Mobile socket

Abstract

The present application relates to a mobile socket. The mobile socket (100) comprises: a housing (101); a power supply assembly (102) comprising a power supply interface for the mobile socket; the functional components (103) are at least distributed on the first surface and the second surface of the shell, and each functional component comprises a jack; a circuit board assembly (104) disposed within the housing, the circuit board assembly being electrically connected to at least a portion of the functional components; and a heat sink (105), which is laid on the housing on the inner side of the housing, and which is designed to discharge heat via the housing.

Description

TECHNICAL FIELD

[0001] The present application relates to a mobile socket. BACKGROUND

[0002] In the field of electrical connection, sockets as the key equipment of power transmission can be generally divided into fixed sockets and mobile sockets according to the installation mode. The fixed socket is typically a wall socket, which is usually embedded in the wall of a building and is fixedly connected with the power grid through the electrical wiring system. The position of the fixed socket is relatively fixed and cannot be easily changed after installation. In contrast, the mobile socket is a socket device with flexible access characteristics. It is connected with any available power interface in the power grid through its power supply components, such as electrical contacts, and can reliably transmit power grid power to various types of electrical equipment plugged into it, providing power for electrical equipment.

[0003] With the rapid development of modern science and technology, the types of household electrical equipment are increasingly diverse and the functions are increasingly varied. From traditional refrigeration, heating, and lighting equipment to smart home appliances with Internet of Things functions, such as smart home appliance control systems and smart home environment monitoring devices, the widespread use of these devices has greatly improved the quality of life and convenience. At the same time, the demand for power supply is also showing a rapid growth trend, not only in terms of the increase in the number of electrical equipment, but also in terms of higher requirements for power supply quality, power supply methods, and intelligent control.

[0004] Under this background, smart power supply sockets are proposed and gradually become the key equipment to meet the modern power demand. Compared with traditional mobile sockets, smart power supply sockets integrate intelligent control technologies, such as remote control, power monitoring, overload protection, and timing switch functions, on the basis of their basic power supply functions, realizing intelligent management and control of electrical equipment and improving the safety, convenience, and energy efficiency of electricity use.

[0005] However, with the continuous expansion of the functions of smart power supply sockets and the increasing complexity of their structures, the integration of internal components and electronic circuits is continuously improved. In a limited space, high-density integrated electronic components and complex circuit systems generate a large amount of heat during operation. Due to the limitation of internal space, the heat dissipation channels and areas are restricted, and the heat is difficult to effectively dissipate, causing heat dissipation problems of internal components and electronic circuits. This problem not only may affect the normal operation and service life of smart power supply sockets, but also may pose a potential threat to the safe operation of electrical equipment. Therefore, how to effectively solve the heat dissipation problem of sockets, especially smart power supply sockets, has become a problem that needs to be solved. INVENTION CONTENTS

[0006] Therefore, it is the task of the present application to provide a mobile socket which is able to overcome at least one of the drawbacks of the prior art, whereby in particular an effective heat dissipation is achieved even in the case of a complex and space-limited construction inside the socket body.

[0007] The task is solved by a mobile socket.

[0008] The present application relates to a mobile socket, wherein the mobile socket comprises a housing, a power supply assembly comprising a power supply interface for the mobile socket, functional components distributed at least on a first face and a second face of the housing, the functional components comprising sockets, a circuit board assembly arranged inside the housing, the circuit board assembly being electrically connected to at least some of the functional components, and a heat sink applied on the inside of the housing, the heat sink being configured for conducting heat out of the housing.

[0009] Within the scope of the present application, a mobile socket can be understood as a socket which is able to flexibly access a power grid via its power supply assembly, in particular a power supply interface, in order to provide electrical energy for the mobile socket itself as well as for electrical devices plugged onto the mobile socket. The mobile socket can comprise various functional components, typically, the mobile socket can comprise sockets, in particular mains sockets, for the access of electrical devices. The mains sockets can be, for example, GB sockets, US sockets, EU sockets, UK sockets, EU sockets, South African sockets, etc. It can be understood that the power supply interface of the mobile socket can belong to a different plug / socket standard than the mains sockets it has, so that the mobile socket can also exist as a converter socket.

[0010] Within the scope of the present application, a functional component can be understood as a component which is arranged on or inside the housing of the mobile socket and which is at least partially accessible to a user (for example via a corresponding opening of the housing). The user can interact with these components. The sockets mentioned above are a typical functional component, to which the user can plug in electrical devices. Furthermore, in some embodiments, in particular for smart sockets, the functional components can also comprise at least one of manipulator means (such as keys, touchscreens, etc.), indicator means (such as LED lights, displays, nixie tubes, etc.), low-voltage sockets (such as TYPE-A, TYPE-B, TYPE-C, Mini USB, Micro USB, Lighting interface, etc.). It is advantageous for miniaturized, integrated mobile sockets that the functional components are distributed at least on two faces (i.e. a first face and a second face) of the housing of the mobile socket, whereby a diversified functionality can be provided in a small outer size.

[0011] In addition, the mobile socket can further comprise a circuit board assembly disposed within the housing and electrically connected with at least part of the functional components to realize the corresponding functions of the functional components. In some cases, the functional components can exist as part of the circuit board assembly and be disposed on the circuit board of the circuit board assembly, for example. In addition to the functional components disposed on the circuit board, the circuit board assembly can further comprise other electronic components disposed on the circuit board and accommodated in the housing of the mobile socket for realizing the corresponding functions of the mobile socket and not for (direct) interaction with the user. Examples of such electronic components can be an isolation transformer assembly, a rectification / stabilization circuit, a wireless module, a processor, a memory, a sensor, etc.

