Liquid cooling supporting device and processing equipment

Abstract

The utility model discloses a liquid cooling support device and processing equipment, the liquid cooling support device comprises a bottom plate, a guide plate and a top plate, a heat exchange piece is arranged in a first flow channel, and the heat exchange piece is provided with a heat exchange surface contacted with flowing liquid in the first flow channel. The liquid cooling supporting device is internally provided with a liquid storage cavity, a plurality of first flow channels and a first liquid drainage cavity, during heat dissipation, cold liquid firstly enters the liquid storage cavity and overflows after the liquid storage cavity is filled with the cold liquid, the overflowed cold liquid can more uniformly enter all the first flow channels at the same time, the flowing consistency of the cold liquid in the first flow channels is improved, and the heat dissipation efficiency is improved. The heat dissipation effect can be obviously improved; a heat exchange piece is further arranged in the first flow channel and provided with a heat exchange face making contact with fluid. And the heat exchange piece is arranged, so that the contact area with the liquid is increased, the heat exchange rate of the liquid can be effectively improved, and the heat dissipation efficiency of the liquid cooling supporting device is improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to component manufacturing technical field, concretely relates to a liquid cooling support device and processing equipment. BACKGROUND

[0002] In the manufacturing process of integrated circuits, micro-electro-mechanical systems (MEMS), optoelectronic devices, etc., etching technique is needed to process its parts. During the etching process, the equipment will generate a large amount of heat. These heat not only affects the precision and uniformity of etching, but also causes the equipment to overheat, reducing the service life of the equipment. Especially in the case of high power and long time running, temperature control is particularly important.

[0003] The existing cooling solutions mainly include air cooling (AC) and simple water cooling (WC) systems, but these methods have many shortcomings.

[0004] Although the air cooling system is simple in structure and low in cost, due to the low thermal conductivity of air, the cooling effect is limited, which is difficult to meet the needs of high-precision etching. In the high-power etching process, the air cooling system often cannot take away the heat generated in time, resulting in local temperature being too high, affecting the etching quality and the stability of the equipment. In addition, the air cooling system also has obvious shortcomings in noise and space occupation.

[0005] While the simple water cooling system has high cooling efficiency, it has shortcomings in cooling uniformity and temperature control. The traditional water cooling system usually adopts straight-line or simple spiral cooling channels, which will cause the flow rate of the cooling liquid to be inconsistent in different areas, resulting in uneven temperature distribution. Especially in the complex etching chamber, this uneven cooling effect will cause differences in etching rate and depth, affecting the quality of the final product. SUMMARY

[0006] The utility model provides a liquid cooling support device and processing equipment for solving the heat dissipation problem of workpiece in the etching process.

[0007] In one embodiment, a liquid cooling support device is provided, comprising:

[0008] The bottom plate has a mounting groove;

[0009] A guide plate is installed in the mounting groove of the bottom plate, a hollow part is arranged in the middle of the guide plate, the hollow part and the bottom plate form a liquid storage cavity, a liquid inlet is arranged in the liquid storage cavity, and the liquid inlet is used for guiding cold liquid; the side surface of the guide plate is arranged in a spaced manner with the side surface of the mounting groove and forms a first liquid discharge cavity, the first liquid discharge cavity is provided with a first liquid discharge port, and the first liquid discharge port is used for discharging hot liquid; the upper surface of the guide plate is covered with a plurality of spaced first flow channels, one end of the first flow channel is in communication with the liquid storage cavity, and the other end of the first flow channel extends to be in communication with the first liquid discharge cavity; a heat exchange element is arranged in the first flow channel, and the heat exchange element has a heat exchange surface in contact with the liquid flowing in the first flow channel.

[0010] A top plate is installed on the upper surface of the guide plate, the top plate covers and seals the liquid storage cavity, the first flow channel and the first liquid discharge cavity, and the top plate is used for placing a workpiece or mounting a workpiece carrier.

[0011] In an embodiment, a plurality of heat exchange elements are arranged in the first flow channel in a staggered and spaced manner in the fluid flow direction.

[0012] In an embodiment, in the fluid flow direction, the heat exchange element is aligned with the middle position between the two heat exchange elements in front, and / or the heat exchange element is aligned with the middle position between the two heat exchange elements in back.

[0013] In an embodiment, one end of the heat exchange element towards the liquid storage cavity is arranged in a circular arc or sharp corner structure.

[0014] In an embodiment, the cross section of the heat exchange element is in a water drop structure, one end of the heat exchange element towards the liquid storage cavity is arranged in a circular arc structure, and the other end of the heat exchange element away from the liquid storage cavity is arranged in a sharp corner structure.

[0015] In an embodiment, the sharp corner angle of the sharp corner structure is 30°-180°.

[0016] In an embodiment, the first flow channel is a micro flow channel structure; and / or a plurality of the first flow channels are arranged in a mutually equidistant parallel manner; and / or a plurality of the first flow channels are arranged in a radial line shape.

[0017] In an embodiment, the bottom surface of the guide plate is provided with a second liquid discharge cavity and at least one liquid discharge channel, one end of the liquid discharge channel is in communication with the first liquid discharge port, the other end of the liquid discharge channel is in communication with the second liquid discharge cavity, a second liquid discharge port is arranged in the second liquid discharge cavity, and the second liquid discharge port is used for discharging liquid from the liquid cooling support device.

[0018] In an embodiment, a liquid cooling support device is provided, comprising:

[0019] A bottom plate having a mounting slot;

[0020] A flow guide plate mounted in the mounting slot of the bottom plate, a hollow part is arranged in the middle of the flow guide plate, the hollow part and the bottom plate form a liquid storage cavity, a liquid inlet is arranged in the liquid storage cavity, the liquid inlet is used for guiding cold liquid; the side surface of the flow guide plate is arranged in a spaced manner with the side surface of the mounting slot and forms a first liquid discharge cavity, the first liquid discharge cavity is provided with a first liquid discharge port, the first liquid discharge port is used for discharging hot liquid; the flow guide plate is uniformly covered with a plurality of heat exchange pieces arranged in a staggered manner, flow channels are formed between the heat exchange pieces, one end of the flow channel is communicated with the liquid storage cavity, and the other end of the flow channel extends to be communicated with the first liquid discharge cavity;

[0021] and a top plate mounted on the upper surface of the flow guide plate, the top plate covers and seals the liquid storage cavity, the flow channel and the first liquid discharge cavity, and the top plate is used for placing a workpiece or mounting a workpiece carrier.

