Heat dissipation module

Abstract

The utility model relates to a heat dissipation module which comprises a heat conduction plate, a cavity which is in negative pressure at normal temperature is arranged in the heat conduction plate, a liquid working medium is arranged in the cavity, a plurality of guide pipes are arranged on the edge of the heat conduction plate, one end of each guide pipe is communicated with the cavity, and the other end of each guide pipe is open. A telescopic pipe in sliding fit with the guide pipe is arranged in the guide pipe, the end, facing the cavity, of the telescopic pipe is open, and the other end of the telescopic pipe is sealed. When the electronic equipment does not run, the external air pressure is higher than the negative pressure of the cavity, so that the telescopic pipe is in a contraction state, the total length of the telescopic pipe and the guide pipe is small, and the whole heat dissipation module occupies a small space and is convenient to carry. When the electronic equipment runs, the temperature of the heat conducting plate is gradually increased, the liquid working medium in the cavity absorbs heat and is gasified, the pressure in the cavity is gradually increased, the telescopic pipe is pushed to move towards the outside of the guide pipe, the outer end of the telescopic pipe can move into external air, and rapid heat dissipation of the outer end of the telescopic pipe is promoted.

Description

TECHNICAL FIELD

[0001] The utility model belongs to the field of heat dissipation equipment, especially a heat dissipation module. BACKGROUND

[0002] The notebook and other electronic equipment generate heat when running, in order to avoid the temperature of each component being too high, usually need to configure the heat dissipation module. The conventional heat dissipation module is heat pipe or heat dissipation plate, adopts the material of high thermal conductivity, the heat generated by internal element is transmitted to the electronic equipment shell, then again cooperation fan or water cooling equipment promotes the shell heat dissipation. The existing heat dissipation module position is fixed, only can the heat inside the electronic equipment be transferred to the shell, if the edge of heat dissipation module projects the shell, can directly transfer the heat to the equipment outside, can improve the heat dissipation effect, but this structure will lead to the volume of heat dissipation module being large, the carrying of electronic equipment is inconvenient. UTILITY MODEL CONTENTS

[0003] The utility model solves the technical problem to provide a heat dissipation module, can improve the heat dissipation effect.

[0004] To solve the above problem, the utility model adopts the technical scheme that: heat dissipation module, including heat dissipation plate, the heat dissipation plate inside is provided with the cavity that is under normal temperature negative pressure, be provided with liquid state working medium in the cavity,

[0005] The edge of heat dissipation plate is provided with a plurality of guide pipes, one end of guide pipe is communicated with cavity, and the other end is open;

[0006] The guide pipe is provided with the telescopic pipe of sliding fit with guide pipe in, and the one end of telescopic pipe is open towards the cavity, and the other end is sealed.

[0007] Further, the inner wall of telescopic pipe is circular truncated cone, and the inner diameter of telescopic pipe gradually increases from the outer end to the inner end.

[0008] Further, the heat dissipation plate is copper plate, and the guide pipe and telescopic pipe are copper pipes.

[0009] Further, the outer wall of telescopic pipe is provided with the guide convex strip of axial extension, and the inner wall of guide pipe is provided with the guide groove of axial extension, the guide convex strip is located in guide groove and is slidably fitted with guide groove.

[0010] Further, the both ends of guide groove are provided with limit stopper.

[0011] Further, the liquid state working medium is water.

[0012] Further, the top wall and bottom wall of cavity are provided with capillary structure layer.

[0013] Further, the capillary structure layer of the cavity top wall is connected with the capillary structure layer of the cavity bottom wall through the capillary connecting column.

[0014] Further, the capillary structure layer is a sintered copper powder layer; and the capillary connecting column comprises a plurality of copper wires.

[0015] Further, the diameter of the copper wire is 0.03-0.05 mm.

[0016] The utility model discloses a heat dissipation module, which comprises a cavity, a heat conduction plate, a guide pipe, a telescopic pipe and a capillary structure layer.

