IGBT module temperature stability test system

Abstract

The utility model discloses an IGBT module temperature stability test system, which comprises a carrier, a switch unit and a heating unit, the carrier comprises a carrier plate, a conductive assembly and a cover plate, the carrier plate is used for placing an IGBT module, the conductive assembly comprises a plurality of probes and a plurality of plug-ins, each probe is provided with an elastic structure, and the switch unit is arranged on the carrier plate. The plurality of probes are arranged on the side of the IGBT module, the plug-ins are connected with the probes in a one-to-one correspondence mode to form a plurality of conductive paths, and the cover plate is arranged on the IGBT module in a pressing mode. The beneficial effects of the IGBT module temperature stability test system are that the plug-ins are connected with the probes in a one-to-one correspondence manner to form a plurality of conductive paths, so that the problem that a tester needs to continuously disassemble and assemble wires during each test is solved, and the temperature stability of the IGBT module can be tested according to test requirements. The switch unit controls the corresponding conductive path to be in an on or off state, so that different measurements are realized, and different measurement requirements are met.

Description

TECHNICAL FIELD

[0001] The utility model relates to test equipment technical field especially relates to a kind of IGBT module temperature stability test system. BACKGROUND

[0002] IGBT is a kind of compound full-control voltage drive type power semiconductor device, with high input impedance, low on-voltage drop, switching speed fast etc., in rail transit, smart grid, aerospace, electric vehicle etc. It has wide application. The detection method of IGBT mainly includes static electrical characteristic test, dynamic electrical characteristic test and reliability test etc., since IGBT usually works at high frequency under high voltage, high temperature environment, its temperature stability test is crucial.

[0003] The existing IGBT module temperature stability test device (such as the semiconductor chip thrust test heating table disclosed in the application number 202222345772.1) is placed on the heating table when the IGBT module is tested for temperature stability, and then the IGBT module is fixed by the positioning mechanism, and the wires required for testing are fixed to the corresponding position of the IGBT module one by one by locking screws or welding method, the temperature of the heating table is adjusted, the electrical performance of the IGBT module under different temperature conditions is tested, to complete the test. Since IGBT modules are widely used in various fields, IGBT modules have various different packages, and when performing temperature stability test, each replacement of IGBT module needs to disconnect and connect the wires once, and different packaged IGBT modules also need to replace different wires according to the test requirements, and adjust the wiring position, and the wiring method of different packaged IGBT modules is different, which brings great inconvenience to the testers. UTILITY MODEL CONTENTS

[0004] The utility model aims at overcoming the above technical deficiencies, and proposes an IGBT module temperature stability test system, which solves the technical problems of replacing wires, adjusting wiring position and repeatedly disconnecting and connecting wires when testing different IGBT modules in the prior art.

[0005] To achieve the above technical purpose, the technical scheme of the utility model provides an IGBT module temperature stability test system, which comprises:

[0006] The utility model provides a carrier, it includes the carrier plate, the conductive component and the cover plate, the carrier plate is used to place IGBT module, the conductive component includes a plurality of probes and a plurality of inserts, each probe has elastic structure, and is evenly arranged in the side of IGBT module, each insert is connected with each probe one by one to form a plurality of conductive paths, the cover plate is pressed on IGBT module, and is detachably connected with the carrier plate, to fix IGBT module, when the cover plate is pressed on IGBT module, the cover plate extrudes each probe, so that each probe and each electrode of IGBT module one by one butt joint;

[0007] The switch unit is electrically connected with the test equipment and is used for controlling the on-off of each conductive path.

[0008] The heating unit is used for heating the IGBT module.

[0009] Further, the upper surface of the carrier plate has a loading area, and the IGBT module is placed in the loading area.

[0010] Further, one side of the cover plate is hingedly connected with the carrier plate via a pin shaft.

