device (3) connected with the knife seat (22) for driving the knife seat (22) to move the slicing knife (21) to cut the wafer (10); a blowing device (4) fixed on the knife seat (22) of the cutting assembly (2) and having a gas inlet end (41) and a blowing nozzle (42); the gas inlet end (41) is in communication with an external gas supply bottle and the blowing nozzle (42) to supply gas to the blowing nozzle (42); the blowing device (4) is fixedly arranged on the knife seat (22) adjacent to the slicing knife (21) and faces the wafer (10) to be cut so that the blowing nozzle (42) blows the wafer (10) synchronously.

2. The cutting device according to claim 1, wherein the driving device (3) comprises a first driving slide rail (31) and a sliding support (32); the first driving slide rail (31) is provided on two opposite sides of the carrier table (1) along a first direction (X); the sliding support (32) is arranged on the two first driving slide rails (31) so as to slide along the first direction (X) of the carrier table (1); the sliding support (32) comprises a second driving slide rail (321) and two sliding columns (322); the two sliding columns (322) are respectively connected with the two first driving slide rails (31); the second driving slide rail (321) is arranged between the two sliding columns (322) and has a first preset height (H1) from the wafer (10) to be cut; the knife seat (22) is connected with the second driving slide rail (321) so that the cutting assembly (2) can slide along a second direction (Y) of the carrier table (1) on the second driving slide rail (321); the first direction (X) and the second direction (Y) are the width direction and the length direction of the carrier table (1) respectively.

3. The cutting device according to claim 2, wherein the two sliding columns (322) are further provided with an auxiliary slide rail (323); the knife seat (22) is arranged on the second driving slide rail (321) and the auxiliary slide rail (323); the auxiliary slide rail (323) is arranged in parallel with the second driving slide rail (321) and has a second preset height (H2) from the wafer (10) to be cut; the second driving slide rail (321) and the auxiliary slide rail (323) are used for supporting the knife seat (22) and making the knife seat (22) slide between the two sliding columns (322). ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ 4. The cutting device according to claim 1, wherein the slicing knife (21) is slidingly installed on the knife holder (22) in a height direction, so that the slicing knife (21) can move up and down on the knife holder (22) in the height direction to cut the wafer (10) on the wafer stage (1).

5. The cutting device according to claim 1, wherein the blowing device (4) is a cold gas blowing device.

6. The cutting device according to claim 1, wherein the wafer stage (1) has a wafer placing part (11) and a fixing part (12), the wafer placing part (11) is detachably embedded in the fixing part (12).

7. The cutting device according to claim 6, wherein the upper surface of the fixing part (12) is further provided with a dust suction hole (15), the dust suction hole (15) is communicated with an external suction equipment to suck the debris generated in the cutting process.

8. The cutting device according to claim 6, wherein the wafer placing part (11) is provided with an air suction hole (16), the air suction hole (16) is communicated with an external suction equipment to fix the wafer (10) to be cut by suction force.

9. The cutting device according to claim 6, wherein the wafer stage (1) further comprises a rotating assembly (18) arranged below the wafer placing part (11) and connected with the wafer placing part (11) to drive the wafer placing part (11) to rotate around the center position of the wafer placing part (11).

10. The cutting device according to claim 9, wherein the rotating assembly (18) comprises a rotating motor (181) and a rotating shaft (182).

11. The cutting device according to claim 6, wherein the wafer cutting device further comprises a plurality of edge positioning pieces (5), the wafer (10) to be cut is fixed on the wafer stage by at least two edge positioning pieces (5) installed on the edge of the wafer (10) to be cut.

12. The cutting device according to claim 6, wherein the upper surface of the wafer placing part (11) is further provided with a first positioning screw hole (17).

13. The cutting device according to claim 6, wherein the edge positioning piece (5) has a second positioning screw hole (51) arranged through in a thickness direction. ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ Screws pass through the second positioning screw hole (51) and the first positioning screw hole (17) to fix the edge positioning sheet (5) to the upper surface of the object table (1).

12. The cutting device according to claim 11, wherein, The thickness of the edge positioning sheet (5) is 200-300 μm. The structure of the edge positioning sheet (5) is linear, right-angled or circular arc-shaped.

13. The cutting device according to claim 11, wherein, The edge positioning sheet (5) is an adjustable positioning sheet, which comprises at least two fixed rotating sheets (52) and at least one rotating shaft (53); each two fixed rotating sheets (52) are connected to one rotating shaft (53); the two fixed rotating sheets (52) can rotate around the rotating shaft (53) to change the angle between the two fixed rotating sheets (52).

14. The cutting device according to claim 1, wherein, The wafer cutting device further comprises a host computer (6) connected in communication with the cutting assembly (2), the driving device (3) and the blowing device (4) to drive the cutting assembly (2), the driving device (3) and the blowing device (4) to operate.

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