Heat dissipation assembly and electronic equipment

Abstract

The utility model discloses a heat dissipation assembly and electronic equipment, and relates to the technical field of heat dissipation, and the heat dissipation assembly comprises a housing which is provided with a containing cavity; the first heat conduction part is arranged in the accommodating cavity and divides the accommodating cavity into a first chamber and a second chamber which are relatively independent; at least part of the heat conduction columns are arranged in the first cavity and connected with the inner wall of the first cavity, and the first cavity is filled with a phase change working medium; the heat dissipation assembly further comprises a liquid inlet and a liquid outlet which are formed in the shell. The liquid inlet and the liquid outlet are communicated with the second cavity. The problem that in the prior art, when the temperature of the chip suddenly rises, the temperature of the chip cannot be transferred within a short time by adopting liquid cooling or air cooling is solved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of heat dissipation, in particular to a heat dissipation assembly and an electronic device. BACKGROUND

[0002] With the rapid development of high-performance computing, artificial intelligence and 5G communication technology, the heat flux density of electronic chips has increased significantly, especially when processing high load or transient power overshoot, the temperature of the chip will rise sharply. This temperature rise phenomenon poses a serious threat to the performance and life of the chip, because the temperature is too high, not only will reduce the operating efficiency of the chip, but also may cause physical damage to electronic components, thereby shortening the service life of the device.

[0003] However, in the prior art, when dissipating heat from the chip, liquid cooling or air cooling or a combination of the two is usually used, but the thermal response time of the liquid cooling and air cooling system is long, and it cannot respond in time to the temperature rise in a very short time. Under the condition of high heat flux density, the heat dissipation efficiency of the liquid cooling and air cooling technology is limited, and the heat cannot be quickly transferred from the hot spot area, thereby affecting the service life of the chip and the overall thermal management effect. CONTENT OF THE INVENTION

[0004] The present application provides a heat dissipation assembly and an electronic device to solve the problem that liquid cooling or air cooling cannot transfer the temperature of the chip itself in a short time when the temperature of the chip rises sharply in the prior art.

[0005] The present application provides a heat dissipation assembly, comprising a housing having a receiving cavity;

[0006] A first heat-conducting part is arranged in the receiving cavity and divides the receiving cavity into a first chamber and a second chamber;

[0007] A plurality of heat-conducting columns are at least partially arranged in the first chamber and connected to the inner wall of the first chamber, and the first chamber is filled with a phase change working medium;

[0008] The heat dissipation assembly further comprises an inlet and an outlet formed on the housing, and the inlet and the outlet are in communication with the second chamber.

[0009] Further, at least part of the plurality of heat-conducting columns passes through the first heat-conducting part and extends into the second chamber, and the second chamber is used to accommodate the cooling liquid.

[0010] Further, the heat dissipation assembly further comprises a heat-conducting part arranged in the second chamber, the heat-conducting part is provided with a plurality of accommodating holes, the plurality of accommodating holes are arranged one-to-one corresponding to the plurality of heat-conducting columns, and at least part of the plurality of heat-conducting columns extends into the second chamber from the accommodating hole corresponding thereto.

[0011] Further, the number of the heat-conducting components is multiple, the multiple heat-conducting components are arranged in layers, and each two adjacent heat-conducting components have a heat-dissipation gap therebetween to accommodate the cooling liquid through the heat-dissipation gap.

[0012] Further, the heat-dissipation assembly further comprises a partition component arranged in the second cavity, the partition component is multiple to divide the second cavity into multiple sub-cavities through the partition component, each sub-cavity is provided with an inlet sub-port and an outlet sub-port, each inlet sub-port is communicated with the inlet port, each outlet sub-port is communicated with the outlet port, the heat-conducting components are multiple groups, the multiple heat-conducting components are arranged in one-to-one correspondence with the multiple sub-cavities, and each group of heat-conducting components is arranged in the corresponding sub-cavity.

[0013] Further, the heat-dissipation assembly further comprises a first communication component arranged on the shell and communicated with the multiple inlet sub-ports, and the inlet port is arranged on the first communication component; and / or the heat-dissipation assembly further comprises a second communication component arranged on the shell and communicated with the multiple outlet sub-ports, and the outlet port is arranged on the second communication component.

[0014] Further, the shell comprises a second heat-conducting part, multiple connecting parts, and a cover plate part, the multiple connecting parts are arranged around the outer edge of the second heat-conducting part, and the cover plate part is arranged on the side of the multiple connecting parts away from the second heat-conducting part.

[0015] Further, the side of the second heat-conducting part away from the first cavity is provided with multiple heat-conducting grooves, and the groove opening of the multiple heat-conducting grooves is arranged away from the first cavity, wherein the groove opening width of each heat-conducting groove is between 9.5mm and 10.5mm; and / or the thickness of the first heat-conducting part is between 2.9mm and 3.1mm; and / or each heat-conducting column is welded between the bottom wall and the top wall of the first cavity.