[0011] Further, the conductive component further includes a PCB board, the PCB board is arranged below the carrier plate and is detachably connected with the lower surface of the carrier plate, each probe is arranged above the PCB board, the lower end of each probe is fixedly connected with the PCB board, the upper end of each probe penetrates through the carrier plate and reaches above the carrier plate, each insert is arranged below the PCB board, and the upper end of each insert is fixedly connected with the PCB board.

[0012] Further, the carrier further includes a heating assembly connected with the cover plate and used for heating the IGBT module, and the heating unit is a heating table electrically connected with the heating assembly and used for controlling the temperature of the heating assembly.

[0013] Further, the heating assembly includes a heating plate and a first adapter, the heating plate is fixedly connected with the lower surface of the cover plate and is used for abutting against the IGBT module to heat the IGBT module, and the first adapter is arranged on one side wall of the cover plate and is electrically connected with the heating plate, and the first adapter is further electrically connected with an external socket on the heating table via a wire.

[0014] Further, the carrier further includes a positioning assembly arranged on the carrier plate and used for positioning the IGBT module so that each electrode of the IGBT module corresponds to each probe.

[0015] Further, the positioning assembly comprises a plurality of positioning pins, each of the positioning pins encloses the loading area, and the lower end of each of the positioning pins is fixedly connected with the carrier plate.

[0016] Further, the carrier further comprises a fastening assembly, one end of the fastening assembly is detachably fixedly connected with the cover plate, and the other end of the fastening assembly is detachably fixedly connected with the carrier plate.

[0017] Further, the switch unit comprises a box body, a circuit board, a plurality of female sockets, a relay and a second adapter, a plurality of insertion holes are formed in the upper surface of the box body, the arrangement structure of each of the insertion holes is the same as that of each of the plug-in units, the circuit board is arranged in the box body, each of the female sockets is arranged in the box body and fixedly connected with the circuit board, each of the female sockets is embedded in each of the insertion holes one by one, each of the female sockets is used for inserting the lower end of each of the plug-in units one by one, the relay is fixedly connected with the circuit board and used for controlling the on-off of each of the female sockets and the corresponding plug-in unit, and the second adapter is arranged on one side wall of the box body and electrically connected with the circuit board.

[0018] Compared with the prior art, the beneficial effects of the IGBT module temperature stability test system include: when in use, the IGBT module to be tested is placed on the carrier plate, the cover plate is pressed on the IGBT module to be tested, and the cover plate and the carrier plate are detachably fixedly connected, so that the IGBT module to be tested can be fixed. When the cover plate is pressed on the IGBT module to be tested, the cover plate will extrude each probe, so that each probe abuts against each electrode of the IGBT module to be tested one by one, so that each conductive path is in conduction with each electrode of the IGBT module to be tested one by one. Then, the heating unit is turned on, the IGBT module to be tested is heated by the heating unit, and according to the test requirement, the corresponding conductive path is controlled to be in conduction or open state by the switch unit, so that different measurements can be realized, and different measurement requirements can be met. The IGBT module temperature stability test system realizes one-to-one connection of each plug-in unit and each probe, forms a plurality of conductive paths, solves the problem that the tester needs to constantly disassemble and assemble the wires every time for testing, and can realize different measurements according to the test requirement by controlling the corresponding conductive path to be in conduction or open state by the switch unit, so that different measurement requirements can be met. BRIEF DESCRIPTION OF DRAWINGS

[0019] Figure 1 is a three-dimensional structure schematic diagram of the IGBT module temperature stability test system provided by the utility model;

[0020] Figure 2It is the utility model provides a kind of IGBT module temperature stability test system omit after stereoscopic structure schematic diagram of heating unit;

[0021] Figure 3 It is the utility model provides a kind of IGBT module temperature stability test system omit after stereoscopic structure schematic diagram of switch unit and heating unit;

[0022] Figure 4 It is the utility model provides the stereoscopic structure schematic diagram of carrier;

[0023] Figure 5 It is the utility model provides the stereoscopic structure schematic diagram of carrier in another view;

[0024] Figure 6 It is Figure 4 Enlarged view of A in it;

