Dynamic low-oxygen structure and plasma cleaning machine with same
By using a dynamic low-oxygen structure and gas channel design, the problems of large equipment size and high gas consumption of plasma cleaners have been solved, realizing automated production in a low-oxygen environment, reducing costs and improving production efficiency.
Patent Information
- Application Number
- CN202423112035.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-17
- Publication Date
- 2026-02-17
- Estimated Expiration
- 2034-12-17
AI Technical Summary
Existing plasma cleaning equipment is large in size, consumes a lot of protective gas, has high production costs, is difficult to control the oxygen content in the chamber, cannot achieve automated production, cannot be integrated with the production line, and has low production efficiency.
The system adopts a dynamic low-oxygen structure. A cleaning chamber is formed by setting a cleaning zone and a cover plate on the top of the heating table. Dynamic sealing is achieved by using a cleaning module to drive the steel belt. Protective gas is filled into the cleaning chamber through the first and second gas channels to reduce the oxygen content. Online unmanned automated production is achieved through a support module and an external robot.
It reduces the consumption of protective gas, lowers production costs, reduces equipment size, and enables automated production, improving production efficiency and enabling integration with production lines.
Smart Images
Figure CN223928765U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of semiconductor manufacturing technology, and in particular to a dynamic low-oxygen structure and a plasma cleaner having the same. Background Technology
[0002] Wafer fabrication is a crucial process in the semiconductor industry, and plasma cleaning is an integral part of this process. The main function of plasma cleaning is to remove contaminants and residues from the wafer surface, ensuring the quality and stability of the wafer fabrication process.
[0003] Plasma cleaning technology in low-oxygen environments provides cleaner and more stable processing conditions for semiconductor manufacturing, which can effectively improve product quality and manufacturing efficiency.
[0004] Current plasma cleaners are generally offline. Typically, pre-cleaned wafers are first placed into a hopper, then the hopper is placed into the plasma cleaning chamber, the chamber is sealed, protective gas is introduced, and then cleaning is performed. However, these plasma cleaners have the following problems: large equipment size, high protective gas consumption, high production cost, difficulty in controlling the oxygen content in the chamber, inability to achieve automatic loading and unloading, inability to be integrated with production lines, can only be used independently, require manual assistance, and have low production efficiency. Utility Model Content
[0005] To address the shortcomings of existing technologies, the purpose of this invention is to provide a dynamic low-oxygen structure and a plasma cleaner incorporating it, thereby solving the problems mentioned in the background section. To achieve the above objective, this invention adopts the following technical solution:
[0006] In the first aspect, this utility model discloses a dynamic low-oxygen structure, including: a cover plate, in which a cleaning channel is provided through the middle;
[0007] A cleaning module is disposed on the first side of the cover plate, and its working end is slidably connected to the cleaning channel.
[0008] A heating platform is disposed on the second side of the cover plate. A cleaning area is provided on the side of the heating platform near the cover plate. When the heating platform is close to the cover plate, the cleaning area and the second side of the cover plate form a cleaning chamber.
[0009] A steel strip is disposed on the cleaning module and located on the second side of the cover plate, for use in closing the cleaning channel around the cleaning module when the cleaning module moves;
[0010] The first gas passage is located on one side of the heating platform and communicates with the cleaning chamber.
[0011] Optionally, the heating platform is surrounded by a frame that is higher than the cleaning area, and the first gas channel is located on the frame on one side of the cleaning area.
[0012] Optionally, an exhaust channel is provided through the frame of the cleaning area on the side away from the first gas channel.
[0013] Optionally, it also includes a support module, which includes a Y-axis assembly and a Z-axis assembly, the Z-axis assembly being disposed at the working end of the Y-axis assembly, and the heating stage being disposed on the Z-axis assembly.
[0014] Optionally, the support module further includes multiple support rods, which are respectively disposed on the periphery of the Z-axis assembly, pass through the heating platform, and are slidably connected to the heating platform.
[0015] Optionally, a second gas channel is provided on the second side of the cover plate around the cleaning channel and corresponding to the steel strip.