[0012] In the mobile socket according to the present application, a heat dissipation member is advantageously disposed within the housing, which is laid on the housing on the inner side of the housing and configured to conduct heat, for example, from the power supply assembly, the functional components and / or the circuit board assembly, out of the housing. Here, the heat dissipation member can be in surface contact with the housing, there being a large heat-conducting contact surface between the heat dissipation member and the housing, so that heat inside the mobile socket can be transferred to the housing via the heat dissipation member and dissipated out of the housing via the housing, which can effectively increase the heat dissipation area and not occupy the original design space of the electronic circuit. Thus, heat can be advantageously conducted out of the housing without significantly affecting, or even affecting, the internal and external structural design of the mobile socket. In some cases, due to the presence of the heat dissipation member, there is no need to reserve space in the housing for heat dissipation, so that the mobile socket can be designed more compactly.

[0013] The technical solution according to the present application is particularly suitable for miniaturized, portable power supply sockets, and is different from some solutions in the prior art that arrange heat dissipation structures without considering or with a large space environment. For these sockets, there is a complex constraint relationship between small size, compact structure, integrated functions and efficient heat dissipation, so it is very challenging to balance these factors. In particular, for intelligent power supply sockets with complex functions, the balance between size, function, heat dissipation, aesthetics and other factors is even more challenging. By the technical solution according to the present application, and in particular by laying the heat dissipation member on the inner side of the housing, the balance between the various factors can be advantageously achieved, the internal structure design of the power supply socket is more optimized without changing the overall appearance of the socket, the assembly efficiency is improved, and the effect is particularly significant for complex sockets.

[0014] According to an embodiment of the present application, the heat dissipation member is arranged at least partially on the first face and / or the second face of the housing. Generally, the functional components distributed on the first face and / or the second face of the housing, especially the components such as the jack which is frequently plugged and carries current transmission, and the indicator which is in working state for a long time, can generate a large amount of heat during operation. By arranging the heat dissipation member on the first face and / or the second face of the housing, the heat generated by the functional components can be effectively conducted away, and the temperature of the components can be reduced in time, so that the heat dissipation is realized advantageously, and the stability and reliability of the equipment during long-time operation are ensured.

[0015] According to an embodiment of the present application, the heat dissipation member extends on at least two faces of the housing which are adjacent to each other. Here, the heat dissipation member is not limited to a single surface of the housing, but can extend on at least two faces of the housing which are adjacent to each other, which breaks the limitation of the traditional heat dissipation structure, and fully considers the heat transfer and dissipation inside the equipment. By extending the heat dissipation member to at least another face of the housing, more abundant heat conduction and dissipation paths can be provided. Here, the heat dissipation member is arranged to open the heat dissipation channel across the multiple faces of the housing, and the multiple surfaces of the housing are jointly involved in the heat dissipation process, so that the heat can be quickly and uniformly transferred from the inside of the socket to the external environment. In particular, the heat dissipation member can extend to the non-heat concentration areas of the housing, which generally have a lower temperature, and the heat conduction to these areas helps to dissipate heat more efficiently. In addition, the temperature difference inside the socket can be effectively reduced, the potential damage to the internal components caused by the uneven temperature can be reduced, and the stability and service life of the socket can be improved.

[0016] According to an embodiment of the present application, the heat dissipation member is arranged in or near the heat concentration area of the mobile socket, and the heat concentration area includes at least one of the area of the power supply assembly, the area of the functional components, and the area of the circuit board assembly.

[0017] According to an embodiment of the present application, the heat concentration area includes the area of the isolation transformer assembly and / or the rectification / voltage stabilization circuit and / or the wireless module and / or the processor and / or the memory and / or the jack of the mobile socket.

[0018] According to an embodiment of the present application, the heat dissipation member is arranged between the housing and the circuit board assembly, and the heat dissipation member is in direct or indirect contact with the housing and the circuit board assembly. In particular for the function-integrated smart socket, the circuit board assembly, for example, its processor, wireless transceiver module, etc., generally has a large amount of heat. By arranging the heat dissipation member between the housing and the circuit board assembly, the circuit board assembly can be targeted for heat dissipation to ensure the reliable operation of the mobile socket. Here, "direct contact" can be understood as the heat dissipation member being directly thermally connected with the housing and / or the circuit board assembly without passing through other intermediate medium. In contrast, "indirect contact" can be understood as there being an intermediate medium between the heat dissipation member and the housing and / or the circuit board assembly, at least in some areas. The heat dissipation member can be arranged on the upper side (i.e. the electronic component side) and / or the lower side (i.e. the circuit board side) of the circuit board assembly.

[0019] According to an embodiment of the present application, the heat dissipation member has a relief gap; and / or a thermally conductive element is arranged between the heat dissipation member and the circuit board assembly. The relief gap can enable other elements / structures to pass through the heat dissipation member without problems, which can be, for example, elements / structures of the mobile socket itself, but also, for example, elements / structures outside the mobile socket, such as the plug of the electrical equipment, etc. By adding the thermally conductive element, on the one hand, the gap between the heat dissipation member and the circuit board assembly can be bridged to ensure reliable thermal contact; on the other hand, the thermal conductivity efficiency can also be improved to achieve more efficient heat conduction. In some embodiments, the thermally conductive element can be configured as a thermally conductive sheet or a thermally conductive glue, such as silicone grease, etc., which can be coated or injected to the desired position.