[0022] In an embodiment, a processing device is provided, comprising:

[0023] A processing cabinet having a processing cavity;

[0024] A circulating cooling device located outside the processing cavity;

[0025] and the above-mentioned liquid cooling support device, the liquid cooling support device is mounted in the processing cavity, the liquid inlet and the first liquid discharge port of the liquid cooling support device are communicated with the circulating cooling device, and the circulating cooling device is used to drive liquid to inject and discharge into the liquid cooling support device to achieve circulating cooling.

[0026] According to the liquid cooling support device and the processing device of the above-mentioned embodiment, since the liquid cooling support device is provided with a liquid storage cavity, a plurality of first flow channels and a first liquid discharge cavity, when cooling, cold liquid first enters the liquid storage cavity, and after the cold liquid in the liquid storage cavity is full, it overflows, and the overflowing cold liquid can enter all the first flow channels at the same time more uniformly, improving the consistency of the cold liquid flow in the first flow channels, and the cooling effect can be obviously improved; the combination structure of the liquid storage cavity, the plurality of first flow channels and the first liquid discharge cavity can make the liquid flow quickly from the liquid storage cavity to the first flow channels and then be discharged from the first liquid discharge cavity, the liquid can quickly enter the next cycle, effectively reducing the time of the liquid lingering in the liquid cooling support device, ensuring that fresh liquid can quickly enter the liquid cooling support device for cooling, and thereby improving the cooling efficiency.

[0027] The plurality of first flow channels are arranged on the upper surface of the flow guide plate, which can achieve more uniform cooling of a larger area, further improve the cooling effect, and thereby meet the cooling needs of the workpiece in the etching process;

[0028] The bottom plate, the flow guide plate and the top plate form a three-layer laminated structure, which is more compact, easier to install, can save materials and space, effectively save the manufacturing cost of the liquid cooling support device, and improve the installation efficiency of the liquid cooling support device.

[0029] The first flow channel is further provided with a heat exchange element having a heat exchange surface in contact with the fluid. The heat exchange element increases the contact area with the liquid, effectively improves the heat exchange rate of the liquid, and further improves the heat dissipation efficiency of the liquid cooling support device. BRIEF DESCRIPTION OF DRAWINGS

[0030] Figure 1 It is an exploded view of the liquid cooling support device in an embodiment;

[0031] Figure 2 It is an exploded view of the liquid cooling support device in an embodiment;

[0032] Figure 3 It is a top view of the hidden top plate of the liquid cooling support device in an embodiment;

[0033] Figure 4 It is a top view of the flow guide plate in an embodiment;

[0034] Figure 5 It is a partial enlarged view of the flow guide plate in an embodiment;

[0035] Figure 6 It is a schematic diagram of the liquid flow direction of the exploded top plate of the liquid cooling support device in an embodiment;

[0036] Figure 7 It is a schematic diagram of the side view of the flow guide plate in an embodiment;

[0037] Figure 8 It is a top view of the liquid cooling support device in an embodiment;

[0038] Figure 9 It is a partial enlarged view of the flow guide plate in an embodiment;

[0039] Figure 10 It is a schematic diagram of the processing equipment in an embodiment;

[0040] The reference signs are as follows:

[0041] 1-bottom plate, 11-mounting groove, 12-liquid storage cavity, 121-liquid inlet, 13-first liquid discharge cavity, 131-first liquid discharge port, 132-second liquid discharge port, 14-protruding part, 141-groove hole;

[0042] 2 - deflector, 21 - hollow part, 22 - first flow channel, 23 - liquid discharge passage, 24 - heat exchange member, 241 - heat exchange surface, 25 - second liquid discharge cavity;

[0043] 3 - top plate, 31 - opening;

[0044] 4 - liquid inlet pipe;

[0045] 5 - liquid discharge pipe;

[0046] 100 - processing cabinet 100, 101 - processing cavity;

[0047] 200 - circulating cooling device, 201 - water outlet pipe, 202 - water inlet pipe;

[0048] 300 - liquid cooling support device. DETAILED DESCRIPTION

[0049] The utility model will be further described in detail below through specific implementation mode combined with drawings. Similar elements in different implementation modes adopt relevant similar element marks. In the following implementation mode, many details are described in order to make the present application be better understood. However, the person skilled in the art can easily realize that part of the features can be omitted in different cases, or can be replaced by other elements, materials, methods. In some cases, some operations related to the present application are not shown or described in the specification, in order to avoid the core part of the present application from being overwhelmed by too much description, and for the person skilled in the art, it is not necessary to describe these related operations in detail according to the description in the specification and the general technical knowledge in the art, and the related operations can be completely understood.

[0050] In addition, the features, operations or characteristics described in the specification can be combined in any appropriate way to form various embodiments. At the same time, the steps or actions in the method description can also be sequentially adjusted or adjusted in a manner that is obvious to the person skilled in the art. Therefore, the various sequences in the specification and drawings are only for the purpose of clearly describing a certain embodiment, and do not mean that the sequence is necessary, unless otherwise stated that a certain sequence must be followed.

[0051] The serial numbers of the components in this paper, such as "first", "second", etc., are only used to distinguish the described objects, and have no any sequence or technical meaning. Unless otherwise specified, the "connection" and "coupling" in the present application include direct and indirect connection (coupling).

[0052] In one embodiment, a liquid cooling support device is provided, which is mainly used for supporting the etching process of a wafer workpiece. The liquid cooling support device is also provided with a liquid cooling channel, which can cool the workpiece through the cooling liquid to complete the processing at a suitable temperature. The liquid cooling channel in the embodiment can inject cooling liquid to achieve heat exchange and cool the workpiece. The cooling liquid can include water. The cooling liquid can also include other cooling liquids with high thermal conductivity, such as ethylene glycol aqueous solution, mineral oil or special cooling liquid, which can have better heat conduction performance and lower freezing point in specific application scenarios, and is suitable for low temperature environment or occasions requiring antifreeze. The cooling liquid can also be a mixed liquid, which can be mixed with other cooling liquids to improve the thermal conductivity and flowability of the cooling liquid. For example, adding an appropriate amount of ethylene glycol can improve the antifreeze performance of the cooling liquid while maintaining good heat conduction effect.

