Uniform heat dissipation TR module and TR module group

Abstract

The utility model discloses a TR module with uniform heat dissipation, and discloses a TR module group with the TR module with uniform heat dissipation, and the TR module with uniform heat dissipation comprises a heat dissipation substrate, a PCB and a heat dissipation pipe. Wherein the PCB is provided with a power amplifier, and the PCB is arranged on the heat dissipation substrate; the heat dissipation pipe is embedded in the heat dissipation substrate, one end of the heat dissipation pipe is close to the power amplifier, and the other end of the heat dissipation pipe is close to the edge of the heat dissipation substrate. According to the TR module, through the heat dissipation bottom plate structure with the embedded heat pipes and the reasonable arrangement mode of the heat pipes, heat dissipated by heat release components on the power amplifier and the PCB is rapidly and evenly distributed to the two sides of the heat dissipation base plate, and therefore the temperature distribution nonuniformity of the whole TR module is reduced to a large extent, local hot spots are eliminated, and uniform temperature distribution and heat dissipation uniformity are achieved.

Description

Technical Field

[0001] This utility model relates to the field of heat dissipation for radar products, and in particular to a TR module and TR module group with uniform heat dissipation. Background Technology

[0002] In existing large radar products, the TR module mostly uses an aluminum alloy base plate for heat dissipation. Due to the dispersed arrangement of high-power power amplifier tubes inside the TR module, this heat dissipation method faces two problems: one is the temperature difference between the multi-channel power amplifier tubes, and the other is the poor temperature uniformity of the entire PCB board. When the external heat dissipation conditions are asymmetrical, this temperature difference becomes more obvious. Utility Model Content

[0003] This invention aims to solve at least one of the technical problems existing in the prior art. To this end, this invention proposes a TR module with uniform heat dissipation, which can greatly reduce the uneven temperature distribution of the entire module through a heat dissipation base plate with embedded heat pipes and a reasonable arrangement of heat pipes.

[0004] This utility model also proposes a TR module group having the above-mentioned uniform heat dissipation TR module.

[0005] The uniform heat dissipation TR module according to a first aspect embodiment of the present invention includes:

[0006] Heat dissipation substrate;

[0007] A PCB board, wherein a power amplifier is provided on the PCB board, and the PCB board is disposed on the heat dissipation substrate;

[0008] A heat sink is embedded in the heat sink substrate, with one end of the heat sink close to the power amplifier and the other end close to the edge of the heat sink substrate.

[0009] According to some embodiments of the present invention, the heat dissipation pipe includes:

[0010] The first bent heat pipe has one end disposed near the side of the power amplifier and the other end disposed near the edge of the heat dissipation substrate.

[0011] The second bent heat pipe has one end disposed near the other side of the power amplifier and is staggered with one end of the first bent heat pipe, and the other end of the second bent heat pipe is disposed near the other edge of the heat dissipation substrate.

[0012] According to some embodiments of the present invention, the heat dissipation pipe further includes:

[0013] A plurality of direct heating pipes are arranged in parallel, with one end of each direct heating pipe disposed near one edge of the heat dissipation substrate and the other end of each direct heating pipe disposed near the other edge of the heat dissipation substrate.

[0014] According to some embodiments of the present invention, the bending radius of the bent heat pipe is greater than or equal to three times the diameter of the bent heat pipe.

[0015] According to some embodiments of this utility model, it also includes:

[0016] TR cover plate, which is adapted to the heat dissipation substrate and is used to cover the heat dissipation substrate, and the PCB board is located between the heat dissipation substrate and the TR cover plate.

[0017] According to some embodiments of this utility model, it also includes:

[0018] Two locking strips are provided, which are respectively fixed to the two sides of the TR cover plate on the side away from the PCB board.

[0019] A TR module assembly according to a second aspect embodiment of the present invention includes:

[0020] Several TR modules with uniform heat dissipation as described in any of the preceding embodiments;

[0021] A module mounting bracket, in which the TR module is disposed.

[0022] According to some embodiments of the present invention, the module mounting bracket is provided with a plurality of spaced baffles, and a groove is formed between two adjacent baffles. The number of grooves is equal to the number of TR modules, and each TR module is placed in a corresponding groove.

