Mobile phone middle frame structure with heat conduction function
By introducing airflow channels and heat dissipation frame structures into the phone's mid-frame, the problem of poor heat dissipation in traditional mid-frames is solved, achieving faster heat dissipation and higher heat dissipation efficiency.
Patent Information
- Application Number
- CN202520404668.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-03-10
- Publication Date
- 2026-02-17
- Estimated Expiration
- 2035-03-10
AI Technical Summary
Traditional mobile phone frames have poor heat dissipation performance. The internal space for heat flow is small, making it difficult to dissipate heat effectively and quickly, resulting in low heat transfer efficiency.
Design a mobile phone mid-frame structure with airflow channels and heat dissipation frame. The airflow channels are connected to the heat dissipation holes to increase the internal airflow space. The heat dissipation frame transfers heat to the outside. The surface of the frame is coated with a metal-based pure copper coating to improve the heat absorption effect.
It improves the rate of heat dissipation and heat dissipation efficiency. By expanding the flow space through the guide channel and using the heat dissipation frame to quickly expel heat, it achieves a better heat dissipation effect.
Smart Images
Figure CN223928343U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of mobile phone mid-frame technology, specifically a mobile phone mid-frame structure with thermal conductivity. Background Technology
[0002] The mid-frame of a mobile phone is one of the most important components. The screen is installed at the front of the mid-frame, while electronic components such as the motherboard and the back cover are installed inside and at the rear of the mid-frame. The mid-frame is responsible for dissipating internal heat.
[0003] However, traditional mid-frames have poor heat dissipation. The heat generated by the motherboard processor has limited space to flow inside the phone, making it difficult to effectively dissipate the heat. Furthermore, the heat transfer efficiency is low, making it difficult to quickly transfer the internal heat away. Therefore, there is an urgent need for a mid-frame structure with thermal conductivity. Utility Model Content
[0004] In view of the shortcomings of the prior art, this utility model provides a mobile phone mid-frame structure with thermal conductivity, which solves the problems mentioned in the background art.
[0005] To achieve the above objectives, this utility model provides the following technical solution: a mobile phone frame structure with thermal conductivity, comprising a frame body, side frames on both sides of the frame body, a heat dissipation frame fixed between the frame body and the side frames, the outer end of the heat dissipation frame protruding and the inner end also protruding, a heat dissipation hole at the lower end of the frame body, and a flow guide groove inside the frame body, the flow guide groove communicating with the heat dissipation hole.
[0006] Furthermore, heat dissipation arc plates are fixedly connected to the four corners of the outer side of the frame, and the heat dissipation arc plates are matched with the outer edge of the heat dissipation frame.
[0007] Furthermore, the number of the flow guide grooves is set to be multiple, and the vertical spacing is set to be equal. A connecting groove is opened between the multiple flow guide grooves, and the connecting groove is set through the heat dissipation frame.
[0008] Furthermore, the connecting slot and the heat dissipation hole are matched and connected accordingly.
[0009] Furthermore, the surface of the heat dissipation frame located inside the frame is coated with a metal-based pure copper coating.
[0010] Furthermore, the thickness of the heat dissipation frame protruding from the frame is less than 1 mm, and all protruding edges are rounded.
[0011] Compared with the above background technology, the mobile phone mid-frame structure with thermal conductivity provided in this application includes a mobile phone mid-frame with very mature technology, and core components with flow channels and heat dissipation frames. Its principle relies on expanding the internal heat dissipation space through the flow channels, increasing the flow space, and then dissipating the hot air from the heat dissipation holes. Then, the internal heat is dissipated through the heat transfer of the heat dissipation frame, thereby achieving a better heat dissipation effect.
[0012] This invention provides a mobile phone mid-frame structure with thermal conductivity. Compared with the prior art, it has the following advantages:
[0013] This mobile phone frame structure features thermal conductivity. By incorporating airflow channels and a heat dissipation frame, it increases the airflow space inside the frame, thereby improving the speed of heat dissipation. Furthermore, the heat dissipation frame's protrusions both inside and out transfer internal heat to the outside, enhancing internal heat dissipation efficiency. Attached Figure Description
[0014] Figure 1 This is a schematic diagram of the overall structure of this utility model;
[0015] Figure 2 This is a schematic diagram of the unfolded frame and border of this utility model;
[0016] Figure 3 for Figure 1 Enlarged structural diagram at point A;
[0017] Figure 4 for Figure 2 Enlarged structural diagram at point B.
[0018] In the diagram: 1. Frame; 2. Heat dissipation frame; 3. Frame edge; 4. Heat dissipation holes; 5. Guide channel; 6. Connecting channel; 7. Heat dissipation arc plate. Detailed Implementation
[0019] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.
