Butterfly valve capable of improving pressure control precision and thin film deposition equipment thereof

Abstract

The utility model discloses a butterfly valve capable of improving pressure control precision. The butterfly valve comprises a driving unit, a valve body connected to the driving unit, a valve plate connected to the driving end of the driving unit and a heating unit connected to the valve plate. Wherein the valve body is provided with a valve hole, the valve plate is located in the valve hole, the valve plate is controlled by the driving unit to rotate in the axial direction of the valve hole to adjust the opening degree, and the heating unit is used for preheating the valve plate. According to the butterfly valve capable of improving the pressure control precision and the thin film deposition equipment thereof, the heating unit is adopted to preheat the valve plate, and the opening degree is adjusted according to the deformation of the preheated valve plate, so that the accuracy of the opening degree adjustment of the butterfly valve can be improved; and the blocking risk caused by deposition of low-temperature process gas can be avoided in a preheating mode.

Description

Technical Field

[0001] This utility model relates to the field of thin film deposition equipment technology, and in particular to a butterfly valve that can improve pressure control accuracy and its thin film deposition equipment. Background Technology

[0002] As semiconductor manufacturing processes shrink, the demands for yield are increasing, leading to ever-growing requirements for the precision of pressure control in semiconductor equipment and the repeatability between processes. Pressure, as a major factor affecting thin film deposition, presents a significant challenge in semiconductor manufacturing by ensuring stable pressure control and high repeatability.

[0003] Butterfly valves achieve accurate process pressure control by adaptively adjusting the valve plate opening to alter the flow resistance between the reaction chamber and the vacuum pump. However, metallic materials, especially stainless steel and aluminum alloys, exhibit significant thermal deformation. As the process progresses, the valve plate is continuously heated, gradually reducing the gap between the valve plate and the valve body, leading to different valve openings when controlling the same pressure. For processes with thicker film, a thin film can deposit on the valve plate at low temperatures, affecting pressure control and potentially causing valve jamming. Utility Model Content

[0004] The purpose of this invention is to overcome the shortcomings of the prior art and provide a butterfly valve that can improve the pressure control accuracy, so as to solve the technical problem that the pressure control accuracy of the existing butterfly valve is affected by thermal changes.

[0005] To achieve the above objectives, the present invention adopts the following technical solution:

[0006] In a first aspect, embodiments of this utility model provide a butterfly valve that can improve pressure control accuracy, comprising: a drive unit, a valve body connected to the drive unit, a valve plate connected to the drive end of the drive unit, and a heating unit connected to the valve plate; wherein, the valve body is provided with a valve hole, the valve plate is located in the valve hole, and the valve plate is controlled by the drive unit to adjust the opening by rotating axially with respect to the valve hole, and the heating unit is used to preheat the valve plate.

[0007] The valve plate is provided with a hollow rotating shaft in the radial direction, the heating unit is provided inside the hollow rotating shaft, and the hollow rotating shaft is also connected to the driving end of the driving unit.

[0008] The heating unit is a heating rod, which is inserted into the hollow rotating shaft.

[0009] The valve body is also provided with a connecting hole for rotatably connecting the hollow shaft, and a sealing ring is provided between the outer wall of the hollow shaft and the connecting hole.

[0010] The valve plate is also equipped with a temperature detection sensor, which is used to detect the current temperature of the valve plate.

[0011] The hollow rotating shaft is detachably connected to the valve plate.

[0012] The hollow rotating shaft is connected to the surface of the valve plate by a snap-fit.

[0013] The drive end of the drive unit is connected to the hollow rotating shaft via a heat insulation component.

[0014] The heat insulation component is made of PEEK or PTFE material.

[0015] Secondly, embodiments of the present invention provide a thin film deposition apparatus, which includes a butterfly valve as described in any of the above claims that can improve pressure control accuracy.

[0016] This invention relates to a butterfly valve and its thin-film deposition equipment that can improve pressure control accuracy. It uses a heating unit to preheat the valve plate and adjusts the opening based on the deformation of the valve plate after preheating. This not only improves the accuracy of the butterfly valve's opening adjustment but also avoids the risk of jamming caused by the deposition of low-temperature process gases through preheating.

[0017] The above description is only an overview of the technical solution of this utility model. In order to better understand the technical means of this utility model, it can be implemented according to the contents of the specification. In order to make the above and other objects, features and advantages of this utility model more obvious and easy to understand, the following are preferred embodiments, which are described in detail below. Attached Figure Description

[0018] Figure 1 and Figure 2 This is a schematic diagram of the butterfly valve at different angles according to an embodiment of the present invention, which can improve the pressure control accuracy.

[0019] Figure 3 This is an exploded view of a butterfly valve that can improve pressure control accuracy according to an embodiment of the present invention.

[0020] Figure 4 This is a front structural diagram of a butterfly valve that can improve pressure control accuracy according to an embodiment of the present invention.

[0021] Figure 5 for Figure 4 The sectional view shown is along line AA.

[0022] Figure 6 for Figure 5 The diagram shows a magnified view of part A.

[0023] Figure 7Side view of a butterfly valve that improves pressure control accuracy according to an embodiment of this utility model.