[0016] Further, the thickness of each heat-conducting component is between 0.2mm and 0.4mm; and / or the spacing between each two heat-conducting components is between 1.5mm and 2.5mm; and / or each heat-conducting component is provided with a lubricating layer; and / or the gap between each two adjacent heat-conducting columns is between 14.5mm and 15.5mm.

[0017] According to another aspect of the present application, the present application further provides an electronic device comprising the heat-dissipation assembly.

[0018] The application achieves efficient heat absorption and uniform distribution by setting the first heat-conducting part. The first heat-conducting part is arranged in the shell, which divides the shell into a first chamber and a second chamber. The first chamber is formed on the side directly contacting the target component and is used to accommodate the phase change working medium. This design ensures that the heat generated by the target component can be quickly absorbed by the phase change working medium, and the structure of the first heat-conducting part helps to homogenize the heat, avoiding local overheating and improving the heat dissipation efficiency.

[0019] By setting the liquid inlet and the liquid outlet, the circulation of the cooling liquid is realized, ensuring continuous heat dissipation. The liquid inlet is communicated with the second chamber and is responsible for delivering the cooling liquid to the second chamber. The liquid outlet leads out the cooled cooling liquid, forming the circulation of the cooling liquid. This design not only ensures the continuous supply of the cooling liquid, but also realizes the continuity of the heat dissipation of the target component, improving the stability and reliability of the heat dissipation system.

[0020] By setting multiple heat-conducting columns, rapid heat conduction and efficient heat dissipation are realized. At least part of the multiple heat-conducting columns is distributed in the first chamber, connecting the bottom wall and the top wall of the first chamber, forming a heat conduction path from the phase change working medium to the second chamber. These heat-conducting columns can quickly transfer the heat absorbed by the phase change working medium to the second chamber and exchange heat with the circulating cooling liquid, effectively realizing rapid heat conduction and dissipation, and improving the overall heat dissipation capacity of the heat dissipation assembly.

[0021] By setting the relatively independent first chamber and the second chamber, the synergistic effect of phase change heat dissipation and liquid cooling heat dissipation is realized. The phase change working medium in the first chamber can quickly absorb heat when there is a transient power overshoot, while the second chamber continuously dissipates heat through the circulating cooling liquid. This design enables the heat dissipation assembly to simultaneously cope with transient heat shock and continuous steady-state heat load, improving the adaptability and efficiency of the heat dissipation system. BRIEF DESCRIPTION OF DRAWINGS

[0022] In order to more clearly illustrate the embodiments of the present application, the drawings needed in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative labor.

[0023] Fig. 1 The overall structure of the heat dissipation assembly of the embodiment of the present application is shown;

[0024] Fig. 2 The structure inside the shell of the embodiment of the present application is shown;

[0025] Fig. 3 The schematic diagram of the shell of the embodiment of the present application provided with the liquid outlet is shown;

[0026] Fig. 4 A schematic view of a shell provided with liquid inlet sub-ports according to an embodiment of the present application is shown.

[0027] Wherein, the above-mentioned drawings include the following reference signs:

[0028] 1, shell; 2, first heat-conducting part; 3, liquid inlet; 4, liquid outlet; 5, heat-conducting column; 6, second heat-conducting part; 7, connecting part; 8, cover plate part; 9, heat-conducting part; 10, separating part; 11, liquid inlet sub-port; 12, liquid outlet sub-port; 13, first communicating part; 14, second communicating part. DETAILED DESCRIPTION

[0029] It should be noted that the embodiments and features in the present application can be combined with each other without conflict. The present application will be described in detail below with reference to the accompanying drawings and in combination with the embodiments.

[0030] The technical solutions in the embodiments of the present application will be described clearly and completely below in combination with the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work fall within the protection scope of the present application.

[0031] It should be noted that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the present application. The terms "mounting", "connecting", "connecting" should be broadly understood, for example, it can be fixed connection, or detachable connection, or integral connection; it can be mechanical connection, or electrical connection; it can be directly connected, or indirectly connected through intermediate medium, or the communication between two elements inside. The terms "parallel", "perpendicular", "equal" include the described case and the approximate case of the described case, and the approximate case is within the acceptable deviation range, wherein the acceptable deviation range is determined by the person skilled in the art considering the measurement being discussed and the error related to the measurement of the specific quantity (i.e. the limitation of the measurement system). For example, "parallel" includes absolute parallel and approximate parallel, wherein the acceptable deviation range of approximate parallel can be, for example, within 5°; "perpendicular" includes absolute perpendicular and approximate perpendicular, wherein the acceptable deviation range of approximate perpendicular can also be, for example, within 5°. "Equal" includes absolute equality and approximate equality, wherein the acceptable deviation range of approximate equality can be, for example, less than or equal to 5% of the difference between the two. For those skilled in the art, the specific meaning of the above terms in the present application can be understood in specific cases.

