Rapid polishing device for wafer edge

Abstract

The utility model relates to the technical field of polishing devices, discloses a rapid polishing device for wafer edges, and aims to solve the problems that the positioning effect is poor and polishing scraps are difficult to collect when the wafer edges are polished in the prior art. The device comprises a supporting cylinder, the upper end of which is provided with a net ring for placing wafers and a fixing assembly, and the lower end of which is a dust collection cavity; a guide assembly, a rotating assembly and a polishing assembly are arranged on the supporting cylinder. The position of the polishing plate is adjusted by starting the motor so that the polishing plate can be attached to the edges of wafers with different diameters, and the motor drives the gear to move along the gear ring to achieve movable polishing of the polishing plate. In addition, an air exhaust assembly is arranged, an air exhaust fan is started in the polishing process, chippings are collected into a dust collection cavity after being blocked by a blocking net, and environmental pollution and damage to the wafer are avoided. According to the utility model, the polishing efficiency is improved, the polishing scraps can be effectively collected, and the cleanliness of an operation environment and the safety of wafers are ensured.

Description

TECHNICAL FIELD

[0001] The utility model relates to polishing device technical field, concretely to a wafer edge quick polishing device. BACKGROUND

[0002] Wafer refers to the silicon wafer used for making silicon semiconductor circuit, and its raw material is silicon. High-purity polysilicon is dissolved and added into silicon crystal seeds, and then slowly pulled out to form cylindrical monocrystalline silicon. After grinding, polishing and slicing, the silicon crystal rod forms a silicon wafer, that is, a wafer.

[0003] Before polishing the edge of the wafer, the wafer needs to be placed and fixed in the polishing device. Since the diameter of the wafer is different, the positioning effect is not good, which affects the polishing effect of the edge, and it is not convenient for the polishing operation of the wafer. At the same time, the debris generated during polishing cannot be collected, which can spread everywhere and easily damage the polished wafer.

[0004] The utility model discloses a kind of wafer processing edge polishing devices of application No. 202320449758.8, by setting polishing assembly, wafer is placed in the center position corresponding place on tray, rotation makes rotating disc driving screw rod rotate on fixed plate, and limit plate of one end of screw rod is moved to the direction of wafer, so that polishing plate is attached to wafer outer wall, different diameter size wafer can be positioned and polished. Although the utility model can polish wafer, the structure relies on manpower rotation, and its transmission structure is exposed, which is easy to be contaminated and cause rotation to be sluggish, in addition, wafer dust polished down cannot be collected, which can cause environmental pollution. UTILITY MODEL CONTENT

[0005] To solve the above technical problems, the utility model provides a wafer edge quick polishing device.

[0006] The technical scheme adopted by the utility model is: a wafer edge quick polishing device, including support cylinder, the support cylinder is hollow structure, and the upper end opening is provided with a net ring for placing wafer, and the lower end is provided with a dust collection cavity for accommodating wafer debris, the net ring is further provided with a fixing assembly above, one end of the fixing assembly corresponds to the center of the net ring, and the other end is fixed on the outer surface of the side wall of the support cylinder, the annular surface of the upper end of the support cylinder is provided with a guide assembly, a plurality of rotating assemblies are arranged on the guide assembly, and a polishing assembly for polishing the edge of wafer is arranged on each rotating assembly.

[0007] As a preferred scheme, the guide assembly comprises a fixed ring and a guide ring, the fixed ring is arranged on the upper end surface of the supporting cylinder, the upper end of the fixed ring is also provided with a first annular groove for placing the guide ring, the guide ring is rotatably arranged in the first annular groove, and the guide assembly is also provided with a gear ring, the middle part surface of the supporting cylinder is provided with a second annular groove for placing the gear ring, and the gear ring is arranged in the second annular groove.

[0008] As a preferred scheme, the rotating assembly comprises a T-shaped frame, a first motor and a gear, the upper end of the T-shaped frame is fixed with the guide ring, the gear is arranged in the second annular groove and combined with the gear ring, and the power end of the first motor passes through the lower end of the T-shaped frame and is connected with the gear.