[0053] In the embodiment, the liquid cooling support device is a three-layer laminated structure, which forms a water storage cavity, a flow channel and a first liquid discharge cavity. The water storage cavity is located in the middle, and the first liquid discharge cavity is located at the peripheral edge position. The water storage cavity and the first liquid discharge cavity are connected through multiple flow channels. The flow channels are connected to the upper end position of the water storage cavity and the first liquid discharge cavity, so that the water in the water storage cavity can overflow into the flow channels only when the water storage cavity is full of water. This design allows the cooling liquid to enter multiple flow channels at the same time, avoiding uneven heat dissipation caused by the sequential flow of cooling liquid in the flow channels, and greatly improving the uniformity of heat dissipation of multiple flow channels. The three-layer laminated structure of the liquid cooling support device is more compact, easier to install, can save materials and space, effectively save the manufacturing cost of the liquid cooling support device, and improve the installation efficiency of the liquid cooling support device.

[0054] The heat exchange member is located in the path of liquid flow and has a heat exchange surface in contact with the liquid. The heat exchange member can increase the contact area with the liquid and improve the heat exchange efficiency of the liquid. It can quickly transfer the heat generated during the processing of the workpiece to the liquid, thereby improving the heat dissipation efficiency of the liquid cooling support device.

[0055] Further, the heat exchange member can be provided in a water droplet-shaped structure. This structure not only does not block the flow rate of the liquid, but also fully contacts with the liquid, that is, it ensures sufficient heat transfer while not affecting the rapid circulation of the liquid.

[0056] Further, the flow channel can be provided in a micro-flow channel structure to achieve efficient heat exchange through dense micro-flow channels. The micro-flow channels are equal in width to ensure consistent flow rate of the cooling liquid in different areas. The narrow and long micro-flow channels can improve the flow rate of the cooling liquid to improve the uniformity and efficiency of heat dissipation.

[0057] Further, the flow channels in the liquid cooling support device can be arranged on one surface of the liquid cooling support device and close to the support surface on which the workpiece is placed, and the plurality of flow channels can be arranged in a radial or approximately radial manner, which can not only increase the heat dissipation area, but also improve the uniformity of heat dissipation.

[0058] Please refer to Figures 1 to 7 In an embodiment, a liquid cooling support device is provided, which mainly comprises a bottom plate 1, a flow guide plate 2 and a top plate 3. The bottom plate 1, the flow guide plate 2 and the top plate 3 can all be disc structures for mounting and placing a circular workpiece to support and dissipate heat from the circular workpiece. The bottom plate 1, the flow guide plate 2 and the top plate 3 can also be square plates or other structures for mounting and placing square or other shaped workpieces. In this embodiment, the bottom plate 1, the flow guide plate 2 and the top plate 3 are all disc structures as an example for description.

[0059] The middle part of the bottom plate 1 has a mounting groove 11, and the flow guide plate 2 and the top plate 3 are mounted in the mounting groove 11. The shape of the mounting groove 11 is consistent with the outer shape of the bottom plate 1, the mounting groove 11 is a circular groove, and the center line of the mounting groove 11 coincides with the center line of the bottom plate 1, so that the bottom plate 1, the flow guide plate 2 and the top plate 3 can be aligned and mounted along the center line, and the structure is simpler, facilitating the processing and mounting of the bottom plate 1, the flow guide plate 2 and the top plate 3.

[0060] The flow guide plate 2 is mounted at the bottom of the mounting groove 11, and the top plate 3 is mounted on the upper surface of the flow guide plate 2, and the top plate 3, the flow guide plate 2 and the bottom plate 1 form a three-layer structure stacked from top to bottom.

[0061] The middle part of the mounting groove 11 is provided with a protruding part 14, the middle part of the flow guide plate 2 is provided with a hollow part 21, the volume of the protruding part 14 is smaller than the volume of the hollow part 21, and the protruding part 14 and the hollow part 21 have the same or similar structure. The outer side surface of the protruding part 14 is spaced apart from the inner side surface of the hollow part 21, and there is a certain spacing space between them, which forms a liquid storage cavity 12. The bottom or side of the liquid storage cavity 12 can be provided with a liquid inlet 121, and liquid can be injected into the liquid storage cavity 12 through the liquid inlet 121.

[0062] The upper surface of the flow guide plate 2 is covered with a plurality of uniformly distributed first flow channels 22, the plurality of first flow channels 22 are located at the same height position, and one end of all the first flow channels 22 communicates with the liquid storage cavity 12. The height of the protruding part 14 is higher than the height of the first flow channel 22, so that the highest part of the liquid storage cavity 12 enclosed by the protruding part 14 can be connected with the first flow channel 22, and when the liquid storage cavity 12 is filled with liquid, the liquid can overflow into all the first flow channels 22 at the same height. The first flow channel 22 is a heat exchange and heat dissipation area, and the liquid flowing through the first flow channel 22 will exchange heat with the workpiece above to cool the workpiece by liquid cooling.

[0063] The outer diameter of the flow guide plate 2 is smaller than the inner diameter of the mounting groove 11, the outer side surface of the flow guide plate 2 is arranged in a spaced manner with the inner side surface of the mounting groove 11, and a spacing space is formed between the two, which forms a first liquid discharge cavity 13. The ends of all the first flow channels 22 away from the liquid storage cavity 12 are respectively communicated with the first liquid discharge cavity 13. The bottom or side of the first liquid discharge cavity 13 is provided with a first liquid discharge port 131, and the first liquid discharge port 131 is used to discharge hot liquid.

[0064] The outer diameter of the top plate 3 is equal to or slightly larger than the inner diameter of the mounting groove 11, the top plate 3 covers the flow guide plate 2, the top plate 3 covers the entire flow guide plate 2, and the top plate 3 also covers and seals the liquid storage cavity 12, the first flow channel 22 and the first liquid discharge cavity 13. Among them, when the top plate 3 is not installed, the upper ends of the liquid storage cavity 12, the first flow channel 22 and the first liquid discharge cavity 13 are all open structures; when the top plate 3 is installed, the top plate 3 covers and seals the liquid storage cavity 12, the first flow channel 22 and the first liquid discharge cavity 13, so that the liquid cannot leak out, affecting the processing equipment and workpieces. By such arrangement, a plurality of guide grooves can be arranged on the flow guide plate 2, the guide grooves form the first flow channel 22, and the liquid storage cavity 12 and the first liquid discharge cavity 13 are enclosed by a plurality of components, which can simplify the structure of the bottom plate 1, the flow guide plate 2 and the top plate 3, and reduce the manufacturing difficulty of the bottom plate 1, the flow guide plate 2 and the top plate 3.