[0025] Figure 7 It is Figure 5 Enlarged view of B in it;

[0026] Figure 8 It is Figure 5 Enlarged view of C in it;

[0027] Figure 9 It is the utility model provides the stereoscopic structure schematic diagram of switch unit;

[0028] Figure 10 It is the utility model provides the stereoscopic structure schematic diagram of switch unit in another view;

[0029] Figure 11 It is Figure 10 Enlarged view of D in it;

[0030] Figure 12 It is Figure 10 Enlarged view of E in it;

[0031] Figure 13 It is the utility model provides the stereoscopic structure schematic diagram of heating unit;

[0032] Figure 14 It is the utility model provides the stereoscopic structure schematic diagram of heating unit in another view;

[0033] In the figure: 1-IGBT module, 100-carrier, 110-carrier plate, 111-loading area, 120-conductive assembly, 121-probe, 122-insert, 123-PCB board, 130-cover plate, 140-heating assembly, 141-heating plate, 142-first adapter, 150-positioning assembly, 151-positioning pin, 160-fastening assembly, 161-locking block, 162-locking pin, 200-switching unit, 210-box body, 211-jack, 220-second adapter, 300-heating unit, 310-heating table box, 320-heating table surface, 330-external socket, 340-power socket. DETAILED DESCRIPTION

[0034] In order to make the purpose, technical scheme and advantages of the utility model more clearly, the following will be further described in detail in combination with the drawings and examples. It should be understood that the specific examples described herein are only used to explain the utility model, and are not used to limit the utility model.

[0035] The utility model provides a kind of IGBT module temperature stability test system, its structure as shown in Figure 1 - Figure 5 Indicated, including carrier 100, switching unit 200 and heating unit 300, the carrier 100 includes carrier plate 110, conductive assembly 120 and cover plate 130, the carrier plate 110 is used to place IGBT module 1 on, the conductive assembly 120 includes multiple probes 121 and multiple inserts 122, each probe 121 has elastic structure, and is evenly arranged in the side of IGBT module 1, each insert 122 is connected with each probe 121 one-to-one, to form multiple conductive paths, the cover plate 130 is pressed on IGBT module 1, and is detachably fixedly connected with the carrier plate 110, to fix IGBT module 1, when the cover plate 130 is pressed on IGBT module 1, the cover plate 130 extrudes each probe 121, to make each probe 121 and each electrode of IGBT module 1 one-to-one abut; the switching unit 200 is electrically connected with test equipment, and is used to control the on-off of each conductive path;The heating unit 300 is used to heat IGBT module 1.

[0036] In use, the IGBT module 1 to be tested is placed on the carrier plate 110, and the cover plate 130 is pressed on the IGBT module 1 to be tested and detachably fixedly connected with the carrier plate 110, so that the IGBT module 1 to be tested can be fixed. Since the cover plate 130 will extrude each probe 121 when the cover plate 130 is pressed on the IGBT module 1 to be tested, each probe 121 will abut against each electrode of the IGBT module 1 to be tested one by one, so that each conductive path is in conduction with each electrode of the IGBT module 1 to be tested one by one. Then the heating unit 300 is turned on to heat the IGBT module 1 to be tested by the heating unit 300, and the corresponding conductive path is controlled to be in conduction or open state by the switch unit 200 according to the test requirement, so that different measurements can be realized to meet different measurement requirements. The IGBT module temperature stability test system forms a plurality of conductive paths through the one-to-one connection of each plug-in 122 and each probe 121, solves the problem that the tester needs to constantly disassemble and assemble the wires every time, and can control the corresponding conductive path to be in conduction or open state according to the test requirement by the switch unit 200, so that different measurements can be realized to meet different measurement requirements.

[0037] As a preferred embodiment, please refer to Figure 3 and Fig. 4, the upper surface of the carrier plate 110 has a loading area 111 for placing the IGBT module 1, and each probe 121 is arranged on the side of the loading area 111, so that each probe 121 can be arranged on the side of the IGBT module 1 to be tested, so that after the cover plate 130 is pressed on the IGBT module 1 to be tested, the cover plate 130 can extrude each probe 121 to bend inward to abut against each electrode of the IGBT module 1 to be tested one by one, solving the problem that the tester needs to constantly disassemble and assemble the wires every time.