[0009] As a preferred scheme, the polishing assembly comprises a strip-shaped cavity, a moving block, a moving frame, a polishing plate, a threaded rod and a second motor, the upper end of the T-shaped frame is internally provided with an upwardly-opened strip-shaped cavity, the moving block is slidably arranged in the strip-shaped cavity, the moving block is internally provided with a threaded hole penetrating through the moving block, the upper end of the T-shaped frame is externally provided with the second motor, the power end of the second motor is matched with the threaded hole in the moving block through the threaded rod, the polishing plate is fixed with the moving block through the moving frame, and the outer surface of the supporting cylinder is also provided with a brush slip ring for providing power for the first motor and the second motor.

[0010] As a preferred scheme, the upper side of the net ring is also provided with a placing disc for placing a wafer, the fixing assembly comprises a fixing frame, an extension rod, a fixing disc and a gasket, one end of the fixing frame is connected with the supporting cylinder, the other end is arranged above the placing disc, the upper side of the fixing frame is provided with the extension rod, the extension arm of the extension rod penetrates through the extension rod and is provided with the fixing disc at the lower end, and the fixing disc is provided with the gasket below and corresponds to the center position of the placing disc.

[0011] As a preferred scheme, the outer side of the supporting cylinder is also provided with an air extraction assembly, the air extraction assembly comprises an air extraction pipe, a barrier net and an air extraction fan, the lower end surface of the supporting cylinder is provided with an air extraction hole communicating with a dust collecting cavity, the air extraction hole is internally provided with the air extraction pipe, one end of the air extraction pipe leading to the dust collecting cavity is provided with the barrier net, and the other end is provided with the air extraction fan.

[0012] As a preferred scheme, the surface of the supporting cylinder is also provided with an arc-shaped baffle for taking out waste materials, the supporting cylinder is provided with a notch corresponding to the shape of the arc-shaped baffle, the arc-shaped baffle is slidably arranged on the notch, and the arc-shaped baffle is also provided with a handle for moving the arc-shaped baffle.

[0013] The utility model discloses the beneficial effect is:

[0014] Based on the deficiencies existing in the prior art, the utility model provides a wafer edge rapid polishing device, through optimization structure design, the utility model has the following technical effects:

[0015] Firstly, the utility model discloses a placing disc for storing wafers, and four second motors are started to drive four threaded rods to rotate according to the diameter of the wafers after storage, so that the four polishing plates are moved and attached to the edge of the wafers, and then the rotating assembly is started to move the four polishing plates along the edge of the wafers, so that the edge of the wafers of different diameters can be polished quickly and conveniently.

[0016] Secondly, the utility model discloses an air extraction assembly and a dust collection cavity, so that the air extraction fan can be started when polishing the wafers, and the debris generated in the polishing process of the wafers can be sucked into the inside of the supporting barrel under the blockage of the barrier net, so that the wafers can be prevented from being damaged by the debris.

[0017] Thirdly, the utility model discloses a fixing ring and a tooth ring, which ingeniously compress the space occupied by the rotating assembly and the polishing assembly, effectively avoid the overall device from occupying a large amount of space, and expand the use range of the device. BRIEF DESCRIPTION OF DRAWINGS

[0018] In order to more clearly illustrate the technical scheme in the embodiments of the utility model or the prior art, the following will briefly introduce the drawings needed to be used in the embodiment or the prior art description, and obviously, the drawings in the following description are only some embodiments of the utility model, and for those skilled in the art, other drawings can be obtained according to these drawings without creating labor.

