Cooling device and thin film deposition equipment

Abstract

The utility model discloses a cooling device and thin film deposition equipment, the thin film deposition equipment includes: cooling device, gas uniformizing plate, spraying plate, intake passage and heating ring, cooling device is provided above gas uniformizing plate, gas uniformizing plate is provided above spraying plate, intake passage passes through the plate body of cooling device and is connected with gas uniformizing plate, and heating ring is provided above spraying plate. The heating ring is arranged on the periphery of the gas uniformizing plate, the cooling device comprises a plate body, a plurality of cooling water channels are formed in the plate body, each cooling water channel is provided with a water inlet, a water outlet and a valve element, and cooling liquid enters the cooling water channels from the water inlets and flows out from the water outlets; the valve elements are used for controlling the on-off and / or flow of the corresponding cooling water channels; wherein different cooling water channels are distributed in different areas of the plate body, and the different areas of the plate body correspond to the different areas of the spraying plate in a one-to-one mode. Different areas of the spraying plate are cooled through different cooling water channels, and the surface temperature uniformity of the spraying plate can be optimized.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor technology, and in particular to a cooling device and a thin film deposition equipment. Background Technology

[0002] In plasma-enhanced chemical vapor deposition (PECVD), amorphous carbon masks require high temperatures to reduce hydrogen content and improve etching selectivity. However, the increased temperature of the heating plate significantly affects the central region of the spray plate due to thermal radiation. Current technologies employ dual-zone heating plates to regulate the temperature of the inner and outer rings; however, the lack of real-time temperature monitoring in the central region of the spray plate prevents accurate feedback of temperature changes, leading to a continuous increase in the temperature difference between the center and the edge as the process temperature rises. Especially under high-temperature processes, the non-uniformity of the temperature distribution on the spray plate surface intensifies, directly affecting the thermodynamic state of the process gases, thereby causing variations in film deposition thickness and a decrease in process stability. Utility Model Content

[0003] The present invention provides a cooling device and a thin film deposition equipment, which aims to solve the problem of uneven surface temperature distribution of existing spray plates caused by the heat radiation of the heating plate.

[0004] In a first aspect, the present invention provides a cooling device for adjusting the temperature of a spray plate. The cooling device includes a plate body, wherein a plurality of cooling water channels are provided in the plate body, each of the cooling water channels is provided with an inlet and an outlet and a valve element, wherein cooling liquid enters the cooling water channel from the inlet and flows out from the outlet, and the valve element is used to control the on / off state and / or flow rate of the corresponding cooling water channel.

[0005] Different cooling water channels are distributed in different areas of the plate, and the different areas of the plate correspond one-to-one with the different areas of the spray plate.

[0006] Furthermore, one of the cooling water channels is a central cooling water channel, which is located in the central region of the plate, and the central region of the plate is opposite to the central region of the spray plate.

[0007] Furthermore, one of the cooling channels is an edge cooling channel, which is located in the edge region of the plate, and the edge region of the plate is opposite to the edge region of the spray plate.

[0008] Furthermore, one of the cooling channels is an intermediate cooling channel, which is located between the central cooling channel and the edge cooling channel, and in the middle region between the central region and the edge region of the plate, with the middle region of the plate opposite to the middle region of the spray plate.

[0009] Furthermore, the central cooling channel, the intermediate cooling channel, and the edge cooling channel are all annular cooling channels, and the three are arranged concentrically.

[0010] Furthermore, the width of the central cooling channel is greater than the width of the intermediate cooling channel, and the width of the intermediate cooling channel is greater than the width of the edge cooling channel.

[0011] Furthermore, the central cooling channel, the intermediate cooling channel, and the edge cooling channel are parallel to each other.

[0012] Furthermore, the water inlet and the water outlet are located on the upper surface of the plate and above the corresponding cooling water channel, and both the water inlet and the water outlet are connected to the cooling water channel.

[0013] Furthermore, a central hole is provided in the center of the plate body, which is used for the air intake channel to pass through.