[0016] Optionally, the cleaning module includes a Y-axis module and a cleaning head, wherein the cleaning head is disposed at the working end of the Y-axis module and is slidably connected to the cleaning channel.
[0017] Optionally, rollers are rotatably mounted on the cover plates at both ends of the cleaning channel, and the steel strip is tumbledly connected to the two rollers respectively, with its two ends connected to both sides of the cleaning head respectively.
[0018] Optionally, the support module further includes an X-axis component, and the Y-axis component is disposed at the working end of the X-axis component.
[0019] Secondly, this utility model discloses a plasma cleaner, which includes the aforementioned dynamic low-oxygen structure.
[0020] Compared to existing technologies, the advantages of this invention are as follows: By setting a cleaning zone at the top of the heating table, a cleaning chamber is formed between the cleaning zone and the cover plate. The cleaning module drives the steel belt to move, achieving dynamic sealing of the cleaning channel. Protective gas is filled into the cleaning chamber through the first and second gas channels, sealing the gap between the steel belt and the cover plate, reducing the oxygen content in the cleaning chamber, ensuring the wafer cleaning effect, and greatly reducing the consumption of protective gas, thus lowering production costs. The cross-shaped movement of the cleaning module and the heating table cleans the wafer, greatly reducing the size of the equipment. With the cooperation of the support module and the external robotic arm, online unmanned automated production is achieved. Attached Figure Description
[0021] Figure 1 This is a schematic diagram of the overall structure of the dynamic low-oxygen structure of this utility model.
[0022] Figure 2 This is a schematic diagram of the heating platform structure of this utility model;
[0023] Figure 3 This is a schematic diagram of the support module structure of this utility model;
[0024] Figure 4 This is a partial structural diagram of the support module and support rod of this utility model;
[0025] Figure 5 This is a cross-sectional structural diagram of the cover plate, steel strip, and second gas channel of this utility model;
[0026] Figure 6 This is a schematic diagram of the cleaning head structure of this utility model;
[0027] Figure 7 This is a schematic diagram of the steel strip structure of this utility model;
[0028] The attached diagram shows: 1. Cover plate; 2. Cleaning module; 3. Heating table; 4. Steel strip; 5. First gas channel; 6. Cleaning channel; 7. Inlet connector; 30. Wafer; 31. Cleaning area; 32. Frame; 8. Exhaust channel; 9. Wafer stage; 10. Support module; 11. Y-axis assembly; 12. Z-axis assembly; 13. Support rod; 14. Second gas channel; 15. Roller; 17. Inlet head; 18. Through hole; 21. Y-axis module; 22. Plasma; 22. Cleaning head; 15. Roller; 16. X-axis assembly. Detailed Implementation
[0029] To facilitate understanding of this utility model, the present application will be described in more detail below with reference to the accompanying drawings and specific embodiments; the drawings show preferred embodiments of the present application; however, the present application can be implemented in many different forms and is not limited to the embodiments described in this specification; rather, these embodiments are provided so that the disclosure of the present application will be more thorough and complete.
[0030] It should be noted that, unless otherwise explicitly specified and limited, the terms "set up," "install," "connect," and "link" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal connection of two components. For those skilled in the art, the specific meaning of the above terms in this application can be understood according to the specific circumstances. The terms "vertical," "horizontal," "left," "right," "front," "rear," and similar expressions used in this specification are for illustrative purposes only.
[0031] It should also be noted that the terms "first," "second," etc., in the specification, claims, and accompanying drawings of this application are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence; it should be understood that such data can be interchanged where appropriate so that the embodiments of this application described herein can be implemented in a sequence other than those illustrated or described herein.
[0032] Unless otherwise defined, all technical and scientific terms used in this specification have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used in this specification is for the purpose of describing particular embodiments only and is not intended to limit this application.