[0065] The flow guide plate 2 can be fixedly connected with the bottom plate by screw connection, welding, bonding and the like. The top plate 3 can be fixedly connected with the flow guide plate 2 by screw connection, welding, bonding and the like, and the top plate 3 can also be fixedly connected with the bottom plate 1 by welding, bonding and the like. The bottom plate 1, the flow guide plate 2 and the top plate 3 are all made of high-thermal-conductivity materials, preferably metal matrix composites (MMC), for example, the bottom plate 1, the flow guide plate 2 and the top plate 3 are copper and aluminum matrix composites; the bottom plate 1, the flow guide plate 2 and the top plate 3 can also be silver, gold and other high-thermal-conductivity materials. Although these materials have high cost, they can provide better thermal conductivity in some high-precision and high-performance application scenarios. The bottom plate 1, the flow guide plate 2 and the top plate 3 have good heat conduction performance, and can allow the heat generated by the processed workpiece to be transferred to the inside to exchange heat with the liquid.

[0066] The bottom plate 1, the flow guide plate 2 and the top plate 3 can also be made of corrosion-resistant materials to improve the corrosion resistance of the bottom plate 1, the flow guide plate 2 and the top plate 3 and prolong their service life. The bottom plate 1, the flow guide plate 2 and the top plate 3 can be made of stainless steel and nickel-plated copper, and the bottom plate 1, the flow guide plate 2 and the top plate 3 can also be made of titanium alloy or ceramic materials. These materials have higher corrosion resistance and high-temperature resistance, and are suitable for cooling requirements in extreme environments.

[0067] The bottom plate 1, the flow guide plate 2 and the top plate 3 can also be made of a composite material, for example, the bottom plate 1, the flow guide plate 2 and the top plate 3 can also be made of a copper-aluminum composite material or a copper-graphite composite material, etc. These composite materials combine the advantages of different materials, both high thermal conductivity and good mechanical properties and corrosion resistance.

[0068] The upper surface of the top plate 3 is a support surface, which can be used to directly place the workpiece or place the load-bearing member for mounting the workpiece. That is, during workpiece processing, the top plate 3 can be directly or indirectly connected with the workpiece, and the top plate 3 can transfer the heat generated by the processed workpiece to the liquid in the first flow channel 22 to achieve liquid cooling heat dissipation.

[0069] In this embodiment, the first flow channel 22 is a micro-flow channel structure, and a plurality of first flow channels 22 have the same spacing and are parallel to each other. The diameter of the first flow channel 22 is relatively small, and the spacing between adjacent first flow channels 22 can be smaller than the diameter of the first flow channel 22, and preferably the spacing between adjacent first flow channels 22 is as small as possible, and the spacing can approach zero, so that the upper surface of the flow guide plate 2 is uniformly covered with more micro first flow channels 22 to improve the heat exchange efficiency.

[0070] The first flow channel 22 is a micro-flow channel structure, which forms a monolithically integrated manifold microchannel (mMMC) structure. By reducing the pipe cross-sectional area, the flow rate is increased under the same flow condition. When the flow rate increases, the relative motion of the liquid and the solid surface accelerates, which will cause the thickness of the boundary layer to decrease. The boundary layer refers to the velocity gradient region formed near the solid surface due to viscosity. The thinner the boundary layer between the micro-flow channels, the higher the efficiency of heat transfer by convection, and therefore the convection heat transfer coefficient increases. During the heat exchange process, one important influencing factor is the contact area. The contact area between the cold liquid and the heat exchange surface of the first flow channel 22 of the micro-flow channel structure is greatly improved compared with the traditional water cooling structure, thereby improving the cooling efficiency.

[0071] The liquid flow rate in the micro-flow channel structure of the first flow channel 22 is accelerated, which helps to increase the Reynolds number, thereby generating turbulent flow, which helps to improve the convective heat transfer coefficient. At the same time, under the condition of turbulent flow, the liquid mixing degree is higher, which improves the heat transfer efficiency.

[0072] The upper surface of the flow guide plate 2 can be distributed with a plurality of first flow channels 22 in the form of radial lines or approximately radial lines, and the shape of the first flow channel 22 can be linear or curved. The plurality of first flow channels 22 in the form of radial lines or approximately radial lines can further improve the uniformity of heat dissipation, which can avoid local overheating of the top plate 3; at the same time, the plurality of first flow channels 22 in the form of radial lines or approximately radial lines can also ensure that the flow rates in the plurality of first flow channels 22 are the same or similar, which is conducive to improving the uniformity of heat dissipation.

[0073] In other embodiments, the upper surface of the deflector 2 can also be distributed with the first flow channel 22, which can also be in the shape of a spiral line, or the shape of the first flow channel 22 can be a combination of one or more of straight lines, curves, and spiral lines. The first flow channel 22 covers the upper surface of the deflector 2, which can also achieve uniform heat dissipation and increase the heat dissipation area.

[0074] In this embodiment, the first flow channel 22 is also provided with a heat exchange member 24, and the first flow channel 22 can be uniformly distributed with a plurality of heat exchange members 24. The heat exchange member 24 can be a protruding structure protruding from the first flow channel 22. The heat exchange member 24 has a heat exchange surface 241 in contact with the liquid in the first flow channel 22. The heat exchange surface 241 is vertically or obliquely arranged. The heat exchange member 24 can be in contact with the liquid in the first flow channel 22, so that when the liquid flows through the first flow channel 22, it not only contacts the inner wall of the first flow channel 22, but also contacts the heat exchange surface 241 of the heat exchange member 24. It can greatly increase the contact area with the liquid, and quickly transfer the heat generated by the workpiece processing to the circulating liquid, thereby improving the heat dissipation effect.

[0075] Among them, the plurality of heat exchange members 24 in the first flow channel 22 are preferably uniformly and evenly distributed in the first flow channel 22. In the fluid flow direction (i.e. the length direction of the first flow channel 22), the plurality of heat exchange members 24 are staggered and spaced apart from each other. In this way, the circulation speed of the liquid can be avoided by the heat exchange member 24, while ensuring that the liquid is in full contact with the heat exchange surface 241 of the heat exchange member 24.