[0020] According to an embodiment of the present application, the thermally conductive element is arranged at a position corresponding to a heat concentrating element of the circuit board assembly; and / or the thermally conductive element bridges the distance between the circuit board assembly and the heat dissipation member. The heat concentrating element can be understood as an element with a large amount of heat, such as an isolation transformer assembly, a rectifier / stabilizer, a wireless signal processing unit, a processing unit for providing an identification and operation of a power transmission protocol of a charging module with a weak electrical interface, a memory, etc. In this way, the effective heat conduction and dissipation of these heat concentrating elements can be ensured by means of the thermally conductive element. In addition, for the low-height electronic components on the circuit board assembly, the heat dissipation member laid on the housing can not be able to directly contact these low-height electronic components, in which case the thermally conductive element can be arranged between these low-height electronic components and the heat dissipation member to ensure reliable thermal contact.

[0021] According to an embodiment of the present application, the circuit board of the circuit board assembly extends parallel to the side of the housing on which the power outlet is formed. Generally, the side of the mobile socket on which the power outlet is formed can have a larger area, and the circuit board arranged parallel to this side can accordingly have a larger size for use, thereby enabling more efficient use of the internal space of the housing, integrating more electronic components and realizing more functions. In addition, a heat dissipation member can be arranged on the side of the housing on which the power outlet is formed, and this heat dissipation member can also extend directly on the housing to the area of the circuit board assembly, forming a continuous heat dissipation channel, which is conducive to more rational planning of the internal space layout of the mobile socket and enables the heat dissipation member to cooperate more closely and orderly with the circuit board assembly and other components.

[0022] According to an embodiment of the present application, the mobile socket comprises two circuit board assemblies, and the circuit boards of the two circuit board assemblies are parallel to each other and spaced apart from each other in a direction perpendicular to the circuit boards. This embodiment is particularly suitable for a socket of a substantially cubic shape, such as a portable conversion socket. Advantageously, the two circuit board assemblies can be arranged parallel to the side of the mobile socket on which the power pins are arranged. Advantageously, the two circuit board assemblies can be arranged facing each other, so that the circuit boards of the two circuit board assemblies can be respectively closer to the side of the housing on which a heat dissipation member is arranged, and the heat dissipation of the circuit boards can be simultaneously performed by means of the heat dissipation member.

[0023] According to an embodiment of the present application, the mobile socket comprises a temperature sensor and a processor electrically connected to the temperature sensor, and the temperature sensor is arranged in or near a heat concentration area of the mobile socket. Advantageously, the temperature monitoring function is added to the mobile socket, and the temperature sensor arranged in or near the heat concentration area can advantageously monitor the temperature inside the socket.

[0024] According to an embodiment of the present application, the processor is configured to limit or shut down at least part of the functions of the mobile socket according to the temperature measured by the temperature sensor. For example, when the temperature sensor detects that the temperature inside the mobile socket exceeds a safety threshold, the processor can quickly respond and timely limit or shut down part of the functions of the socket to avoid safety hazards such as fire and damage to electrical appliances caused by excessive temperature, thereby providing reliable safety protection for the user. In addition, this intelligent control mechanism can effectively prevent irreversible damage to the key components of the mobile socket, such as the circuit board, electronic components and outlet, caused by overheating, thereby prolonging the service life of the socket and reducing maintenance costs.

[0025] According to an embodiment of the present application, the heat dissipation member comprises a metal layer and a thermally conductive adhesive layer on one or both sides of the metal layer. The metal layer can be a copper sheet, an aluminum sheet or the like high thermally conductive metal member. The thermally conductive adhesive layer can be, for example, an insulating thermally conductive silicone adhesive material known from the prior art, a high-temperature insulating adhesive tape layer, a thermally conductive silicone grease or a thermally conductive insulating elastomer layer, the material of which can be widely known silicone rubber, epoxy resin, polyurethane, graphene or the like. This layered structure of the heat dissipation member can advantageously improve the thermal conduction efficiency and the structural stability of the heat dissipation member.

[0026] According to an embodiment of the present application, the functional component further comprises at least one of a manipulation device, an indicator device, a sensor interface. The manipulation device can be, for example, a key, a touch screen, a scroll wheel, a knob or the like; while the indicator device can be, for example, an LED light, a display screen, a nixie tube or the like. The sensor interface can be, for example, configured as a USB interface, an RJ45 Ethernet interface, an RS-485 interface or the like, which is used to connect a corresponding sensor. In addition, a wireless interface such as a Wi-Fi interface, a Bluetooth interface, a ZigBee interface or the like is also conceivable.

[0027] Further features of the present application result from the drawings and the specific embodiments. All the above-mentioned features and combinations of features mentioned in the description and the following specific embodiments mentioned and / or shown alone in the drawings can be used not only in the respective combinations indicated, but also in other combinations or in the individual state. BRIEF DESCRIPTION OF DRAWINGS

[0028] The various aspects of the present application will be better understood after a reading of the following specific embodiments in conjunction with the drawings in which:

[0029] Figure 1 Schematically shows a partial exploded perspective view of a mobile socket according to an embodiment of the present application;

[0030] Figure 2 Schematically shows Figure 1 the upper housing and the circuit board assembly of the mobile socket of

[0031] Figure 3 Schematically shows Figure 1 the upper housing of the mobile socket of

[0032] Figure 4 Schematically shows an exploded view of a mobile socket according to another embodiment of the present application. DETAILED DESCRIPTION

[0033] The present application will now be described with reference to the drawing figures, which illustrate several embodiments of the application. It is to be understood that the application can assume various alternative embodiments, and that the generic principles of the application can be implemented in various ways, all of which are intended to be encompassed by the application. It is to be understood that the embodiments disclosed herein are merely exemplary of the principles of the application, and that various modifications can be made by those skilled in the art without departing from the scope and spirit of the application. It is to be understood that both the forgoing general description and the following detailed description are exemplary and explanatory only, and are not restrictive of the application, as claimed.

