Semiconductor chilling plate cleaning tank

Abstract

The utility model belongs to the technical field of semiconductor chilling plate cleaning, and particularly relates to a semiconductor chilling plate cleaning tank. Comprising a tank body used for containing cleaning water and a semiconductor chilling plate; the connecting shell is arranged at the upper part of the tank body and is communicated with the tank body; the drying mechanism is arranged on the connecting shell and used for generating heat to dry the to-be-dried articles in the tank body; the drying mechanism comprises an air inlet groove formed in one side of the connecting shell; the air heater is arranged on the outer side of the connecting shell and communicates with the connecting shell through the air inlet groove; the air duct communicates with the hot-air blower, and the hot-air blower drives the air duct to extract external air, so that heat enters the connecting shell from the air inlet groove through the hot-air blower; the guide rails are arranged on two sides in the connecting shell; the sealing rubber plate is arranged between the two guide rails in a sliding mode and covers the air inlet groove. The utility model provides the cleaning tank for the semiconductor chilling plate, which not only can efficiently clean the semiconductor chilling plate, but also can effectively dry the cleaned semiconductor chilling plate.

Description

TECHNICAL FIELD

[0001] The utility model belongs to the technical field of semiconductor refrigeration piece cleaning, especially relates to a semiconductor refrigeration piece cleaning tank. BACKGROUND

[0002] In the field of electronic equipment manufacturing, as an important temperature control element, the performance and quality of semiconductor refrigeration pieces directly affect the stability and reliability of electronic equipment. During the production and processing of semiconductor refrigeration pieces, the surface will be contaminated with various impurities such as dust, oil stains, and metal debris. These impurities can seriously affect the refrigeration efficiency and service life of semiconductor refrigeration pieces. Therefore, cleaning semiconductor refrigeration pieces is an indispensable key link in the production process.

[0003] The utility model discloses a semiconductor refrigeration piece cleaning tank discloses a kind of semiconductor refrigeration piece cleaning tank, including tank body and top cover, the side of tank body top end is hinged with the side of top cover, the middle part of both sides of tank body inner wall is equipped with sliding slot, the both sides of tank body bottom are fixedly connected with electric lifting column, the top of two electric lifting columns is fixedly connected with connecting plate, the middle part of both ends of cleaning support is fixedly connected in two connecting plates one side respectively, two connecting plates are slidably connected with two sliding slots respectively, the inboard of cleaning support is uniformly fixedly connected with several storage grooves, a kind of semiconductor refrigeration piece cleaning tank of the utility model, storage groove can be lifted, it is convenient to store and take out semiconductor refrigeration piece, first flushes semiconductor refrigeration piece using flush nozzle, then semiconductor refrigeration piece is cleaned, finally flushes again, more completely clean, sealing ring can be sealed to the middle part of electric lifting column, avoid cleaning water to infiltrate the clearance inside of electric lifting column and tank body installation.

[0004] Although the technology improves the cleaning efficiency of semiconductor refrigeration pieces, reduces the error and time cost caused by manual operation, and meets the production demand to some extent. However, the technology cannot dry the cleaned semiconductor refrigeration pieces. Semiconductor refrigeration pieces are usually composed of multiple metal materials. If they are in a wet state after cleaning, the metal materials are easy to react with oxygen and moisture in the air, resulting in rusting phenomenon. Rusting not only changes the appearance of semiconductor refrigeration pieces, but more importantly, it damages the internal circuit structure and heat conduction performance, thereby affecting the overall quality of semiconductor refrigeration pieces, reducing their refrigeration effect, and even possibly causing semiconductor refrigeration pieces to work abnormally. UTILITY MODEL CONTENTS

[0005] The utility model aims at the above-mentioned technical problem, and provides a semiconductor refrigeration piece cleaning tank which can efficiently clean semiconductor refrigeration pieces and effectively dry cleaned semiconductor refrigeration pieces.

