Screening equipment for semiconductor material processing

Abstract

The utility model discloses screening equipment for semiconductor material processing, and relates to the field of semiconductor material screening, and the scheme is as follows: the screening equipment for semiconductor material processing comprises a rack which is obliquely arranged; the mounting plate is mounted on the rack; the connecting sleeve is mounted on the mounting plate; one end of the roller is rotationally mounted in the connecting sleeve; the screen drum is mounted in the roller; the multiple rolling assemblies are sequentially arranged in the extending direction of the rack, and each rolling assembly comprises two rolling pieces oppositely installed on the two sides of the roller; the rolling rings are mounted on the outer side wall of the roller; the driving gear is mounted on the outer side wall of the roller, and the driving gear is connected with a driving assembly; at least part of the feeding assembly extends into the screen drum; damage to semiconductor materials in the screening process can be reduced, and noise generated by the production environment can be reduced.

Description

TECHNICAL FIELD

[0001] The utility model relates to the field of semiconductor material screening, specifically relates to a kind of screening equipment for semiconductor material processing. BACKGROUND

[0002] Semiconductor materials have many important applications, including electronic devices, optoelectronic devices and solar cells, silicon is one of the most commonly used semiconductor materials, with good electrical properties and processability, and stable in high temperature environment, in the manufacturing process, semiconductor materials are often in powder form, screening can ensure uniform particle size, improve material performance;In thin film deposition process, screening can remove oversized particles to avoid film defects;Nanoscale semiconductor materials have strict requirements on particle size, screening helps to control size distribution;Screening is a key step in quality control, to ensure that materials meet specifications.

[0003] According to the authorized announcement number (CN104525475B) batch exposure of a kind of semiconductor grain chip's automatic screening device, including: motor, eccentric disc, motor mounting plate and spring;And motor is equipped with eccentric disc, motor fixing device is on motor mounting plate, the upper end of spring is abutted with motor mounting plate, and its lower end is abutted with the bottom plate of base;When driving motor, motor mounting plate is shaken and vibrated under the action of eccentric disc. The semiconductor chip to be screened is placed in each screening frame, and the motor mounting plate is vibrated under the action of eccentric disc, so as to achieve the purpose of screening semiconductor chip. The above-mentioned equipment when screening semiconductor chip, not only the collision of semiconductor chip and screening frame inner wall may cause particle breakage, but also the screening frame generates large noise when running, which causes disturbance to production environment. UTILITY MODEL CONTENT

[0004] The utility model aims at providing a kind of screening equipment for semiconductor material processing, it can be directed to the problem that semiconductor material screening process is easily damaged in prior art, and the noise of working environment is larger, proposes solution, it not only can reduce the damage received in semiconductor material screening process, but also can reduce the noise generated in production environment.

[0005] The utility model realizes by the following technical scheme:

[0006] A screening device for semiconductor material processing includes: a frame, the frame being arranged at an angle; a mounting plate, the mounting plate being mounted on the frame; a connecting sleeve, the connecting sleeve being mounted on the mounting plate; a drum, one end of the drum being rotatably mounted inside the connecting sleeve; a screen cylinder, the screen cylinder being mounted inside the drum; multiple rolling assemblies, the multiple rolling assemblies being arranged sequentially along the extension direction of the frame, each rolling assembly including two rolling elements mounted opposite to each other on both sides of the drum; multiple rolling rings, the multiple rolling rings corresponding one-to-one with the multiple rolling assemblies, the rolling rings being mounted on the outer wall of the drum; a drive gear, the drive gear being mounted on the outer wall of the drum, the drive gear being connected to a drive assembly; and a feeding assembly, the feeding assembly extending at least partially into the screen cylinder.

[0007] Furthermore, in this utility model, the above also includes: a screening shell, which is installed below the drum, a first feed inlet is provided at the top of the screening shell, a first collection groove is provided on the inner side wall of the screening shell, an airflow port is provided on the inner side wall of the screening shell, and a second collection groove is provided at the bottom of the screening shell; the first collection groove and the airflow port are arranged opposite to each other on both sides of the screening shell; an airflow nozzle is installed in the airflow port, and the airflow nozzle is connected to an air source.