[0033] Firstly, this utility model discloses a dynamic hypoxia structure, such as... Figures 1-2 As shown, the system includes a cover plate 1, a cleaning module 2, a heating platform 3, a steel belt 4, and a first gas channel 5. The cover plate 1 is horizontally positioned, and a cleaning channel 6 is vertically opened through the middle of the cover plate 1. The cleaning module 2 is positioned above the cover plate 1, and its working end is horizontally slidably connected to the cleaning channel 6. The heating platform 3 is positioned below the cover plate 1, and a cleaning area 31 is provided on the top surface of the heating platform 3. When the heating platform 3 is close to the cover plate 1, the cleaning area 31 and the bottom surface of the cover plate 1 form a cleaning chamber. The steel belt 4 is positioned on the cleaning module 2 and located on the bottom surface of the cover plate 1, and is used to close the cleaning channel 6 around the cleaning module 2 when the cleaning module 2 moves. The first gas channel 5 is located on one side of the top surface of the heating platform 3 and communicates with the cleaning chamber.
[0034] When cleaning wafer 30, wafer 30 is located in cleaning area 31 of heating stage 3. Heating stage 3 moves upward, so that cleaning area 31 and bottom surface of cover plate 1 form cleaning chamber. Steel belt 4 and cleaning module 2 seal cleaning channel 6. Protective gas enters cleaning chamber through first gas channel 5 and exhausts oxygen in cleaning chamber. When cleaning module 2 moves horizontally, it drives steel belt 4 to move, keeping the volume of cleaning chamber stable and achieving stable oxygen concentration in cleaning chamber.
[0035] This dynamic low-oxygen structure creates a cleaning chamber between the cleaning zone and the cover plate by setting a cleaning zone on top of the heating platform. The cleaning module drives the steel belt to move, achieving dynamic sealing of the cleaning channel, which greatly reduces the size of the equipment. Protective gas is filled into the cleaning chamber through the first gas channel, which reduces the oxygen content in the cleaning chamber and greatly reduces the consumption of protective gas, thus reducing production costs.
[0036] In one embodiment, such as Figure 2As shown, a frame 32 is provided around the top surface of the heating platform 3. The frame 32 is higher than the cleaning area 31, so that a cleaning chamber is formed between the cleaning area 31 and the cover plate 1. The first gas channel 5 is provided on the frame 32 on one side of the cleaning area 31, so that the protective gas can enter at one end of the cleaning chamber, thereby promoting the discharge of oxygen in the cleaning chamber.
[0037] In one embodiment, the first gas channel 5 is configured as a groove, and a plurality of air inlet connectors 7 are provided on the bottom frame 32 of the first gas channel 5. The plurality of air inlet connectors 7 are respectively connected to the first gas channel 5, so as to facilitate the protective gas to enter the cleaning chamber quickly and fully from one end.
[0038] In one embodiment, such as Figure 2 As shown, an exhaust channel 8 is provided through the frame 32 on the side of the cleaning zone 31 away from the first gas channel 5. The exhaust channel 8 and the first gas channel 5 are arranged opposite to each other. When the protective gas enters from one end of the cleaning chamber, the oxygen is discharged from the exhaust channel 8, which can quickly reduce the oxygen content in the cleaning chamber.
[0039] In one embodiment, such as Figure 2 As shown, in order to accelerate the oxygen release speed, multiple exhaust channels 8 are provided and are arranged at intervals on the side frame 32 away from the first gas channel 5.
[0040] In one embodiment, such as Figure 2 As shown, a wafer stage 9 is provided in the middle of the cleaning area 31 for placing the wafer 30. The height of the wafer stage 9 is greater than the height of the cleaning area 31 and less than the height of the frame 32, which facilitates the placement of the wafer 30 and keeps the wafer 30 in the cleaning chamber.
[0041] In one embodiment, such as Figures 3-4 As shown, it also includes a support module 10, which includes a Y-axis assembly 11 and a Z-axis assembly 12. The Z-axis assembly 12 is disposed at the working end of the Y-axis assembly 11, and the heating stage 3 is disposed on the Z-axis assembly 12. The Y-axis assembly 11 is used to drive the Z-axis assembly 12 to move in the front-back direction, so as to facilitate the adjustment of the wafer 30 position in conjunction with the cleaning module 2. The Z-axis assembly 12 is used to drive the heating stage 3 to move in the vertical direction, so that the heating stage 3 moves closer to or away from the cover plate 1.