[0019] Figure 1 It is a structural schematic view of the utility model;

[0020] Figure 2 It is a structural schematic view of the air extraction assembly of the utility model;

[0021] Figure 3 It is an enlarged view of A of the utility model;

[0022] In the drawing: 1, supporting barrel; 2, brush slip ring; 3, net ring; 4, placing disc; 5, rotating assembly; 51, T-shaped frame; 52, first motor; 53, gear; 6, polishing assembly; 61, strip cavity; 62, moving block; 63, moving frame; 64, polishing plate; 65, threaded rod; 66, second motor; 7, fixing assembly; 71, fixing frame; 72, telescopic rod; 73, fixed disc; 74, gasket; 8, air extraction assembly; 81, air extraction pipe; 82, barrier net; 83, air extraction fan; 9, guide assembly; 91, fixing ring; 92, guide ring; 93, tooth ring; 10, arc baffle; 11, handle. DETAILED DESCRIPTION

[0023] In the following, the utility model will be described in detail through exemplary embodiments. However, it should be understood that the elements, structures and features in one embodiment can also be beneficially combined into other embodiments without further elaboration.

[0024] It should be noted that, unless otherwise defined, the technical terms or scientific terms used herein should be understood as the common meanings understood by those skilled in the art to which the utility model belongs. The similar words such as "one", "a" or "the" used in the utility model patent application description and claims do not express quantity limitation, but indicate that there is at least one; The similar words such as "include" or "contain" indicate that the elements or objects appearing before "include" or "contain" cover the elements or objects listed after "include" or "contain" and their equivalents, but do not exclude other elements or objects with the same function.

[0025] In order to more clearly describe the specific structural composition of the wafer edge rapid polishing device, the accompanying drawings are combined Figure 1 - the accompanying drawings Figure 3 The embodiment is described as follows:

[0026] The embodiment provides the following technical scheme: a wafer edge rapid polishing device, comprising a support barrel 1, a rotating assembly 5, a guide assembly 9, a rotating assembly 5, a polishing assembly 6 and an air extraction assembly 8.

[0027] In the embodiment, the specific shape of the support cylinder 1 is a hollow structure in the shape of a sandglass, the upper end is a reverse conical opening structure, the lower end is a hollow cylindrical structure, and the space between the upper end and the lower end is through, but it should be noted that it is not limited to the sandglass shape in the drawing, and those skilled in the art can also use other shapes such as a cylindrical shape under the condition of being familiar with the present scheme.

[0028] In the embodiment, the support cylinder 1 is provided with a net ring 3 for placing a wafer at the opening of the upper end, and is provided with a dust collection cavity for accommodating wafer debris at the lower end, the net ring 3 is further provided with a fixing assembly 7 above, one end of the fixing assembly 7 corresponds to the center of the net ring 3, and the other end is fixed on the outer surface of the side wall of the support cylinder 1, the upper end annular surface of the support cylinder 1 is provided with a guide assembly 9, the guide assembly 9 is provided with four groups of rotating assemblies 5, and each group of rotating assemblies 5 is provided with a polishing assembly 6 for polishing the edge of the wafer;

[0029] The support barrel 1 is provided with a brush slip ring 2 on the surface, the upper end of the inside of the support barrel 1 is fixed with a net ring 3, the middle of the net ring 3 is fixed with a placing disc 4, the lower end of the surface of the support barrel 1 is provided with an air extraction assembly 8, the surface of the support barrel 1 is provided with a fixing assembly 7, and the fixing assembly 7 corresponds to the placing disc 4.

[0030] The rotating assembly 5 comprises a T-shaped frame 51, a first motor 52 and a gear 53, the guide assembly 9 comprises a fixed ring 91, a guide ring 92 and a tooth ring 93, the upper end of the support barrel 1 is fixed with the fixed ring 91, the upper end of the fixed ring 91 is provided with a first annular groove, the inside of the first annular groove is rotatably connected with the guide ring 92, the upper end of the guide ring 92 is fixed with four corresponding T-shaped frames 51, the side surface of the T-shaped frame 51 is provided with the first motor 52, the output shaft of the first motor 52 is fixed with the gear 53, the circumferential surface of the support barrel 1 is provided with a second annular groove, the inside of the second annular groove is fixed with the tooth ring 93, the tooth ring 93 is engaged with the four gears 53, the upper side of the T-shaped frame 51 is provided with the polishing assembly 6, and the four polishing plates 64 are moved by setting the rotating assembly 5;

[0031] The input end of the brush slip ring 2 is electrically connected with the output end of the external control switch group, and the output end of the brush slip ring 2 is electrically connected with the input end of the first motor 52.