[0032] In order for those skilled in the art to better understand the scheme of the present application, the present application will be further described in detail below in combination with the drawings and specific embodiments.

[0033] With the rapid development of high-performance computing, artificial intelligence and 5G communication technology, the heat flux density of electronic chips has increased significantly, especially when processing high load or transient power overshoot, the temperature of the chip will rise sharply. This temperature rise phenomenon poses a serious threat to the performance and life of the chip, because the temperature is too high, not only will reduce the running efficiency of the chip, but also may cause physical damage to electronic components, thereby shortening the service life of the equipment.

[0034] However, in existing technologies, liquid cooling, air cooling, or a combination of both are typically used for chip heat dissipation. However, liquid cooling and air cooling systems have long thermal response times, making it difficult to react quickly to sudden temperature increases. Under high heat flux density conditions, the heat dissipation efficiency of liquid cooling and air cooling technologies is limited, failing to rapidly transfer heat from hot spots, thus affecting the chip's lifespan and overall thermal management effectiveness. Therefore, the technical solution of this application is to provide a heat dissipation component and electronic device to address the above problems.

[0035] Example 1

[0036] First, this application provides a heat dissipation component for dissipating heat from a target component, such as... Figs. 1 to 4 As shown, the heat dissipation assembly includes a housing 1 and a first heat-conducting part 2 disposed within the housing 1. The first heat-conducting part 2 divides the housing 1 into a relatively independent first chamber and a second chamber. The side of the first chamber away from the second chamber is used to contact the target component for heat dissipation. The housing 1 is provided with an inlet 3 and an outlet 4, both of which are connected to the second chamber. The inlet 3 is used to introduce external coolant into the second chamber, and the outlet 4 is used to lead the coolant out of the second chamber after heat dissipation of the target component. Multiple heat-conducting columns 5 are also disposed within the housing 1. At least a portion of the multiple heat-conducting columns 5 is disposed within the first chamber and connected to the top and bottom walls of the first chamber. The first chamber is filled with a phase change working medium, which is a mixture of docosane and nanodiamond powder. The phase change working medium can absorb the heat generated by the target component and transfer the generated heat to the second chamber through the multiple heat-conducting columns 5, thereby achieving heat dissipation of the target component.

[0037] The heat dissipation assembly includes a housing 1, a first heat-conducting section 2, and internal first and second chambers. The first chamber is filled with a mixed phase change working fluid of docosane and nanodiamond powder to absorb instantaneous heat generated by the target component. The second chamber is connected to an external coolant system via an inlet 3 and an outlet 4 to dissipate heat. When the target component experiences a sudden power overshoot that causes a temperature rise, the phase change working fluid in the first chamber rapidly changes from a solid to a liquid state, absorbing a large amount of heat and forming a temperature buffer to prevent drastic temperature changes in the target component. The addition of nanodiamond powder improves the overall thermal conductivity of the phase change working fluid, making heat absorption faster and more uniform.

[0038] A plurality of heat-conducting columns 5 are arranged in the shell 1, part of the heat-conducting columns 5 are arranged in the first chamber and are in close contact with the phase change working medium, and the other part extends into the second chamber and is in direct contact with the cooling liquid. The arrangement of the heat-conducting columns 5 can realize efficient heat conduction of the heat absorbed by the phase change working medium to the second chamber, and then the cooling liquid takes away the heat, completing the heat transfer process from the target component to the external cooling system.

[0039] The cooperation of the phase change working medium and the plurality of heat-conducting columns 5 enables the heat dissipation assembly to respond to transient power overshoot within microseconds, forming an effective temperature buffer to protect the target component from temperature surges. Through the arrangement of the heat-conducting columns 5, heat can be quickly and smoothly transferred from the target component to the cooling liquid, ensuring that heat is dissipated in time even under high heat flux, maintaining the temperature stability of the target component.

[0040] The addition of nanodiamond powder significantly reduces the internal thermal resistance of the phase change working medium, improves the heat diffusion rate in the phase change working medium, ensures smooth heat transfer on multiple time scales, and enhances the heat dissipation efficiency of the system. The double-cavity design and compact heat-conducting columns 5 not only realize efficient heat dissipation, but also simplify the system structure, making it easy to integrate with the target component and other system components, improving the overall stability and maintainability of the system.

[0041] Further, the side of the first heat-conducting part 2 away from the first chamber is provided with a plurality of heat-conducting grooves, and the grooves of the plurality of heat-conducting grooves are arranged away from the first chamber. The groove width of each heat-conducting groove is between 9.5mm and 10.5mm, and preferably 10mm.

[0042] The arrangement of the heat-conducting grooves can greatly increase the contact area between the phase change material and the surface of the heat source, thereby improving the heat absorption rate and efficiency.