[0014] Secondly, this utility model also discloses a thin film deposition apparatus, comprising: a cooling device, a gas equalization plate, a spray plate, an air inlet channel, and a heating ring. The cooling device is the aforementioned cooling device, which is disposed above the gas equalization plate. The gas equalization plate is disposed above the spray plate. The air inlet channel passes through the plate body of the cooling device and is connected to the gas equalization plate. The heating ring is disposed on the outer periphery of the gas equalization plate. The cooling device is configured to control the on / off state and / or flow rate of different cooling water channels.

[0015] This invention provides a cooling device and a thin film deposition apparatus. The thin film deposition apparatus includes a cooling device, a gas equalization plate, a spray plate, an air inlet channel, and a heating ring. The cooling device is positioned above the gas equalization plate, which is positioned above the spray plate. The air inlet channel passes through the cooling device and connects to the gas equalization plate. The heating ring is positioned on the outer periphery of the gas equalization plate. Multiple cooling water channels are arranged within the cooling device, each channel distributed in different areas of the plate. Each cooling water channel forms a corresponding cooling zone on the plate, dividing the plate into multiple cooling zones. These different zones of the plate correspond to different zones of the spray plate, thus achieving zoned cooling of the spray plate. In this way, when the surface temperature distribution of the spray plate is uneven, selectively opening the cooling water channels in corresponding areas achieves directional strong cooling of the high-temperature areas, reducing the temperature difference with other areas, thereby balancing the surface temperature distribution of the spray plate, reducing the temperature radiation impact on the spray plate under high-temperature conditions, optimizing the surface temperature uniformity of the spray plate, and thus improving the process stability of high-temperature processes and enhancing film uniformity. Attached Figure Description

[0016] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0017] Figure 1 A top view schematic diagram of the cooling device according to an embodiment of the present invention is shown;

[0018] Figure 2 A side cross-sectional view of a thin film deposition apparatus according to an embodiment of the present invention is shown.

[0019] Figure label:

[0020] 1. Cooling device; 11. Plate; 12. Central cooling water channel; 13. Intermediate cooling water channel; 14. Edge cooling water channel; 15. Water inlet; 16. Water outlet; 17. Central hole; 2. Air distribution plate; 3. Spray plate; 4. Air inlet channel; 5. Heating ring. Detailed Implementation

[0021] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of the present utility model.

[0022] The directional terms used in this invention, such as "up," "down," "front," "back," "left," "right," "inner," "outer," and "side," are merely for reference to the accompanying drawings. Therefore, the directional terms used are for explanation and understanding of this invention, and not for limiting it. Furthermore, in the accompanying drawings, structures that are similar or identical are indicated by the same reference numerals.

[0023] In the high-temperature PECVD process, amorphous carbon masks require heating via a heating plate to reduce hydrogen content and improve etching selectivity. However, the central region of the spray plate is significantly affected by the heat radiation from the heating plate due to the lack of temperature monitoring and active control. Existing temperature control solutions rely on dual-zone heating plates to adjust the edge temperature, but they cannot dynamically balance the temperature difference between the center and edge regions of the spray plate, leading to decreased film deposition uniformity and deterioration of process stability.

[0024] To address this issue, this invention provides a cooling device and a thin film deposition equipment. By incorporating multiple independently controlled annular cooling water channels within the spray plate, the surface temperature of the spray plate is zonal and controlled, solving the problem of excessive temperature differences under high-temperature radiation. The width of each water channel decreases from the center outwards, and combined with selective flow rate adjustment, dynamically adapting to the heat load requirements of different process temperatures, significantly improving the temperature uniformity of the spray plate and the quality of thin film deposition.

[0025] This invention addresses the problem of uneven temperature distribution on the surface of the spray plate by dividing the cooling plate into three annular cooling zones: a central zone, a middle zone, and an edge zone, corresponding to the high, medium, and low heat radiation influence zones of the spray plate. The central zone features the widest water channel to accommodate high-temperature, high-intensity cooling requirements. Each water channel's flow rate is controlled by an independent valve, and different channel combinations are selectively activated based on the process temperature. When the heating plate temperature rises, more wide water channels are activated to enhance the central cooling capacity, actively counteracting the temperature rise caused by heat radiation, thereby reducing the temperature difference between the center and edge of the spray plate and achieving dynamic temperature balance.

[0026] To better understand the above technical solutions, the following will provide a detailed explanation of the technical solutions in conjunction with the accompanying drawings and specific implementation methods.