[0034] It is to be understood that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art. It will be further understood that the use of the singular includes the plural unless otherwise specified. For the sake of clarity, the technical and scientific terms used herein are to be interpreted as being consistent with the meaning of the terms as known to one of ordinary skill in the art.

[0035] As used in the description of the application herein, the following terms have the following meanings.

[0036] In the description herein, terms of orientation such as "on," "attached to," "connected to," "coupled to," or "in contact with" one element to another element are used to describe a relative position of one element to another element. It will be understood that the positional relationship can be directly or indirectly, and one element can be positioned on, attached to, connected to, coupled to, or in contact with another element with intervening elements present.

[0037] In the description herein, terms of orientation such as "on," "attached to," "connected to," "coupled to," or "in contact with" one element to another element are used to describe a relative position of one element to another element. It will be understood that the positional relationship can be directly or indirectly, and one element can be positioned on, attached to, connected to, coupled to, or in contact with another element with intervening elements present.

[0038] Figures 1 to 3 A mobile socket 100 according to an embodiment of the present application is schematically illustrated. The mobile socket 100 includes:

[0039] a housing 101;

[0040] a power supply assembly 102 including a power supply interface for the mobile socket 100;

[0041] functional components 103, which are distributed at least on the first face 30 and the second face 310 of the housing, the functional components comprising the receptacles 31, 312;

[0042] a circuit board assembly 200 arranged within the housing, the circuit board assembly being electrically connected with at least some of the functional components; and

[0043] a heat sink arranged on the inside of the housing 101, the heat sink being configured for conducting heat out of the housing 101.

[0044] In particular, the housing 101 of the mobile socket 100 can comprise an upper housing 3 and a lower housing 1 assembled therewith. The upper housing 3 can be connected with the lower housing 1, for example, by snap connection, screw connection, adhesive connection, etc. As shown in Figure 1 and Figure 3 In the shown embodiment, the upper housing 3 and the lower housing 1 can comprise thread connections 15, which are positionally corresponding to each other, respectively, and the upper housing 3 and the lower housing 1 can be fixedly connected with each other by means of bolts or screws passing through the corresponding thread connections 15. The upper housing 3 and the lower housing 1 can jointly define an interior space of the housing. Figures 1 to 3 The shown mobile socket 100 can be configured as a power strip, and the power supply assembly thereof can comprise an extension cable 4 and a power interface, for example, a plug, not shown. The extension cable 4 can be accessed into the housing through a threading hole 20 (see Figure 3 ). Herein, the lower housing 1 of the mobile socket 100 can exist as a bottom face of the mobile socket 100, which can be used to be placed on a bearing surface, for example, a table top, or to contact other outer surfaces, for example, a wall surface, for example, in the case of hanging.

[0045] The mobile socket 100 can be configured as a smart socket herein. The smart socket can not only have a larger number of different types of receptacles, but also have functions such as sensor interface, network relay, overload protection, timing switch, etc. In order to provide diversified functions under the limited external size and internal space, the functional components of the mobile socket 100 can be distributed at least on the first face 30 and the second face 310 of the housing. In particular, in the shown embodiment, at least one, preferably a plurality of first receptacles 31 can be provided in the first face 30 of the mobile socket 100, herein the upper wall 33 of the upper housing 3 opposite to the lower housing 1, the first receptacles 31 can exist as strong current receptacles herein, which are five-hole receptacles. Additionally, some other functional components can also be provided in other areas on the first face 30, for example, the mechanical / touch-sensitive button area 35, the LED / LCD indicator, etc. In order to integrate more functions, as shown in Figure 2As shown, at least one, preferably multiple, second sockets 312 can also be provided on the second surface 310 of the movable socket 100, which is here the first sidewall 34 of the upper housing 3. These second sockets 312 can also function as high-voltage sockets, being two-prong sockets. It is also conceivable that additionally... Figure 2 At least one, preferably multiple, second sockets 312 are also formed on the second sidewall 36 opposite to the visible second surface 310. Advantageously, in some embodiments, the first sockets 31 and second sockets 312 that correspond to each other in position can share a single metal socket structure assembly, thereby enabling the integration of more sockets within a limited space. Additionally or alternatively, such as Figure 2 As shown, a low-voltage socket group 311 may be provided on the second side 310 of the portable socket 100, which can communicate with a corresponding low-voltage interface 22 located inside the housing. The low-voltage socket or low-voltage interface 22 may include at least one of the following: TYPE-A, TYPE-B, TYPE-C, Mini USB, Micro USB, Lightning interface, etc.

[0046] To enable the corresponding functions of the functional components, the portable socket 100 also includes a circuit board assembly 200 disposed within the housing. The circuit board assembly 200 can be electrically connected to at least a portion of the functional components, such as the mechanical / touch-sensitive button area 35, the LED / LCD indicator, and / or the low-voltage interface 22. To comply with electrical regulations, the first socket 31, the second socket 312, and their corresponding metal sleeves, conductive elements 27, etc., used for the high-voltage path can be electrically isolated from the circuit board assembly 200 in the low-voltage path.

