Wall-mounted host heat dissipation device

Abstract

The utility model belongs to the technical field of heat dissipation, and particularly relates to a wall-mounted host heat dissipation device, which comprises a case and an upper cover, the upper cover is fixed at the upper end of the case, mounting brackets are fixed at the lower ends of the left side and the right side of the case, mounting buckles are fixed at the front side of the case, heat dissipation fins are arranged at the upper side of the upper cover, and the mounting buckles are fixed at the lower ends of the mounting brackets. The computer case is ingenious and reasonable in structural design, the cooling fins are arranged at the upper end of the upper cover, the mounting support and the mounting buckles are arranged on the back face of the upper cover, the size and weight of the computer case can be kept while the cooling area is increased, no fan is arranged in the computer case, product power consumption is reduced, and heat generated by the computer case is dissipated into air through the flat radiator, the heat conduction block and the computer case; in other words, the purpose of equipment heat dissipation is achieved through the combination mode of increasing the heat dissipation area and reducing the product power consumption. And after the equipment is used for a long time, the heat dissipation effect can be influenced by dust accumulation, the cleaning procedure can be carried out only by disassembling the equipment, disassembly and assembly are convenient, and later maintenance and management are facilitated.

Description

Technical Field

[0001] This utility model relates to the field of heat dissipation technology, specifically a wall-mounted host computer heat dissipation device. Background Technology

[0002] Industry mainly refers to the industries and engineering of raw material collection and product processing and manufacturing. Industry is an important part of the secondary industry and is mainly divided into two categories: light industry and heavy industry. Industry is the only sector that produces modern means of labor, and it determines the speed, scale and level of national economic modernization. With the progress of science and technology and the increasing demand for industrial use, people are also seeking new development.

[0003] The development of the industrial sector is inseparable from the participation of industrial equipment. Since industrial equipment generally consumes a lot of power, operates for a long time, and has a high temperature, heat dissipation has always been a problem in the application of industrial equipment, especially for rugged and portable equipment. It is required not only to achieve heat dissipation effect, but also to have high requirements on the weight and volume of the heat sink. That is, it is generally necessary to achieve good heat dissipation effect without increasing the weight and volume of the equipment.

[0004] In addition, existing cooling fans are all located inside the casing. After the equipment has been used for a long time, the accumulation of dust will affect the heat dissipation effect. At this time, the entire casing needs to be disassembled to clean the fan, which is troublesome and not conducive to later maintenance and management.

[0005] Therefore, a wall-mounted host cooling device is proposed to solve the above-mentioned problems. Utility Model Content

[0006] The purpose of this invention is to provide a wall-mounted host computer cooling device to solve the problems mentioned in the background art.

[0007] To achieve the above objectives, this utility model provides the following technical solution: a wall-mounted host heat dissipation device, including a chassis and a top cover, the top cover being fixed to the upper end of the chassis, mounting brackets being fixed to the lower left and right sides of the chassis, mounting buckles being fixed to the front side of the chassis, and heat dissipation fins being provided on the upper side of the top cover;

[0008] A flat panel heat sink is fixed inside the chassis. A heat-conducting block is fixed on the upper side of the flat panel heat sink. A heat-conducting pad is fixed on the upper side of the heat-conducting block. The upper side of the heat-conducting pad contacts the lower side of the top cover. Thermally conductive silicone is fixed on the lower side of the flat panel heat sink.

[0009] Preferably, both mounting brackets have adjustable mounting holes on their side walls.

[0010] Preferably, the left and right sides of the heat dissipation fins are inclined.

[0011] Preferably, the heat-conducting block is fixedly connected to the flat plate heat sink by screws.

[0012] Preferably, the top cover is fixedly connected to the chassis by screws.

[0013] Compared with the prior art, the beneficial effects of this utility model are:

[0014] This application features a clever and rational structural design. The upper part of the cover is equipped with heat dissipation fins, and the back has mounting brackets and clips. This design increases the heat dissipation area while maintaining the device's size and weight. The device has no internal fan, reducing power consumption. Heat generated by the device is dissipated into the air through a flatbed heat sink, heat-conducting blocks, and the chassis. Thus, by combining increased heat dissipation area with reduced power consumption, the device achieves its heat dissipation goals. After prolonged use, dust accumulation may affect heat dissipation; however, cleaning can be easily performed by disassembling the device. This convenient disassembly and assembly facilitates future maintenance and management. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the structure of this utility model;

[0016] Figure 2 for Figure 1 A schematic diagram of the explosion structure.