[0008] Furthermore, in this utility model, the airflow port is a spherical cavity, a spherical component is placed inside the airflow port, the spherical component can rotate inside the airflow port, the airflow nozzle is installed inside the spherical component, and the output end of the airflow nozzle is located inside the screening housing.

[0009] Furthermore, in this utility model, the first feed inlet is tapered, with the inner diameter of the first feed inlet near the roller being R1 and the inner diameter of the first feed inlet away from the roller being R2, and R1 being greater than R2.

[0010] Furthermore, in this utility model, the aforementioned rolling element includes a mounting frame and a rolling wheel; the mounting frame is mounted on the machine frame; the rolling wheel is rotatably mounted on the mounting frame, and the rolling wheel and the rolling ring are in rotatable cooperation.

[0011] Furthermore, in this utility model, the above-mentioned feeding assembly includes a feeding pipe, feeding blades, a rotating shaft, and a drive motor; a second feeding port is provided on the feeding pipe, the feeding pipe passes through the mounting plate, and the feeding pipe extends at least partially into the screen cylinder; one side of the rotating shaft extends into the feeding pipe, the outer side wall of the rotating shaft is equipped with feeding blades along the extension direction, and the drive motor is installed on the side of the rotating shaft located outside the feeding pipe.

[0012] Compared with the prior art, this utility model has the following advantages and beneficial effects:

[0013] A screening device for semiconductor material processing involves the semiconductor material continuously tumbling within a screen cylinder during transport. Smaller semiconductor particles fall between the drum and the screen cylinder, while smaller particles are retained within the screen cylinder, thus completing the mechanical screening of the semiconductor material. The appropriate screen cylinder can be selected based on the properties of the semiconductor material, ensuring that the screen openings can separate particles of different sizes. The semiconductor material does not undergo centrifugal motion during screening, preventing collisions with the inner wall of the screening device and thus avoiding damage. Furthermore, the screening process does not require vibration from the screening device, resulting in minimal noise. Attached Figure Description

[0014] The accompanying drawings, which are included to provide a further understanding of the embodiments of the present invention and form part of this application, do not constitute a limitation thereof. In the drawings:

[0015] Figure 1 This is a schematic diagram of a screening device for semiconductor material processing.

[0016] Figure 2 This is a longitudinal sectional view of the roller;

[0017] Figure 3 This is a longitudinal sectional view of the screening shell;

[0018] Figure 4 for Figure 3 Enlarged view of point A in the middle.

[0019] The attached diagram shows the markings and corresponding component names:

[0020] 1-Frame, 2-Drum, 3-Rolling ring, 4-Drive gear, 5-Feeding assembly, 6-Rolling assembly, 7-Mounting frame, 8-Rolling wheel, 9-Screening shell, 10-Mounting plate, 11-Screen cylinder, 12-Feeding pipe, 13-Drive motor, 14-Second feed inlet, 15-Feeding blade, 16-Rotating shaft, 17-First collection trough, 18-Airflow port, 19-Spherical component, 20-Airflow nozzle, 21-Rotating component, 22-Second collection trough. Detailed Implementation

[0021] To make the objectives, technical solutions, and advantages of this utility model clearer, the present utility model will be further described in detail below with reference to the embodiments and accompanying drawings. The illustrative embodiments and descriptions of this utility model are only used to explain this utility model and are not intended to limit this utility model.