[0023] The uniform heat dissipation TR module according to the embodiments of the present invention has at least the following beneficial effects:

[0024] By embedding heat pipes in the heat dissipation substrate and using a reasonable heat pipe arrangement with one end close to the power amplifier and the other end close to the edge of the heat dissipation substrate, the ambient temperature of the power amplifiers in different channels can be made consistent, the temperature difference between different areas of the PCB board can be significantly reduced, and the heat dissipation can be made more uniform, thereby solving the problem of asymmetrical external heat dissipation conditions of the TR module.

[0025] Additional aspects and advantages of this invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0026] The above and / or additional aspects and advantages of this utility model will become apparent and readily understood from the description of the embodiments taken in conjunction with the following drawings, in which:

[0027] Figure 1 This is a schematic diagram of the assembled TR module with uniform heat dissipation according to an embodiment of the present invention.

[0028] Figure 2 for Figure 1 An exploded view of the structure of a TR module with uniform heat dissipation is shown.

[0029] Figure 3 for Figure 1 An exploded view of the TR module with uniform heat dissipation from another perspective;

[0030] Figure 4 This is a schematic diagram of the assembled TR module assembly according to an embodiment of the present invention;

[0031] Figure 5 for Figure 4 The top view of the assembled TR module group is shown.

[0032] Heat dissipation substrate 100, PCB board 200, power amplifier 210, heat pipe 300, first bent heat pipe 311, second bent heat pipe 312, straight heat pipe 320, TR cover plate 400, locking strip 500, TR module 600, module mounting bracket 700, baffle 710, groove 720. Detailed Implementation

[0033] The embodiments of this utility model are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this utility model, and should not be construed as limiting this utility model.

[0034] In the description of this utility model, it should be understood that the directional descriptions, such as up, down, front, back, left, right, etc., indicate the directional or positional relationship based on the directional or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0035] In the description of this utility model, "several" means one or more, "multiple" means two or more, "greater than," "less than," and "exceeding" are understood to exclude the stated number, while "above," "below," and "within" are understood to include the stated number. If "first" or "second" is used in the description, it is only for the purpose of distinguishing technical features and should not be construed as indicating or implying relative importance, or implicitly indicating the number of indicated technical features, or implicitly indicating the order of the indicated technical features.

[0036] In the description of this utility model, unless otherwise explicitly defined, terms such as "setting," "installation," and "connection" should be interpreted broadly, and those skilled in the art can reasonably determine the specific meaning of the above terms in this utility model in conjunction with the specific content of the technical solution.

[0037] The following is in conjunction with the appendix Figure 1-5 This document describes in detail the uniform heat dissipation TR module and TR module group of the present invention.

[0038] On the one hand, refer to Figure 1 , Figure 2 and Figure 3 This utility model proposes a TR module with uniform heat dissipation, comprising:

[0039] Heat sink 100;

[0040] PCB board 200, power amplifier 210 is provided on PCB board 200, and PCB board 200 is provided on heat dissipation substrate 100;

[0041] Heat pipe 300 is embedded in heat dissipation substrate 100. One end of heat pipe 300 is close to power amplifier 210, and the other end of heat pipe 300 is close to the edge of heat dissipation substrate 100.