[0006] The utility model provides a kind of semiconductor refrigerating fin cleaning tank, including:

[0007] Tank body, for containing cleaning water and semiconductor refrigerating fin;

[0008] Support frame, by bolt connection mode is set to tank body outside left and right sides;

[0009] Support column, is set to tank body inside four arounds;

[0010] Cleaning plate, is set to between four support column top, for placing semiconductor refrigerating fin;

[0011] Through hole, with several, evenly spaced apart on cleaning plate, so that cleaning water can fully contact semiconductor refrigerating fin;

[0012] Connecting shell, is set to tank body upper portion, connecting shell is linked with tank body;

[0013] Top cover, is set to connecting shell top, top cover can be opened or closed, facilitate to put or take out semiconductor refrigerating fin, and prevent cleaning water from spilling when cleaning;

[0014] Cleaning mechanism, is set to connecting shell inside, for cleaning water is sprayed on semiconductor refrigerating fin, realizes to wash;

[0015] Drainage mechanism, for realizing the discharge of water after cleaning, prevent cleaning water from leaking;

[0016] Drying mechanism, is set to connecting shell, for generating heat to dry tank body in drying goods;

[0017] The drying mechanism includes:

[0018] Air inlet slot, with several, is set to connecting shell side;

[0019] Hot air machine, is set to connecting shell outside, and by air inlet slot with connecting shell is linked;

[0020] Support plate, is set to connecting shell top right side;

[0021] Air duct, is set to connecting shell both sides, and with hot air machine is linked, hot air machine drives air duct to extract external air, to realize heat through hot air machine from air inlet slot into connecting shell;

[0022] Guide rail, is set to connecting shell inside both sides;

[0023] Sealing rubber plate, is slidably arranged between two guide rails, and covers air inlet slot, for enhancing the sealing property of hot air machine, prevent refrigerating fin from washing water stain splashing to hot air machine.

[0024] In the above technical solution, further, the drying mechanism further comprises a temperature sensor, the temperature sensor is arranged inside the groove body, is used for detecting the temperature in the groove body in real time, and transmits the temperature signal to the external controller, and the controller controls the heating power of the air heater according to the temperature signal.

[0025] In any of the above technical solutions, further, a dust prevention mechanism is arranged inside the air duct, and the dust prevention mechanism comprises:

[0026] A rotating shaft is rotatably arranged on the upper side of the air duct, and one end of the rotating shaft penetrates the air duct;

[0027] A dust screen is arranged on the rotating shaft, and the dust screen is located inside the air duct;

[0028] A support is arranged on the outer side of the air duct;

[0029] A handle is rotatably arranged on the support, and one end of the handle penetrates the support and is connected with the rotating shaft.

[0030] In any of the above technical solutions, further, the cleaning mechanism comprises:

[0031] A bottom plate is located on the left side of the support frame;

[0032] A water tank is arranged on the bottom plate and is used for storing cleaning water;

[0033] A spray pipe is arranged inside the connecting shell and on the upper side;

[0034] A plurality of spray heads are uniformly and interval distributed along the length direction of the spray pipe, and the spray heads are inclined and aligned with the groove body;

[0035] A connecting pipe is arranged on the spray pipe and penetrates the connecting shell;

[0036] A rack is arranged on the outer side of the water tank and at both ends;

[0037] A water pump is arranged on the rack, one end of the water pump is connected with the water tank, and the other end is connected with the connecting pipe;

[0038] A forward-reverse motor is located on the bottom of the groove body, and an output shaft of the forward-reverse motor penetrates the groove body;

[0039] A blade is arranged on the output shaft of the forward-reverse motor, the blade is located inside the groove body and below the cleaning plate; the blade rotates, so that the cleaning water in the groove body generates forward and reverse rotation, and the semiconductor refrigeration piece on the cleaning plate is cleaned in all directions, and the cleaning effect is enhanced.

[0040] In any of the above technical solutions, further, the drainage mechanism comprises:

[0041] A water outlet pipe is arranged on one side of the bottom end of the groove body;

[0042] An electromagnetic valve is arranged on the water outlet pipe;

[0043] A water guide pipe is arranged at the rear end of the electromagnetic valve.

[0044] In any of the above technical solutions, further, the inside of the connecting shell is provided with a fixing frame on both sides, and the spray pipe is embedded on the fixing frame.