[0022] Example

[0023] Please refer to Figure 1 andFigure 2. In some embodiments of the present application, the rack 1 is fixedly installed on the base surface, the installation surface of the rack 1 is arranged obliquely, the height of one end of the rack 1 gradually decreases along the height of the other end of the rack 1, the two ends of the rack 1 form a clear height difference, the rack 1 is provided with a mounting plate 10 on one side, the mounting plate 10 is provided with a connecting sleeve for mounting the roller 2, one side of the roller 2 is mounted on the inner side of the connecting sleeve (the roller 2 and the connecting sleeve are coaxially arranged), and the roller 2 and the connecting sleeve are rotatably connected (which can be mounted by a bearing). A plurality of rolling assemblies 6 are sequentially mounted on one side of the rack 1, the plurality of rolling assemblies 6 are located on one side of the mounting plate 10, the plurality of rolling assemblies 6 are used for bearing the roller 2, a plurality of rolling rings 3 are mounted on the outer side wall of the roller 2 along the extension direction, the number of the plurality of rolling rings 3 is consistent with the number of the plurality of rolling assemblies 6, and the plurality of rolling rings 3 and the plurality of rolling assemblies 6 are one-to-one rolling matched, so that the roller 2 can roll axially above the rack 1. The outer side wall of the roller 2 is provided with a driving gear 4, the driving gear 4 is connected with an external driving source, the driving source can be composed of a motor and a gear, the output end of the motor is connected with the gear, the gear is engaged with the driving gear 4, the motor can drive the gear to rotate, the gear can drive the driving gear 4 to rotate, the driving gear 4 can drive the roller 2 to rotate, and the roller 2 is internally provided with a sieve cylinder 11. The roller 2 can drive the sieve cylinder 11 to rotate. The feeding assembly 5 and the roller 2 are located on both sides of the mounting plate 10, respectively, and the feeding end of the feeding assembly 5 extends into the sieve cylinder 11 through the mounting plate 10. Working principle: the screening of semiconductor materials refers to the process of classifying semiconductor materials according to particle size, shape or other characteristics. This process is very important in semiconductor manufacturing, because the uniformity and purity of the material will directly affect the performance of the final product. The staff controls the rotation of the roller 2 through the external driving source, the roller 2 drives the sieve cylinder 11 to rotate, the semiconductor materials are conveyed into the sieve cylinder 11 through the feeding assembly 5, the inclined sieve cylinder 11 can convey the semiconductor materials during rotation, and the semiconductor materials can be conveyed from one end of the sieve cylinder 11 close to the feeding assembly 5 to the other end of the sieve cylinder 11 away from the feeding assembly 5. The semiconductor materials are continuously turned over in the sieve cylinder 11 during the conveying process, the semiconductor materials with smaller volume fall between the roller 2 and the sieve cylinder 11, and the semiconductor materials with smaller volume are intercepted in the sieve cylinder 11, thereby completing the mechanical screening of the semiconductor materials. The corresponding sieve cylinder 11 can be selected according to the properties of the semiconductor materials to ensure that the sieve holes of the sieve cylinder 11 can screen out semiconductor materials with different volumes. Finally, all the semiconductor materials screened out are conveyed to the end of the roller 2 away from the mounting plate 10, a discharge port can be formed at the end of the roller 2 and the sieve cylinder 11 away from the mounting plate 10, and the screened semiconductor materials can be taken out.In this application, the semiconductor material does not undergo centrifugal motion during the screening process, and the semiconductor material will not collide with the inner wall of the screening device, thus preventing damage to the semiconductor material; moreover, the semiconductor material does not require the screening device to vibrate during the screening process, thus avoiding significant noise.

[0024] Please refer to Figure 1 and Figure 2 For example, the rolling assembly 6 includes two opposing rolling elements, located on opposite sides of the drum 2. Each rolling element consists of a mounting frame 7 and rolling wheels 8. The mounting frame 7 has a U-shaped mounting groove, into which the rolling wheels 8 are mounted. A rolling ring 3 is mounted on the outer wall of the drum 2, falling between the two rolling wheels 8. The rolling ring 3 can roll between the two rolling wheels 8, thus enabling the rolling screening operation.

[0025] Please refer to Figure 1 and Figure 2 For example, the feeding assembly 5 includes a feeding pipe 12, feeding blades 15, a rotating shaft 16, and a drive motor 13. The top end of the feeding pipe 12 has a second feeding port 14. The feeding pipe 12 extends through the mounting plate 10 into the screen cylinder 11. The rotating shaft 16 is installed inside the feeding pipe 12. The rotating shaft 16 is equipped with feeding blades 15 (the feeding blades 15 are spiral-shaped) along the extension direction. The output end of the drive motor 13 is connected to the rotating shaft 16. The drive motor 13 can drive the rotating shaft 16 to rotate. The rotating shaft 16 can drive the feeding blades 15 to rotate. The feeding blades 15 can transport semiconductor material from the second feeding port 14 into the screen cylinder 11.

