Thermal analysis device for power device

By designing a thermal analysis device for power devices and utilizing the coordinated movement of components such as the analysis chamber and heating stage, the problem of low testing efficiency for single devices in existing technologies has been solved, enabling synchronous thermal testing of batch devices and improving testing efficiency.

CN223870779UActive Publication Date: 2026-02-03LUOU ZHIZAO (SHANDONG) HIGH-END EQUIP TECH CO LTD
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Patent Information

Application Number
CN202423195029.8
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-12-24
Publication Date
2026-02-03
Estimated Expiration
2034-12-24

AI Technical Summary

Technical Problem

Existing technologies can only test single devices, resulting in low testing efficiency and making them unsuitable for simultaneous testing of batches of devices.

Method used

A thermal analysis device for power devices was designed, including an analysis chamber, a heating stage, a telescopic cylinder, a rotary seat, a transverse seat, a lead screw, a nut, and a thermal imaging component. The coordinated movement of these components enables simultaneous thermal testing of batch power devices.

Benefits of technology

It significantly improves the testing efficiency of batch power devices and enables simultaneous thermal testing of multiple devices.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model discloses a thermal analysis device for a power device, which comprises an analysis chamber, a horizontally arranged heating table is mounted at the bottom of an inner cavity of the analysis chamber, the heating table is of a circular structure, a plurality of rings of loading grooves are formed in the upper surface of the heating table, each ring of loading groove comprises a plurality of loading grooves which are circumferentially distributed, and the loading grooves are used for placing the power device; a telescopic cylinder arranged downwards in the vertical direction is mounted at the top of an inner cavity of the analysis chamber, a rotary seat and a transverse moving seat are sequentially mounted at the head of the telescopic cylinder from top to bottom, a lead screw penetrates through the transverse moving seat, a nut in threaded connection with the lead screw is mounted on a main body of the lead screw, and the nut is slidably connected with the bottom of the transverse moving seat; and a thermal imaging component arranged downwards is mounted at the bottom of the nut. The thermal analysis device for the power device provided by the utility model can realize synchronous testing of batch devices, and remarkably improves the testing efficiency.
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Description

TECHNICAL FIELD

[0001] The utility model relates to a kind of power device thermal analysis devices, belong to semiconductor thermal analysis technical field. BACKGROUND

[0002] Power device is a kind of semiconductor equipment for processing and converting electric power, and its core part is metal oxide semiconductor field effect transistor or insulated gate bipolar transistor and other semiconductor devices. These devices have high performance in voltage, current and power, and can realize efficient and reliable power transmission and control in various application scenarios. However, power device generates heat when working, and with the continuous accumulation of heat, the output power of the device is greatly attenuated, and the performance of the device cannot be fully utilized. Therefore, the thermal analysis of power device has become a research hotspot in the field of semiconductor.

[0003] Patent No. CN202223013080.3 discloses a high-power semiconductor chip thermal distribution test system, comprising a power heating system and a thermal imager illumination system. The power heating system includes a high-voltage small-current heating power supply and a low-voltage large-current heating power supply. The power heating system is connected to the thermal imager illumination system. The thermal imager illumination system includes a thermal imager fixing mechanism, a box, a chip clamping mechanism and a safety door mechanism. The power heating system provides the heating power required for the measured chip in the thermal imager illumination system. The thermal imager illumination system provides a platform for clamping and thermal imager illumination of the measured chip.

[0004] According to the technical solution disclosed in the above patent document, it is considered that the following technical problems still exist in practice:

[0005] Only single device testing can be achieved, resulting in low testing efficiency, which is not conducive to the simultaneous testing of batch devices.

[0006] As can be seen from the above, the prior art has obvious inconvenience and defects in actual use, so it is necessary to improve. INVENTION CONTENTS

[0007] The utility model provides a kind of power device thermal analysis device according to the deficiency in background art, can realize the simultaneous testing of batch devices, significantly improve testing efficiency.