[0032] Further, the polishing assembly 6 comprises a strip-shaped cavity 61, a moving block 62, a moving frame 63, a polishing plate 64, a threaded rod 65 and a second motor 66, the upper end is internally provided with an upwardly-open strip-shaped cavity 61, the inside of the strip-shaped cavity 61 is slidably connected with the moving block 62, the middle part of the moving block 62 is provided with a threaded hole, the inside of the threaded hole is threadedly connected with the threaded rod 65, the threaded rod 65 is rotatably connected in the inside of the strip-shaped cavity 61, the side surface of the T-shaped frame 51 is provided with the second motor 66, the output shaft of the second motor 66 is fixed on the end face of the threaded rod 65, the upper side of the moving block 62 is fixed with the moving frame 63, the side surface of the moving frame 63 is fixed with the polishing plate 64, and the four polishing plates 64 are located in the inside of the fixed ring 91, the input end of the second motor 66 is electrically connected with the output end of the brush slip ring 2, and the edge part of the wafer is quickly polished by setting the polishing assembly 6.

[0033] Further, the fixing assembly 7 comprises a fixed frame 71, an electric telescopic rod 72, a fixed disc 73 and a gasket 74, the surface of the support barrel 1 is fixed with the fixed frame 71, the upper side of the fixed frame 71 is provided with the electric telescopic rod 72, the telescopic arm of the electric telescopic rod 72 is fixed with the fixed disc 73, the lower end of the fixed disc 73 is fixed with the gasket 74, the gasket 74 corresponds to the placement disc 4, and the input end of the electric telescopic rod 72 is electrically connected with the output end of the external control switch group.

[0034] Further, the air extraction assembly 8 comprises an air extraction pipe 81, a barrier net 82 and an air extraction fan 83, the lower end of the surface of the supporting barrel 1 is provided with an air extraction hole, the air extraction pipe 81 is fixed in the air extraction hole, the left end of the air extraction pipe 81 is fixed with the barrier net 82, and the right end of the air extraction pipe 81 is provided with the air extraction fan 83, and the input end of the air extraction fan 83 is electrically connected with the output end of the control switch group.

[0035] Further, the circumferential surface of the supporting barrel 1 is provided with a material taking opening, and the arc-shaped baffle 10 is hinged in the material taking opening.

[0036] The working principle of the wafer edge rapid polishing device is as follows:

[0037] Firstly, the wafer to be polished is placed above the placing disc 4, four second motors 66 are started to drive the four threaded rods 65 to rotate according to the diameter of the wafer, the four threaded rods 65 rotate to drive the four moving blocks 62 to move, the four moving blocks 62 move to drive the four moving frames 63 to move, the four moving frames 63 move to drive the four polishing plates 64 to move and be attached to the edge of the wafer, after the attachment, four first motors 52 are started to drive the four gears 53 to rotate, the four gears 53 rotate to drive the four T-shaped frames 51 to move under the action of the toothed ring 93, the four T-shaped frames 51 move to drive the four polishing plates 64 to move along the edge of the wafer, in this way, the edge of the wafer with different diameters can be polished, and the air extraction fan 83 can be started when the wafer is polished, and the air extraction fan 83 can extract the debris generated in the wafer polishing process into the inside of the supporting barrel 1 under the blockage of the barrier net 82, in this way, the wafer can be prevented from being damaged by the debris.

[0038] It should be noted that although the utility model has been described through the above-mentioned embodiments, the utility model can also have other various embodiments. Those skilled in the art can obviously make various corresponding changes and modifications to the utility model without departing from the spirit and range of the utility model, and these changes and modifications should all belong to the range protected by the appended claims and equivalents thereof of the utility model.