[0045] The beneficial effects of the present application are:

[0046] 1. The hot air blower drives the air duct to extract external air, and the air is heated by the hot air blower and enters the connecting shell from the air inlet slot to heat the semiconductor refrigerating fin in the groove body;

[0047] 2. The sliding sealing rubber plate covers the air inlet slot, enhancing the sealing property of the hot air blower and preventing water stains from splashing on the hot air blower during cleaning;

[0048] 3. The temperature sensor senses the temperature change in the groove body in real time and transmits accurate temperature signals to the external controller, intelligently controls the heating power of the hot air blower according to the preset temperature range and drying requirements, avoids damage to the refrigerating fin due to excessively high temperature, or low drying efficiency due to excessively low temperature, thereby improving the drying effect and the safety of the semiconductor refrigerating fin;

[0049] 4. The dust screen blocks external dust from entering the air duct, and only clean air passes through the air duct to be heated by the hot air blower, thereby ensuring the purity of the drying link and avoiding the attachment of dust and other foreign matters on the semiconductor refrigerating fin, affecting its performance and service life;

[0050] 5. The water pump pumps water from the water tank and sends the cleaning water to the spray pipe through the connecting pipe, the cleaning water is inclined sprayed to the semiconductor refrigerating fin in the groove body through the spray head, and preliminary spray flushing is performed; the forward and reverse motor drives the blade to rotate inside the groove body and below the cleaning plate, so that the cleaning water in the groove body is reversed, and the semiconductor refrigerating fin is impacted in all directions, and the cleaning effect is further enhanced, and the impurities on the surface of the refrigerating fin are thoroughly removed. BRIEF DESCRIPTION OF DRAWINGS

[0051] Figure 1 is a schematic diagram of the three-dimensional structure of the present application;

[0052] Figure 2 is a schematic diagram of part of the three-dimensional structure of the present application;

[0053] Figure 3 is a sectional view of the present application;

[0054] Figure 4 is a schematic diagram of the three-dimensional structure of the drainage mechanism of the present application;

[0055] The figure is marked as: 1, groove body; 2, support frame; 3, support column; 4, cleaning plate; 41, through hole; 5, connecting shell; 51, top cover; 6, drying mechanism; 61, air inlet groove; 62, hot air machine; 63, support plate; 64, air duct; 65, guide rail; 66, sealing rubber plate; 67, temperature sensor; 68, controller; 7, dustproof mechanism; 71, rotating shaft; 72, dustproof net; 73, support; 74, handle; 8, cleaning mechanism; 81, bottom plate; 82, water tank; 83, spray pipe; 84, spray head; 85, connecting pipe; 86, rack; 87, water pump; 88, forward and reverse motor; 89, blade; 9, drainage mechanism; 91, water outlet pipe; 92, water guide pipe; 93, electromagnetic valve; 10, fixing frame. DETAILED DESCRIPTION

[0056] The technical solutions in the embodiments of the present application will be clearly described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by a person of ordinary skill in the art belong to the scope of protection of the present application.

[0057] In the description of the present application, it should be noted that the terms used herein are only for the purpose of describing the specific embodiments, and are not intended to limit the exemplary embodiments according to the present application. For the convenience of description, the sizes of the various parts shown in the drawings are not drawn in accordance with the actual proportional relationship. The techniques, methods and devices known to those skilled in the relevant art can not be discussed in detail, but in appropriate cases, the techniques, methods and devices should be considered as part of the authorized description. In all examples shown and discussed herein, any specific value should be interpreted as merely exemplary, and not as a limitation. Therefore, other examples of exemplary embodiments can have different values. It should be noted that similar reference numerals and letters represent similar items in the following drawings, so once an item is defined in one drawing, it does not need to be further discussed in subsequent drawings.

[0058] Embodiment 1:

[0059] As Figures 1-3 shown, the present embodiment provides a semiconductor refrigeration piece cleaning tank, comprising:

[0060] Groove body 1 for containing cleaning water and semiconductor refrigeration piece;

[0061] Support frame 2 is arranged on the left and right sides outside the groove body 1 by bolt connection;

[0062] Support column 3 is arranged around the inside of the groove body 1;

[0063] The cleaning plate 4 is arranged between the top of the four supporting columns 3 and used for placing the semiconductor refrigerating sheet;

[0064] The through holes 41 are arranged on the cleaning plate 4 and uniformly spaced apart, so that the cleaning water can fully contact the semiconductor refrigerating sheet;

[0065] The connecting shell 5 is arranged on the upper part of the groove body 1, and the connecting shell 5 is connected with the groove body 1;

[0066] The top cover 51 is arranged on the top of the connecting shell 5, and the top cover 51 can be opened or closed, so as to facilitate the placing or taking out of the semiconductor refrigerating sheet and prevent the cleaning water from splashing out during cleaning;