[0038] As a preferred embodiment, please refer to Figure 3 and Fig. 4, one side of the cover plate 130 is hinged to the carrier plate 110 via a pin shaft, and the cover plate 130 can rotate around the pin shaft. After the IGBT module 1 to be tested is placed on the carrier plate 110, the cover plate 130 is closed downward until the cover plate 130 abuts against the IGBT module 1 to be tested. After the test is completed, the cover plate 130 is opened upward to replace the IGBT module 1 to be tested.

[0039] As a preferred embodiment, please refer to Figure 5The conductive assembly 120 further comprises a PCB board 123, which is arranged below the carrier plate 110 and detachably fixedly connected with the lower surface of the carrier plate 110, each probe 121 is arranged above the PCB board 123, the lower end of each probe 121 is fixedly connected with the PCB board 123, the upper end of each probe 121 penetrates through the carrier plate 110 and reaches above the carrier plate 110, each plug-in 122 is arranged below the PCB board 123, the upper end of each plug-in 122 is fixedly connected with the PCB board 123, each plug-in 122 and each probe 121 are connected one by one through internal wiring of the PCB board 123, thereby solving the problem that the tester needs to constantly disassemble and assemble the cable every time for testing.

[0040] As a preferred embodiment, refer to Figure 6 - Figure 8 A plurality of probes 121 form a matrix block, and a part of each plug-in 122 is a large banana plug, a plurality of large banana plugs form a matrix block, and the other part is a small banana plug, which is convenient for switching detection lines, the small banana plug is used for signal transmission, and the large banana plug is used for current transmission.

[0041] As a preferred embodiment, refer to Figure 6 The probe 121 is a spring structure, and after the cover plate 130 presses the IGBT module 1 to be tested, the spring inside the probe 121 is compressed, and the probe 121 is pressed against the electrode of the IGBT module 1 to be tested under the action of spring elastic force.

[0042] As a preferred embodiment, refer to Figure 3 The carrier 100 further comprises a heating assembly 140, which is connected with the cover plate 130 and used for heating the IGBT module 1, and the heating unit 300 is a heating table and is electrically connected with the heating assembly 140 and used for controlling the temperature of the heating assembly 140.

[0043] As a preferred embodiment, refer to Figure 13 and Figure 14The heating table includes a heating table box 310, a heating table surface 320, an external socket 330, and a power socket 340. The heating table box 310 is internally provided with a voltage conversion switching power supply, a temperature controller, a control module, and a communication module. The external socket 330 provides power output and temperature signal input for the heating assembly 140. The temperature of the heating assembly 140 is controlled by the temperature controller and the control module in the heating table box 310. When the temperature of the heating assembly 140 reaches the upper limit of the temperature control precision, the control module in the heating table box 310 disconnects the power output switch of the heating assembly 140. When the temperature of the heating assembly 140 decreases from the upper limit of the temperature control precision to the lower limit of the temperature control precision, the control module in the heating table box 310 connects the power output switch of the heating assembly 140 to control the temperature of the heating assembly 140. The heating table is a conventional heating device and is prior art, which will not be described in detail in this solution.

[0044] As a preferred embodiment, refer to Figure 4 and Figure 5 The heating assembly 140 includes a heating plate 141 and a first adapter 142. The heating plate 141 is fixedly connected to the lower surface of the cover plate 130 and is used to abut the IGBT module 1 to heat the IGBT module 1. The first adapter 142 is arranged on one side wall of the cover plate 130 and is electrically connected to the heating plate 141. The first adapter 142 is also electrically connected to the external socket 330 on the heating table via a wire, so that the temperature signal of the heating plate 141 can be transmitted to the heating table, and power can be taken from the heating table. The heating assembly 140 can be integrated into the carrier 100.