[0043] Further, the thickness of the first heat-conducting part 2 is between 2.9mm and 3.1mm, and preferably 3mm.

[0044] Selecting the optimal heat-conducting part thickness of 3mm can reduce thermal resistance and accelerate the heat transfer speed from the target component to the second chamber while ensuring sufficient heat conduction area and strength. The 3mm thick first heat-conducting part 2 provides sufficient structural strength, which can maintain the stability and reliability of the structure even under high heat flux and long-term operation conditions, preventing deformation or failure caused by thermal expansion or other stresses.

[0045] Further, each heat-conducting column 5 is welded between the bottom wall and the top wall of the first chamber, and the welding material is an alloy material.

[0046] Welding replaces traditional mechanical connections, eliminating air gaps or poor contact between them, significantly reducing the thermal resistance between the heat-conducting column 5 and the first chamber wall. This means that heat can be transferred from the phase-change working medium to the heat-conducting column 5 more quickly and directly, and then efficiently through the heat-conducting column 5 to the second chamber, accelerating the heat dissipation process.

[0047] Welding is a metallurgical bond that provides stronger structural stability and durability compared to other methods such as bolting or bonding. Under high heat load or long-term operating conditions, welded connections can maintain close contact between the heat-conducting column 5 and the first chamber wall, avoiding loosening or failure due to thermal expansion and contraction, ensuring the reliability of the system during long-term operation.

[0048] The selection of low-resistance, high-thermal-conductivity alloy welding materials ensures the rapid conduction of heat between the heat-conducting column 5 and the first chamber wall, unaffected by the thermal resistance of the material itself. The high thermal conductivity of the alloy material further accelerates the speed of heat flow, improving the thermal conduction efficiency of the entire heat dissipation assembly.

[0049] Further, the shell 1 includes a second heat-conducting portion 6, a plurality of connecting portions 7, and a cover portion 8, the plurality of connecting portions 7 are arranged around the outer edge of the second heat-conducting portion 6, and the cover portion 8 is arranged on the side of the plurality of connecting portions 7 away from the second heat-conducting portion 6, the second heat-conducting portion 6 is the bottom of the shell 1, the plurality of connecting portions 7 are respectively arranged around the outer edge of the second heat-conducting portion 6, and the cover portion 8 is arranged on the side of the plurality of connecting portions 7 away from the second heat-conducting portion 6, to jointly form the shell 1, wherein the first heat-conducting portion 2 is arranged in the shell 1, for dividing the shell 1 into relatively independent first and second chambers.

[0050] The second heat-conducting portion 6 directly contacts the phase-change material, and its design and material selection (such as high-thermal-conductivity copper or copper alloy) ensure efficient heat exchange between the phase-change material and the cooling system. Through the cooperation of the connecting portions 7 and the cover portion 8, the second heat-conducting portion 6 can quickly absorb and transfer heat through the connecting portions 7, improving the overall heat dissipation speed and efficiency.

[0051] The plurality of connecting portions 7 are arranged around the outer edge of the second heat-conducting portion 6, not only enhancing the structural stability of the entire heat dissipation shell 1, but also forming a sealed boundary of the second chamber together with the cover portion 8. This design ensures the safe circulation of the cooling liquid inside the cavity, prevents leakage, and maintains the mechanical strength and thermal performance of the cavity.

[0052] The second chamber surrounded by the cover portion 8 and the connecting portions 7 optimizes the flow path of the cooling liquid through the carefully designed liquid inlet 3 and liquid outlet 4, as well as the internal liquid distributor system. This not only ensures the uniform distribution of the cooling liquid inside the cavity, but also reduces flow resistance, improving cooling efficiency and system response speed.

[0053] Further, at least part of the plurality of heat-conducting columns 5 passes through the first heat-conducting part 2 and extends into the second cavity to transfer heat to the cooling liquid in the second cavity.

[0054] The arrangement of the heat-conducting columns 5 directly shortens the distance of heat transfer from the first heat-conducting part 2 to the cooling liquid, thereby accelerating the heat conduction process. This point-to-point heat flow mode can more quickly transfer heat to the cooling liquid than relying on large-area heat conduction or convection heat dissipation, thereby improving the heat dissipation speed of the system.

[0055] The heat-conducting columns 5 extend into the second cavity and directly contact the cooling liquid, increasing the heat exchange area and improving the heat exchange efficiency. The cooling liquid can flow closely around the heat-conducting columns 5, further improving the absorption speed of the cooling liquid to heat by increasing turbulence and reducing boundary layer thickness, thereby ensuring efficient heat dissipation of the system.

