Carrier tape and electronic component carrier tape assembly
By setting the first and second conductive layers and guide lines on the carrier tape, the problem of wire crossing or bridging is solved, achieving high-quality signal transmission and reliable electronic component packaging, and improving production efficiency and stability.
Patent Information
- Application Number
- CN202520443796.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-03-13
- Publication Date
- 2026-02-03
- Estimated Expiration
- 2035-03-13
AI Technical Summary
When existing carrier tapes are electrically connected to chips, the bonding wires may cross or span electronic components, leading to abnormal signal transmission and poor packaging.
A carrier tape comprising first and second conductive layers is designed to achieve electrical connection through a connection hole, avoiding wire crossing or spanning. Guide wires are used to connect electronic components to the connection hole, ensuring signal transmission quality and packaging reliability.
It reduces soldering complexity, minimizes signal crosstalk, improves signal transmission quality and packaging reliability, ensures neat soldering arrangement, and enhances the production efficiency and stability of electronic components.
Smart Images
Figure CN223865171U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of electronic component packaging and transportation technology, and in particular to a carrier tape and electronic component carrier tape assembly. Background Technology
[0002] A smart card is a card with a built-in integrated circuit chip that can store and process data. The carrier tape, as one of the key components of a smart card, is mainly used to fix and protect the chip, and enables the chip to communicate with external reading and writing devices via electrical connection.
[0003] When existing carrier tapes and chips are electrically connected via wire bonding, abnormal situations such as wire crossing or crossing the chip may occur, which may affect signal transmission or adversely affect the subsequent chip packaging process. Utility Model Content
[0004] This application provides a carrier tape and an electronic component carrier tape assembly.
[0005] A first aspect of this application provides a carrier tape, the carrier tape including at least one carrier unit; each carrier unit includes a substrate, the substrate including a first surface and a second surface disposed opposite to each other; the first surface is provided with a first conductive layer; the second surface is provided with a second conductive layer, the second conductive layer being used for electrical connection with electronic components; the substrate further includes a connection hole connecting the first surface and the second surface, the second conductive layer being electrically connected to the first conductive layer through the connection hole.
[0006] In one embodiment, the second conductive layer includes at least one guide line; the second surface includes a placement area for placing electronic components; one end of the guide line is used to connect to the connection hole, and the other end is used to electrically connect to the electronic components in the placement area.
[0007] In one embodiment, when the second conductive layer includes multiple guide lines, the orthographic projections of different guide lines on the second surface do not overlap.
[0008] In one embodiment, the orthographic projection of the guide line onto the second surface is located outside the placement area.
[0009] In one embodiment, the carrier belt includes a plurality of carrier unit groups arranged along a first direction, each carrier unit group including a plurality of carrier units arranged along a second direction; the first direction intersects the second direction.
[0010] In one embodiment, the carrier belt includes a plurality of teeth arranged along a first direction, the teeth being distributed on opposite sides of the carrier unit group.
[0011] In one embodiment, the toothed holes located on both sides of the bearing unit are symmetrically arranged along the first direction.
[0012] In one embodiment, the first conductive layer includes etched lines that divide the first conductive layer into a plurality of contacts.
[0013] In one embodiment, there are multiple connection holes, one end of each connection hole is connected to a contact point, and the other end is electrically connected to the second conductive layer.
[0014] A second aspect of this application provides an electronic component carrier tape assembly, the electronic component carrier tape assembly including an electronic component and the carrier tape described above, the electronic component being electrically connected to a second conductive layer of the carrier tape.
[0015] The carrier tape provided in this application, by incorporating a second conductive layer, avoids situations where solder wires cross or span electronic components, reducing the complexity of direct wire bonding, minimizing the possibility of signal crosstalk, and improving signal transmission quality. Furthermore, this design facilitates a more regular solder arrangement, allowing the packaging material to more evenly cover the electronic components and the carrier tape, thereby improving the reliability of the electronic component packaging.
[0016] It should be understood that the above general description and the following detailed description are exemplary and explanatory only, and do not limit this application. Attached Figure Description
[0017] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with this application and, together with the description, serve to explain the principles of this application.