[0045] As a preferred embodiment, refer to Figure 3 and Figure 4 The carrier 100 further includes a positioning assembly 150 arranged on the carrier plate 110 to position the IGBT module 1 so that each electrode of the IGBT module 1 corresponds to each probe 121 one by one. After each probe 121 is pressed by the cover plate 130, each probe 121 can abut each electrode of the IGBT module 1 one by one, so that each conductive path is in conduction with each electrode of the IGBT module 1 one by one.

[0046] As a preferred embodiment, refer to Figure 3 and Figure 4The positioning assembly 150 comprises a plurality of positioning pins 151, each of which encloses the loading area 111, and the lower end of each of the positioning pins 151 is fixedly connected with the carrier plate 110, so that each electrode of the IGBT module 1 corresponds to each probe 121, and each probe 121 can abut against each electrode of the IGBT module 1 to be tested after being pressed by the cover plate 130.

[0047] As a preferred embodiment, refer to Figure 3 and Figure 4 The carrier 100 further comprises a fastening assembly 160, one end of the fastening assembly 160 is detachably fixedly connected with the cover plate 130, and the other end of the fastening assembly 160 is detachably fixedly connected with the carrier plate 110, so as to realize the detachable fixed connection between the cover plate 130 and the carrier plate 110.

[0048] As a preferred embodiment, refer to Figure 3 and Figure 4 The fastening assembly 160 comprises a locking block 161 and a locking pin 162, the cover plate 130 is provided with a first screw hole, the locking block 161 is fixedly connected with the carrier plate 110, the locking block 161 is provided with a second screw hole, the first screw hole corresponds to the second screw hole when the cover plate 130 is pressed on the IGBT module 1, the locking pin 162 passes through the first screw hole and is threadedly connected with the first screw hole, and the locking pin 162 is also used for being inserted into the second screw hole and being threadedly connected with the second screw hole, the first screw hole corresponds to the second screw hole when the cover plate 130 is pressed on the IGBT module 1, the locking pin 162 is downwardly moved and inserted into the second screw hole by being forwardly rotated, the detachable fixed connection between the cover plate 130 and the carrier plate 110 is realized, the locking pin 162 is upwardly moved and moved out of the second screw hole by being reversely rotated after the test is completed, and the cover plate 130 and the carrier plate 110 are separated.

[0049] As a preferred embodiment, refer to Figure 9 and Figure 10The switch unit 200 includes a box body 210, a circuit board, a plurality of female sockets, a relay and a second adapter 220. A plurality of insertion holes 211 are formed on the upper surface of the box body 210, and the arrangement structure of each insertion hole 211 is the same as that of each plug-in 122. The circuit board is arranged in the box body 210. Each female socket is arranged in the box body 210 and is fixedly connected with the circuit board. Each female socket is embedded in each insertion hole 211 one by one, and each female socket is used for inserting the lower end of each plug-in 122 one by one. The relay is fixedly connected with the circuit board and is used for controlling the on-off of each female socket and the corresponding plug-in 122. The second adapter 220 is arranged on one side wall of the box body 210 and is electrically connected with the circuit board. The second adapter 220 is also electrically connected with a test device through a wire. The lower end of each plug-in 122 is inserted into each female socket one by one, realizes conduction and fixation with the circuit board, the arrangement structure of each insertion hole 211 is the same as that of each plug-in 122, the rapid replacement of the carrier 100 can be realized, the switch software can control the on-off of each female socket and the corresponding plug-in 122 through the relay, different circuit conduction is realized, and different test devices are conducted on demand. The IGBT module temperature stability test system unifies the plug-in position of the carrier 100 and the switch unit 200. The carrier 100 and the switch unit 200 are rapidly replaced through elastic contact of the plug-in 122 and the female socket. One set of system can be compatible with different module tests. The IGBT module temperature stability test system can control the on-off of each female socket and the corresponding plug-in 122 through the relay, realize different circuit conduction, realize conduction with different test devices on demand, and be linked with other test devices. The automatic measurement can meet the requirements of different module tests. The special test software on the PC is opened. The test software selects the corresponding type of the current test module, sends instructions to each device and reads the related values, and automatically exports the test data after the test is completed.