[0056] The layout design of the plurality of heat-conducting columns 5 can optimize the distribution of heat flow in the second cavity, ensuring that heat is evenly distributed throughout the liquid cooling system and avoiding local overheating or uneven cooling. This uniform heat flow distribution is conducive to improving the stability and efficiency of the entire cooling system. In the case of transient power overshoot, the heat-conducting columns 5 can quickly respond to high temperature signals and rapidly transfer heat to the cooling liquid, forming an effective heat buffer mechanism and avoiding rapid temperature rise of the heat source, thereby protecting the performance and safety of electronic devices.

[0057] Further, the heat dissipation assembly further comprises a heat-conducting component 9 arranged in each sub-cavity, the heat-conducting component 9 is provided with a plurality of accommodating holes, the plurality of accommodating holes are arranged in one-to-one correspondence with the plurality of heat-conducting columns 5, and at least part of the plurality of heat-conducting columns 5 extends into the second cavity from the accommodating holes corresponding thereto, wherein the connection mode between the accommodating holes and the heat-conducting columns 5 is welding.

[0058] Welding provides metallurgical bonding between the heat-conducting columns 5 and the accommodating holes, and the interface thermal resistance is greatly reduced compared with mechanical connection. This means that heat can be more directly and efficiently transferred from the heat-conducting columns to the heat-conducting component 9 and then to the cooling liquid, significantly improving heat conduction efficiency. The welding connection ensures firm fixation between the heat-conducting columns 5 and the accommodating holes, and even under high heat load, the stability and thermal stability of the structure can be maintained, avoiding loosening or vibration caused by thermal expansion or cooling liquid flow, thereby improving the overall reliability and life of the system.

[0059] The precise correspondence between the accommodating holes and the heat-conducting columns 5 optimizes the heat flow distribution of the cooling liquid in the second cavity, avoiding heat concentration in certain areas and ensuring that the cooling liquid uniformly carries away heat. This distribution optimization is conducive to improving cooling efficiency and prolonging the service life of electronic devices.

[0060] The welding connection not only enhances heat conduction but also accelerates the heat response speed. In the case of transient power overshoot, heat can be quickly transferred to the cooling liquid through the welding interface, forming an effective heat buffer to protect electronic components from overheating damage.

[0061] Further, the number of heat-conducting components 9 is multiple, and the multiple heat-conducting components 9 are stacked, with a heat dissipation gap between each adjacent two heat-conducting components 9 to accommodate the cooling liquid through the heat dissipation gap, and the heat-conducting components 9 are heat dissipation fins.

[0062] The stacked heat-conducting components 9 increase the surface area in contact with the cooling liquid, thereby significantly enhancing the heat exchange capacity. More contact area means that the cooling liquid can more fully absorb heat, improving the heat dissipation efficiency of the system. The presence of the heat dissipation gap provides a more complex flow path for the cooling liquid, through which the cooling liquid can flow between the various heat-conducting components 9, increasing the length of the heat dissipation path and thereby increasing the time for the cooling liquid to contact the thermal energy, improving the heat absorption rate.

[0063] The flow of cooling liquid in the heat dissipation gap helps to distribute heat evenly within the second chamber. Through the stacking of multiple heat-conducting components 9, it can be ensured that heat is uniformly absorbed and spread, avoiding local overheating and improving the uniformity and efficiency of heat dissipation of the entire system. Due to the increased contact area between the heat-conducting components 9 and the cooling liquid and the optimized flow path, the response speed of the system to transient thermal load is improved. When the power of the chip suddenly increases, the cooling liquid can absorb and carry away the excess heat more quickly, maintaining the temperature stability of the device under peak power consumption. The number of stacked heat-conducting components 9 can be flexibly adjusted according to different thermal management needs, and by changing the number of layers of heat-conducting components 9 and the size of the heat dissipation gap, the heat exchange capacity of the system can be adjusted to meet the heat dissipation needs under different working conditions.

[0064] Further, the heat dissipation assembly further comprises a partition component 10 arranged in the second chamber, and the partition component 10 is multiple to divide the second chamber into multiple sub-chambers through the partition component 10, wherein each sub-chamber is provided with an inlet sub-port 11 and an outlet sub-port 12, each inlet sub-port 11 is in communication with the inlet port 3, each outlet sub-port 12 is in communication with the outlet port 4, the heat-conducting components 9 are multiple groups, the multiple heat-conducting components 9 are one-to-one corresponding to the multiple sub-chambers, and each group of heat-conducting components 9 is arranged in the corresponding sub-chamber.

[0065] Each sub-chamber is provided with an independent liquid inlet sub-port 11 and a liquid outlet sub-port 12, which not only increases the contact area between the cooling liquid and the heat source, but also optimizes the flow path of the cooling liquid, reduces the flow resistance, and accelerates the circulation speed of the cooling liquid, thereby improving the cooling efficiency and response speed. By setting the heat-conducting components 9 in the sub-chambers, the heat can be effectively and evenly distributed, avoiding the concentration of thermal stress caused by local overheating, and protecting the operation stability and safety of the electronic equipment. At the same time, the uniform flow of the cooling liquid in each sub-chamber ensures the balance of overall heat dissipation.