[0067] The cleaning mechanism 8 is arranged in the connecting shell 5 and used for spraying the cleaning water on the semiconductor refrigerating sheet to realize the washing thereof;

[0068] The drainage mechanism 9 is used for realizing the drainage of the water after cleaning and preventing the leakage of the cleaning water;

[0069] The drying mechanism 6 is arranged on the connecting shell 5 and used for generating heat to dry the articles to be dried in the groove body 1;

[0070] The drying mechanism 6 comprises:

[0071] The air inlet grooves 61 are arranged on one side of the connecting shell 5;

[0072] The hot air machine 62 is arranged on the outer side of the connecting shell 5 and connected with the connecting shell 5 through the air inlet grooves 61;

[0073] The supporting plate 63 is arranged on the top right side of the connecting shell 5;

[0074] The air ducts 64 are arranged on both sides of the supporting plate 63 and connected with the hot air machine 62, and the hot air machine 62 drives the air ducts 64 to draw the external air, so as to realize that the heat enters the connecting shell 5 from the air inlet grooves 61 through the hot air machine 62;

[0075] The guide rails 65 are arranged on both sides of the connecting shell 5;

[0076] The sealing rubber plate 66 is slidingly arranged between the two guide rails 65 and covers the air inlet grooves 61, so as to enhance the sealing property of the hot air machine 62 and prevent the water stains from splashing to the hot air machine 62 during the cleaning of the refrigerating sheet.

[0077] In the technical solution, the groove body 1 contains cleaning water, the through holes 41 on the cleaning plate 4 can allow the cleaning water to fully contact the semiconductor refrigeration sheet, and the cleaning mechanism 8 in the connecting shell 5 sprays the cleaning water on the refrigeration sheet to realize all-round washing and effectively remove dust, oil stains and other impurities on the surface of the refrigeration sheet. The support frames 2 on the two sides of the outside of the groove body 1 provide stable support through bolt connection, and the support columns 3 around the inside of the groove body 1 are used for fixing the cleaning plate 4 to ensure that the semiconductor refrigeration sheet maintains a stable position during the cleaning process and avoids shaking or collision. The top cover 51 at the top of the connecting shell 5 can be opened or closed, which is convenient for putting in or taking out the semiconductor refrigeration sheet, can prevent the cleaning water from splashing out during cleaning, and guarantees the safety of the operating environment; the sealing rubber plate 66 in the connecting shell 5 slides on the guide rail 65, covers the air inlet groove 61, enhances the sealing performance of the hot air blower 62, prevents water stains from splashing on the hot air blower 62 during the cleaning of the refrigeration sheet, and protects the hot air blower 62 from being damaged. The drainage mechanism 9 can safely and quickly drain the cleaning water after the cleaning is completed, prevents the cleaning water from leaking, and maintains the cleanliness of the equipment and the surrounding environment. The drying mechanism 6 cooperates with the air inlet groove 61, the hot air blower 62, the support plate 63 and the air duct 64, the hot air blower 62 drives the air duct 64 to draw external air, the air is heated by the hot air blower 62 and then enters the connecting shell 5 from the air inlet groove 61 to dry the cleaned semiconductor refrigeration sheet in the groove body 1, removes residual moisture, and avoids rusting or performance degradation of the refrigeration sheet due to residual moisture.

[0078] Work flow: open the top cover 51, place the semiconductor refrigeration sheet on the cleaning plate 4, then close the top cover 51 to ensure good sealing and prevent the cleaning water from splashing out. At the same time, slide the sealing rubber plate 66 to cover the air inlet groove 61 to enhance the sealing performance of the hot air blower 62 and prevent water stains from splashing on the hot air blower 62 during the cleaning process. Pour an appropriate amount of cleaning water into the groove body 1, start the cleaning mechanism 8, and the cleaning mechanism 8 sprays the cleaning water from the connecting shell 5 onto the semiconductor refrigeration sheet, the cleaning water passes through the through holes 41 of the cleaning plate 4 to fully contact each part of the refrigeration sheet, and the impurities on the surface of the refrigeration sheet are washed. After the cleaning is completed, start the drainage mechanism 9 to drain the cleaning water in the groove body 1, ensure that the cleaning water is completely drained, and avoid residual. After the drainage is completed, slide the sealing rubber plate 66 to open the air inlet groove 61, and start the hot air blower 62, the hot air blower 62 drives the air duct 64 to draw external air, the air is heated by the hot air blower 62 and then enters the connecting shell 5 from the air inlet groove 61 to dry the semiconductor refrigeration sheet in the groove body 1. After drying is completed, close the hot air blower 62, open the top cover 51, and take out the dried semiconductor refrigeration sheet. Thus, an efficient, convenient and safe device for cleaning and drying the semiconductor refrigeration sheet is provided, which meets the cleaning needs of the semiconductor refrigeration sheet in the production, maintenance and other links, ensures that the performance of the refrigeration sheet is not affected by impurities, prevents secondary damage or pollution during the cleaning process, and improves the service life and working stability of the semiconductor refrigeration sheet.