[0020] Please see Figures 1-4This utility model provides a technical solution: a heat-conducting mobile phone frame structure, including a frame 1, with side frames 3 on both sides of the frame 1, and a heat dissipation frame 2 fixed between the frame 1 and the side frames 3. The outer end of the heat dissipation frame 2 protrudes, and the inner end also protrudes. A heat dissipation hole 4 is opened at the lower end of the frame 1, and a guide groove 5 is opened inside the frame 1, which is connected to the heat dissipation hole 4. The frame 1 is the main supporting structure in the overall mobile phone and plays the most important role in heat dissipation. The side frames 3 are fixed on the front and rear sides of the frame 1, and the frame 1 and the side frames 3 are fixedly connected. There are various ways to fix them, which will not be described in detail here. When the guide groove 5 is opened inside the frame 1, the heat generated by the processor and other components during the operation of the mobile phone moves through the guide groove 5. The guide groove 5 changes the original movement space, providing a better and more stable movement space for the heat. The guide groove 5 is matched and connected to the heat dissipation hole 4, and the heat flows through the guide groove 5 to the heat dissipation hole 4 for discharge. This is conducive to the dissipation of internal heat and improves the overall heat dissipation effect.
[0021] like Figure 3 As shown, heat dissipation arc plates 7 are fixedly connected to the four corners of the outer side of the frame 1. The heat dissipation arc plates 7 are matched with the outer edge of the heat dissipation frame 2. The heat dissipation arc plates 7 and the heat dissipation frame 2 are integrally formed. This can increase the contact area with the outside through the heat dissipation arc plates 7, thereby achieving a better heat dissipation effect. Moreover, the heat dissipation arc plates 7 are located at the four corners of the frame 1, which can protect the four corners of the frame 1.
[0022] like Figure 4 As shown, there are multiple flow channels 5 with equal vertical spacing. A connecting channel 6 is provided between the multiple flow channels 5, and the connecting channel 6 passes through the heat dissipation frame 2. The multiple flow channels 5 can make the flow space inside the frame 1 and the side frame 3 larger. The connecting channel 6 is provided between the multiple flow channels 5, and the multiple flow channels 5 can be connected and converged at the heat dissipation hole 4 through the connecting channel 6, so as to quickly exhaust the internal hot air.
[0023] like Figure 4 As shown, the connecting groove 6 and the heat dissipation hole 4 are matched and connected, and the positions of the connecting groove 6 and the heat dissipation hole 4 are matched and connected. This can increase the flow space at the junction inside the heat dissipation hole 4, further improve the dissipation of heat, and achieve a better heat dissipation effect.
[0024] like Figure 4 As shown, the surface of the heat dissipation frame 2 located inside the frame 1 is coated with a metal-based pure copper coating. The surface of the heat dissipation frame 2 inside the frame 1 is coated with a metal-based pure copper coating through a spraying process, which further improves the heat absorption effect inside the heat dissipation frame 2. Through the heat transfer of the heat dissipation frame 2 itself, the heat is transferred to the outside of the frame 1, thereby achieving the effect of heat transfer.
[0025] likeFigure 3 As shown, the thickness of the heat dissipation frame 2 protruding from the frame 1 is less than 1 mm, and the protruding edges are all rounded. The thickness of the protruding part does not exceed 1 mm, so it does not affect the user's grip and can achieve the effect of dissipating heat. The rounded edges are designed to make the contact surface with the user's hand smoother.
Claims
1. A heat-conducting mobile phone frame structure, comprising a frame (1), wherein side borders (3) are provided on both sides of the frame (1), characterized in that, A heat dissipation frame (2) is fixed between the frame (1) and the side frame (3). The outer end of the heat dissipation frame (2) protrudes, and the inner end also protrudes. A heat dissipation hole (4) is opened at the lower end of the frame (1). A flow guide groove (5) is opened inside the frame (1). The flow guide groove (5) is connected to the heat dissipation hole (4).
2. The mobile phone frame structure with thermal conductivity according to claim 1, characterized in that, A heat dissipation arc plate (7) is fixedly connected to the four corners of the outer end of the frame (1), and the heat dissipation arc plate (7) is matched with the outer edge of the heat dissipation frame (2).
3. A mobile phone frame structure with thermal conductivity according to claim 2, characterized in that, The number of the flow guide grooves (5) is set to be multiple, and the vertical spacing is set to be equal. A connecting groove (6) is opened between the multiple flow guide grooves (5), and the connecting groove (6) is set through the heat dissipation frame (2).
4. A mobile phone frame structure with thermal conductivity according to claim 3, characterized in that, The connecting slot (6) is matched with the heat dissipation hole (4) and connected accordingly.
5. A mobile phone frame structure with thermal conductivity according to claim 2, characterized in that, The surface of the heat dissipation frame (2) located inside the frame (1) is provided with a metal-based pure copper coating.
6. A mobile phone frame structure with thermal conductivity according to claim 2, characterized in that, The thickness of the heat dissipation frame (2) protruding from the frame (1) is less than 1 mm, and the protruding edges are all rounded.