[0066] The introduction of the partition component 10 provides additional structural support, enhancing the stability and durability of the entire second chamber. Especially when the device is subjected to external impact or vibration, the partition component 10 can reduce the shaking of the cooling liquid, protect the internal components from damage, and ensure the reliable operation of the system.

[0067] The number and layout of the sub-chambers can be customized according to the needs of specific applications, whether it is a high-density server, a high-performance GPU, or a data center. By adjusting the number and size of the sub-chambers, the heat dissipation performance can be optimized, enhancing the adaptability and flexibility of the heat dissipation assembly.

[0068] Further, the heat dissipation assembly further comprises a first communication component 13, which is arranged on the shell 1 and communicates with the plurality of liquid inlet sub-ports 11, and the liquid inlet port 3 is arranged on the first communication component 13; and / or, the heat dissipation assembly further comprises a second communication component 14, which is arranged on the shell 1 and communicates with the plurality of liquid outlet sub-ports 12, and the liquid outlet port 4 is arranged on the second communication component 14.

[0069] The first communication component 13 and the second communication component 14, as extensions of the liquid inlet port 3 and the liquid outlet port 4, can more accurately control the distribution and collection of the cooling liquid in each sub-chamber. They ensure that the cooling liquid can be evenly delivered to each sub-chamber, while also ensuring that the cooled liquid can smoothly flow out of the sub-chamber, avoiding local overcooling or overheating, and improving the thermal balance capability of the system.

[0070] The integrated design of the first communication component 13 and the second communication component 14 not only reduces the number of external pipelines, but also reduces the potential risk of leakage, improving the overall integration and space utilization of the system. This is particularly important for high-density, high-performance electronic equipment, helping to achieve miniaturization and high performance of the equipment.

[0071] Further, the thickness of each heat-conducting component 9 is between 0.2mm and 0.4mm, preferably 0.3mm.

[0072] The thickness of the heat-conducting component 9 directly affects its thermal resistance. By setting the thickness of the heat-conducting component 9 in the range of 0.2mm to 0.4mm, and preferably 0.3mm, the thermal resistance can be significantly reduced, and the conduction speed of heat from the heat source to the cooling liquid can be accelerated. Thin design improves heat conduction efficiency, helps to quickly respond to high-power load, reduces chip junction temperature, and improves device performance and stability.

[0073] Optimizing the thickness of the heat-conducting component 9 to 0.3mm can achieve a higher heat exchange surface area density in a limited space.

[0074] Further, the spacing between each heat-conducting component 9 is 1.5mm to 2.5mm, and preferably 2mm.

[0075] The preferred spacing of 2mm allows the cooling liquid to contact the heat-conducting component 9 more evenly during flow, avoiding local heat concentration, improving the overall heat exchange efficiency and uniformity of the system, and ensuring the temperature stability of the electronic device under high load operation.

[0076] Selecting 2mm as the spacing between the heat-conducting components 9 in the range of 1.5mm to 2.5mm can reduce fluid resistance while ensuring sufficient heat exchange area, optimizing the flow performance of the cooling liquid.

[0077] Further, each heat-conducting component 9 is provided with a lubricating layer.

[0078] The lubricating layer significantly reduces the friction coefficient between the surface of the heat-conducting component 9 and the cooling liquid, reducing the resistance of the cooling liquid flow and improving the fluid dynamics performance of the system. This means that the system can operate at lower pressure under the same cooling effect, thereby reducing the energy consumption of the cooling pump and improving the overall operating efficiency.

[0079] Further, the gap between each adjacent two heat-conducting columns 5 is between 14.5mm and 15.5mm, and preferably 15mm.

[0080] Selecting 15mm as the gap between the heat-conducting columns in the range of 14.5mm to 15.5mm can effectively reduce the resistance of the cooling liquid flow, promote natural convection and turbulent flow of the cooling liquid in the second chamber, thereby improving the heat exchange capacity of the cooling liquid and the heat-conducting columns 5, and reducing the energy consumption and operating cost of the system.

[0081] When the chip power consumption suddenly increases, the cooling liquid can quickly contact and cover all the heat-conducting columns 5, quickly absorb and transfer heat through its efficient heat conduction characteristics, effectively control the chip temperature, and protect the electronic device from overheating damage.

[0082] The material of each connecting part 7 is stainless steel.

[0083] The wall thickness of each of the connecting portions 7 is 1.4mm-1.6mm.

[0084] Stainless steel is known for its excellent mechanical strength and corrosion resistance. Selecting this material as the material of the connecting portion 7 can ensure the structural stability and durability of the connecting portion under high heat load and long-term operation conditions.