[0079] As Figures 1-3As shown, in this embodiment, the optimized drying mechanism 6 further comprises a temperature sensor 67 arranged inside the tank body 1 for detecting the temperature inside the tank body 1 in real time and transmitting a temperature signal to an external controller 68, which controls the heating power of the hot air fan 62 according to the temperature signal.

[0080] In this technical solution, the temperature sensor 67 arranged inside the tank body 1 can sense the temperature change inside the tank body 1 in real time and transmit an accurate temperature signal to the external controller 68, providing a data basis for subsequent temperature regulation. After receiving the temperature signal from the temperature sensor 67, the external controller 68 intelligently controls the heating power of the hot air fan 62 according to the preset temperature range and drying requirements. When the temperature inside the tank is lower than the set lower limit value, the controller 68 increases the heating power of the hot air fan 62 to speed up the temperature rise. When the temperature approaches or reaches the set upper limit value, the controller 68 reduces the heating power of the hot air fan 62 to maintain a stable drying temperature and prevent damage to the refrigeration sheet caused by excessive temperature. By monitoring the temperature inside the tank body 1 in real time, the semiconductor refrigeration sheet can be dried in a suitable temperature environment, avoiding damage to the refrigeration sheet due to excessive temperature or low drying efficiency due to low temperature, thereby improving the drying effect and the safety of the semiconductor refrigeration sheet.

[0081] Embodiment 2:

[0082] This embodiment provides a semiconductor refrigeration sheet cleaning tank, which has the following technical features in addition to the technical solutions of the above embodiments.

[0083] As Figures 1-4 shown, in this embodiment, the optimized air duct 64 is provided with a dust prevention mechanism 7, which comprises:

[0084] A rotating shaft 71 is arranged on the upper side of the air duct 64, and one end of the rotating shaft 71 penetrates the air duct 64;

[0085] A dust screen 72 is arranged on the rotating shaft 71, and the dust screen 72 is located inside the air duct 64;

[0086] A support 73 is arranged on the outside of the air duct 64;

[0087] A handle 74 is rotatably arranged on the support 73, and one end of the handle 74 penetrates the support 73 and is connected to the rotating shaft 71.

[0088] In the technical solution, before starting the drying process, the state of the dustproof mechanism 7 is checked. The handle 74 is rotated to make the dust screen 72 in the closed state to block the external dust from entering the air duct 64. At this time, the handle 74 is fixed with the support 73 to ensure the stability of the dust screen 72. The hot air machine 62 is started to drive the air duct 64 to extract external air. Since the dust screen 72 is closed, the external dust is effectively blocked, and only clean air passes through the air duct 64 into the hot air machine 62 to be heated, and then enters the connecting shell 5 through the air inlet slot 61 to dry the semiconductor refrigeration sheet in the cleaning tank. In this way, the external dust, impurities, etc. are prevented from being sucked into the air duct 64 and then entering the cleaning tank to contact the semiconductor refrigeration sheet. The purity of the drying link is ensured, the performance and service life of the semiconductor refrigeration sheet are not affected by the dust and other foreign matters attached to the semiconductor refrigeration sheet, and the damage of the dust to the equipment such as the hot air machine 62 is reduced, and the overall maintenance period and service life of the equipment are prolonged.

[0089] Embodiment 3:

[0090] The embodiment provides a semiconductor refrigeration sheet cleaning tank, which comprises the technical solutions of the above-mentioned embodiments and has the following technical features.

[0091] As shown in Figures 1-4 In the embodiment, the optimized cleaning mechanism 8 comprises:

[0092] The bottom plate 81 is located on the left side of the support frame 2.