[0050] As a preferred embodiment, refer to Figure 11 and Figure 12 In each female socket, part of them are large banana head female sockets, and the other part are small banana head female sockets, which facilitate switching detection lines.

[0051] As a preferred embodiment, different IGBT modules 1 can be customized with different carriers 100. The positions of the plug-ins 122 on all the carriers 100 are consistent, and the positions of the probes 121 can be directly replaced according to the positions of the IGBT modules 1 to be tested.

[0052] In order to better understand the utility model, the following will be combined Figure 1 The working principle of the technical scheme of the utility model is described in detail in the following figure:

[0053] In use, the IGBT module to be tested 1 is placed on the loading area 111 of the carrier plate 110, the cover plate 130 is covered downward until the cover plate 130 abuts against the IGBT module to be tested 1, the locking pin 162 is rotated forward, the locking pin 162 moves downward and is inserted into the second screw hole, realizing the detachable fixed connection of the cover plate 130 and the carrier plate 110, so that the IGBT module to be tested 1 can be fixed. Since the cover plate 130 is pressed on the IGBT module to be tested 1, the cover plate 130 will extrude each probe 121, the spring inside the probe 121 is compressed, and the probe 121 is pressed against the electrode of the IGBT module to be tested 1 under the action of the spring force, so that each probe 121 abuts against each electrode of the IGBT module to be tested 1 one by one, so that each conductive path is in conduction with each electrode of the IGBT module to be tested 1 one by one. The carrier plate 110 is placed on the box body 210 of the switch unit 200, so that each plug-in 122 can be inserted into the corresponding female seat from top to bottom until the lower surface of the carrier plate 110 is attached to the upper surface of the box body 210. At this time, each conductive path is in conduction with the corresponding female seat. The second adapter 220 is electrically connected with the test equipment through wires, and the first adapter 142 is electrically connected with the external socket 330 on the heating table through wires. The temperature of the heating plate 141 is controlled by the temperature controller and control module in the heating table box 310, the IGBT module to be tested 1 is heated by the heating plate 141, and according to the test requirement, the female seat and the plug-in 122 are in conduction or open state controlled by the relay in the switch unit 200, so that different measurements can be realized to meet different measurement requirements. Open the special test software on the PC, communicate with each device through the switch, and select the corresponding type of the current test module in the built-in different module test program of the test software. The test software sends instructions to each device and reads the related values. After the test is completed, the test data is automatically exported. The IGBT module temperature stability test system realizes one-to-one connection of each plug-in 122 and each probe 121 to form a plurality of conductive paths, solves the problem of constantly disassembling and assembling wires for testers each time, and can realize different measurements according to the test requirement by controlling the conductive path in conduction or open state through the relay in the switch unit 200, so as to meet different measurement requirements.

[0054] The IGBT module temperature stability test system has the following beneficial effects:

[0055] (1) The IGBT module temperature stability test system unifies the plug-in position of the carrier 100 and the switch unit 200, and the carrier 100 and the switch unit 200 are quickly replaced through the plug-in 122 and the female seat elastic contact, and one set of system can be compatible with different module tests.

[0056] (2) The IGBT module temperature stability test system, the switch software can control the on-off of each female seat and the corresponding plug-in 122 through the relay, realize different circuit conduction, thereby realizing on-demand conduction with different test equipment, and linkage with other test equipment, and can meet the requirements of automatic measurement of different module tests, the second adapter 220 of the switch unit 200 has a rich interface, and can connect multiple different test equipment as needed.

[0057] (3) The IGBT module temperature stability test system, each plug-in 122 and each probe 121 are connected one by one, forming a plurality of conductive paths, solving the problem that the tester needs to constantly disassemble and assemble the wire each time, and according to the test requirements, the corresponding conductive path is in the on or off state through the relay in the switch unit 200, thereby realizing different measurement and meeting different measurement requirements.