[0026] Please refer to Figure 3 and Figure 4In some embodiments of this application, semiconductor materials require multi-stage screening during the screening process, which can improve screening efficiency, accuracy, and applicability, while meeting the needs of different application scenarios. Multi-stage screening can more accurately classify materials according to particle size, avoiding errors that may occur in a single screening process. Mechanical screening can screen larger semiconductor materials, while airflow screening can screen finer semiconductor materials. A connecting port is provided at the end of the roller 2 away from the mounting plate 10. After smaller semiconductor materials in the screen cylinder 11 fall into the roller 2, the roller 2 transports the smaller semiconductor materials to the connecting port. The smaller semiconductor materials can fall from the connecting port into the screening housing 9. The smaller semiconductor materials fall into the screening housing 9 from the first feed port. When the semiconductor materials fall into the airflow port 18, the airflow nozzle 20 installed in the airflow port 18 injects high-speed airflow into the semiconductor. The high-speed airflow carries the semiconductor materials, and the semiconductor materials are subjected to the combined effects of drag force, gravity, and inertial force in the high-speed airflow. Smaller or lighter semiconductor materials are carried into the first collection tank 17 by a high-speed airflow, while larger or heavier semiconductor materials fall into the second collection tank 22 due to their greater inertia, thus completing the multi-stage sieving of semiconductor materials.

[0027] Please refer to Figure 3 and Figure 4 For example, the airflow port 18 on the side wall of the screening housing 9 is a spherical cavity. A spherical component 19 is placed inside the airflow port 18, and the spherical component 19 can rotate freely within the airflow port 18. An airflow nozzle 20 is mounted on the spherical component 19, and the output end of the airflow nozzle 20 extends into the screening housing 9. A rotating component 21 can be mounted on the spherical component 19, and the rotating component 21 extends outside the airflow port 18. The operator can control the rotation state of the spherical component 19 within the airflow port 18 by controlling the rotating component 21. When the rotating component 21 is controlled to rotate downward, the airflow nozzle 20 rotates upward within the screening housing 9. The high-speed airflow ejected by the airflow nozzle 20 can be decomposed into airflow one flowing towards the first collection tank 17 and airflow two flowing towards the top of the screening housing 9. Airflow two can act on the semiconductor material, which can reduce the speed at which the semiconductor material falls within the screening housing 9, ensuring that the semiconductor material can obtain sufficient screening time. In particular, it avoids the situation where a large amount of semiconductor material falls within the screening housing 9 and thus cannot be effectively screened by the airflow. If the semiconductor material is small in size or weight, the control rotating part 21 can be rotated upwards, and the airflow nozzle 20 can be rotated downwards inside the screening housing 9. The high-speed airflow ejected by the airflow nozzle 20 can increase the speed at which the semiconductor material falls inside the screening housing 9, ensuring that the relatively heavy semiconductor material falls into the second collection tank 22, thus avoiding the problem that all the semiconductor material enters the first collection tank 17 and the semiconductor material cannot be effectively screened.

[0028] Multiple angle slots can be formed on the upper right side of the outer wall of the screening housing 9. The rotating component 21 can be inserted into different angle slots. By inserting the rotating component 21 into the corresponding angle slots, the angle of the airflow nozzle 20 inside the screening housing 9 can be adjusted to adapt to different screening scenarios. If there is a large amount of semiconductor material descending inside the screening housing 9, the rotating component 21 can be inserted into the lower angle slot of the screening housing 9; if the semiconductor material inside the screening housing 9 is relatively light, the rotating component 21 can be inserted into the upper angle slot of the screening housing 9.

[0029] For example, the first feed inlet of the screening shell 9 is tapered. The inner diameter of the first feed inlet near the roller 2 is R1, and the inner diameter of the first feed inlet away from the roller 2 is R2. R1 is greater than R2, so the semiconductor material inside the roller 2 can more easily fall into the first feed inlet, avoiding the semiconductor material falling outside and causing contamination.