[0018] Figure 1 This is a partial structural schematic diagram of an electronic component carrier tape assembly provided in related technologies;
[0019] Figure 2 This is a schematic diagram of the structure of the first surface of a carrier tape provided in an embodiment of this application;
[0020] Figure 3 This is a schematic diagram of the structure of the second surface of a carrier tape provided in an embodiment of this application;
[0021] Figure 4 for Figure 3 The illustrated embodiment is a partial cross-sectional view taken along the AA direction;
[0022] Figure 5 This is a partial structural schematic diagram of an electronic component carrier tape assembly provided in an embodiment of this application. Detailed Implementation
[0023] The technical solutions in the embodiments (or "implementations") of this application will be clearly and completely described herein with reference to the accompanying drawings. When the following description relates to the drawings, unless otherwise indicated, the same numbers in different drawings represent the same or similar elements.
[0024] If the embodiments of this application contain terms relating to directional indications or positional relationships (such as up, down, left, right, front, back, inside, outside, top, bottom, center, vertical, horizontal, longitudinal, transverse, length, width, counterclockwise, clockwise, axial, radial, circumferential, etc.), such terms are only used to explain the relative positional relationships and movements between components in a specific posture (as shown in the attached figures); if the specific posture changes, the directional indications or positional relationships will also change accordingly. Furthermore, the terms "first" and "second" used in the embodiments of this application are only for descriptive convenience and should not be construed as indicating or implying relative importance.
[0025] The carrier tape and electronic component carrier tape assembly of the present application embodiments will be described in detail below with reference to the accompanying drawings. Unless otherwise specified, the features of the following embodiments and implementations can complement or combine with each other.
[0026] In related technologies, such as Figure 1 As shown, the carrier tape has multiple connection holes 14', each of which connects to a contact point on the carrier tape. When each pad on the electronic component is electrically connected to a connection hole 14' at a specific location on the carrier tape via a bonding wire 300', the bonding wire 300' may cross or span the electronic component. For example, the bonding wire connecting the electronic component to connection hole 143' and the bonding wire connecting the electronic component to connection hole 145' may cross, while the bonding wire connecting the electronic component to connection hole 141' may span the electronic component. Crossing bonding wires may cause crosstalk between signals, and bonding wires spanning electronic components may reduce the surface flatness of the electronic component, creating difficulties for subsequent packaging of the electronic component.
[0027] This application provides a carrier tape, such as Figures 2 to 4 As shown, the carrier tape 100 includes at least one carrier unit 10, and each carrier unit 10 includes a substrate 11. The substrate 11 includes a first surface 111 and a second surface 112 disposed opposite to each other. The first surface 111 is provided with a first conductive layer 12, and the second surface 112 is provided with a second conductive layer 13. The second conductive layer 13 is used for electrical connection with electronic components. The substrate 11 also includes a connection hole 14 connecting the first surface 111 and the second surface 112, and the second conductive layer 13 is electrically connected to the first conductive layer 12 through the connection hole 14.
[0028] The substrate 11 forms the main body of the carrier tape 100, used for mounting and setting the first conductive layer 12, the second conductive layer 13, and electronic components. The first conductive layer 12 and the second conductive layer 13 have excellent conductivity, enabling them not only to transmit electrical signals but also to provide contact points for subsequent soldering or crimping. After filling the connection hole 14 with conductive material, the first conductive layer 12 and the second conductive layer 13 can be electrically connected using the connection hole 14, ensuring high-speed signal transmission while avoiding complex wiring connections.
[0029] When using a carrier tape to carry electronic components, the electronic components need to be placed on the second surface 112 of the carrier tape 100, and the pads or pins of the electronic components are electrically connected to the connection holes 14 by wire bonding, thereby realizing the electrical connection between the electronic components and the first conductive layer 12. Since the second conductive layer 13 is located on the second surface 112 of the substrate 11, the pads or pins of the electronic components can be connected to the second conductive layer 13 by wire bonding, and the signals of different pins of the electronic components can be reasonably guided to the corresponding connection holes 14 by the second conductive layer 13.
[0030] By providing a second conductive layer 13, situations where solder wires cross or span electronic components can be avoided, reducing the complexity of direct wire bonding, minimizing the possibility of signal crosstalk, and improving signal transmission quality. Furthermore, this design also facilitates a more regular solder arrangement, allowing the packaging material to more evenly cover the electronic components and carrier tape, thereby improving the reliability of the electronic component packaging.
[0031] In one embodiment, the substrate 11 may be made of polymer materials such as glass fiber or polyimide, or ceramic materials.
[0032] In one embodiment, the materials of the first conductive layer 12 and the second conductive layer 13 may be, for example, copper, aluminum, silver, or other materials with good conductivity.