[0027] Please see Figures 1-2 This utility model embodiment illustrates a cooling device 1 for adjusting the temperature of a spray plate 3. The cooling device 1 includes a plate body 11, which has multiple cooling water channels. Each cooling water channel is provided with an inlet 15, an outlet 16, and a valve element. Cooling liquid enters the cooling water channel from the inlet 15 and flows out from the outlet 16. The valve element is used to control the on / off state and / or flow rate of the corresponding cooling water channel. Different cooling water channels are distributed in different areas of the plate body 11, and the different areas of the plate body 11 correspond one-to-one with the different areas of the spray plate 3.

[0028] Specifically, the cooling device 1 includes a plate 11, which can be a disc structure or a rectangular disc structure. It is positioned above the uniform gas distribution plate 2 of the thin film deposition equipment and is parallel to the upper surface of the spray plate 3 at intervals. The cooling device 1 is used to regulate the temperature of the spray plate 3, ensuring a uniform surface temperature distribution. The plate 11 contains multiple independent cooling water channels. Each cooling water channel is equipped with an inlet 15, an outlet 16, and a valve element. Both the inlet 15 and outlet 16 are connected to the cooling water channel. Cooling liquid enters from the inlet 15 and flows into the cooling water channel, exiting from the outlet 16. The cooling liquid can be water or other liquids with heat dissipation functions. The cooling liquid circulates within the cooling water channel, thereby carrying away heat and achieving a cooling effect. The valve element can be a solenoid valve, a pneumatic valve, a manual regulating valve, etc. Each valve element controls the on / off state and flow rate of one cooling water channel, meaning each cooling water channel can be independently controlled and its flow rate can be independently adjusted. The structure of the cooling water channels can be varied, such as arc-shaped, strip-shaped, fan-shaped, and labyrinth-shaped, etc., and is not limited here. Multiple cooling water channels are distributed radially from the center to the edge of the plate 11. The cooling function of the cooling water channels creates multiple different cooling zones on the plate 11, with each cooling water channel corresponding to one cooling zone. Since the plate 11 and the spray plate 3 are parallel and opposite each other at intervals, each cooling zone on the plate 11 corresponds one-to-one with different areas of the spray plate 3. Thus, different cooling water channels can cool different areas of the spray plate 3, realizing zoned temperature control of the spray plate 3. Therefore, by selectively opening different cooling water channels, the corresponding areas of the spray plate 3 can be directionally cooled, thereby balancing the temperature difference and maintaining the uniformity of the surface temperature of the spray plate 3. Of course, it is understandable that by adjusting the flow rate of the cooling water channels, the temperature regulation accuracy can be further improved, achieving the minimum temperature difference and the optimal temperature distribution uniformity. For example, when the temperature in the central area of ​​the spray plate 3 is significantly higher than that in the edge area due to heat radiation from the heating plate, the cooling water channel corresponding to the central area of ​​the plate 11 is opened and its flow rate is adjusted to a higher level, allowing the coolant to circulate more rapidly within the wide channel, thus specifically enhancing the heat dissipation capacity of the central area. At this time, the heat in the central area of ​​the spray plate 3 is quickly absorbed, while the edge area, because its corresponding cooling water channel is not open, maintains its original cooling state, thereby reducing the temperature difference between the center and the edge. This embodiment achieves targeted and precise cooling of specific areas of the spray plate 3 by independently controlling the opening and closing and flow rate of each cooling water channel, thereby dynamically balancing the surface temperature distribution, suppressing regional temperature rise caused by heat radiation, and significantly improving the temperature uniformity of the spray plate 3 and the stability of the thin film deposition process.

[0029] The cooling device 1 in this embodiment can implement directional cooling of the target area based on the heat load difference of different areas of the spray plate 3 using a zoned independent control mechanism, thereby dynamically balancing the temperature difference between the center and the edge. At the same time, by adapting to the changes in heat radiation intensity under different process temperatures through differentiated cooling strategies, the temperature distribution distortion caused by local temperature rise is suppressed, thereby improving the surface temperature uniformity of the spray plate 3, and ultimately ensuring the stability of the thin film deposition process and the consistency of film quality.