[0017] When the electronic equipment is stopped, the gaseous working medium gradually cools and liquefies, and the air pressure in the cavity gradually decreases to negative pressure, thereby sucking the telescopic pipe into the guide pipe. BRIEF DESCRIPTION OF DRAWINGS

[0018] Figure 1 is the sectional view of the heat dissipation module of the utility model;

[0019] Figure 2 is the sectional view of A-A in the utility model; Figure 1

[0020] Figure 3 is the sectional view of B-B in the utility model; Figure 1

[0021] Figure 4 is the sectional view of C-C in the utility model; Figure 1

[0022] Figure 5 is the schematic diagram when the heat dissipation module works;

[0023] Fig. 1 is a heat conduction plate; 2 is a cavity; 3 is a guide pipe; 4 is a telescopic pipe; 5 is a capillary structure layer; 6 is a guide convex strip; 7 is a limiting stopper; 8 is a capillary connecting column. DETAILED DESCRIPTION

[0024] ​​​The present invention will be further described below with reference to the accompanying drawings and embodiments.

[0025] The heat dissipation module of this utility model, such as Figures 1 to 5 As shown, it includes a heat-conducting plate 1, and a cavity 2 that is under negative pressure at room temperature is provided inside the heat-conducting plate 1. A liquid working fluid is provided inside the cavity 2.

[0026] The heat-conducting plate 1 includes an upper side plate and a lower side plate, with an appropriate gap between them. The edges of the upper and lower side plates are connected by a connecting plate, forming a cavity 2. The heat-conducting plate 1 is made of a material with high thermal conductivity, and in contact with the heating elements of the electronic device, it can quickly absorb the heat generated by the heating elements. By evacuating the cavity 2 of the heat-conducting plate 1, a negative pressure is created inside the cavity 2. A liquid working fluid is then filled into the cavity 2. After absorbing heat, the liquid working fluid evaporates and vaporizes, absorbing heat and achieving a certain heat dissipation effect. At the same time, the vaporized working fluid can flow rapidly, realizing rapid heat transfer.

[0027] The shape of the heat-conducting plate 1 can be rectangular, circular, trapezoidal, or other regular or irregular shapes. It can be designed according to the shape of the heat-generating element of the electronic device, as long as it can effectively absorb the heat generated by the heat-generating element.

[0028] Multiple guide tubes 3 are provided on the edge of the heat-conducting plate 1. The guide tubes 3 are connected to the connecting plate of the heat-conducting plate 1. The guide tubes 3 are circular tubes made of a material with high thermal conductivity. One end of the guide tube 3 is connected to the cavity 2, and the other end is open. When the liquid working fluid in the cavity 2 vaporizes, the gaseous working fluid can enter the guide tube 3.

[0029] The guide tube 3 has a telescopic tube 4 that slides within it. The telescopic tube 4 is also made of a material with high thermal conductivity. One end of the telescopic tube 4 facing the cavity 2 is open, while the other end is sealed. The outer wall of the telescopic tube 4 is smooth, providing a good seal between it and the inner wall of the guide tube 3 to prevent leakage of the internal working fluid. The inner bore of the telescopic tube 4, the inner bore of the guide tube 3, and the cavity 2 are connected in sequence.