[0076] For example, in the fluid flow direction, the heat exchange members 24 are staggered and arranged in a front and back arrangement of one and two, and a half heat exchange member 24 can also be arranged to connect with the side wall of the first flow channel 22. The half heat exchange member 24 and the side wall of the first flow channel 22 can be an integrated structure. In this structure, one heat exchange member 24 is aligned with the middle position of the two heat exchange members 24 in front, and / or one heat exchange member 24 is aligned with the middle position of the two heat exchange members 24 behind. So that the liquid flowing through the gap between the two heat exchange members 24 will immediately come into contact with the heat exchange member 24 behind, which can repeatedly achieve full contact between the liquid and the heat exchange surface 241 of the heat exchange member 24, thereby improving the heat dissipation effect.

[0077] In other embodiments, the plurality of heat exchange members 24 can also be staggered and spaced apart in other ways to improve the heat dissipation effect.

[0078] In this embodiment, the heat exchange member 24 also contacts the top plate 3, so that the heat exchange member 24 can transfer the heat from the top plate 3 to the liquid in the first flow channel 22.

[0079] The heat exchange member 24 can also be in contact with the side surface and / or the bottom surface of the first flow channel 22, so that the heat exchange member 24 can transfer the heat transferred from the top plate 3 to the guide plate 2 to the liquid in the first flow channel 22.

[0080] Please refer to Figure 6 and Figure 7 In this embodiment, the principle steps of a cycle of liquid cooling of the liquid cooling support device are as follows:

[0081] Liquid injection and storage: cold liquid is injected into the liquid storage cavity 12 from the liquid inlet 121, and after the liquid storage cavity 12 is filled with liquid, the liquid is simultaneously overflowed from the liquid storage cavity 12 into all the first flow channels 22;

[0082] Heat exchange and heat dissipation: the liquid flows from the end of the first flow channel 22 close to the liquid storage cavity 12 to the end close to the first liquid discharge cavity 13, and the liquid exchanges heat with the heat exchange member 24 in the first flow channel 22 and the inner wall of the first flow channel 22 when flowing in the first flow channel 22, so as to absorb the heat generated during the processing of the workpiece;

[0083] Liquid discharge: after heat exchange, all the liquid in the first flow channel 22 is discharged into the first liquid discharge cavity 13, and then discharged from the first liquid discharge port 131.

[0084] In this embodiment, since the liquid cooling support device is provided with the liquid storage cavity 12, the plurality of first flow channels 22 and the first liquid discharge cavity 13, during heat dissipation, the cold liquid first enters the liquid storage cavity 12, and after the cold liquid in the liquid storage cavity 12 is filled, it overflows, and the overflowed cold liquid can enter all the first flow channels 22 simultaneously more uniformly, improving the consistency of the flow of the cold liquid in the first flow channels, and the heat dissipation effect can be obviously improved; the combination structure of the liquid storage cavity 12, the plurality of first flow channels 22 and the first liquid discharge cavity 13 can make the liquid flow quickly from the liquid storage cavity 12 through the first flow channels 22 and then be discharged from the first liquid discharge cavity 13, so that the liquid can quickly enter the next cycle, effectively reducing the time of the liquid lingering in the liquid cooling support device, ensuring that fresh liquid can quickly enter the liquid cooling support device for heat dissipation, thereby improving the heat dissipation efficiency.

[0085] The liquid in the liquid storage cavity 12 and the first liquid discharge cavity 13 also contacts the guide plate 2, and the liquid in the liquid storage cavity 12 and the first liquid discharge cavity 13 can fully exchange heat with the guide plate 2, which is beneficial to the heat dissipation efficiency.

[0086] The plurality of first flow channels 22 are distributed on the upper surface of the guide plate 2, which can achieve more uniform heat dissipation in a larger area, further improve the heat dissipation effect, and thus meet the heat dissipation requirements of the workpiece during etching.

[0087] The bottom plate 1, the flow guide plate 2 and the top plate 3 of the liquid cooling support device form a three-layer laminated structure, which is more compact, easier to install, can save materials and space, effectively save the manufacturing cost of the liquid cooling support device, and improve the installation efficiency of the liquid cooling support device.

[0088] The first flow channel 22 is further provided with a heat exchange element 24, and the heat exchange element 24 has a heat exchange surface 241 in contact with the fluid. The arrangement of the heat exchange element 24 increases the area in contact with the liquid, which can effectively improve the heat exchange rate of the liquid, and further improve the heat dissipation efficiency of the liquid cooling support device.

[0089] Please refer to Figures 3 to 5 In an embodiment, the heat exchange element 24 is provided with a special structure to ensure sufficient contact with the liquid while not affecting the flow rate of the liquid.

[0090] The end of the heat exchange element 24 facing the liquid storage cavity 12 (i.e. the front end of the heat exchange element 24) can be provided with a non-planar structure such as a circular arc or a sharp corner structure, which can avoid directly blocking the flow channel of the liquid, and the use of a circular arc or a sharp corner structure can effectively distribute the liquid and reduce the blocking effect on the liquid.

[0091] Preferably, the cross section (horizontal cross section) of the heat exchange element 24 is a water droplet structure, and the heat exchange element 24 is a columnar structure perpendicular to the bottom surface of the first flow channel 22. The end of the heat exchange element 24 facing the liquid storage cavity 12 is a circular arc structure, and the end of the heat exchange element 24 facing away from the liquid storage cavity 12 is a sharp corner structure. This structure forms a circular arc heat exchange surface 241 at the front end of the heat exchange element 24, and forms a planar heat exchange surface 241 on both sides of the heat exchange element 24 and its thickness. The circular arc heat exchange surface 241 at the front end can fully contact and distribute the liquid, and the planar heat exchange surface 241 at the rear end can not only fully contact the liquid, but also accelerate the flow of the liquid.

[0092] The sharp corner angle of the sharp corner structure at the rear end of the heat exchange element 24 is 30°-180°, including 30° and excluding 180°. Preferably, the sharp corner angle of the sharp corner structure at the rear end of the heat exchange element 24 is 30°-60°.

[0093] The water droplet and columnar structure is arranged in the first flow channel 22. On the one hand, it can increase the effective heat exchange area, and the water droplet dispersed isolated structure can periodically destroy the flow and thermal boundary layer, so that the fluid cannot fully develop, and the heat exchange effect is obviously strengthened. At the same time, the staggered arrangement instead of the order arrangement further enhances the above phenomenon.

[0094] When the sharp corner angle of the sharp corner structure at the rear end of the heat exchange element 24 is less than 60°, the tail reverse pressure gradient is small, the boundary layer vortex shedding phenomenon disappears, the water droplet-shaped streamline structure can improve the tail flow distribution, delay the transition of flow from laminar flow to overrunning zone, and the smaller the tail angle α, the more obvious the effect. The appropriate water droplet-shaped structure can avoid the resistance loss caused by the vortex shedding of the tail of the heat exchange element 24; the area of the heat exchange element 24 tail which is weak in heat transfer to the fluid is replaced by solid heat conduction, and at the same time the heat transfer surface is expanded to the fluid mainstream area, thereby improving the heat exchange efficiency.