[0042] In one embodiment, the support module 10 further includes multiple support rods 13, which are respectively disposed on the periphery of the Z-axis assembly 12. The heating table is provided with multiple through holes 18, and the multiple support rods correspond one-to-one with the multiple through holes 18 and are slidably connected.
[0043] In this embodiment, there are three support rods. The support rod 3 is used to place the wafer 30 and connect to the external robot arm, so that the external robot arm can pick up and put down the wafer 30. The support rod 3 moves with the Y-axis assembly 11, but does not move with the Z-axis assembly 12. When placing the wafer 30, the Z-axis assembly 12 drives the heating stage 3 to descend. The external robot arm lifts the wafer 30 from the bottom and places the wafer 30 on multiple support rods 13. After the robot arm leaves, the Z-axis assembly 12 drives the heating stage 3 to rise, so that the wafer 30 falls on the wafer stage 9. After the heating stage 3 rises to the position, the distance between the bottom surface of the cover plate 1 and the frame 32 is controlled within 1 mm, thereby maintaining the volume of the cleaning chamber.
[0044] In one embodiment, such as Figure 5 , 7 As shown, the bottom surface of the cover plate 1 surrounds the cleaning channel 6 and is provided with a second gas channel 14 corresponding to the steel strip 4. The outlet of the second gas channel 14 is located in the gap between the steel strip 4 and the cover plate 1. After the cover plate 1 and the cleaning area 31 form a cleaning chamber, an air inlet 17 is provided above the cover plate. The air inlet 17 is connected to the second gas channel 14. The protective gas enters from the second gas channel 14. After encountering the steel strip 4, the protective gas flows into the cleaning chamber along the gap between the steel strip 4 and the cover plate 1, which helps to remove the oxygen inside the cleaning chamber. Another part is reflected after encountering the steel strip 4, preventing the external oxygen from flowing into the cleaning chamber from the gap between the steel strip 4 and the cover plate 1, thus maintaining the low oxygen environment of the cleaning chamber. After the protective gas is filled at the first gas channel 5 and the second gas channel 14, the oxygen concentration in the cleaning chamber can be stably maintained below 100ppm, reducing the amount of protective gas used and reducing the oxygen concentration in the cleaning area 31.
[0045] In one embodiment, such as Figure 1 , 6 As shown, the cleaning module 2 includes a Y-axis module 21 and a cleaning head 22. The cleaning head 22 is located at the working end of the Y-axis module 21 and is slidably connected to the cleaning channel 6.
[0046] During operation, the Y-axis module 21 drives the cleaning head 22 to move in the front-to-back direction. The width of the cleaning head 22 matches the width of the cleaning chamber to seal the cleaning chamber in the area of the cleaning head 22.
[0047] In one embodiment, such as Figure 7As shown, rollers 15 are rotatably mounted on the cover plates 1 at both ends of the cleaning channel 6. The steel belt 4 is rotatably connected to the two rollers 15 respectively, and its two ends are connected to the front and rear sides of the cleaning head 22 respectively. The two rollers 15 can keep a fixed distance between the top surface of the steel belt 4 and the cover plate 1. When the cleaning head 22 moves, it drives the steel belt 4 to rotate. The two work together to dynamically close the entire cleaning channel 6. In this embodiment, two tension rollers are also provided below the support module 10, so that the steel belt 4 passes around the two tension rollers and the support module 10 is located inside the surrounding steel belt 4. While maintaining the position of the upper section of the steel belt 4, interference between the lower section of the steel belt 4 and the support module 10 is also avoided.
[0048] In one embodiment, such as Figure 3 As shown, the support module 10 also includes an X-axis assembly 16, and the Y-axis assembly 11 is disposed at the working end of the X-axis assembly 16. The X-axis assembly 16 is used to drive the heating table 3 to move in the front-back direction, which crosses the movement direction of the cleaning module 2, reducing the size of the equipment. At the same time, it is convenient for an external robot arm to load materials from the front, realizing automatic loading and unloading. It is also convenient to integrate with the production line, improving production efficiency.