Claims

1. A wafer edge rapid polishing apparatus, comprising a support cylinder (1), characterized in that, The support cylinder (1) is a hollow structure. A mesh ring (3) for placing wafers is provided at the upper opening. A dust collection cavity for accommodating wafer debris is provided at the lower end. A fixing component (7) is also provided above the mesh ring (3). One end of the fixing component (7) corresponds to the center of the mesh ring (3), and the other end is fixed to the side wall of the support cylinder (1). A guide component (9) is provided on the annular surface at the upper end of the support cylinder (1). Several sets of rotating components (5) are provided on the guide component (9). A polishing component (6) for polishing the edge of the wafer is provided on each rotating component (5).

2. The wafer edge rapid polishing apparatus according to claim 1, characterized in that, The guide assembly (9) includes a fixing ring (91) and a guide ring (92). The fixing ring (91) is disposed on the upper surface of the support cylinder (1). The upper end of the fixing ring (91) is also provided with a first annular groove for placing the guide ring (92). The guide ring (92) is rotatably disposed in the first annular groove.

3. The wafer edge rapid polishing apparatus according to claim 2, characterized in that, The guide assembly (9) is also provided with a toothed ring (93), and the middle surface of the support cylinder (1) is provided with a second annular groove for placing the toothed ring (93), and the toothed ring (93) is disposed in the second annular groove.

4. The wafer edge rapid polishing apparatus according to claim 3, characterized in that, The rotating assembly (5) includes a T-shaped frame (51), a first motor (52) and a gear (53). The upper end of the T-shaped frame (51) is fixed to the guide ring (92). The gear (53) is disposed in the second annular groove and engages with the gear ring (93). The power end of the first motor (52) passes through the lower end of the T-shaped frame (51) and is connected to the gear (53).

5. The wafer edge rapid polishing apparatus according to claim 4, characterized in that, The polishing assembly (6) includes a strip cavity (61), a moving block (62), a moving frame (63), a polishing plate (64), a threaded rod (65), and a second motor (66). The upper end of the T-shaped frame (51) is provided with an upward-opening strip cavity (61). The moving block (62) is slidably disposed inside the strip cavity (61), and the moving block (62) is provided with a threaded opening that penetrates the moving block (62). The upper outer side of the T-shaped frame (51) is provided with a second motor (66). The power end of the second motor (66) is engaged with the threaded opening in the moving block (62) through the threaded rod (65). The polishing plate (64) is fixed to the moving block (62) through the moving frame (63).

6. The wafer edge rapid polishing apparatus according to claim 5, characterized in that, The outer surface of the support cylinder (1) is also provided with a brush slip ring (2) for providing power to the first motor (52) and the second motor (66).

7. The wafer edge rapid polishing apparatus according to claim 1, characterized in that, Above the mesh ring (3) is a placement tray (4) for placing wafers.

8. The wafer edge rapid polishing apparatus according to claim 7, characterized in that, The fixing component (7) includes a fixing frame (71), a telescopic rod (72), a fixing plate (73), and a gasket (74). One end of the fixing frame (71) is connected to the support cylinder (1), and the other end is located above the placement plate (4). The telescopic rod (72) is located above the fixing frame (71). The telescopic arm of the telescopic rod (72) passes through the telescopic rod (72), and the fixing plate (73) is located at its lower end. The gasket (74) is located below the fixing plate (73) and corresponds to the center position of the placement plate (4).

9. The wafer edge rapid polishing apparatus according to claim 1, characterized in that, The support cylinder (1) is also provided with an air extraction component (8) on the outside. The air extraction component (8) includes an air extraction pipe (81), a barrier net (82) and an air extraction fan (83). The lower surface of the support cylinder (1) is provided with an air extraction hole that connects to the dust collection cavity. The air extraction hole is provided with an air extraction pipe (81). One end of the air extraction pipe (81) leading to the dust collection cavity is provided with a barrier net (82), and the other end is provided with an air extraction fan (83).

10. A wafer edge rapid polishing apparatus according to claim 1, characterized in that, The surface of the support cylinder (1) is also provided with an arc-shaped baffle (10) for removing waste material. The support cylinder (1) is provided with a notch corresponding to the shape of the arc-shaped baffle (10). The arc-shaped baffle (10) is slidably disposed on the notch. The arc-shaped baffle (10) is also provided with a handle (11) for moving the arc-shaped baffle (10).

Images