[0030] When the electronic device is not in operation, the heat-conducting plate 1 and its internal cavity 2 are at room temperature. The air pressure inside cavity 2 is lower than the external atmospheric pressure. Under the action of the air pressure difference, the telescopic tube 4 is in a contracted state, such as... Figure 1As shown, the total length of the telescopic tube 4 and the guide tube 3 is small, and the whole heat dissipation module occupies a small space, so as to facilitate carrying the electronic device. When the electronic device is running, the temperature of the heat conduction plate 1 gradually rises, the liquid working medium in the cavity 2 absorbs heat and vaporizes, part of the heat in the cavity 2 is transferred to the outer end of the telescopic tube 4 along with the gaseous working medium, and part of the heat is transferred to the outer end of the telescopic tube 4 through the guide tube 3 and the telescopic tube 4 itself. After the liquid working medium absorbs heat and vaporizes, the pressure in the cavity 2, the inner hole of the telescopic tube 4 and the inner hole of the guide tube 3 gradually rises, when the pressure in the cavity 2 is higher than the external air pressure, the gaseous working medium in the cavity 2 pushes the telescopic tube 4 to move towards the outside of the guide tube 3, the total length of the telescopic tube 4 and the guide tube 3 increases, at this time the outer end of the telescopic tube 4 can move outside the shell of the electronic device, such as Figure 5 As shown, the outer end of the telescopic tube 4 can be directly contacted with the external air, so as to facilitate the rapid heat dissipation of the outer end of the telescopic tube 4.

[0031] When the electronic device is stopped, the gaseous working medium gradually cools and liquefies, and the air pressure in the cavity 2 gradually decreases to negative pressure, so as to suck the telescopic tube 4 into the guide tube 3.

[0032] When the gaseous working medium reaches the outer end of the telescopic tube 4 and cools and liquefies, in order to promote the liquid working medium to flow back to the cavity 2 and realize the circulation of the working medium, the inner wall of the telescopic tube 4 is in the shape of a truncated cone, and the inner diameter of the telescopic tube 4 gradually increases from the outer end to the inner end, and the outer wall of the telescopic tube 4 is in the shape of a cylinder with a consistent diameter. When the telescopic tube 4 is horizontally arranged, the inner wall of the telescopic tube 4 has a certain slope, and the liquid working medium on the inner wall of the outer end of the telescopic tube 4 can slide down to the guide tube 3 under the action of gravity, and the end connected with the cavity 2 of the guide tube 3 can also be arranged in the shape of a truncated cone, so as to promote the liquid working medium in the guide tube 3 to flow into the cavity 2. In addition, the telescopic tube 4 and the guide tube 3 can be arranged as a whole in an inclined manner, so that the outer end of the telescopic tube 4 is higher than the end connected with the cavity 2 of the guide tube 3.

[0033] In the utility model, the heat conduction plate 1 is a copper plate, and the guide tube 3 and the telescopic tube 4 are copper pipes.

[0034] In order to improve the stability of the telescopic tube 4 during telescopic movement, the outer wall of the telescopic tube 4 is provided with an axially extending guide convex strip 6, the inner wall of the guide tube 3 is provided with an axially extending guide groove, and the guide convex strip 6 is located in the guide groove and is in sliding fit with the guide groove. The guide convex strip 6 can adopt various shapes such as rectangular blocks and trapezoidal blocks, and the shape of the guide groove is consistent with the shape of the guide convex strip 6. The guide convex strip 6 and the guide groove can play the roles of guiding and positioning, so as to prevent the telescopic tube 4 from rotating during telescopic movement.

[0035] In order to limit the axial position of the telescopic tube 4 and prevent the telescopic tube 4 from being separated from the guide tube 3, limit blocks 7 are arranged at the two ends of the guide groove. The guide groove can extend axially inward from the outer port of the guide tube 3, and the length of the guide groove is smaller than the length of the guide tube 3, that is, the guide groove does not penetrate through the guide tube 3. After the telescopic tube 4 is arranged in the guide tube 3, the limit blocks 7 are arranged in the guide groove at the outer end of the guide tube 3, and the limit blocks 7 can be welded in the guide groove.

[0036] The liquid working medium is determined according to the working temperature of the electronic device, and water is usually used.

[0037] The top wall and the bottom wall of the cavity 2 are provided with the capillary structure layer 5. The capillary structure layer 5 can absorb the liquid working medium and promote the liquid working medium to be uniformly distributed on the top wall and the bottom wall of the cavity 2. After being heated, the liquid working medium in the capillary structure layer 5 can be uniformly heated and evaporated, thereby improving the heat absorption efficiency.