[0047] like Figure 2 As shown, the upper housing 3 can be constructed as a cover and form an internal mounting space 300 to accommodate internal components of the movable socket 100, such as the circuit board assembly 2, metal sleeves for high-voltage sockets, conductive elements 27, protective door structures 28, 29, etc. Typically, the height of the sidewalls of the upper housing 3 (in the illustrated embodiment, this is essentially equivalent to the distance between the upper wall of the upper housing 3 and the bottom surface of the lower housing 1) is determined by the conductive elements 27 and their protective door structures 28, 29 housed in the internal mounting space 300. Furthermore, the height of the sidewalls of the upper housing 3 can also be determined by taking into account the overall height of the circuit board assembly 2 to achieve a flat and compact overall socket design. To make more efficient use of the internal mounting space 300 and provide more functionality, on the one hand, a single-layer circuit board design can be used to reduce the height of the sidewalls of the upper housing 3. On the other hand, as mentioned earlier, the functionality of the smart socket can be expanded by adding more functional components to the upper wall, various sidewalls, and even the bottom surface of the movable socket 100.

[0048] In some embodiments, such asFigure 3 As shown, to achieve miniaturization of the socket as much as possible, the first protective door structure 28 for the first socket 31 can be held, for example, via the first retaining part 37, and can be limited and slidable within the first retaining part 37. Similarly, the second protective door structure 29 for the second socket 312 can be held, for example, via the second retaining part 32, and can be limited and slidable within the second retaining part 32. The first retaining part 37 can be constructed on the inner side of the upper wall 33 of the upper housing 3 in the region where the first socket 31 is located, while the second retaining part 32 can be constructed on the inner side of the first side wall 34 of the upper housing 3 in the region where the second socket 312 is located. Likewise, if a socket is located in the second side wall 36 of the upper housing 3, a corresponding retaining part can be constructed in the corresponding region of the second side wall 36 to retain the corresponding protective door structure.

[0049] In some embodiments, such as Figure 1 As shown, the bottom surface 11 of the lower housing 1 may be provided with a retaining rib 13 for fixing the conductive component 27 to fix the conductive component 27 as compactly as possible.

[0050] In some embodiments, to achieve a flat and compact configuration, the circuit board 2 of the circuit board assembly 200 may extend parallel to the surface of the housing that has power sockets. Power sockets, particularly five-hole or three-hole sockets, generally occupy a large area; therefore, the surface of the removable socket 100 that has power sockets can generally have a large, preferably maximum, area. By arranging the circuit board 2 parallel to this surface, a larger circuit board can be selected, and more electronic components can be arranged on the circuit board 2, thereby providing richer functionality. Specifically, in Figures 1 to 3 In the illustrated embodiment, the circuit board 2 of the circuit board assembly 200 can be arranged parallel to the upper wall 33 of the upper housing 3. Furthermore, the circuit board assembly 200 may include a button control unit 26, which can abut against buttons 25 embedded in the button area 35 of the upper wall 33 to receive control inputs, such as for turning relay elements on / off, setting operating modes, countdown functions, and / or network configuration functions.

[0051] To achieve heat dissipation of the portable socket 100, such as Figure 1As shown, the mobile socket 100 comprises heat dissipation members 12, 23 which are applied on the inner side of the housing and are configured to conduct heat out of the housing. In order to achieve a good heat dissipation effect, in some embodiments, the heat dissipation members 12, 23 can be arranged in or near the heat concentration area of the mobile socket 100. The heat concentration area can comprise at least one of the area of the power supply assembly, the area of the functional components and the area of the circuit board assembly. In particular, the heat concentration area can comprise the area of the isolation transformer assembly and / or the rectification / stabilization circuit and / or the wireless module and / or the processor and / or the memory and / or the jack of the mobile socket 100.

[0052] In Figures 1 to 3 In the shown embodiment, heat dissipation members can be arranged in the area of the circuit board assembly 200. Advantageously, a first heat dissipation member 23 and a second heat dissipation member 12 can be arranged on both sides of the circuit board assembly 200, respectively. It can be understood that a large number of electronic components can be densely arranged on the circuit board assembly 200, which can have a large heat generation. Therefore, arranging heat dissipation members in the area of the circuit board assembly 200 can achieve a targeted heat dissipation for the circuit board assembly 200. The first heat dissipation member 23 can be arranged between the upper side of the circuit board assembly 200 and the upper wall 33 of the upper housing 3, while the second heat dissipation member 12 can be arranged between the bottom side of the circuit board assembly 200 (i.e. the back side of the circuit board 2) and the lower housing 1. Advantageously, the area of at least one heat dissipation member can be larger than the area of the circuit board assembly 200 or the circuit board 2, so that the heat generated on the circuit board 2 can be well conducted to the upper housing 3 and / or the lower housing 1. As shown, Figure 1 As shown, the area of the second heat dissipation member 12 arranged on the back side of the circuit board 2 can be larger than the area of the circuit board 2.

[0053] Alternatively or additionally, in some embodiments, heat dissipation members can also be applied in the area of the housing where functional components, in particular functional components with a large heat generation, are arranged. Functional components with a large heat generation can be, for example, the jack, indicator devices (such as LED lights, display screens, nixie tubes) and the like. The heat dissipation members can be arranged, for example, around the jack or the indicator devices.

[0054] In some embodiments, the heat dissipation members can be laid and fixed by means of adhesion, injection molding and the like. For example, the heat dissipation members can exist as heat dissipation films with adhesive backing, which can be adhered to the housing by means of the adhesive backing. For example, the heat dissipation members can initially exist as heat dissipation gels or heat dissipation silicone grease, which can be injected and coated in the corresponding area and form the heat dissipation members after a certain solidification process if necessary. In some embodiments, for example for heat dissipation members arranged between the circuit board 2 and the housing, the heat dissipation members can also be clamped directly between the circuit board 2 and the housing without the need for adhesive connection.