[0049] During cleaning, the plasma 221 emitted by the cleaning head 22 starts cleaning from the left side of the wafer 30. The X-axis assembly 16 drives the wafer 30 to move from front to back, so that the left third of the entire wafer 30 passes through the cleaning head 22. Then, the Y-axis module 21 drives the cleaning head 22 to move to the right a certain distance. After that, the X-axis assembly 16 drives the wafer 30 to move forward, so that the middle part of the entire wafer 30 passes through the cleaning head 22. At this time, two-thirds of the wafer 30 has been cleaned. Finally, the Y-axis module 21 drives the cleaning head 22 to move to the right a certain distance, and the X-axis assembly 16 drives the wafer 30 to move backward, completing the cleaning of the entire wafer 30.
[0050] In one embodiment, the length of the cover plate in the Y-axis direction is at least greater than the moving distance of the heating platform 3 in the Y-axis direction, and the length of the cover plate in the X-axis direction is at least twice the length of the heating platform 3 in the X-axis direction. Compared with the wafer 30 moving in the X-axis and Y-axis directions, the area of the cover plate 1 is reduced by 40% when the cleaning module 2 is fixed, which also reduces the size of the equipment.
[0051] Secondly, this utility model discloses a plasma cleaner, which includes the aforementioned dynamic low-oxygen structure.
[0052] It should be noted that the above-mentioned technical features can be combined with each other to form various embodiments not listed above, all of which are considered to be within the scope of this utility model specification; and, for those skilled in the art, improvements or modifications can be made based on the above description, and all such improvements and modifications should fall within the protection scope of the appended claims of this utility model.
Claims
1. A dynamic hypoxia structure, characterized in that, include: The cover plate has a cleaning channel running through its middle. A cleaning module is disposed on the first side of the cover plate, and its working end is slidably connected to the cleaning channel. A heating platform is disposed on the second side of the cover plate. A cleaning area is provided on the side of the heating platform near the cover plate. When the heating platform is close to the cover plate, the cleaning area and the second side of the cover plate form a cleaning chamber. A steel strip is disposed on the cleaning module and located on the second side of the cover plate, for use in closing the cleaning channel around the cleaning module when the cleaning module moves; The first gas passage is located on one side of the heating platform and communicates with the cleaning chamber.
2. The dynamic hypoxia structure according to claim 1, characterized in that, The heating platform is surrounded by a frame that is higher than the cleaning area, and the first gas channel is located on the frame on one side of the cleaning area.
3. The dynamic hypoxia structure according to claim 2, characterized in that, An exhaust channel is provided through the frame of the cleaning area on the side away from the first gas channel.
4. A dynamic hypoxia structure according to claim 1, characterized in that, It also includes a support module, which includes a Y-axis assembly and a Z-axis assembly. The Z-axis assembly is disposed at the working end of the Y-axis assembly, and the heating stage is disposed on the Z-axis assembly.
5. A dynamic hypoxia structure according to claim 4, characterized in that, The support module also includes multiple support rods, which are respectively disposed on the periphery of the Z-axis assembly, pass through the heating platform, and are slidably connected to the heating platform.
6. A dynamic hypoxia structure according to claim 1, characterized in that, The second side of the cover plate surrounds the cleaning channel and is provided with a second gas channel corresponding to the steel strip.
7. A dynamic hypoxic structure according to claim 1, characterized in that, The cleaning module includes a Y-axis module and a cleaning head. The cleaning head is disposed at the working end of the Y-axis module and is slidably connected to the cleaning channel.
8. A dynamic hypoxia structure according to claim 7, characterized in that, Rollers are rotatably mounted on the cover plates at both ends of the cleaning channel. The steel strip is tumbled to the two rollers and its two ends are connected to the two sides of the cleaning head.
9. A dynamic hypoxia structure according to claim 4, characterized in that, The support module also includes an X-axis component, and a Y-axis component is disposed at the working end of the X-axis component.
10. A plasma cleaner, characterized in that, The plasma cleaner described herein includes the dynamic low-oxygen structure as described in any one of claims 1-9.