[0008] To solve the above technical problems, the utility model adopts the following technical solutions:

[0009] The power device thermal analysis device comprises an analysis chamber, a heating table horizontally installed at the bottom of the inner cavity of the analysis chamber, the heating table is of circular structure, and a plurality of load grooves are arranged on the upper surface of the heating table, each load groove comprises a plurality of circumferentially distributed load grooves, and the load grooves are used for placing power devices.

[0010] The inner cavity top of the analysis chamber is provided with a telescopic cylinder arranged in a vertical direction downward, a rotary seat and a transverse moving seat are sequentially arranged on the head of the telescopic cylinder from top to bottom, a lead screw is arranged in the transverse moving seat, a nut is arranged on the main body of the lead screw and is threadedly connected with the lead screw, the nut is slidably connected with the bottom of the transverse moving seat, and a thermal imaging component is arranged on the bottom of the nut and arranged downward.

[0011] Further, the outer open door is arranged on the side of the analysis chamber, and the leveling feet are arranged on the bottom of the analysis chamber.

[0012] Further, the bottom of the heating table is connected with the bottom of the analysis chamber through the hollow support shaft.

[0013] Further, the cylinder body of the telescopic cylinder is fixedly connected with the top of the analysis chamber.

[0014] Further, the rotary motor is connected with the upper portion of the rotary seat, and the rotary motor is a stepping motor.

[0015] Further, the transverse moving seat is arranged in a horizontal direction.

[0016] Further, one end of the lead screw is connected with the transverse motor, and the other end of the lead screw is rotatably connected with the end portion of the transverse moving seat.

[0017] Further, the guide rods are arranged on the left side and the right side of the telescopic cylinder and are arranged in parallel with the telescopic cylinder, and the guide rods are slidably connected with the top of the analysis chamber.

[0018] Further, the bottom end of the guide rod is fixedly connected with the piston rod of the telescopic cylinder through the horizontally arranged connecting plate.

[0019] Compared with the prior art, the above technical scheme has the following advantages:

[0020] The thermal imaging component can perform lifting movement under the action of the telescopic cylinder, transverse movement under the action of the transverse motor and rotary movement under the action of the rotary motor, so that the heating state of each power device on the heating table in the heat test process can be monitored.

[0021] The efficiency of each power device can be significantly improved, and the synchronous heat test of batch power devices is facilitated.

[0022] The utility model will be described in detail below in combination with the drawings and examples. DRAWINGS

[0023] Fig. 1 is the structural schematic diagram of the utility model;

[0024] Fig. 2 is the installation schematic diagram of the thermal imaging component;

[0025] Fig. 3 is a structure plan view of the heating table.

[0026] In the figure, 1-analyzing chamber, 2-outer opening door, 3-leveling foot, 4-telescopic cylinder, 5-rotary seat, 6-rotary motor, 7-translational seat, 8-guide rod, 9-connecting plate, 10-screw rod, 11-nut, 12-translational motor, 13-thermal imaging component, 14-heating table, 15-hollow support shaft, 16- object slot. DETAILED DESCRIPTION

[0027] In order to have a clearer understanding of the technical features, purposes and effects of the present application, the specific embodiments of the present application will be described with reference to the accompanying drawings.

[0028] As Figs. 1-3 The utility model provides a kind of power device thermal analysis device, including analyzing chamber 1, outer opening door 2 is installed in the side of analyzing chamber 1, leveling foot 3 is installed in the bottom of analyzing chamber 1.

[0029] The bottom of the analyzing chamber 1 is provided with a heating table 14, and the bottom of the heating table 14 is connected to the bottom of the analyzing chamber 1 through a hollow support shaft 15.

[0030] The heating table 14 is circular in structure, and a plurality of object slots 16 are arranged on the upper surface of the heating table 14 in a circular manner.

[0031] The top of the analyzing chamber 1 is provided with a telescopic cylinder 4 arranged in a vertical downward direction.

[0032] The head of the telescopic cylinder 4 is sequentially provided with a rotary seat 5 and a translational seat 7 from top to bottom, and the rotary motor 6 is connected to the top of the rotary seat 5.

[0033] The translational seat 7 is arranged in a horizontal direction, and a screw rod 10 is arranged in the translational seat 7.