[0058] The specific implementation of the above-mentioned utility model does not constitute a limitation on the protection scope of the utility model. Any various other corresponding changes and modifications made according to the technical concept of the utility model should be included in the protection scope of the utility model claim.

Claims

1. An IGBT module temperature stability test system, characterized by, The utility model provides a carrier, which comprises a carrier plate, a conductive assembly and a cover plate, the carrier plate is used for placing an IGBT module, the conductive assembly comprises a plurality of probes and a plurality of inserts, each probe has a resilient structure and is arranged on the side of the IGBT module, each insert is connected with each probe one by one to form a plurality of conductive paths, the cover plate is arranged on the IGBT module and is detachably connected with the carrier plate to fix the IGBT module, when the cover plate is arranged on the IGBT module, the cover plate extrudes each probe to make each probe abut with each electrode of the IGBT module one by one. A switch unit is electrically connected with the test equipment and is used for controlling the on-off of each conductive path. A heating unit is used for heating the IGBT module. The upper surface of the carrier plate has a loading area, the loading area is used for placing the IGBT module, and each probe is arranged on the side of the loading area.

2. The IGBT module temperature stability test system of claim 1, wherein, One side of the cover plate is hinged to the carrier plate through a pin shaft.

3. The IGBT module temperature stability test system of claim 1, wherein, The conductive assembly further comprises a PCB, which is arranged below the carrier plate and is detachably connected with the lower surface of the carrier plate, each probe is arranged above the PCB, the lower end of each probe is fixedly connected with the PCB, the upper end of each probe penetrates through the carrier plate and reaches above the carrier plate, and each insert is arranged below the PCB, the upper end of each insert is fixedly connected with the PCB.

4. The IGBT module temperature stability test system of claim 1, wherein, The carrier further comprises a heating assembly connected with the cover plate for heating the IGBT module, and the heating unit is a heating table electrically connected with the heating assembly for controlling the temperature of the heating assembly.

5. The IGBT module temperature stability test system of claim 1, wherein, The heating assembly comprises a heating plate and a first adapter, the heating plate is fixedly connected with the lower surface of the cover plate and is used for abutting with the IGBT module to heat the IGBT module, the first adapter is arranged on one side wall of the cover plate and is electrically connected with the heating plate, and the first adapter is further electrically connected with an external socket on the heating table through a wire.

6. The IGBT module temperature stability test system of claim 5, wherein, The carrier further comprises a positioning assembly arranged on the carrier plate for positioning the IGBT module so that each electrode of the IGBT module corresponds to each probe.

7. The IGBT module temperature stability test system of claim 2, wherein, The positioning assembly comprises a plurality of positioning pins, each positioning pin encloses the loading area, and the lower end of each positioning pin is fixedly connected with the carrier plate.

8. The IGBT module temperature stability test system of claim 7, wherein, The carrier further comprises a fastening assembly, one end of the fastening assembly is detachably connected with the cover plate, and the other end of the fastening assembly is detachably connected with the carrier plate.

9. The IGBT module temperature stability test system of claim 1, wherein, ​ 10. The IGBT module temperature stability test system of claim 4, wherein, The switch unit comprises a box body, a circuit board, a plurality of female sockets, a relay and a second adapter, a plurality of insertion holes are formed on the upper surface of the box body, the arrangement structure of each insertion hole is the same as that of each plug-in, the circuit board is arranged in the box body, each female socket is arranged in the box body and fixedly connected with the circuit board, each female socket is embedded in each insertion hole one by one, each female socket is used for one-to-one insertion of the lower end of each plug-in, the relay is fixedly connected with the circuit board and used for controlling the on-off of each female socket and the corresponding plug-in, and the second adapter is arranged on one side wall of the box body and electrically connected with the circuit board, and the second adapter is also electrically connected with a test device through a wire.

Images