[0093] The water tank 82 is arranged on the bottom plate 81 and is used for storing cleaning water.

[0094] The spray pipe 83 is arranged on the upper side of the inside of the connecting shell 5.

[0095] The spray head 84 is provided with a plurality of spray heads 84 which are uniformly and interval distributed along the length direction of the spray pipe 83, and the spray head 84 is inclined and aligned with the tank body 1.

[0096] The connecting pipe 85 is arranged on the spray pipe 83, and the connecting pipe 85 penetrates out of the connecting shell 5.

[0097] The rack 86 is arranged on the outer sides of the two ends of the water tank 82.

[0098] The water pump 87 is arranged on the rack 86, one end of the water pump 87 is connected with the water tank 82, and the other end of the water pump 87 is connected with the connecting pipe 85.

[0099] The forward and reverse motor 88 is located on the bottom of the outer side of the tank body 1, and the output shaft of the forward and reverse motor 88 penetrates through the tank body 1.

[0100] The blade 89 is arranged on the output shaft of the forward and reverse motor 88, the blade 89 is located in the inside of the tank body 1 and below the cleaning plate 4, and the blade 89 is rotated to make the cleaning water in the tank body 1 generate forward and reverse rotation to clean the semiconductor refrigeration sheet on the cleaning plate 4 in all directions and enhance the cleaning effect.

[0101] In the technical solution, the water tank 82 is placed on the bottom plate 81 to store a sufficient amount of cleaning water to provide a stable water source for the entire cleaning process, ensuring that the cleaning work can continue. The spray pipe 83 is installed inside the connecting shell 5 above, and a plurality of spray heads 84 are uniformly spaced along the length direction of the spray pipe 83, and the spray heads 84 are inclined to the groove body 1. The water pump 87 delivers the cleaning water in the water tank 82 to the spray pipe 83 through the connecting pipe 85, and then the cleaning water is sprayed out through the spray heads 84 to form a fine water flow to spray and wash the semiconductor refrigeration sheet in the groove body 1, effectively removing dust and oil stains and other impurities on the surface. The forward and reverse motor 88 is located at the bottom outside of the groove body 1, and the output shaft thereof penetrates the groove body 1 and is connected with the blade 89. The blade 89 rotates under the drive of the forward and reverse motor 88 to make the cleaning water in the groove body 1 reverse. The strong agitation of the water flow not only enables the cleaning water to more fully contact the semiconductor refrigeration sheet, but also generates a flushing force to clean the semiconductor refrigeration sheet on the cleaning plate 4 in all directions, greatly enhancing the cleaning effect.

[0102] Work flow: Check whether the amount of cleaning water in the water tank 82 is sufficient, and ensure that the water pump 87, the forward and reverse motor 88 and other equipment are in normal working condition. Open the top cover 51, place the semiconductor refrigeration sheet on the cleaning plate 4, and then close the top cover 51. Start the water pump 87, the water pump 87 pumps water from the water tank 82, and delivers the cleaning water to the spray pipe 83 through the connecting pipe 85. The cleaning water is inclined to the semiconductor refrigeration sheet in the groove body 1 through the spray heads 84 to perform preliminary spray washing. At the same time, the forward and reverse motor 88 is started, and the blade 89 on the output shaft is rotated in the groove body 1 below the cleaning plate 4 to make the cleaning water in the groove body 1 reverse, and the cleaning water is sprayed to the semiconductor refrigeration sheet in all directions. The cleaning water and the spray water cooperate with each other to further enhance the cleaning effect, and ensure that the impurities on the surface of the refrigeration sheet are completely removed. After cleaning, first close the water pump 87 and the forward and reverse motor 88, and then start the drainage mechanism 9 to drain the cleaning water in the groove body 1, and ensure that the cleaning water is completely drained to avoid residue. In this way, the surface impurities of the refrigeration sheet are strongly flushed and cleaned in all directions, and each part of the refrigeration sheet can be effectively cleaned in the cleaning process to meet higher cleanliness requirements and protect the performance and quality of the semiconductor refrigeration sheet.

[0103] Example 4:

[0104] The embodiment provides a semiconductor refrigeration sheet cleaning tank, which comprises the technical solutions of the above-mentioned embodiments and has the following technical features.

[0105] As shown in Figure 2 and Figure 4 In this embodiment, the optimized drainage mechanism 9 comprises:

[0106] The water outlet pipe 91 is arranged at one side of the bottom end of the groove body 1.