[0055] In some embodiments, the heat sink can be configured as a composite layer. For example, the heat sink may include a metal layer and thermally conductive adhesive layers located on one or both sides of the metal layer. The metal layer may be a high thermal conductivity metal such as a copper sheet or an aluminum sheet. The thermally conductive adhesive layers may be applied to one or both sides of the metal layer, and these adhesive layers may be, for example, thermally insulating silicone materials, high-temperature insulating tape sheets, thermally conductive silicone grease, or thermally insulating elastic rubber layers known in the art.

[0056] In some embodiments, such as Figure 1 and Figure 2 As shown, a heat-conducting element 21 can be disposed between the heat sink and the circuit board assembly 200. The heat-conducting element 21 can be disposed at a position corresponding to the heat-concentrating element of the circuit board assembly 200, and / or the heat-conducting element can bridge the distance between the circuit board assembly 200 and the heat sink. For example, for... Figure 1 As shown, the first heat sink 23, arranged between the upper side of the circuit board assembly 200 and the upper wall 33 of the upper housing 3, can have thermally conductive elements 21 attached to some electronic components of the circuit board assembly 200. The electronic components requiring the attachment of thermally conductive elements 21 can be, for example, so-called "heat-concentrated components," i.e., these electronic components can generate a large amount of heat, such as isolation transformer assemblies, rectifiers / regulators, wireless signal processing units, processing units for providing power transmission protocols for the identification and operation of charging modules with low-voltage interfaces 22, memory, etc. Thus, effective heat conduction and dissipation can be ensured for these heat-concentrated components by means of the thermally conductive elements 21. Furthermore, the electronic components requiring the attachment of thermally conductive elements 21 can also have a low height, so that the heat sink mounted on the housing cannot directly establish a thermally conductive connection with such electronic components. In this case, the thermally conductive elements 21 can bridge the distance between such low-height electronic components and the heat sink to ensure effective heat conduction and dissipation for these heat-concentrated components. Furthermore, for example, for... Figure 1 The second heat sink 12, shown as being disposed between the back side of the circuit board 2 and the lower housing 1, can also have a heat-conducting element 21 attached between the circuit board 2 and the lower housing 1. The position of the heat-conducting element 21 can also correspond to the position of the heat concentration element on the circuit board 2.

[0057] In some embodiments, alternatives to or additional to the sheet-like thermal conductive element 21 may also be injected into the gap between the heat sink and the component that needs to be cooled (e.g., the circuit board 2, the heat concentration element on the circuit board 2, etc.) in the form of thermally conductive adhesive to enhance the heat dissipation effect.

[0058] In some embodiments, the heat sink can have an avoiding gap. The avoiding gap can enable other elements / structures to pass through the heat sink without any problem, which can be elements / structures of the mobile socket 100 itself, but also can be elements / structures outside the mobile socket 100, such as plugs of electrical appliances, etc. For example, in the case that the circuit board assembly 200 has relatively high parts, so that the distance between the high parts and the housing is very small, especially less than the thickness of the heat sink, an avoiding gap can be opened at a position opposite to the high parts, so as to reliably arrange the heat sink without causing deformation, bending or even damage of the high parts. In addition, an avoiding gap can also be opened at a position corresponding to elements such as plug-in connectors or light guides, etc. In some embodiments, an avoiding gap can be opened at a position corresponding to, for example, a sensor or a wireless transceiver, so as to avoid affecting the function of the sensor or the wireless transceiver due to the presence of the heat sink. For example, the heat sink with a metal layer can have a certain shielding effect on electromagnetic waves, and opening an avoiding gap at a position of the heat sink corresponding to the wireless transceiver can reduce or eliminate the interference to the wireless transceiver.

[0059] In some embodiments, the heat sink can extend on at least two mutually adjacent faces of the housing of the mobile socket 100. For example, Figure 1 The first heat sink 23 shown in FIG. 1 can extend from the upper wall 33 of the upper housing 3 to the first side wall 34 and / or the second side wall 36 adjacent to the upper wall 33. In this way, on the one hand, the adjacent side walls can be advantageously used as heat dissipation surfaces to improve the heat dissipation efficiency; on the other hand, the design space of the original electronic circuit in the housing can be occupied as little as possible.

[0060] In some embodiments, in order to maintain effective temperature control, the mobile socket 100 can include a temperature sensor and a processor electrically connected to the temperature sensor. The temperature sensor can be arranged in or near the heat concentration area of the mobile socket 100. The temperature inside the housing can be monitored by means of the temperature sensor to ensure the normal operation of each component. The processor can obtain the temperature information measured by the temperature sensor in order to control the operation of the mobile socket 100. Specifically, the processor can limit or shut down at least part of the functions of the mobile socket 100, such as shutting down or limiting the power of part of the electronic circuit, for example, after the temperature measured by the temperature sensor exceeds a set threshold. In this way, the mobile socket 100 can be ensured to operate at a safe temperature.

[0061] Figure 4 The mobile socket 100 according to another embodiment of the present application is schematically shown.