[0085] Setting the wall thickness to 1.4mm-1.6mm can ensure structural strength while avoiding excessive weight and material waste due to excessive wall thickness, achieving a balance between lightweight and mechanical strength.

[0086] In summary, the technical solution in this scheme uses docosane as the base phase change material, and incorporates one-thousandth by weight of nano-diamond powder with a particle size controlled at 5nm. This design significantly improves the thermal conductivity of the material, from the original 0.2 W / K to 0.8 W / K, enhancing the response speed of the phase change material to instantaneous high heat flow. Nano-diamond not only forms a three-dimensional heat conduction network, but also acts as a nucleating agent, avoiding phase separation and supercooling phenomena, ensuring the stability and efficiency of the phase change process, thereby quickly absorbing the heat generated on the chip surface due to power overshoot.

[0087] The second heat conduction portion 6 and the first heat conduction portion 2 are connected by an array of heat conduction columns 5, forming a 3D structure. The outer diameter of the heat conduction column 5 is 6.0mm, the wall thickness is 0.3mm, and the spacing is 15mm. The second heat conduction portion 6 and the first heat conduction portion 2 are connected using diffusion welding process, forming a stable heat conduction network. The second heat conduction portion 6 directly contacts the chip, with a surface flatness of nanometer level, ensuring close contact with the chip and efficient heat absorption. The first heat conduction portion 2 homogenizes the heat from the heat conduction column 5, while being connected to the second chamber, achieving rapid diffusion and dissipation of heat. This three-dimensional heat conduction path is particularly suitable for rapid elimination of local hot spots, improving the response speed to transient thermal shock.

[0088] By providing multiple liquid inlet ports 11 and multiple liquid outlet ports 12 on the shell 1, uniform distribution of the cooling liquid in the width direction of the first heat conduction portion 2 is achieved, thereby improving the heat dissipation efficiency and stability of temperature control.

[0089] Each connecting portion 7 is made of stainless steel with a wall thickness of 1.4mm-1.6mm. Stainless steel has good corrosion resistance and strength, and can maintain structural stability in high temperature environment, ensuring the long-term performance of the heat conduction column 5. The optimized wall thickness design ensures strength while reducing thermal resistance, accelerating heat transfer.

[0090] Example 2

[0091] The embodiment of the present application further provides an electronic device comprising the heat dissipation assembly.

[0092] The heat dissipation assembly and the electronic device provided by the present application are described above. The principles and implementation manners of the present application are described by using specific examples, and the above embodiment is only used to help understand the method and the core idea of the present application. It should be pointed out that, for those skilled in the art, without departing from the principles of the present application, some improvements and modifications can be made to the present application, and these improvements and modifications also fall within the protection scope of the claims of the present application.

[0093] It should be noted that the terms used herein are only intended to describe specific embodiments, and are not intended to limit the exemplary embodiments according to the present application. As used herein, the singular form is intended to include the plural form, unless the context clearly indicates otherwise, and it should be understood that, when the terms "comprise" and / or "include" are used in the specification, there is a feature, step, operation, device, component and / or combination thereof.

[0094] Unless specifically stated otherwise, the relative arrangement of components and steps, numerical expressions, and numerical values set forth in the various embodiments described herein are not meant to limit the scope of the present application. At the same time, it should be understood that, for the convenience of description, the sizes of the various parts shown in the drawings are not drawn in accordance with the actual proportional relationship. The technology, methods and devices known to those skilled in the art can not be discussed in detail, but under appropriate circumstances, the technology, methods and devices should be considered as part of the specification. In all examples shown and discussed herein, any specific value should be interpreted as merely exemplary, and not as a limitation. Therefore, other examples of exemplary embodiments can have different values. It should be noted that similar reference numerals and letters represent similar items in the following drawings, so once an item is defined in one drawing, it does not need to be further discussed in subsequent drawings.

[0095] In the description of the present application, it should be understood that the orientation words such as "front, rear, upper, lower, left, right", "horizontal, vertical, perpendicular, horizontal" and "top, bottom" and the like indicate the orientation or positional relationship shown in the drawings, and are only used for the convenience of describing the present application and simplifying the description, and in the absence of contrary statements, these orientation words do not indicate and imply that the indicated device or element must have a specific orientation or be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the scope of protection of the present application; the orientation words "inner, outer" refer to the inner and outer of the contour of each component itself.

[0096] For purposes of the description hereinafter, spatial relative terms, such as "above", "below", "upper", "lower", and the like, can be used to describe the relative position of one element or feature to another as illustrated in the figures. It will be understood that the spatial relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientations depicted in the figures. For example, if the device in the figures is turned over, elements described as "above" or "up" other elements or features would then be oriented "below" or "down" the other elements or features. Thus, the exemplary term "above" can encompass both an orientation of above and below. The device can be otherwise oriented (rotated 90 degrees or at other orientations) and the spatial relative descriptors used herein interpreted accordingly.