[0034] The screw rod 10 is provided with a nut 11 threadedly connected thereto, and the nut 11 is slidably connected to the bottom of the translational seat 7.

[0035] The telescopic cylinder 4 is provided with guide rods 8 parallel to the telescopic cylinder 4 on the left and right sides, the guide rods 8 are slidably connected to the top of the analysis chamber 1, and the bottom ends of the guide rods 8 are fixedly connected with the piston rod of the telescopic cylinder 4 through the horizontally arranged connecting plate 9. The guide rods 8 ensure the stability of the telescopic cylinder 4 during the telescopic process.

[0036] The specific working principle of the utility model is as follows:

[0037] The power device to be tested is arranged in the object slot 16 of the heating table 14, and the heating table 14 provides the required heat source for the thermal test of the power device; the thermal imaging component 13 in the utility model can be lifted under the action of the telescopic cylinder 4, can move horizontally under the action of the transverse motor 12, and can rotate under the action of the rotary motor 6, so that the heating state of each power device on the heating table 14 in the thermal test process can be monitored. The utility model can significantly improve the efficiency of each power device, and is beneficial to the synchronous thermal test of batch power devices.

[0038] The above is an example of the best implementation mode of the utility model, wherein the parts not described in detail are the common knowledge of those skilled in the art. The protection scope of the utility model is subject to the content of the claims, and any equivalent transformation based on the technical inspiration of the utility model is also within the protection scope of the utility model.

Claims

1. A power device thermal analysis apparatus, characterized in that: The analysis chamber (1) is equipped with a horizontally arranged heating table (14) at the bottom of the inner cavity of the analysis chamber (1). The heating table (14) has a circular structure and multiple rings of loading slots (16) are provided on the upper surface of the heating table (14). Each ring of loading slots (16) includes multiple loading slots (16) distributed in a circular pattern. The loading slots (16) are used to place power devices. The top of the inner cavity of the analysis chamber (1) is equipped with a telescopic cylinder (4) that is set vertically downward. The head of the telescopic cylinder (4) is equipped with a rotary seat (5) and a transverse seat (7) from top to bottom. A lead screw (10) is installed inside the transverse seat (7). A nut (11) that is threadedly connected to the lead screw (10) is installed on the main body of the lead screw (10). The nut (11) is slidably connected to the bottom of the transverse seat (7). A thermal imaging component (13) that is set downward is installed at the bottom of the nut (11).

2. The power device thermal analysis apparatus as described in claim 1, characterized in that: An outward-opening door (2) is installed on the side of the analysis chamber (1), and a leveling foot (3) is installed at the bottom of the analysis chamber (1).

3. The power device thermal analysis apparatus as described in claim 1, characterized in that: The bottom of the heating stage (14) is connected to the bottom of the analysis chamber (1) via a hollow support shaft (15).

4. The power device thermal analysis apparatus as described in claim 1, characterized in that: The cylinder body of the telescopic cylinder (4) is fixedly connected to the top of the analysis chamber (1).

5. The power device thermal analysis apparatus as described in claim 1, characterized in that: A rotary motor (6) is connected above the rotary base (5), and the rotary motor (6) is a stepper motor.

6. The power device thermal analysis apparatus as described in claim 1, characterized in that: The transverse sliding seat (7) is arranged in the horizontal direction.

7. The power device thermal analysis apparatus as described in claim 1, characterized in that: One end of the lead screw (10) is connected to the transverse motor (12), and the other end of the lead screw (10) is rotatably connected to the end of the transverse seat (7).

8. The power device thermal analysis apparatus as described in claim 1, characterized in that: The telescopic cylinder (4) is equipped with guide rods (8) arranged parallel to it on the left and right sides, and the guide rods (8) are slidably connected to the top of the analysis chamber (1).

9. The power device thermal analysis apparatus as described in claim 8, characterized in that: The bottom end of the guide rod (8) is fixedly connected to the piston rod of the telescopic cylinder (4) through a horizontally set connecting plate (9).

Citation Information

Patent Citations

  • High-power semiconductor chip heat distribution test system

    CN219039273U