[0062] The mobile socket 100 can be configured as a portable conversion socket. The housing of the mobile socket 100 can comprise an upper housing 3 and a lower housing 1 assembled therewith. A first socket 31, for example as a mains socket, can be provided on the upper wall 33 and / or a side wall, for example the first side wall 34 or the third side wall 38, of the upper housing 3. The first socket 31 can be configured as a five-hole socket. Alternatively or additionally, a low-voltage socket 513 can also be provided on the upper wall 33 and / or a side wall, here the first side wall 34, of the upper housing 3, with the low-voltage interface 22 inside the housing being aligned with the low-voltage socket 513 for the corresponding low-voltage plug to be plugged in. The low-voltage interface 22 can be configured as a TYPE-A interface. By combining a mains socket and a low-voltage socket on the mobile socket 100, a comprehensive smart socket function can be provided. Here, the power supply interface of the mobile socket 100 can be configured in the form of a pin 561 inserted through the bottom surface 560 of the lower housing 1, via which the mobile socket 100 can be directly plugged into the corresponding power grid interface to draw power from the power grid. In addition, an indicator device 515 can also be provided in the upper wall 33 of the mobile socket 100. The indicator device 515 can be configured as an LED light.

[0063] in combination with Figures 1 to 3 Unlike the mobile socket shown, in order to adapt to the cuboid outer shape, Figure 4 The mobile socket 100 shown can comprise at least two circuit board assemblies, here exactly two, i.e. a first circuit board assembly 201 with a first circuit board 52 and a second circuit board assembly 202 with a second circuit board 55. The first circuit board 52 and the second circuit board 55 can be parallel to each other and spaced apart from each other in a direction perpendicular to the circuit boards, i.e. in the vertical direction in Figure 4 Referring to Figure 4 , the first circuit board assembly 201 and the second circuit board assembly 202 can be arranged facing each other. In particular, the second circuit board assembly 202 can be arranged in the housing in a so-called "upright" manner, in which the second circuit board 55 is located lower, while the electronic components carried on the upper side 550 of the second circuit board 55 are located above the second circuit board 55. In contrast, the first circuit board assembly 201 can be arranged in the housing in a so-called "inverted" manner, in which the first circuit board 52 is located above, while the electronic components carried on the surface 521 of the first circuit board 52 are located below the first circuit board 52. As a result, the first circuit board 52 can be arranged closer to the upper wall 33 of the upper housing 3, while the second circuit board 55 can be arranged closer to the bottom surface 560 of the lower housing 1. By arranging the circuit boards closer to the corresponding surfaces of the housing, it is advantageous to conduct and dissipate heat from the respective circuit board assemblies by the heat dissipation elements applied on the inside of the housing, which will be described in more detail below.

[0064] The first circuit board assembly 201 and the second circuit board assembly 202 can be electrically connected to each other, and a bracket 53 can be arranged between the first circuit board assembly 201 and the second circuit board assembly 202 to provide support and isolation. The bracket 53 can have a positioning structure that accommodates the outer contour of the first circuit board assembly 201 and the second circuit board assembly 202 to achieve such stable support and isolation. For example, one side of the bracket 53 facing the first side wall 34 of the housing can be provided with a positioning groove 533 to avoid the weak current interface 22 of the first circuit board assembly 201 from contacting the second circuit board assembly 202, and to provide force support during plugging and unplugging. Alternatively, in some embodiments, if the weak current interface 22 or the weak current jack 513 is replaced by a strong current interface, the positioning groove 533 can also be used to accommodate the corresponding metal plug. The electronic components of the mobile socket 100 can be distributed on the first circuit board assembly 201 and the second circuit board assembly 202 as needed, and if necessary, the electronic components of the first circuit board assembly 201 can be signal connected with the electronic components of the second circuit board assembly 202 to work together. Here, the second circuit board assembly 202 can include signal processing units, storage units, and other electronic components.

[0065] In order to supply power to the circuit system of the mobile socket 100, the back side 551 of the second circuit board 55 can be provided with contacts that are electrically connected to the electrical contacts 564 on the lower housing 1, which can be welded to the electrical contacts 564. The electrical contacts 564 and / or the contacts can be electrically connected to the conductive end of the metal plug 54 matched with the first jack 31 on the one hand, and to the power supply assembly of the second circuit board assembly 202 on the other hand. The power supply assembly can include an isolation transformer 553, a rectification / voltage stabilization circuit, etc., in order to provide an adapted voltage for the weak current system of the mobile socket 100. The power output of the second circuit board assembly 202 can be delivered to the first circuit board assembly 201 through one or more electrical connector interfaces 554 via the electrical contact pins 524 in order to supply power to the first circuit board assembly 201. The metal plug 54 can pass through the opening 534 in the center of the bracket 53 and the opening 522 in the corresponding position of the first circuit board assembly 201 side by side in order to be aligned with the first jack 31.

[0066] To adapt to the cuboid shape of the mobile socket 100, the first circuit board assembly 201, the bracket 53 and the second circuit board assembly 202 can be stacked on each other to form a regular cuboid structure as much as possible. The first circuit board assembly 201 can be fixed to the bracket 53, for example, via threaded connection. If necessary, the bracket 53 can separate the electrical contact pins 524 or the electrical connector interfaces 554 by the support rods 532. On the lower housing 1, a clamping rib 563 can be configured for clamping the second circuit board assembly 202 to a fixed position / height, wherein the clamping rib 563 can be clamped with the clamping groove 552 on the second circuit board assembly 202, and can achieve physical isolation of the metal bush 54 after welding. The bracket 53 can be fixed on the threaded connection part 567 of the lower housing 56.

