PCB semi-finished product convenient for stripping film

Abstract

The utility model relates to a PCB semi-finished product convenient for film stripping, comprising a substrate which comprises a plurality of circuit units arranged in an array; the circuit unit comprises a substrate and an anti-plating dry film, the anti-plating dry film is arranged on at least one surface of the substrate, a non-circuit area is formed on the periphery of the circuit unit, and the anti-plating dry film is provided with a plurality of first windows corresponding to the non-circuit area. According to the anti-plating dry film stripping device, the adhesion area of the anti-plating dry film and the substrate can be reduced, so that the film stripping difficulty is reduced, the anti-plating dry film can be cleanly stripped by stripping the film once, the film stripping efficiency and quality are improved, and the product quality and the production efficiency are further improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to the field of PCB manufacturing, specifically, relate to a kind of PCB semi-finished product of membrane fading. BACKGROUND

[0002] The manufacturing process of the existing PCB (printed circuit board) needs to be plugged with resin, and the through hole is plated before plugging with resin. The anti-plating dry film is attached to the surface of the circuit board during plating, and the plated hole is exposed. After plating is completed, the anti-plating dry film is removed. The diameter of the existing PCB plating hole is small or the number of holes that need to be plated is not much. For such PCB, when the membrane is removed, the anti-plating dry film is difficult to remove or not clean due to the large area of adhesion, which requires multiple membrane removal, affecting the quality and production efficiency of the product. SUMMARY

[0003] The utility model aims at providing a kind of PCB semi-finished product of membrane fading, which is reasonable in structure, can easily remove the anti-plating dry film, improve the efficiency and quality of membrane fading, and thus improve the product quality.

[0004] A kind of PCB semi-finished product of membrane fading, comprising: substrate, the substrate includes a plurality of arrayed circuit units;And anti-plating dry film, the anti-plating dry film is arranged on at least one surface of the substrate, the outer periphery of the circuit unit is formed with non-circuit area, and the anti-plating dry film is provided with a plurality of first windows corresponding to the non-circuit area.

[0005] In the above technical solution, a plurality of first windows are arranged on the anti-plating dry film corresponding to the non-circuit area, forming a spaced hollow area on the anti-plating dry film, which can reduce the area of adhesion between the anti-plating dry film and the substrate, thereby reducing the difficulty of membrane fading, ensuring that the anti-plating dry film can be removed cleanly in a single membrane fading, improving the efficiency and quality of membrane fading, and thus improving the quality and production efficiency of the product.

[0006] Further, a plurality of through holes to be electroplated are arranged in the circuit unit, and the anti-plating dry film is provided with a second window corresponding to the through hole.

[0007] In the above technical solution, the second window is arranged, so that the through hole to be electroplated is exposed, thereby electroplating the through hole in the electroplating process.

[0008] Further, a plurality of first windows are arranged along the outer periphery of the circuit unit.

[0009] In the above technical solution, the first window is arranged along the outer periphery of the circuit unit, forming a continuous window belt around the circuit unit, which can ensure that the anti-plating dry film inside and around the circuit unit is easier to remove, thereby improving the membrane fading quality of the circuit unit.

[0010] Further, distances between two adjacent first windows are equal.

[0011] In the above technical solution, the distances between two adjacent first windows are equal, which can facilitate film removal while ensuring the stability of the dry film structure, avoiding the dry film offsetting and affecting product quality.

[0012] Further, the first windows are arranged in an array in the non-wiring area.

[0013] In the above technical solution, the first windows are arranged in an array in the non-wiring area, which can further reduce the adhesion area of the dry film to the substrate, making the dry film in the non-wiring area more easily removed.

[0014] Further, the wiring unit has a blank area, and the blank area is provided with a plurality of first windows.

[0015] It can be understood that in some wiring units, there are blank areas without wiring or holes, and a plurality of first windows are arranged in the blank areas, which can make the corresponding dry film in the wiring unit more easily removed.

[0016] Further, the non-wiring area is formed between two adjacent wiring units.