[0024] Figure 8 for Figure 7 The BB-directed sectional view is shown.

[0025] Figure 9 for Figure 8 The diagram shows a magnified view of part B.

[0026] Explanation of reference numerals in the attached figures:

[0027] The butterfly valve assembly 100, which can improve pressure control accuracy, includes a drive unit 1, a valve body 2, a valve plate 3, a hollow rotating shaft 4, a snap fastener 5, a heating unit 6, a heat insulation component 7, a sealing ring 8, a drive end 11, a valve hole 21, and a connection hole 22. Detailed Implementation

[0028] To make the objectives, technical solutions, and advantages of this utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0029] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of the present utility model.

[0030] In the description of this utility model, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0031] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this utility model, "a plurality of" means two or more, unless otherwise explicitly specified.

[0032] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral molding; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0033] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0034] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. The illustrative expressions of the above terms in this specification should not be construed as necessarily referring to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0035] As semiconductor manufacturing processes shrink, the demands for yield are increasing, leading to ever-growing requirements for the precision of pressure control in semiconductor equipment and the repeatability between processes. Pressure, as a major factor affecting thin film deposition, presents a significant challenge in semiconductor manufacturing by ensuring stable pressure control and high repeatability.

[0036] Butterfly valves achieve accurate process pressure control by adaptively adjusting the valve plate opening to alter the flow resistance between the reaction chamber and the vacuum pump. However, metallic materials, especially stainless steel and aluminum alloys, exhibit significant thermal deformation. As the process progresses, the valve plate is continuously heated, gradually reducing the gap between the valve plate and the valve body, leading to different valve openings when controlling the same pressure. For processes with thicker film thicknesses, a thin film may deposit on the valve plate at low temperatures, affecting pressure control and potentially causing valve jamming. To address these issues, this embodiment discloses a butterfly valve 100 that improves pressure control accuracy.

[0037] Please see Figures 1 to 9 This embodiment discloses a butterfly valve 100 that can improve pressure control accuracy. The butterfly valve 100 includes: a drive unit 1, a valve body 2 connected to the drive unit 1, a valve plate 3 connected to the drive end of the drive unit 1, and a heating unit 6 connected to the valve plate 3. The valve body 2 is provided with a valve hole 21, the valve plate 3 is located in the valve hole 21, and the valve plate 3 is controlled by the drive unit 1 to adjust the opening degree by rotating axially through the valve hole 21. The heating unit 6 is used to preheat the valve plate 3.

[0038] In this embodiment, the butterfly valve 100, which improves pressure control accuracy, preheats the valve plate 3 through the heating unit 6 when controlling the process gas intake. Once the valve plate 3 reaches the required set temperature, the process gas is then controlled to pass through the valve body 2. Since the valve plate 3 has been preheated, the process gas will not accumulate in large quantities on the valve plate 3 and valve body 2, thus avoiding the problem of butterfly valve blockage caused by large amounts of deposits due to the temperature difference between the valve plate 3 and the passing process gas.

[0039] Meanwhile, because the valve plate 3 deforms when controlling the passing high-temperature process gas, the deformation causes an error between its opening degree and the actual pressure control, ultimately leading to a decrease in control accuracy. This embodiment improves the accuracy of pressure regulation in the process chamber by preheating the valve plate 3 through the heating unit 6 and adjusting the opening degree based on the deformed dimensions of the preheated valve plate 3. This results in higher quality thin-film deposition of the semiconductor. Specifically, the butterfly valve in this embodiment, which improves pressure control accuracy, is a control valve used to control the delivery of process gas to the process chamber; its opening degree directly affects the pressure within the process chamber.

[0040] Please refer to it again. Figures 1 to 3 A hollow rotating shaft 4 is radially disposed on the valve plate 3, and the heating unit 6 is disposed within the hollow rotating shaft 4. The hollow rotating shaft 4 is also connected to the driving end of the driving unit 1. That is, the hollow rotating shaft 4 is controlled to rotate by the driving unit 1, and the central rotating shaft 4 is connected to the valve plate 3, thus synchronously driving the valve plate 3 to rotate relative to the valve body 2. The size of the rotation angle determines the opening degree of the butterfly valve. Placing the heating unit 6 within the hollow rotating shaft 4 can avoid the corrosive effect of process gases on the heating unit 6. In other embodiments, the heating unit 6 can also be connected in other ways to achieve heating of the valve plate 3.

[0041] In this embodiment, the heating unit 6 is a heating rod, which is inserted into the hollow rotating shaft 4. It is understood that in other embodiments, the heating unit 6 can use any other heating element, preferably an electric heating element, the purpose of which is to heat the valve plate 3 and raise its temperature to a set value.

[0042] The valve body 2 is further provided with a connecting hole 22 for rotatably connecting the hollow shaft 4, and a sealing ring 8 is provided between the outer wall of the hollow shaft 4 and the connecting hole 22. Figure 6 As shown, the hollow rotating shaft 4 spans the valve hole 21 of the valve body 2, and both ends of it are rotatably connected to the connecting hole 22. Therefore, the above-mentioned sealing ring 8 is provided at the positions where the two ends of the hollow rotating shaft 4 are inserted into the connecting hole 22, in order to prevent process gas from entering the connecting hole 22.