[0107] An electromagnetic valve 93 is arranged on the water outlet pipe 91.

[0108] A water guide pipe 92 is arranged at the rear end of the electromagnetic valve 93.

[0109] In the technical solution, the water outlet pipe 91 is installed at one side of the bottom end of the tank body 1, which is a direct channel for the cleaning water to be discharged from the tank body 1. The water guide pipe 92 is connected with the electromagnetic valve 93 on the water outlet pipe 91, which is used to guide the cleaning water discharged from the tank body 1 to flow along a predetermined path. The electromagnetic valve 93 is installed on the water outlet pipe 91, and by controlling the opening and closing of the electromagnetic valve 93, the precise control of the cleaning water discharge can be realized. When the cleaning operation is completed and the water needs to be discharged, the electromagnetic valve 93 is opened, and the cleaning water is discharged from the water outlet pipe 91 through the water guide pipe 92 under the action of gravity. When the cleaning operation is in progress, the electromagnetic valve 93 is closed to prevent the cleaning water from leaking in advance.

[0110] Work flow: During the cleaning process, the electromagnetic valve 93 is in a closed state, which ensures that the cleaning water in the tank body 1 can be stably used for cleaning the semiconductor refrigeration sheet and no leakage occurs, thereby ensuring the normal progress of the cleaning work. At this time, no water flows through the water outlet pipe 91 and the water guide pipe 92. After the cleaning is completed, the water discharge operation is started to control the electromagnetic valve 93 to be opened, and the cleaning water in the tank body 1 flows out from the water outlet pipe 91 at one side of the bottom end of the tank body 1 under the action of gravity. Since the water guide pipe 92 is connected with the electromagnetic valve 93 on the water outlet pipe 91, the cleaning water is guided along the water guide pipe 92 to the designated water discharge position, thereby realizing safe and rapid discharge. During the water discharge process, the operator can observe the water flow to confirm whether the water discharge is smooth, until the cleaning water is completely discharged. After the water discharge is completed, the electromagnetic valve 93 is closed to prepare for the next cleaning operation, thereby realizing the orderly and efficient discharge of the cleaning water in the cleaning tank, preventing the cleaning water from being left in the tank body 1, avoiding the corrosion of the equipment or affecting the next cleaning operation, and at the same time, through the reasonable pipeline connection and control device, the safety and stability of the water discharge process are ensured, and the pollution of the surrounding environment caused by the leakage of the cleaning water is prevented.

[0111] As shown in Figure 2 and Figure 3 In the embodiment, the optimized connection shell 5 is internally provided with a fixing frame 10 on each side, and the spray pipe 83 is embedded on the fixing frame 10.

[0112] In the technical solution, the fixed frame 10 provides accurate positioning for the spray pipe 83, so that the spray pipe 83 is fixed at a preset position and angle, and the spray head 84 can accurately spray cleaning water on the semiconductor refrigeration sheet in the tank body 1. The spray pipe 83 is embedded in the fixed frame 10, and the two are tightly matched, which greatly enhances the stability of the spray pipe 83, so that it will not easily deviate or fall off during the process of bearing water flow pressure and long-term use. This embedded installation method facilitates the installation, disassembly and maintenance of the spray pipe 83. When the spray pipe 83 is blocked, damaged or the like, the staff can easily take out the spray pipe 83 from the fixed frame 10 for cleaning, repair or replacement, thereby reducing the difficulty and cost of equipment maintenance and improving the maintainability of the equipment.

[0113] The embodiments of the present application are described above in combination with the drawings, and the embodiments and features in the embodiments of the present application can be combined with each other without conflict, and the present application is not limited to the above-mentioned specific embodiments, which are only illustrative and not restrictive. Those skilled in the art can make many forms under the inspiration of the present application without departing from the scope of the present application, which is protected by the claims.