[0017] In the diagram: 1. Chassis, 2. Top cover, 3. Mounting bracket, 4. Mounting clips, 5. Heatsink fins, 6. Flatbed heatsink, 7. Thermal pad, 8. Thermal pad, 9. Thermal silicone, 10. Adjustable mounting holes. Detailed Implementation

[0018] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0019] In the description of this utility model, it should be understood that the terms "upper", "lower", "front", "rear", "left", "right", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0020] Example:

[0021] Please see Figure 1-2 This utility model provides a technical solution:

[0022] A wall-mounted host cooling device includes a chassis 1 and a top cover 2. The top cover 2 is fixed to the upper part of the chassis 1. Mounting brackets 3 are fixed to the lower left and right sides of the chassis 1. Mounting clips 4 are fixed to the front of the chassis 1. Heat dissipation fins 5 are provided on the upper side of the top cover 2, which increases the heat dissipation area without increasing the size and weight. The mounting clips 4 and mounting brackets 3 enable the device to be installed in two ways. The mounting brackets 3 are located on the back of the device, which can expose the heat dissipation surface to the air, facilitating the overall heat dissipation of the machine.

[0023] Chassis 1 is a modular aluminum alloy shell with high overall structural strength and good heat dissipation.

[0024] A flat heat sink 6 is fixed inside the chassis 1. A heat-conducting block 7 is fixed on the upper side of the flat heat sink 6. A heat-conducting pad 8 is fixed on the upper side of the heat-conducting block 7. The upper side of the heat-conducting pad 8 contacts the lower side of the top cover 2. Thermal conductive silicone 9 is fixed on the lower side of the flat heat sink 6. The flat heat sink 6 contacts the internal electrical components through the thermal conductive silicone 9.

[0025] Both mounting brackets 3 have adjustable mounting holes 10 on their side walls, and the hole diameter is designed according to industry standards to facilitate on-site assembly. When the mounting brackets 3 are not needed, they can be removed, providing a high degree of flexibility.

[0026] The left and right sides of the heat dissipation fins 5 are slanted to increase safety and prevent the edges of the heat dissipation fins 5 from causing injury to the human body.

[0027] The heat-conducting block 7 is fixedly connected to the flat heat sink 6 by screws. The flat heat sink 6 can be customized with heat dissipation structure according to different heat dissipation devices, making it easy to be used with different heat dissipation motherboards. The heat-conducting block 7 is made of aluminum, which can reduce the overall weight of the equipment while enhancing thermal conductivity. The heat-conducting block 7 can be customized with different sizes according to the height of the equipment, so as to realize the promotion of solutions for different equipment.

[0028] The top cover 2 is fixedly connected to the chassis 1 by screws.

[0029] The foregoing has shown and described the basic principles, main features, and advantages of this utility model. It is obvious to those skilled in the art that this utility model is not limited to the details of the exemplary embodiments described above, and that it can be implemented in other specific forms without departing from the spirit or basic characteristics of this utility model. Therefore, the embodiments should be considered exemplary and non-limiting in all respects. The scope of this utility model is defined by the appended claims rather than the foregoing description. Therefore, it is intended that all variations falling within the meaning and scope of equivalents of the claims be included within this utility model, and no reference numerals in the claims should be considered as limiting the scope of the claims.

[0030] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A wall-mounted host computer cooling device, comprising a chassis (1) and a top cover (2), characterized in that, The top cover (2) is fixed to the upper end of the chassis (1). Mounting brackets (3) are fixed to the lower left and right sides of the chassis (1). Mounting buckles (4) are fixed to the front side of the chassis (1). Heat dissipation fins (5) are provided on the upper side of the top cover (2). A flat heat sink (6) is fixed inside the chassis (1). A heat-conducting block (7) is fixed on the upper side of the flat heat sink (6). A heat-conducting pad (8) is fixed on the upper side of the heat-conducting block (7). The upper side of the heat-conducting pad (8) contacts the lower side of the top cover (2). Thermally conductive silicone (9) is fixed on the lower side of the flat heat sink (6).

2. The wall-mounted main unit heat dissipation device according to claim 1, characterized in that: Both of the mounting brackets (3) have adjustable mounting holes (10) on their side walls.

3. The wall-mounted main unit heat dissipation device according to claim 1, characterized in that: The left and right sides of the heat dissipation fins (5) are inclined.

4. The wall-mounted main unit heat dissipation device according to claim 1, characterized in that: The heat-conducting block (7) is fixedly connected to the flat heat sink (6) by screws.

5. A wall-mounted main unit heat dissipation device according to claim 1, characterized in that: The top cover (2) is fixedly connected to the chassis (1) by screws.

Images