[0017] In the above technical solution, the non-wiring area is arranged between two adjacent wiring units, so that the first windows can be arranged between the wiring units, thereby facilitating the removal of the dry film between the wiring units.

[0018] Further, the first window is formed in one of a rectangle, a circle, or an ellipse.

[0019] Compared with the prior art, the PCB semi-finished product of the present application has the following advantages: by arranging a plurality of first windows in the position corresponding to the non-wiring area of the dry film, a spaced hollow area is formed on the dry film, which can reduce the adhesion area of the dry film to the substrate, thereby reducing the difficulty of film removal, ensuring that the dry film can be completely removed at one time, improving the efficiency and quality of film removal, and further improving the quality and production efficiency of the product. BRIEF DESCRIPTION OF DRAWINGS

[0020] Figure 1 The structure of the PCB semi-finished product of the present application is shown in the figure.

[0021] Figure 2 The structure of the wiring unit of the present application is shown in the figure.

[0022] Explanation of reference numerals:

[0023] The substrate 1, the circuit unit 11, the non-circuit area 12, the through hole 13, the blank area 14, the dry film 2, the first window 21, and the second window 22. DETAILED DESCRIPTION

[0024] To make the objectives, technical solutions, and advantages of the embodiments of the present application clearer, the following will be combined with the accompanying drawings for the embodiments of the present application to make a clear and complete description of the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. The components of the embodiments of the present application described and shown in the accompanying drawings can be arranged and designed in various different configurations.

[0025] Therefore, the following detailed description of the embodiments of the present application provided in the accompanying drawings is not intended to limit the scope of the claimed present application, but only represents selected embodiments of the present application. All other embodiments obtained by a person of ordinary skill in the art without creative labor based on the embodiments in the present application are within the scope of protection of the present application.

[0026] Please refer to Figure 1 and Figure 2 In a preferred embodiment, the PCB semi-finished product convenient for film stripping of the present application mainly comprises a substrate 1 and a dry film 2. The substrate 1 comprises a plurality of circuit units 11 arranged in an array. The dry film 2 is arranged on at least one surface of the substrate 1. The outer periphery of the circuit unit 11 forms a non-circuit area 12. The dry film 2 is provided with a plurality of first windows 21 corresponding to the non-circuit area 12.

[0027] For example, the substrate 1 can adopt an existing PCB material. In the present embodiment, the substrate 1 is a PCB semi-finished product formed after a pressing plate, drilling, and copper sinking or plate electrical process. The substrate 1 is provided with a circuit unit 11 having a circuit. The circuit unit 11 is arranged in an array on the substrate 1. The outer periphery of each circuit unit 11 forms a non-circuit area 12. The dry film 2 is attached to one side or both sides of the substrate 1. The dry film 2 is provided with a plurality of first windows 21 corresponding to the non-circuit area 12. The first window 21 is formed as a hole penetrating the dry film 2 from the thickness direction, so that the first window 21 can expose the surface of the substrate 1. The first window 21 can be formed in one of a rectangular shape, a circular shape, or an elliptical shape. In the present embodiment, the first window 21 is rectangular. In other possible embodiments, the first window 21 can also be formed in other regular shapes. It should be noted that, for the convenience of display, Figure 2 The dry film 2 in the figure only shows covering a single circuit unit 11. In actual application, the dry film 2 can completely cover the surface of the substrate 1.

[0028] It can be seen from the above technical solution that by arranging a plurality of first windows 21 at positions corresponding to the non-circuit area 12 of the anti-plating dry film 2, a spaced hollow area is formed on the anti-plating dry film 2, which can reduce the area of adhesion between the anti-plating dry film 2 and the substrate 1, thereby reducing the difficulty of film removal, ensuring that the anti-plating dry film 2 can be completely removed at one time, improving the efficiency and quality of film removal, and further improving the quality and production efficiency of the product.

[0029] In the present embodiment, a plurality of through holes 13 to be plated are provided in the circuit unit 11, and the anti-plating dry film 2 is provided with a second window 22 corresponding to the through hole 13. The second window 22 is formed as a hole penetrating the anti-plating dry film 2 from the height direction, and the diameter thereof matches the diameter of the corresponding through hole 13. By arranging the second window 22, the through hole 13 that needs to be plated can be exposed, so that the through hole 13 is plated in the plating process.