[0033] In one embodiment, such as Figure 2 As shown, the first conductive layer 12 includes etching lines 121, which divide the first conductive layer 12 into multiple contacts 122. Specifically, a layer of photoresist is first coated on the surface of the first conductive layer 12, then the photoresist is patterned using a photolithography process, and then the conductive layer portion not protected by the photoresist is etched using physical or chemical etching to form etching lines 121, dividing the continuous conductive layer into multiple contacts 122. Each contact 122 can be independently connected to a specific pin or electrode of an electronic component, realizing the separation and independent control of transmission paths for different signals or power supplies in the circuit.
[0034] In one embodiment, such as Figure 3As shown, there are multiple connection holes 14. One end of each connection hole 14 is connected to a contact 122, and the other end is connected to the second conductive layer 13. Electrodes or pins on electronic components can be electrically connected to corresponding contacts 122 through the second conductive layer 13.
[0035] In one embodiment, the etched contact 122 conforms to the ISO 7816 protocol, such as Figure 2 As shown, the conductive layer 12 includes six contacts 122, enabling the carrier tape 100 to load electronic components conforming to the ISO 7816 standard.
[0036] In one embodiment, such as Figure 3 As shown, the second conductive layer 13 includes at least one guide line 131, and the second surface 112 includes a placement area 1121 for placing electronic components. One end of the guide line 131 is used to connect to the connection hole 14, and the other end is used to electrically connect to the electronic component within the placement area 1121. The guide line 131 can extend to the vicinity of the pads on which the electronic component needs to be connected, thereby facilitating the connection of the guide line to the pads on the electronic component using wire bonding. The placement area 1121 facilitates the positioning and installation of electronic components, ensuring that the pads or pins of the electronic components can be accurately connected to the guide line 131.
[0037] In one embodiment, such as Figure 3 As shown, when the second conductive layer 13 includes multiple guide lines 131, the orthographic projections of different guide lines 131 on the second surface 112 do not overlap. The spacing between the guide lines 131 can avoid crosstalk between signals, allowing signals to be transmitted in their own independent lines and reducing the possibility of mutual interference.
[0038] In one embodiment, such as Figure 3 As shown, the orthographic projection of the guide line 131 on the second surface 112 is located outside the placement area 1121. If the orthographic projection of the guide line 131 on the second surface 112 is located within the placement area 1121, when electronic components are placed, they may come into physical contact with the guide line 131, causing damage to the guide line 131 or affecting the fixation of the electronic components. Placing the guide line 131 outside the placement area 1121 can reduce signal transmission abnormalities caused by guide line 131 failure, thus improving the reliability and stability of the product.
[0039] In one embodiment, such as Figure 2 and Figure 3As shown, the carrier tape 100 includes multiple carrier unit groups 20 arranged along a first direction X, and each carrier unit group 20 includes multiple carrier units 10 arranged along a second direction Y, where the first direction X intersects the second direction Y. This arrangement fully utilizes the planar area of the carrier tape 100, increases the density of carrier units 10 per unit area, allows for the integration of more electronic components onto a single carrier tape, and improves production efficiency. Figure 2 In the illustrated embodiment, two carrier unit groups 20 are shown, each carrier unit group 20 including two carrier units 10. In other embodiments, the number of carrier unit groups 20 and the number of carrier units 10 in each carrier unit group 20 can be specifically set according to actual production needs.
[0040] In one embodiment, such as Figure 2 and Figure 3 As shown, the first direction X is perpendicular to the second direction Y.
[0041] In one embodiment, such as Figure 2 and Figure 3 As shown, the carrier tape 100 includes a plurality of toothed holes 30 arranged along a first direction X, and the toothed holes 30 are distributed on opposite sides of the carrier unit group 20. In the production process, the carrier tape 100 needs to be conveyed and precisely positioned on automated equipment (such as a pick-and-place machine, packaging machine, etc.). The teeth on the transmission components of the automated equipment can mesh with the toothed holes 30 of the carrier tape 100. When the transmission components rotate, the carrier tape can be precisely moved along the first direction X through the engagement of the teeth and the toothed holes 30. Each toothed hole 30 corresponds to a fixed angle of rotation of the transmission components, thereby achieving precise step-by-step movement of the carrier tape 100, which helps to improve production efficiency and reduce production costs.