Claims

1. A semiconductor cooling chip cleaning tank, characterized in that, include: The tank (1) is used to hold the cleaning water and the semiconductor cooling chip; The support frame (2) is installed on the left and right sides of the outside of the groove (1) by means of bolt connection; Support columns (3) are arranged around the inside of the groove (1); A cleaning plate (4) is disposed between the tops of the four support columns (3) for placing a semiconductor cooling chip; Through holes (41) are provided in a plurality of evenly spaced openings on the cleaning plate (4) so ​​that the cleaning water can fully contact the semiconductor cooling chip; A connecting shell (5) is disposed on the upper part of the groove (1), and the connecting shell (5) is connected to the groove (1); A top cover (51) is provided on the top of the connecting shell (5). The top cover (51) can be opened or closed to facilitate the insertion or removal of the semiconductor cooling chip and to prevent cleaning water from splashing out during cleaning. The cleaning mechanism (8) is located inside the connecting shell (5) and is used to spray cleaning water onto the semiconductor cooling chip to rinse it. Drainage mechanism (9) is used to discharge the water after cleaning and prevent the cleaning water from leaking; A drying mechanism (6) is provided on the connecting shell (5) and is used to generate heat to dry the items to be dried in the tank (1); The drying mechanism (6) includes: The air inlet slots (61) are of several kinds and are opened on one side of the connecting shell (5); A hot air blower (62) is disposed on the outside of the connecting shell (5) and is connected to the connecting shell (5) through the air inlet slot (61); Support plate (63) is disposed on the top right side of the connecting shell (5); The air duct (64) is set on both sides of the support plate (63) and connected to the hot air blower (62). The hot air blower (62) drives the air duct (64) to draw in external air so that heat enters the connecting shell (5) from the air inlet slot (61) through the hot air blower (62). Guide rails (65) are disposed on both sides inside the connecting shell (5); A sealing plate (66) is slidably disposed between the two guide rails (65) and covers the air inlet groove (61) to enhance the sealing of the hot air blower (62) and prevent water stains from splashing onto the hot air blower (62) when the cooling chip is cleaned.

2. The semiconductor cooling chip cleaning tank according to claim 1, characterized in that, The drying mechanism (6) also includes a temperature sensor (67), which is installed inside the tank (1) to detect the temperature inside the tank (1) in real time and transmit the temperature signal to an external controller (68). The controller (68) controls the heating power of the hot air blower (62) according to the temperature signal.

3. The semiconductor cooling chip cleaning tank according to claim 1, characterized in that, The air duct (64) is equipped with a dustproof mechanism (7), which includes: A rotating shaft (71) is rotatably disposed on the upper side inside the air duct (64), and one end of the rotating shaft (71) passes through the air duct (64); A dustproof net (72) is installed on the rotating shaft (71) and the dustproof net (72) is located inside the air duct (64); A bracket (73) is disposed on the outside of the air duct (64); A handle (74) is rotatably mounted on the bracket (73), with one end of the handle (74) passing through the bracket (73) and connected to the rotating shaft (71).

4. A semiconductor cooling chip cleaning tank according to claim 1, characterized in that, The cleaning mechanism (8) includes: The base plate (81) is located on the left side of the support frame (2); A water tank (82) is provided on the base plate (81) for storing cleaning water; The nozzle (83) is located inside the upper part of the connecting shell (5); The nozzles (84) are multiple and are evenly spaced along the length of the nozzle (83), and the nozzles (84) are tilted and aligned with the groove (1); A connecting pipe (85) is disposed on the nozzle (83), and the connecting pipe (85) extends out of the connecting shell (5); The frame (86) is located at both ends of the outside of the water tank (82); A water pump (87) is mounted on the frame (86). One end of the water pump (87) is connected to the water tank (82), and the other end is connected to the connecting pipe (85). A forward and reverse motor (88) is located at the bottom outside of the tank (1), and the output shaft of the forward and reverse motor (88) passes through the tank (1); Blade (89) is set on the output shaft of the forward and reverse motor (88). The blade (89) is located inside the tank (1) and below the cleaning plate (4). The blade (89) rotates, thereby causing the cleaning water in the tank (1) to rotate in both directions, so as to clean the semiconductor cooling chip on the cleaning plate (4) in all directions and enhance the cleaning effect.

5. A semiconductor cooling chip cleaning tank according to claim 4, characterized in that, The drainage mechanism (9) includes: A water outlet pipe (91) is installed on one side of the bottom end of the tank (1); A solenoid valve (93) is installed on the water outlet pipe (91); A water guide pipe (92) is located at the rear end of the solenoid valve (93).

6. A semiconductor cooling chip cleaning tank according to claim 4, characterized in that, The connecting shell (5) has a fixing frame (10) on both sides inside, and the nozzle (83) is embedded in the fixing frame (10).

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