[0067] Advantageously, a heat dissipation member (hereinafter referred to as third heat dissipation member 516 and fourth heat dissipation member 565) can be applied to the upper wall 33 of the upper housing 3 and the bottom surface 560 of the lower housing 1, respectively, for heat dissipation. Specifically, the third heat dissipation member 516 applied to the upper wall 33 can be in thermal contact with the back side 520 of the first circuit board assembly 201, in particular. In some positions of the first circuit board assembly 201 (e.g. heat concentration areas or positions corresponding to heat concentration elements), a heat conduction element 21 can be applied to enhance the heat conduction effect through the heat conduction element 21. The heat dissipation member 516 can at least partially surround the first socket 31 and have a corresponding avoiding gap at least in the area of the first socket 31. The heat dissipation member 516 can advantageously extend from the upper wall 33 to the side wall adjacent to the upper wall 33, here the third side wall 38. The fourth heat dissipation member 565 applied to the bottom surface 560 of the lower housing 1 can at least partially surround the electrical contact 564 or the pin 561, and can also have avoiding gaps for fixing members such as the clamping rib 563, the stud 567, etc. Moreover, in order to achieve better heat dissipation effect, the fourth heat dissipation member 565 can be configured to cover the bottom surface 560 of the lower housing 1 as much as possible and extend to the lower housing side wall 562 by a certain height if necessary. In addition, one or more heat conduction elements 21 can be further applied to the fourth heat dissipation member 565, which can be located in heat concentration areas or positions corresponding to heat concentration elements, especially positions corresponding to some processing chips. It can be understood that each heat conduction element 21 can have different configurations (e.g. thickness, shape, material, etc.), and the corresponding suitable heat conduction element can be selected according to the characteristics and needs of the area where the heat conduction element 21 is needed to be arranged.

[0068] It can be understood that the heat dissipation member does not necessarily have to be arranged in correspondence with the circuit board. For example, in some embodiments, a corresponding heat dissipation member can be applied to the first side wall 34 of the mobile socket 100 having the low-voltage socket 513. Figure 4 In addition, for example, for the mobile socket 100 having the low-voltage socket 513, Figures 1 to 3As shown in the mobile socket 100 in the middle, the heat dissipation member can be arranged in the region of the upper wall 33 of the mobile socket 100 where the first socket 31 is arranged, and / or the heat dissipation member can be arranged in the region of the first side wall 34 of the mobile socket 100 where the second socket 312 is arranged or the region where the weak current socket group 311 is arranged.

[0069] Although the present application has been disclosed with the preferred embodiments as above, it is not intended to limit the present application, and any person skilled in the art can make possible changes and modifications to the technical solutions of the present application by using the disclosed methods and technical contents without departing from the spirit and scope of the present application. Therefore, any simple modification, equivalent change and modification made to the above embodiments according to the technical essence of the present application without departing from the technical solutions of the present application shall fall within the protection scope of the present application.

Claims

1. A mobile socket, characterized in that, The mobile socket (100) comprises: a housing (101); a power supply assembly (102) comprising a power supply interface for the mobile socket; functional components (103) distributed on at least a first face (30) and a second face (310) of the housing, the functional components comprising a socket; a circuit board assembly (104) arranged inside the housing, the circuit board assembly being electrically connected with at least part of the functional components; and a heat sink (105) applied on the housing on the inside of the housing, the heat sink being configured to conduct heat out of the housing.

2. The mobile outlet of claim 1, wherein, The heat sink is at least partially located on the first face and / or the second face of the housing.

3. Mobile socket according to claim 1 or 2, characterized in that The heat sink extends on at least two faces of the housing adjacent to each other.

4. The mobile socket of claim 1 or 2, wherein, The heat sink is arranged in or near a heat concentration area of the mobile socket, the heat concentration area comprising at least one of an area of the power supply assembly, an area of the functional components and an area of the circuit board assembly.

5. The mobile socket of claim 4, wherein, The heat concentration area comprises an area of an isolation transformer assembly and / or a rectification / voltage stabilization circuit and / or a wireless module and / or a processor and / or a memory and / or a socket of the mobile socket.

6. The mobile jack of claim 1 or 2, wherein, The heat sink is arranged between the housing and the circuit board assembly, and the heat sink is in direct or indirect contact with the housing and the circuit board assembly.

7. The mobile jack of claim 1 or 2, wherein, The heat sink has an avoiding notch; and / or a heat conducting element (21) is arranged between the heat sink and the circuit board assembly.

8. The mobile jack of claim 1 or 2, wherein, A heat conducting element (21) is arranged between the heat sink and the circuit board assembly, wherein the heat conducting element is arranged at a position corresponding to a heat concentration element of the circuit board assembly; and / or the heat conducting element bridges a distance between the circuit board assembly and the heat sink.

9. The mobile jack of claim 1 or 2, wherein, The circuit board of the circuit board assembly extends parallel to a face of the housing on which a strong current socket is configured; and / or the mobile socket comprises two circuit board assemblies, the circuit boards of the two circuit board assemblies being parallel to each other and spaced apart from each other in a direction perpendicular to the circuit boards.

10. The mobile jack of claim 4, wherein, The mobile socket comprises a temperature sensor and a processor electrically connected with the temperature sensor, the temperature sensor being arranged in or near a heat concentration area of the mobile socket.

11. The mobile jack of claim 10, wherein, The processor is configured to limit or shut down at least part of the functions of the mobile socket according to the temperature measured by the temperature sensor.

12. The mobile jack of claim 1 or 2, wherein, The heat sink comprises a metal layer and a heat conducting glue layer on one side or both sides of the metal layer.

13. The mobile jack of claim 1 or 2, wherein, The functional components further comprise at least one of a manipulation device, an indicator device, a sensor interface. The heat sink comprises a metal layer and a heat conducting glue layer on one side or both sides of the metal layer. The functional components further comprise at least one of a manipulation device, an indicator device, a sensor interface.

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