[0042] In one embodiment, such as Figure 2 and Figure 3 As shown, the toothed holes 30 located on both sides of the bearing unit group 20 are symmetrically arranged along the first direction X. When the toothed holes 30 are symmetrically arranged along both sides of the bearing unit group 20 and along the first direction X, during the transmission process of the carrier belt 100, after the toothed holes 30 on both sides mesh with the transmission components on the automated equipment, the tension on the carrier belt 100 can be evenly distributed on both sides of the carrier belt. This can prevent the carrier belt 100 from twisting or deforming due to uneven force, and ensure the stability and straightness of the carrier belt 100 during the transmission process.
[0043] This application also provides an electronic component carrier assembly, such as... Figure 5As shown, the electronic component carrier tape assembly includes an electronic component 200 and the aforementioned carrier tape, with the electronic component 200 located within the placement area of the carrier tape. The first conductive layer of the carrier tape is electrically connected to the electronic component 200 sequentially through a connecting hole and a second conductive layer, thereby enabling communication and signal transmission between the electronic component 200 and external circuits, ensuring that the electronic component 200 can function normally.
[0044] In one embodiment, such as Figure 5 As shown, the electronic component carrier tape assembly also includes a bonding wire 300, one end of which is connected to the pad of the electronic component 200, and the other end is connected to the second conductive layer 13.
[0045] exist Figure 5 In the embodiment shown, the electronic component carrier tape assembly is provided with six connection holes 141 to 146. Connection holes 141, 142 and 143 are respectively connected to a guide line 131. The guide line 131 is then connected to the pad of the electronic component through a bonding wire 300. Connection holes 144 and 145 are directly connected to the pad of the electronic component through the bonding wire 300. Connection hole 146 is a spare connection hole.
[0046] Since the thickness of the guide line 131 is less than the thickness of the electronic component, even if the connection holes 144 and 145 intersect with the guide line 131 when they are connected to the pads of the electronic component via the bonding wire 300, there is a large height difference between the bonding wire 300 and the guide line 131 in the direction perpendicular to the substrate 11, thereby avoiding signal crosstalk.
[0047] In one embodiment, the electronic component carrier assembly may be a smart card, and the electronic component may be a smart card chip.
[0048] It should be noted that the technical solutions or features described in the above embodiments can be combined or supplemented with each other without conflict. The scope of protection of this application is not limited to the precise structures described in the above embodiments and shown in the accompanying drawings; all modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the scope of protection of this application.
Claims
1. A carrier tape, characterized in that, The carrier tape includes at least one carrier unit; each carrier unit includes a substrate, the substrate including a first surface and a second surface disposed opposite to each other; the first surface is provided with a first conductive layer; the second surface is provided with a second conductive layer, the second conductive layer being used for electrical connection with electronic components; the substrate also includes a connection hole connecting the first surface and the second surface, the second conductive layer being electrically connected to the first conductive layer through the connection hole.
2. The carrier tape according to claim 1, characterized in that, The second conductive layer includes at least one guide line; the second surface includes a placement area for placing electronic components; one end of the guide line is used to connect to the connection hole, and the other end is used to electrically connect to the electronic components in the placement area.
3. The carrier tape according to claim 2, characterized in that, When the second conductive layer includes multiple guide lines, the orthographic projections of different guide lines on the second surface do not overlap.
4. The carrier tape according to claim 2, characterized in that, The orthographic projection of the guide line onto the second surface lies outside the placement area.
5. The carrier tape according to claim 1, characterized in that, The carrier belt includes multiple carrier unit groups arranged along a first direction, and each carrier unit group includes multiple carrier units arranged along a second direction; the first direction intersects the second direction.
6. The carrier tape according to claim 5, characterized in that, The carrier tape includes a plurality of teeth arranged along a first direction, the teeth being distributed on opposite sides of the bearing unit group.
7. The carrier tape according to claim 6, characterized in that, The toothed holes located on both sides of the bearing unit are symmetrically arranged along the first direction.
8. The carrier tape according to claim 1, characterized in that, The first conductive layer includes etched lines that divide the first conductive layer into multiple contacts.
9. The carrier tape according to claim 8, characterized in that, The number of connection holes is multiple, and one end of each connection hole is connected to a contact point, and the other end is electrically connected to the second conductive layer.
10. An electronic component carrier tape assembly, characterized in that, The electronic component carrier tape assembly includes electronic components and a carrier tape as described in any one of claims 1 to 9, wherein the electronic components are electrically connected to a second conductive layer of the carrier tape.