[0095] In an embodiment, the bottom surface of the flow guide plate 2 is provided with a second drainage cavity 25 and a second drainage channel 23. The second drainage cavity 25 is located at the middle position of the bottom surface of the flow guide plate 2. Part of the second drainage cavity 25 can also extend to the edge position close to the flow guide plate 2. The bottom surface of the flow guide plate 2 is provided with one or more second drainage channels 23. The second drainage channels 23 are distributed in the radial direction on the bottom surface of the flow guide plate 2. One end of the second drainage channel 23 is in communication with the first drainage port 131 of the first drainage cavity 13. The other end of the second drainage channel 23 is in communication with the second drainage cavity 25. The second drainage port 132 is located in the second drainage cavity 25.

[0096] For example, six first drainage ports 131 and six second drainage channels 23 are added without changing the original water cooling pipe design, which meets the single inlet and multiple outlet condition proved by experiments, greatly improves the cooling effect, and evenly distributes the six first drainage ports 131 around the circular flow guide plate 2, thereby increasing the drainage efficiency, shortening the cold liquid circulation time, and greatly saving the volume of the cooling structure.

[0097] In an embodiment, the protruding part 14 includes a plurality of convex strips in a radial shape. Correspondingly, the hollow part 21 includes a plurality of strip-shaped grooves in a radial shape. The number of convex strips of the protruding part 14 is the same as the number of strip-shaped grooves of the hollow part 21. Each strip-shaped groove has a convex strip.

[0098] Please refer to Figure 1For example, the protruding part 14 includes three protrusions in a radial shape, which are evenly distributed to form a Y-shaped structure. Correspondingly, the hollow part 21 includes three strip-shaped grooves in a radial shape, which are evenly distributed to form a Y-shaped structure. The three protrusions and the three strip-shaped grooves form a Y-shaped liquid storage cavity 12. The liquid storage cavity 12 is partially located in the middle of the flow guide plate 2 and partially extends to the edge of the flow guide plate 2. The radial liquid storage cavity 12 divides the upper surface of the flow guide plate 2 into multiple identical flow guide areas. The overflowed water in the liquid storage cavity 12 can flow into the multiple flow guide areas evenly. The first flow channels 22 in each flow guide area can be arranged in a straight line shape and spaced apart from each other. The extension line of the first flow channel 22 in the middle of each flow guide area passes through the center of the liquid storage cavity 12. The multiple first flow channels 22 are arranged in a radial shape, forming more dense and uniform first flow channels 22, which can improve the uniformity of heat dissipation.

[0099] The second liquid discharge cavity 25 can have the same shape as or similar to the Y-shaped hollow part 21. The flow guide plate 2 is provided with a Y-shaped second liquid discharge cavity 25 near the bottom edge of the hollow part 21. This arrangement can make full use of the shape of the flow guide plate 2 and increase the volume of the second liquid discharge cavity 25 to store more liquid. The liquid in the second liquid discharge cavity 25 can also exchange heat with the flow guide plate 2 to absorb more heat, thereby improving the heat dissipation effect.

[0100] In other embodiments, the protrusions of the protruding part 14 and the strip-shaped grooves of the hollow part 21 can have other numbers, such as four for forming a cross shape or eight for forming a rice-shaped structure.

[0101] Please refer to Figure 1 In an embodiment, the middle part of the protruding part 14 can also be provided with a slot hole 141. The slot hole 141 partially penetrates the protruding part 14 and the bottom plate 1. The top plate 3 is provided with an opening 31 corresponding to the slot hole 141. The slot hole 141 and the opening 31 are in communication. The slot hole 141 in the middle part of the protruding part 14 forms a hollow structure, which can be used to install other components. The slot hole 141 penetrates the bottom plate 1, so that the slot hole 141 can be used as a mounting component to mount the liquid cooling support device on other components.

[0102] In other embodiments, the protruding part 14 can also have a solid structure. The protruding part 14 can form the liquid storage cavity 12 with the hollow part 21.

[0103] In an embodiment, the middle part of the bottom plate 1 can also not be provided with the protruding part 14. The hollow part 21 in the middle part of the flow guide plate 2 directly forms the liquid storage cavity 12. The liquid can overflow into all the first flow channels 22 simultaneously, achieving more uniform heat dissipation.

[0104] In one embodiment, the thickness of the flow guide plate 2 and the top plate 3 is equal to the depth of the mounting groove 11, and when the flow guide plate 2 and the top plate 3 are mounted in the mounting groove 11, the upper surface of the top plate 3 is flush with the upper surface of the bottom plate 1.

[0105] In this way, the upper surface of the bottom plate 1 and the upper surface of the top plate 3 together form a support surface, which can increase the area of the support surface, allowing larger-sized workpieces to be installed, or larger-sized carriers to be installed. The top plate 3 is flush with the bottom plate 1, which can also make the liquid-cooled support device more regular and compact, reducing the occupied space of the liquid-cooled support device.

[0106] Please refer to Figure 2 In one embodiment, the lower surface of the flow guide plate 2 can be provided with a liquid discharge channel 23, and a second liquid discharge port 132 is provided in the mounting groove 11 of the bottom plate 1, one end of the liquid discharge channel 23 communicates with the first liquid discharge port 131, and the other end of the liquid discharge channel 23 communicates with the second liquid discharge port 132. The second liquid discharge port 132 is spaced apart from the liquid inlet port 121 and is isolated from each other.

[0107] The flow guide plate 2 is provided with a liquid discharge channel 23, which can allow the second liquid discharge port 132 to be arranged close to the liquid inlet port 121, so that the liquid inlet pipe and the liquid inlet pipe connected to the liquid-cooled support device are closer, facilitating the layout and wiring of the liquid inlet pipe and the liquid inlet pipe.