[0042] Specifically, in this embodiment, the heat dissipation substrate 100 adopts a rectangular heat dissipation material with embedded heat dissipation pipes 300, such as copper, aluminum silicon carbide and aluminum, so as to ensure that the heat dissipation substrate has good thermal conductivity. Preferably, aluminum alloy is used as the material of the heat dissipation substrate 100 to reduce costs.The heat dissipation substrate 100 is the same size and shape as the PCB board 200. One side of the heat dissipation substrate 100 is completely attached to the side of the PCB board without protruding components, i.e., the front side of the PCB board 200. A heat dissipation pipe 300 is embedded on the other side of the heat dissipation substrate 100 or inside the substrate. The heat dissipation pipe 300 is a hollow tube made of a high thermal conductivity material such as copper or aluminum. The heat dissipation pipe 300 can form a cooling channel by incorporating a small fan inside or connecting to an external vent. The PCB board 200 and the heat dissipation substrate 300 can be fixed together using conventional connection methods such as screws and studs. The components on the PCB board 200 include two or more power amplifiers. The power amplifier 210 consists of two or more power amplifiers located at the same height on the PCB board 200 and symmetrically arranged. Each power amplifier 210 is attached to the heat sink substrate 100 and is at least close to one end of one of the heat sink pipes 300 within the heat sink substrate 100. The other end of the heat sink pipe 300 is near the edge of the heat sink substrate 100, such as the first bent heat sink pipe 311 and the second bent heat sink pipe 312. This allows the heat sink pipe 300 to provide airflow cooling for the power amplifiers 210, and to circulate the large amount of heat dissipated by the power amplifiers 210 during operation to the edge of the heat sink substrate 100 via the airflow of the heat sink pipe 300. This ensures that during radar operation, the power amplifier... The heat generated by the power amplifier 210 can be quickly absorbed by the heat dissipation pipe 300 embedded in the heat dissipation substrate 100, and then transferred to both sides of the heat dissipation substrate 100. This heat transfer is achieved for the power amplifier 210, which generates a large amount of heat, thus making the heat dissipation of the power amplifier 210 of the TR module more uniform. This ensures that the temperature of two or more power amplifiers 210 is basically the same, even if the heat dissipation environment on both sides of the heat dissipation substrate 100 is significantly different. For example, due to the limitations of the radar structure, the external heat sinks on both sides of the heat dissipation substrate 100 may be different in size, power, or airflow. This results in a significant temperature uniformity effect among the two or more power amplifiers 210, and the heat from all the power amplifiers 210 is quickly and evenly distributed to the heat dissipation substrate. The two sides of the base plate 100 can effectively eliminate hot spots near the power amplifier 210 on the PCB board 200 during radar operation, avoiding safety accidents. In addition, for other heat-generating components on the PCB board 200, they are all close to at least one heat pipe 300 in the heat dissipation substrate 100. All heat pipes 300 have at least one end close to the edge of the heat dissipation substrate 100, thereby dissipating the heat of all heat-generating components on the PCB board 200 through the efficient airflow of the heat pipes 300 and quickly transferring it to the edge of the heat dissipation substrate 100, achieving uniform heat dissipation, effectively eliminating all hot spots on the PCB board 200 during radar operation, meeting the temperature uniformity design requirements under multiple operating conditions, and avoiding safety accidents.

[0043] Reference Figure 2Furthermore, in some embodiments of this utility model, the heat dissipation pipe includes:

[0044] The first bent heat pipe 311 has one end disposed near the side of the power amplifier 210 and the other end disposed near the edge of the heat dissipation substrate 100.

[0045] The second bent heat pipe 312 has one end located near the other side of the power amplifier 210 and is staggered with one end of the first bent heat pipe 311. The other end of the second bent heat pipe 312 is located near the other edge of the heat dissipation substrate 100.

[0046] Specifically, in this embodiment, the first bent heat pipe 311 and the second bent heat pipe 312 are identical in size and shape, both adopting a combination of right-angled sides and rounded corners, with rounded corners connecting the two right-angled sides. This ensures smooth airflow for the first bent heat pipe 311 and the second bent heat pipe 312. Specifically, the bending radius of the rounded corners of both bent heat pipes is greater than or equal to three times their own diameter, ensuring smooth internal airflow and preventing airflow blockage due to excessively small bending radii, which could lead to poor heat dissipation of the first bent heat pipe 311 and the second bent heat pipe 312. (Refer to...) Figure 2 The first bent heat pipe 311 and the second bent heat pipe 312 are both embedded in the front surface of the heat dissipation base plate 100. In some other embodiments, the first bent heat pipe 311 and the second bent heat pipe 312 can also be completely embedded in the plate body of the heat dissipation base plate 100. The first bent heat pipe 311 and the second bent heat pipe 312 can form a cooling channel by setting a small fan inside or connecting with an external air vent. The upper right-angle side of the first bent heat pipe 311 is parallel and close to the upper side of the power amplifier 210, the lower right-angle side of the first bent heat pipe 311 is parallel and close to the left edge of the heat dissipation base plate 100, the upper right-angle side of the second bent heat pipe 312 is parallel and close to the lower side of the power amplifier 210, and the lower right-angle side of the second bent heat pipe 312 is parallel and close to the right edge of the heat dissipation base plate 100. The upper right-angle sides of the first bent heat pipe 311 and the second bent heat pipe 312 are arranged in parallel and staggered manner.

[0047] Reference Figure 2 Furthermore, in some embodiments of this utility model, the heat dissipation pipe further includes:

[0048] Several direct heat pipes 320 are arranged in parallel. One end of all direct heat pipes 320 is located close to one edge of the heat dissipation substrate 100, and the other end of all direct heat pipes 320 is located close to the other edge of the heat dissipation substrate 100.