[0030] In the present embodiment, a plurality of first windows 21 are arranged along the outer periphery of the circuit unit 11. By arranging the first windows 21 along the outer periphery of the circuit unit 11, a continuous window belt surrounding the circuit unit 11 can be formed, which can ensure that the anti-plating dry film 2 inside and around the circuit unit 11 is more easily removed, thereby improving the film removal quality of the circuit unit 11.

[0031] As a preferred embodiment, the distance between adjacent two first windows 21 is equal. The equal distance between adjacent two first windows 21 can facilitate film removal while ensuring the stability of the structure of the anti-plating dry film 2, avoiding the displacement of the anti-plating dry film 2 and affecting the product quality.

[0032] In the present embodiment, a plurality of first windows 21 are arranged in an array in the non-circuit area 12. The first windows 21 arranged in an array in the non-circuit area 12 can further reduce the adhesion area of the anti-plating dry film 2 and the substrate 1, making the anti-plating dry film 2 in the non-circuit area 12 more easily removed. In specific implementation, the number and interval of the first windows 21 can be set according to the shape and area of the non-circuit area 12, which is not limited herein.

[0033] In the present embodiment, a blank area 14 is formed in the circuit unit 11, and the blank area 14 is provided with a plurality of first windows 21. It can be understood that in some circuit units 11, there are blank areas 14 without wiring or holes, and a plurality of first windows 21 can be arranged corresponding to the blank areas 14, so that the corresponding anti-plating dry film 2 inside the circuit unit 11 is more easily removed.

[0034] In the present embodiment, a non-circuit area 12 is formed between adjacent two circuit units 11. The non-circuit area 12 is arranged between adjacent two circuit units 11, so that the first windows 21 can be arranged between the circuit units 11, thereby facilitating the film removal of the anti-plating dry film 2 between the circuit units 11.

[0035] In the description of the utility model, it is understood that the terms such as "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the utility model and simplifying the description, and therefore cannot be understood as indicating or implying that the device or element indicated must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the utility model.

[0036] In addition, the terms "first", "second" are only for the purpose of description, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined with "first", "second" can explicitly or implicitly include one or more of the features. In the description of the utility model, the meaning of "multiple" is two or more than two, unless otherwise specifically limited.

[0037] Although the embodiments of the utility model have been shown and described, it can be understood by those of ordinary skill in the art that various changes, modifications, replacements and variations can be made to these embodiments without departing from the principles and spirits of the utility model, and the scope of the utility model is defined by the appended claims and their equivalents.

Claims

1. A PCB semi-finished product that is easy to remove the film from, characterized in that, include: A substrate, the substrate comprising a plurality of circuit units arranged in an array; as well as A resist-plating dry film is disposed on at least one surface of the substrate, and a non-circuit area is formed on the outer periphery of the circuit unit. The resist-plating dry film has a plurality of first openings corresponding to the non-circuit area.

2. The PCB semi-finished product with easy film removal according to claim 1, characterized in that, The circuit unit is provided with several through holes to be electroplated, and the anti-plating dry film is provided with a second opening corresponding to the through holes.

3. The PCB semi-finished product with easy film removal according to claim 1, characterized in that, Several of the first windows are arranged along the outer periphery of the line unit.

4. The PCB semi-finished product with easy film removal according to claim 1, characterized in that, The distance between any two adjacent first windows is equal.

5. The PCB semi-finished product with easy film removal according to claim 1, characterized in that, Several of the first windows are arranged in an array in the non-line area.

6. The PCB semi-finished product with easy film removal according to claim 1, characterized in that, A blank area is formed within the line unit, and the blank area is provided with a number of first windows.

7. The PCB semi-finished product with easy film removal according to claim 1, characterized in that, The non-line area is formed between two adjacent line units.

8. The PCB semi-finished product with easy film removal according to claim 1, characterized in that, The first window is formed in one of the following shapes: rectangular, circular, or elliptical.

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