[0030] In one embodiment, one of the cooling channels is a central cooling channel 12, which is located in the central region of the plate 11, opposite to the central region of the spray plate 3. Specifically, this embodiment addresses the problem that the central region of the spray plate 3 bears the maximum heat radiation load due to its proximity to the heating plate, and that traditional cooling devices 1 struggle to concentrate and enhance central heat dissipation. A further optimization scheme is proposed. In the cooling device 1, one of the cooling channels is configured as a central cooling channel 12, which is entirely located in the central region of the plate 11, and the projection of this central region covers the central region of the spray plate 3. Furthermore, to solve the aforementioned technical problem of excessively rapid temperature rise in the central region, this embodiment can also configure the central cooling channel 12 as a ring structure, completely confining the annular flow path of the central cooling channel 12 within 1 / 3 of the diameter of the center of the plate 11. The flow path perfectly matches the contour of the high-temperature zone in the center of the spray plate 3, allowing the coolant to maximize the absorption of heat transferred from the center of the spray plate 3 when flowing through this channel. For example, when the temperature in the central area of ​​the spray plate 3 rises sharply due to heat radiation, it is only necessary to open the valve of the central cooling water channel 12 and increase its flow rate, so that the coolant can circulate rapidly in the dense flow channels in the central area of ​​the plate 11, focusing on high-intensity cooling of the center of the spray plate 3, without activating other peripheral water channels. Through this design, the cooling efficiency of the central cooling water channel 12 is directed and focused on the high heat load area, thereby preferentially suppressing the temperature rise trend in the center of the spray plate 3 and avoiding temperature distribution imbalance caused by local overheating. This embodiment achieves targeted heat dissipation of the core high-temperature area by specially designing the central cooling water channel 12 and its precise alignment with the central area of ​​the spray plate 3, effectively reducing the temperature difference between the center of the spray plate 3 and the adjacent areas, and further improving the targeting of temperature control and process stability.

[0031] In one embodiment, one of the cooling channels is an edge cooling channel 14, which is located in the edge region of the plate 11, opposite to the edge region of the spray plate 3. Specifically, this embodiment addresses the temperature fluctuation problem in the edge region of the spray plate 3 during thin film deposition caused by differences in the flow rate of the adjacent heating ring 5 or process gas. In the cooling device 1, one cooling channel is configured as an edge cooling channel 14, which is entirely located in the edge region of the plate 11, and the projection of this edge region covers the edge region of the spray plate 3. Furthermore, to solve the technical problem of inaccurate temperature control in the edge region, this embodiment arranges the flow channels of the edge cooling channel 14 in a ring around the outer periphery of the plate 11, with its coverage area corresponding to the working area of ​​the heating ring 5 at the edge of the spray plate 3. This allows the coolant flowing through the channel to accurately offset the additional heat input from the heating ring 5 to the edge of the spray plate 3, and also to offset the temperature fluctuations caused by the heat radiation from the heating plate. For example, when the heating ring 5 actively heats the edge of the spray plate 3, the valve of the edge cooling water channel 14 is simultaneously opened and its flow rate is adjusted accordingly, so that the coolant circulates in the outer annular flow channel at an appropriate rate, forming a cooling intensity that is dynamically balanced with the power of the heating ring 5, thereby suppressing temperature overshoot in the edge region. Through this design, the edge of the spray plate 3 can be actively heated by the heating ring 5, and the heat dissipation rate can be controlled in real time by the edge cooling water channel 14, avoiding temperature fluctuations caused by thermal inertia. This embodiment achieves bidirectional controllability of the edge temperature by designing the edge cooling water channel 14 and its precise matching with the edge heating area of ​​the spray plate 3, further reducing the temperature difference between the edge and the middle area of ​​the spray plate 3, ensuring the consistency of the thermodynamic state of the process gas throughout the spray plate 3, and ultimately improving the uniformity of the film thickness.