[0043] Furthermore, the valve plate 3 is also equipped with a temperature detection sensor (not shown in the figure), which is used to detect the current temperature of the valve plate 3. The temperature sensor 3 can be located inside the valve plate 3 or inside the hollow rotating shaft 4. The signal line of the temperature detection sensor passes through the valve body 2 and is led out. In actual application, the heating unit 6 starts to heat the valve plate 3. The temperature detection sensor detects the temperature of the valve plate 3 in real time. When the temperature of the valve plate 3 reaches the set value, the heating unit 6 is immediately controlled to stop heating. Conversely, if the temperature of the valve plate 3 drops, the heating unit 6 is started again to heat the valve plate 3.

[0044] like Figure 2 As shown, the hollow rotating shaft 4 is detachably connected to the valve plate 3. This detachable connection between the hollow rotating shaft 4 and the valve plate 3 facilitates subsequent replacement and maintenance of the valve plate 3 and the heating unit 6, reducing maintenance costs.

[0045] In this embodiment, the hollow rotating shaft 4 is connected to the surface of the valve plate 3 via a snap fastener 5. The snap fastener 5 is fixedly connected to the valve plate 3 by screws, thus fixing the hollow rotating shaft 4 to the valve plate 3.

[0046] Please refer to it again. Figure 3 and Figure 9 The drive end 11 of the drive unit 1 is connected to the hollow rotating shaft 4 via a heat insulation component 7. Since the heating unit 6 is located inside the hollow rotating shaft 4, heat will be transferred to the drive unit 1 during the heating of the valve plate 3. Heating the drive unit 1 will affect its operational stability. Therefore, in this embodiment, a heat insulation component 7 is further provided between the hollow rotating shaft 4 and the drive end 11 of the drive unit 1 to reduce the impact of heat transfer on the drive unit 1. The drive unit 1 employs a motor servo drive.

[0047] The heat insulation component 7 is made of PEEK or PTFE, or other materials with good heat insulation properties. "PEEK" stands for "polyether-ether-ketone," and "PTFE" stands for "polytetrafluoroethylene."

[0048] An embodiment of this utility model provides a thin film deposition apparatus, which includes a butterfly valve 100 as described above that can improve pressure control accuracy. The butterfly valve 100 is used to control the input of process gas into the process chamber.

[0049] The butterfly valve and its thin-film deposition equipment in this embodiment, which can improve the pressure control accuracy, use a heating unit to preheat the valve plate and adjust the opening degree according to the deformation of the valve plate after preheating. This not only improves the accuracy of the butterfly valve opening adjustment, but also avoids the risk of jamming caused by the deposition of low-temperature process gases through preheating.

[0050] The above examples are merely illustrative of the technical content of this utility model to facilitate reader understanding, but do not imply that the implementation of this utility model is limited to these embodiments. Any technical extensions or re-creations made based on this utility model are protected by this utility model. The scope of protection of this utility model is defined by the claims.

Claims

1. A butterfly valve that can improve pressure control accuracy, characterized in that, include: The system includes a drive unit, a valve body connected to the drive unit, a valve plate connected to the drive end of the drive unit, and a heating unit connected to the valve plate. The valve body has a valve hole, the valve plate is located in the valve hole, and the valve plate is controlled by the drive unit to adjust the opening by rotating the valve hole axially. The heating unit is used to preheat the valve plate.

2. The butterfly valve with improved pressure control accuracy according to claim 1, characterized in that, The valve plate has a hollow rotating shaft in the radial direction, the heating unit is installed inside the hollow rotating shaft, and the hollow rotating shaft is also connected to the driving end of the driving unit.

3. The butterfly valve with improved pressure control accuracy according to claim 2, characterized in that, The heating unit is a heating rod, which is inserted into the hollow rotating shaft.

4. The butterfly valve with improved pressure control accuracy according to claim 2, characterized in that, The valve body is also provided with a connecting hole for rotatably connecting the hollow shaft, and a sealing ring is provided between the outer wall of the hollow shaft and the connecting hole.

5. The butterfly valve with improved pressure control accuracy according to claim 2, characterized in that, The valve plate is also equipped with a temperature detection sensor, which is used to detect the current temperature of the valve plate.

6. The butterfly valve with improved pressure control accuracy according to claim 5, characterized in that, The hollow rotating shaft is detachably connected to the valve plate.

7. The butterfly valve with improved pressure control accuracy according to claim 5, characterized in that, The hollow rotating shaft is connected to the surface of the valve plate by a snap-fit.

8. The butterfly valve with improved pressure control accuracy according to any one of claims 2 to 7, characterized in that, The drive end of the drive unit is connected to the hollow rotating shaft via a heat insulation component.

9. The butterfly valve with improved pressure control accuracy according to claim 8, characterized in that, The insulation component is made of PEEK or PTFE material.

10. A thin film deposition apparatus, characterized in that, The thin film deposition apparatus includes a butterfly valve as described in any one of claims 1 to 9, which improves pressure control accuracy.

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