[0049] Specifically, in this embodiment, the number of direct heating pipes 320 is three or more, and the specific number is set according to the area of ​​the PCB board 200 and the arrangement of the heat-generating components on the PCB board 200. (Refer to...) Figure 2 In this embodiment, three direct heat pipes 320 are provided, arranged horizontally in parallel and at equal intervals. The left end of all direct heat pipes 320 is close to the left edge of the heat dissipation base plate 100, and the right end of all direct heat pipes 320 is close to the right edge of the heat dissipation base plate 100. The direct heat pipes 320 and the bent heat pipes are not connected. The position of the direct heat pipes 320 should be as close as possible to the heat-generating elements on the PCB board 200. The direct heat pipes 320 are embedded in the front surface of the heat dissipation base plate 100. In other embodiments, the direct heat pipes 320 can also be completely embedded in the body of the heat dissipation base plate 100. The direct heat pipes 320 can form a cooling channel by setting a small fan inside or connecting with an external air vent, so as to quickly transfer the heat dissipated by the heat-generating elements on the PCB board 200 to the edge of the heat dissipation base plate 100 during radar operation, thereby achieving uniform heat dissipation, effectively eliminating all hot spots on the PCB board 200 during radar operation, meeting the temperature uniformity design requirements under multiple working conditions, and avoiding safety accidents.

[0050] Reference Figure 2 Furthermore, in some embodiments of this utility model, the bending radius of the bent heat pipe is greater than or equal to three times the diameter of the bent heat pipe. Specifically, in this embodiment, the first bent heat pipe 311 and the second bent heat pipe 312 are exactly the same in size and shape, both adopting a shape combining right angles and rounded corners, and the two right angles are connected by rounded corners, thereby ensuring smooth heat dissipation channels for the first bent heat pipe 311 and the second bent heat pipe 312. The bending radius of the rounded corners of both bent heat pipes is greater than or equal to three times their own diameter, thereby ensuring smooth airflow channels inside the bent heat pipes structurally, avoiding airflow blockage due to excessively small bending radii, which would result in poor heat dissipation performance of the first bent heat pipe 311 and the second bent heat pipe 312.

[0051] Reference Figure 1 and Figure 2 Furthermore, in some embodiments of this utility model, it also includes:

[0052] The TR cover plate 400 is adapted to the heat dissipation substrate 100 and is used to cover the heat dissipation substrate 100. The PCB board 200 is located between the heat dissipation substrate 100 and the TR cover plate 400. Specifically, in this embodiment, the size and shape of the TR cover plate 400 are the same as or adapted to the heat dissipation substrate 100, and it can be fixed to the heat dissipation substrate 100 by common detachable fixing methods such as magnetic strips or riveting. The front side of the TR cover plate 400 is provided with a concave surface, so as to reserve space for the power amplifier 210 and other components on the PCB board 200 during assembly and prevent the components from being squeezed by the TR cover plate 400.

[0053] Reference Figure 1 , Figure 2 and Figure 3 Furthermore, in some embodiments of this utility model, it also includes:

[0054] There are two locking bars 500, which are fixed to the two sides of the TR cover plate 400 on the side away from the PCB board 200.

[0055] Specifically, in this embodiment, referring to Figure 3 Both locking strips 500 are fixed to the rear of the TR cover plate 400. The two locking strips 500 are identical in size and shape, both being rectangular strips, and are fixed to the left and right sides of the rear of the TR cover plate 400 respectively. The locking strips 500 are used to fix the entire TR module 600 to a preset location using locking techniques commonly used in the art, such as referring to... Figure 4 and Figure 5 The locking strip 500 and the module mounting bracket 700 work together to fix the TR module 600 onto the module mounting bracket 700.

[0056] On the other hand, refer to Figure 4 and Figure 5 This utility model also proposes a TR module group, comprising:

[0057] Several TR modules 600 with uniform heat dissipation as described above;

[0058] The module mounting bracket 700 houses the TR module 600.