[0108] Please refer to Figure 1 and Figure 2 In one embodiment, the liquid-cooled support device can further include a liquid inlet pipe 4 and a liquid discharge pipe 5, one end of the liquid inlet pipe 4 communicates with the liquid inlet port 121, one end of the liquid inlet pipe 4 communicates with the circulating cooling device, and the liquid inlet pipe 4 is used to inject cold liquid into the liquid storage cavity 12. One end of the liquid discharge pipe 5 communicates with the second liquid discharge port 132, the other end of the liquid discharge pipe 5 communicates with the circulating cooling device, and the liquid discharge pipe 5 is used to discharge hot liquid that absorbs heat in the liquid-cooled support device. The circulating cooling device can use a heat exchanger or other device to perform heat exchange on the recovered hot liquid again, so that the hot liquid becomes cold liquid again, and the cold liquid is driven to be injected into the liquid-cooled support device for the next cycle of cooling.

[0109] In one embodiment, the volume size relationship of the liquid storage cavity 12 and the first liquid discharge cavity 13 can be set according to requirements, and the flow rate of the liquid in the first flow channel 22 can be controlled by changing the volume size relationship of the liquid storage cavity 12 and the first liquid discharge cavity 13 to meet the required heat dissipation efficiency.

[0110] For example, the volume of the liquid storage cavity 12 is larger than that of the first liquid discharge cavity 13, the area of the upper surface of the liquid storage cavity 12 is larger than that of the first liquid discharge cavity 13, and the hydraulic pressure formed by the liquid storage cavity 12 is larger than that formed by the first liquid discharge cavity 13. The difference in hydraulic pressure can drive the liquid in the first flow channel 22 to flow at a high speed, accelerate the circulation of the liquid, and thus improve the heat dissipation efficiency.

[0111] In an embodiment, the density of the first flow channel 22 on the guide plate 2 can be arranged according to the heat dissipation requirement to meet the heat dissipation requirement of different workpieces.

[0112] For example, when the workpiece supported on the liquid cooling support device is a circular workpiece and the circular workpiece generates heat uniformly, the first flow channel 22 is arranged uniformly on the upper surface of the guide plate 2, for example, in the form of equidistant radial lines.

[0113] When the workpiece supported on the liquid cooling support device is a special-shaped workpiece or the local heat generation of the workpiece is significantly higher than that of other areas, the first flow channel 22 is arranged locally on the upper surface of the guide plate 2 directly below the heat generation area of the workpiece to achieve rapid heat dissipation of the heat generation area of the workpiece.

[0114] In an embodiment, the interior of the guide plate 2 is also provided with the first flow channel 22, forming a multi-layer flow channel structure. The first flow channel 22 located in the interior of the guide plate 2 can exchange heat through the heat conduction of the guide plate 2 to achieve heat dissipation. The more layers of flow channel structure provided in the guide plate 2 can further improve the heat dissipation efficiency.

[0115] Please refer to Figure 8 and Figure 9 In an embodiment, a liquid cooling support device is provided. The liquid cooling support device is different from any of the above liquid cooling support devices in that the top surface of the guide plate 2 of the liquid cooling support device is directly provided with a plurality of heat exchange pieces 24 arranged uniformly, and the heat exchange pieces 24 form flow channels that are in communication with each other. That is, the liquid cooling support device does not directly provide the first flow channels 22 that are isolated from each other.

[0116] In this embodiment, the top surface of the guide plate 2 is uniformly covered with a plurality of heat exchange pieces 4 arranged alternately and spaced apart. The heat exchange pieces 4 can have the water droplet-shaped structure described above. The plurality of heat exchange pieces 4 have small gaps therebetween, and the gaps form dense flow channels that are in communication with each other. One end of the flow channels is in communication with the liquid storage cavity 12, and the other end of the flow channels is in communication with the first liquid discharge cavity 13.

[0117] The top plate 3 covers the guide plate 2 from above, and the top plate 3 is in contact with the heat exchange pieces 4. The top plate 3, the heat exchange pieces 4, and the upper surface of the guide plate 2 enclose a complete flow channel.

[0118] In the embodiment, the plurality of heat exchange members 4 are arranged on the upper surface of the deflector 2 to directly form flow channels, so that the spacing between the flow channels is reduced, the flow channels are more densely distributed, the flow of liquid flowing through the deflector 2 for heat exchange is increased, and the heat exchange efficiency is improved.

[0119] In other embodiments, the heat exchange members 24 can also be arranged on the lower surface of the top plate 3, the lower ends of the heat exchange members 24 are in contact with the upper surface of the deflector 2, and the same dense flow channels can be formed to improve the heat dissipation efficiency.

[0120] Please refer to Figure 10 In an embodiment, a processing equipment is provided, and the processing equipment can be etched. The processing equipment mainly comprises a processing cabinet 100, a circulating cooling device 200, and the liquid cooling support device 300 in any of the above embodiments.

[0121] The processing cabinet 100 is in a cabinet structure, and the processing cabinet 100 has a processing cavity 101 inside. The processing cavity 101 is a sealed cavity, and the processing cabinet 100 can be provided with a cabinet door. The workpiece can be put in and taken out through the opening and closing of the cabinet door.

[0122] The circulating cooling device 200 is located outside the processing cavity 101, and the liquid cooling support device 300 is installed in the processing cavity 101. The liquid cooling support device 300 is used to support the workpiece in the processing cavity 101 for processing. The circulating cooling device 200 and the processing cabinet 100 are relatively independent devices. The circulating cooling device 200 can be connected with the liquid cooling support device 300 by plug-in connection, so as to facilitate the maintenance of the processing cabinet 100 and the circulating cooling device 200.

[0123] The circulating cooling device 200 mainly comprises a water pump (not shown in the figure), a heat exchanger (not shown in the figure), a water outlet pipeline 201, and a water inlet pipeline 202. The water outlet pipeline 201 of the circulating cooling device 200 is in communication with the liquid inlet pipeline 4 of the liquid cooling support device 300, the water inlet pipeline 202 of the circulating cooling device 200 is in communication with the liquid outlet pipeline 5 of the liquid cooling support device 300, and the circulating cooling device 200 and the liquid cooling support device 300 form a circulating liquid path. The water pump can include one of a displacement pump (PDP), a centrifugal pump (CP), or a turbine pump (TP), and the heat exchanger can include one of a plate heat exchanger, a displacement heat exchanger, and a tube-shell heat exchanger.

[0124] The water pump in the circulating cooling device 200 is used to inject liquid at a lower temperature into the liquid cooling support device 300 through the water outlet pipeline 201, and then recover the hot liquid discharged from the liquid cooling support device 300 through the water inlet pipeline 202. The heat exchanger in the circulating cooling device 200 is used to convert the recovered hot liquid into cold liquid, and the converted cold liquid can be injected into the liquid cooling support device 300 again for the next cooling cycle.