[0030] In summary, embodiments of the present invention provide a screening device for semiconductor material processing. During the conveying process, the semiconductor material continuously tumbles within the screen cylinder 11. Smaller semiconductor materials fall between the roller 2 and the screen cylinder 11, while smaller semiconductor materials are intercepted within the screen cylinder 11, thus completing the mechanical screening of the semiconductor material. The appropriate screen cylinder 11 can be selected according to the properties of the semiconductor material to ensure that the sieve openings of the screen cylinder 11 can separate particles of different sizes from the semiconductor material. The semiconductor material does not undergo centrifugal motion during screening, and it will not collide with the inner wall of the screening device, thus preventing damage to the semiconductor material. Furthermore, the screening process does not require vibration from the screening device, thereby minimizing noise.

[0031] The specific embodiments described above further illustrate the purpose, technical solution, and beneficial effects of this utility model. It should be understood that the above description is only a specific embodiment of this utility model and is not intended to limit the scope of protection of this utility model. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this utility model should be included within the scope of protection of this utility model.

Claims

1. A screening device for semiconductor material processing, characterized in that, include: A frame (1) is arranged at an angle; Mounting plate (10), which is mounted on the frame (1); A connecting sleeve is mounted on the mounting plate (10); Roller (2), one end of which is rotatably mounted inside the connecting sleeve; A sieve cylinder (11) is installed inside the drum (2); Multiple rolling components (6) are arranged sequentially along the extension direction of the frame (1), and each rolling component (6) includes two rolling elements mounted opposite to each other on both sides of the roller (2). Multiple rolling rings (3), each of the multiple rolling rings (3) corresponds one-to-one with the multiple rolling components (6), and the rolling rings (3) are installed on the outer wall of the roller (2); A drive gear (4) is mounted on the outer side wall of the roller (2) and is connected to a drive assembly. Feeding assembly (5) extends at least partially into the screen cylinder (11).

2. The screening equipment for semiconductor material processing according to claim 1, characterized in that, Also includes: Screening shell (9), the screening shell (9) is installed below the drum (2), the top of the screening shell (9) is provided with a first feed port, the inner side wall of the screening shell (9) is provided with a first collection groove (17), the inner side wall of the screening shell (9) is provided with an air flow port (18), and the bottom of the screening shell (9) is provided with a second collection groove (22); The first collection tank (17) and the airflow port (18) are arranged opposite each other on both sides inside the screening shell (9); An airflow nozzle (20) is installed inside the airflow port (18), and the airflow nozzle (20) is connected to an air source.

3. The screening equipment for semiconductor material processing according to claim 2, characterized in that, The airflow port (18) is a spherical cavity, and a spherical component (19) is placed inside the airflow port (18). The spherical component (19) can rotate inside the airflow port (18). The airflow nozzle (20) is installed inside the spherical component (19), and the output end of the airflow nozzle (20) is located inside the screening housing (9).

4. The screening equipment for semiconductor material processing according to claim 2 or 3, characterized in that, The first feed inlet is tapered, with an inner diameter of R1 near the roller (2) and an inner diameter of R2 away from the roller (2), wherein R1 is greater than R2.

5. The screening equipment for semiconductor material processing according to claim 1, characterized in that, The rolling element includes a mounting bracket (7) and a rolling wheel (8); The mounting bracket (7) is mounted on the frame (1); The rolling wheel (8) is rotatably mounted on the mounting bracket (7), and the rolling wheel (8) is in rotatable engagement with the rolling ring (3).

6. The sieving equipment for semiconductor material processing according to claim 1, characterized in that, The feeding assembly (5) includes a feeding pipe (12), feeding blades (15), a rotating shaft (16), and a drive motor (13); The feed pipe (12) is provided with a second feed port (14), the feed pipe (12) passes through the mounting plate (10), and the feed pipe (12) extends at least partially into the screen cylinder (11); One side of the rotating shaft (16) extends into the feed pipe (12), the feed blade (15) is installed on the outer side wall of the rotating shaft (16) along the extension direction, and the drive motor (13) is installed on the side of the rotating shaft (16) outside the feed pipe (12).

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