[0059] Specifically, in this embodiment, the module mounting bracket 700 adopts a shell-shaped cube or cuboid structure with only a right side, left side, and rear side, and is made of thermally conductive materials such as copper or aluminum. The TR module 600 is fixed in the cavity formed by the three sides of the module mounting bracket 700 by locking strips 500. The size of the module mounting bracket 700 is adapted to the size and number of TR modules 600. The module mounting bracket 700 can accommodate three or more TR modules 600, for example, referring to... Figure 4 Four TR modules 600 are fixed side-by-side, parallel, and at equal intervals within the cavity formed by the three sides of the module mounting bracket 700. This method of centrally and equally spaced TR modules ensures adequate heat dissipation spacing for the TR modules 600 while saving space.

[0060] Reference Figure 4 and Figure 5 Furthermore, in some embodiments of this utility model, the module mounting bracket 700 is provided with a plurality of spaced baffles 710, and a groove 720 is formed between two adjacent baffles 710. The number of grooves 720 is equal to the number of TR modules 600, and each TR module 600 is placed in a corresponding groove 720.

[0061] Specifically, in this embodiment, the locking strip 500 disposed on the TR module 600 is adapted to the baffle 710. The baffle 710 is disposed parallel and equidistantly on the inner walls of the left and right sides of the module mounting bracket 700, and perpendicular to the bottom surface of the module mounting bracket 700. The positions of the baffles 710 disposed on the inner walls of the left and right sides of the module mounting bracket 700 are opposite. The baffle 710 is essentially a protrusion extending inward from the inner walls of the left and right sides of the module mounting bracket 700, and therefore its material is the same as the overall material of the module mounting bracket 700. For example, refer to Figure 5 The module mounting bracket 700 has eight baffles 710 on its left and right inner walls, forming four grooves 720 for placing four TR modules 600. The locking strips 500 on the TR modules 600 abut against the corresponding baffles 710, thus fixing the TR modules 600 to the module mounting bracket 700 and preventing them from moving back and forth. This also facilitates contact with external heat dissipation devices. Furthermore, since all TR modules 600 quickly and evenly distribute the heat from their internal PCB boards 200 to the left and right sides of the heat dissipation substrate 100 during radar operation, the left and right sides of the module mounting bracket 700 bear relatively large amounts of heat. Heat dissipation of the TR modules 600 can be achieved by further installing heat dissipation devices on the outside of the left and right sides of the module mounting bracket 700.

[0062] The embodiments of the present invention have been described in detail above with reference to the accompanying drawings. However, the present invention is not limited to the above embodiments. Within the scope of knowledge possessed by those skilled in the art, various changes can be made without departing from the spirit of the present invention.

Claims

1. A TR module with uniform heat dissipation, characterized in that, include: Heat dissipation substrate; A PCB board, wherein a power amplifier is provided on the PCB board, and the PCB board is disposed on the heat dissipation substrate; A heat sink is embedded in the heat sink substrate, with one end of the heat sink close to the power amplifier and the other end close to the edge of the heat sink substrate. The heat pipe includes: The first bent heat pipe has one end disposed near the side of the power amplifier and the other end disposed near the edge of the heat dissipation substrate. The second bent heat pipe has one end disposed near the other side of the power amplifier and is staggered with one end of the first bent heat pipe, and the other end of the second bent heat pipe is disposed near the other edge of the heat dissipation substrate. A plurality of direct heating pipes are arranged in parallel, with one end of each direct heating pipe being located close to one edge of the heat dissipation substrate and the other end of each direct heating pipe being located close to the other edge of the heat dissipation substrate. A small fan is installed inside the heat dissipation pipe; The bending radius of the bent heat pipe is greater than or equal to three times the diameter of the bent heat pipe.

2. The TR module with uniform heat dissipation according to claim 1, characterized in that, Also includes: TR cover plate, which is adapted to the heat dissipation substrate and is used to cover the heat dissipation substrate, and the PCB board is located between the heat dissipation substrate and the TR cover plate.

3. The TR module with uniform heat dissipation according to claim 2, characterized in that, Also includes: Two locking strips are provided, which are respectively fixed to the two sides of the TR cover plate on the side away from the PCB board.

4. A TR module group, characterized in that, include: Several TR modules with uniform heat dissipation as described in any one of claims 1-3; A module mounting bracket, in which the TR module is disposed.

5. The TR module group according to claim 4, characterized in that, The module mounting bracket is provided with multiple spaced baffles, and grooves are formed between two adjacent baffles. The number of grooves is equal to the number of TR modules, and each TR module is placed in its corresponding groove.

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