[0125] The processing equipment of the embodiment, since the liquid cooling support device 300 is provided with the liquid storage cavity 12, the plurality of first flow channels 22 and the first liquid discharge cavity 13, when radiating heat, the cold liquid first enters the liquid storage cavity 12, and after the cold liquid in the liquid storage cavity 12 is filled, the cold liquid overflows and can enter all the first flow channels 22 at the same time more uniformly, the consistency of the cold liquid flowing in the first flow channels is improved, and the heat dissipation effect can be obviously improved; the combination structure of the liquid storage cavity 12, the plurality of first flow channels 22 and the first liquid discharge cavity 13 can make the liquid flow from the liquid storage cavity 12 to the first flow channels 22 and then be discharged from the first liquid discharge cavity 13, the liquid can quickly enter the next cycle, the time of the liquid lingering in the liquid cooling support device 300 is effectively reduced, fresh liquid can quickly enter the liquid cooling support device 300 to radiate heat, and the heat dissipation efficiency is improved.

[0126] The liquid in the liquid storage cavity 12 and the first liquid discharge cavity 13 also contacts the flow guide plate 2, and the liquid in the liquid storage cavity 12 and the first liquid discharge cavity 13 can fully exchange heat with the flow guide plate 2, which is beneficial to the heat dissipation efficiency.

[0127] The plurality of first flow channels 22 are distributed on the upper surface of the flow guide plate 2, which can realize uniform heat dissipation of a larger area, further improve the heat dissipation effect, and further meet the heat dissipation requirements of the workpiece in the etching process.

[0128] The bottom plate 1, the flow guide plate 2 and the top plate 3 of the liquid cooling support device 300 form a three-layer stacked structure, the structure is more compact, installation is easier, material and occupied space can be saved, the manufacturing cost of the liquid cooling support device is effectively saved, and the installation efficiency of the liquid cooling support device is improved.

[0129] The above application of specific examples is used to describe the utility model, which is only used to help understand the utility model and does not limit the utility model. According to the idea of the utility model, technical personnel in the technical field to which the utility model belongs can make some simple deductions, deformations or substitutions.

Claims

1. A liquid-cooled support device, characterized by, The application relates to a liquid cooling support device. The device comprises a bottom plate with a mounting groove; a flow guide plate installed in the mounting groove of the bottom plate, wherein the middle part of the flow guide plate is provided with a hollow part, the hollow part and the bottom plate form a liquid storage cavity, the liquid storage cavity is provided with a liquid inlet for guiding in cold liquid, the side surface of the flow guide plate is spaced apart from the side surface of the mounting groove and forms a first liquid discharge cavity, the first liquid discharge cavity is provided with a first liquid discharge port for discharging hot liquid, the upper surface of the flow guide plate is covered with a plurality of spaced first flow channels, one end of the first flow channel is communicated with the liquid storage cavity, and the other end of the first flow channel extends to be communicated with the first liquid discharge cavity; the first flow channel is provided with a heat exchange element, and the heat exchange element has a heat exchange surface in contact with the liquid flowing in the first flow channel; and a top plate installed on the upper surface of the flow guide plate, the top plate covers and seals the liquid storage cavity, the first flow channel and the first liquid discharge cavity, and the top plate is used for placing workpieces or mounting workpiece bearing members. In the fluid flow direction, a plurality of heat exchange elements are staggered and spaced in the first flow channel. In the fluid flow direction, the heat exchange element is aligned with the middle position between the two heat exchange elements in front, and / or the heat exchange element is aligned with the middle position between the two heat exchange elements in back.

2. The liquid-cooled support device of claim 1, wherein, The end of the heat exchange element facing the liquid storage cavity is provided with a circular arc or a sharp corner structure.

3. The liquid-cooled support device of claim 2, wherein, The cross section of the heat exchange element is in the shape of a water droplet, the end of the heat exchange element facing the liquid storage cavity is provided with a circular arc structure, and the end of the heat exchange element facing away from the liquid storage cavity is provided with a sharp corner structure.

4. The liquid-cooled support device of claim 1, wherein, The sharp corner angle of the sharp corner structure is 30-180 degrees.

5. The liquid-cooled support device of claim 4, wherein, The first flow channel is a micro flow channel structure; and / or a plurality of the first flow channels are equidistantly and parallel arranged; and / or a plurality of the first flow channels are arranged in the shape of radial lines.

6. The liquid-cooled support apparatus of claim 5, wherein, The bottom surface of the flow guide plate is provided with a second liquid discharge cavity and at least one liquid discharge channel, one end of the liquid discharge channel is communicated with the first liquid discharge port, the other end of the liquid discharge channel is communicated with the second liquid discharge cavity, the second liquid discharge cavity is provided with a second liquid discharge port, and the second liquid discharge port is used for discharging liquid from the liquid cooling support device.

7. The liquid-cooled support device of claim 1, wherein, The device comprises a bottom plate with a mounting groove; a flow guide plate installed in the mounting groove of the bottom plate, wherein the middle part of the flow guide plate is provided with a hollow part, the hollow part and the bottom plate form a liquid storage cavity, the liquid storage cavity is provided with a liquid inlet for guiding in cold liquid, the side surface of the flow guide plate is spaced apart from the side surface of the mounting groove and forms a first liquid discharge cavity, the first liquid discharge cavity is provided with a first liquid discharge port for discharging hot liquid, the upper surface of the flow guide plate is uniformly covered with a plurality of staggered and spaced heat exchange elements, flow channels are formed between the heat exchange elements, one end of the flow channel is communicated with the liquid storage cavity, and the other end of the flow channel extends to be communicated with the first liquid discharge cavity; and a top plate installed on the upper surface of the flow guide plate, the top plate covers and seals the liquid storage cavity, the flow channel and the first liquid discharge cavity, and the top plate is used for placing workpieces or mounting workpiece bearing members.

8. The liquid-cooled support device of claim 1, wherein, The device comprises a processing cabinet with a processing cavity; a circulating cooling device located outside the processing cavity; 9. A liquid-cooled support device, characterized by, ​ ​ ​ ​ 10. A processing apparatus characterized by comprising: ​ ​ ​ And a liquid cooling support device as claimed in any one of claims 1 to 9, which is installed in the processing cavity, the liquid inlet and the first liquid outlet of the liquid cooling support device are communicated with the circulating cooling device, and the circulating cooling device is used to drive liquid to inject and discharge in the liquid cooling support device to realize circulating cooling.

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