[0097] In addition, it should be noted that the use of "first", "second", and the like words of distinction do not connote any meaning of importance, but are used solely to differentiate one element from another, and are used in the context of this application without implying any specific order, or order of precedence. Accordingly, a first element that follows an operation can be performed before, after, or at the same time as a second element that precedes the operation.

[0098] The preferred embodiments of the present application have been described above with the purpose of enabling not only the best modes of practicing the application known to the inventors at this time, but also of enabling others skilled in the art to utilize the application in various embodiments and with various modifications as are suited to the particular use contemplated. Therefore, the above description is intended to be illustrative, but not restrictive, of the scope of the present application. All patents and patent applications mentioned herein are incorporated by reference in their entirety.

Claims

1. A heat dissipation component, characterized in that, include: The shell (1) has a receiving cavity; A first heat-conducting part (2) is disposed in the receiving cavity, and divides the receiving cavity into a relatively independent first chamber and a second chamber; Multiple heat-conducting columns (5) are at least partially disposed in the first chamber and connected to the inner wall of the first chamber, the first chamber being filled with a phase change working fluid; The heat dissipation assembly also includes a liquid inlet (3) and a liquid outlet (4) provided on the housing (1), and the liquid inlet (3) and the liquid outlet (4) are in communication with the second chamber.

2. The heat dissipation assembly according to claim 1, characterized in that, At least a portion of the plurality of heat-conducting columns (5) passes through the first heat-conducting part (2) and extends into the second chamber, which is used to contain coolant.

3. The heat dissipation assembly according to claim 2, characterized in that, The heat dissipation assembly also includes a heat-conducting component (9) disposed in the second chamber. The heat-conducting component (9) is provided with a plurality of receiving holes, and the plurality of receiving holes are provided in a one-to-one correspondence with the plurality of heat-conducting columns (5). At least a portion of the plurality of heat-conducting columns (5) extends into the second chamber from the receiving holes corresponding to them.

4. The heat dissipation assembly according to claim 3, characterized in that, The number of the heat-conducting components (9) is multiple, and the multiple heat-conducting components (9) are stacked. There is a heat dissipation gap between each two adjacent heat-conducting components (9) so as to accommodate the coolant through the heat dissipation gap.

5. The heat dissipation assembly according to claim 3, characterized in that, The heat dissipation assembly also includes a partition component (10) disposed in the second chamber. There are multiple partition components (10) to divide the second chamber into multiple sub-chambers. Each sub-chamber is provided with a liquid inlet (11) and a liquid outlet (12). Each liquid inlet (11) is connected to the liquid inlet (3), and each liquid outlet (12) is connected to the liquid outlet (4). There are multiple sets of heat-conducting components (9). Multiple heat-conducting components (9) are disposed one-to-one with multiple sub-chambers. Each set of heat-conducting components (9) is disposed in the sub-chamber corresponding to it.

6. The heat dissipation assembly according to claim 5, characterized in that, The heat dissipation assembly further includes a first connecting component (13), which is disposed on the housing (1) and communicates with the plurality of liquid inlet ports (11), and the liquid inlet port (3) is disposed on the first connecting component (13); and / or, the heat dissipation assembly further includes a second connecting component (14), which is disposed on the housing (1) and communicates with the plurality of liquid outlet ports (12), and the liquid outlet port (4) is disposed on the second connecting component (14).

7. The heat dissipation assembly according to claim 1, characterized in that, The housing (1) includes a second heat-conducting part (6), a plurality of connecting parts (7) and a cover part (8). The plurality of connecting parts (7) are arranged around the outer edge of the second heat-conducting part (6), and the cover part (8) is arranged on the side of the plurality of connecting parts (7) away from the second heat-conducting part (6).

8. The heat dissipation assembly according to claim 7, characterized in that, The second heat-conducting part (6) is provided with a plurality of heat-conducting grooves on the side away from the first chamber. The groove openings of the plurality of heat-conducting grooves are disposed away from the first chamber. The groove opening width of each heat-conducting groove is between 9.5mm and 10.5mm. And / or, the thickness of the first heat-conducting part (2) is between 2.9mm and 3.1mm. And / or, each heat-conducting column (5) is welded to the bottom wall and top wall of the first chamber.

9. The heat dissipation assembly according to claim 3, characterized in that, The thickness of each of the heat-conducting components (9) is between 0.2 mm and 0.4 mm; and / or, the spacing between each of the heat-conducting components (9) is between 1.5 mm and 2.5 mm; and / or, each of the heat-conducting components (9) is provided with a lubricating layer; and / or, the gap between each two adjacent heat-conducting pillars (5) is between 14.5 mm and 15.5 mm.

10. An electronic device, characterized in that, Includes the heat dissipation component as described in any one of claims 1 to 9.

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