[0038] Generally, the heat conduction plate 1 is usually arranged in contact with the heat generating element of the electronic device on one side, and the contact surface can be the upper side or the lower side. Assuming that the upper side of the heat conduction plate 1 is in contact with the heat generating element in a certain electronic device, the temperature of the heat generating element during operation will be first transmitted to the upper side, so that the temperature of the upper side is high, and the liquid working medium on the top wall of the cavity 2 will evaporate faster, and the liquid working medium on the bottom wall of the cavity 2 will evaporate relatively slowly. In order to promote the liquid working medium to flow to the capillary structure layer 5 on the top wall of the cavity 2, in the utility model, the capillary structure layer 5 on the top wall of the cavity 2 is connected with the capillary structure layer 5 on the bottom wall of the cavity 2 through the capillary connecting column 8. Under the action of the capillary connecting column 8, the capillary structure layer 5 on the top wall of the cavity 2 can be in communication with the capillary structure layer 5 on the bottom wall of the cavity 2, and the liquid working medium can be transferred from the bottom wall of the cavity 2 to the top wall of the cavity 2, so as to promote the liquid working medium to flow to the position with a faster evaporation speed, thereby fully utilizing the liquid working medium and improving the heat absorption effect.

[0039] In the utility model, the capillary structure layer 5 is a copper powder layer obtained by sintering; the capillary connecting column 8 comprises a plurality of copper wires, the plurality of copper wires are condensed together to form a column structure, and the diameter of the copper wire is 0.03mm-0.05mm.

[0040] The above only describes the preferred embodiments of the utility model and is not used to limit the utility model. For those skilled in the art, the utility model can have various changes and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the utility model shall be included in the protection scope of the utility model.

Claims

1. A heat dissipation module, comprising a heat-conducting plate (1) provided with a cavity (2) with negative pressure at normal temperature inside, and a liquid working medium in the cavity (2), characterized in that: a plurality of guide pipes (3) are arranged at the edge of the heat-conducting plate (1), one end of the guide pipe (3) communicates with the cavity (2), and the other end is open; a telescopic pipe (4) is arranged in the guide pipe (3) in sliding fit, one end of the telescopic pipe (4) is open towards the cavity (2), and the other end is sealed. The inner wall of the telescopic pipe (4) is in the shape of a circular truncated cone, and the inner diameter of the telescopic pipe (4) gradually increases from the outer end to the inner end.

2. The heat dissipating module of claim 1, wherein: The heat-conducting plate (1) is a copper plate, and the guide pipe (3) and the telescopic pipe (4) are copper pipes.

3. The heat dissipating module of claim 1, wherein: An axially extending guide ridge (6) is arranged on the outer wall of the telescopic pipe (4), and an axially extending guide groove is arranged on the inner wall of the guide pipe (3), the guide ridge (6) is located in the guide groove and is in sliding fit with the guide groove.

4. The heat dissipating module of claim 1, wherein: Limiting stoppers (7) are arranged at both ends of the guide groove.

5. The heat dissipating module of claim 4, wherein: The liquid working medium is water.

6. The heat dissipating module of claim 1, wherein: Capillary structure layers (5) are arranged on the top wall and the bottom wall of the cavity (2).

7. The heat dissipating module of claim 1, wherein: The capillary structure layer (5) on the top wall of the cavity (2) is connected with the capillary structure layer (5) on the bottom wall of the cavity (2) through a capillary connecting column (8).

8. The heat dissipating module of claim 7, wherein: The capillary structure layer (5) is a sintered copper powder layer, and the capillary connecting column (8) comprises a plurality of copper wires.

9. The heat dissipating module of claim 8, wherein: The diameter of the copper wire is 0.03mm-0.05mm.

10. The heat dissipating module of claim 9, wherein: ​

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