[0032] In one embodiment, one of the cooling channels is an intermediate cooling channel 13, which is located between the central cooling channel 12 and the edge cooling channel 14, and in the middle region between the central region and the edge region of the plate 11. The middle region of the plate 11 is opposite to the middle region of the spray plate 3. Specifically, this embodiment proposes a refined control scheme to address the temperature transition imbalance problem in the middle region between the center and the edge of the spray plate 3 caused by the attenuation of the thermal radiation gradient or uneven distribution of process gas flow. In the cooling device 1, one of the cooling channels is configured as an intermediate cooling channel 13, which is completely located in the middle region between the central region and the edge region of the plate 11, and the projection of this middle region covers the middle transition region of the spray plate 3. To address the aforementioned technical problem of insufficient temperature control accuracy in the intermediate region, this embodiment arranges the flow channels of the intermediate cooling water channel 13 in a ring along the middle of the plate 11. Its coverage area is adapted to the heat load distribution characteristics of the intermediate transition zone of the spray plate 3, allowing the coolant to precisely adjust the heat dissipation intensity of the intermediate region as it flows through the channel, filling the temperature control blind spot between the center and the edge. For example, in high-temperature processes, when the central cooling water channel 12 and the edge cooling water channel 14 are simultaneously activated, the intermediate region may form local hot spots due to the superimposed temperature control effect on both sides. In this case, the intermediate cooling water channel 13 can be additionally activated and its flow rate adjusted to a medium level, allowing the heat in the intermediate region to be evenly dissipated, thereby forming a smooth temperature gradient from the center to the edge. Conversely, in low-temperature processes, if only slight cooling of the intermediate region is required, the intermediate cooling water channel 13 can be activated alone and its flow rate reduced to avoid over-cooling and interference with the overall temperature field balance. Furthermore, during dynamic process switching (e.g., the transition from high to low temperature), gradual compensation for the temperature difference in the intermediate region can be achieved by gradually closing the central cooling water channel 12 and gradually increasing the flow rate of the intermediate cooling water channel 13. This embodiment, by adding the intermediate cooling water channel 13 and its precise alignment with the intermediate transition zone of the spray plate 3, forms a three-level layered temperature control system. This further improves the granularity of temperature distribution control across the entire spray plate 3, especially optimizing the thermal balance of the transition zone between the center and the edge. Ultimately, this ensures the consistency of the thermodynamic response of the process gas on the surface of the spray plate 3, significantly improving the uniformity of thin film deposition and process stability.

[0033] In one embodiment, the central cooling channel 12, the intermediate cooling channel 13, and the edge cooling channel 14 are all annular cooling channels, and the three are arranged concentrically. Specifically, this embodiment addresses the problem of low local cooling efficiency caused by the mismatch between the flow channel orientation and the thermal radiation field distribution of the spray plate 3 in the multi-stage cooling channel layout, and proposes a geometric optimization scheme. The central cooling channel 12, the intermediate cooling channel 13, and the edge cooling channel 14 are all set as annular structures, and the three are arranged concentrically with the central axis of the plate 11 as the reference, forming a multi-layer annular cooling zone from the inside out. Among them, the central cooling channel 12 is the inner annular cooling zone, the intermediate cooling channel 13 is the middle annular cooling zone, and the edge cooling channel 14 is the outer annular cooling zone. By designing the annular flow channels of each cooling channel with a geometric configuration concentric with the surface temperature gradient distribution of the spray plate 3, each annular cooling zone accurately covers the thermal influence range of the corresponding temperature zone of the spray plate 3. For example, in high-temperature processes, when a temperature gradient decreasing from the inside out is formed in the center, middle, and edge regions of the spray plate 3, the three concentric annular cooling channels can be opened simultaneously. The inner central annular cooling zone covers the high-temperature core area, the middle annular cooling zone matches the medium-temperature transition zone, and the outer edge annular cooling zone corresponds to the low-temperature peripheral area. The linear control of the temperature gradient is achieved through the coordinated operation of each annular channel. In low-temperature processes, if it is only necessary to suppress the temperature rise of the outer periphery of the spray plate 3, the outer annular cooling channel can be opened alone while the inner and middle channels are closed, avoiding waste of cooling resources. In addition, in dynamic process scenarios (e.g., when the temperature of the heating plate rises stepwise), the annular cooling channels can be opened sequentially from the inside out, so that the cooling intensity increases synchronously with the direction of heat radiation diffusion, thereby avoiding the lag in the transmission of temperature fluctuations. This embodiment employs a multi-layered cooling zone design with a concentric annular structure to achieve a geometric match between the cooling area and the spatial distribution of the thermal radiation field of the spray plate 3. This eliminates the cooling blind zone under the traditional asymmetric flow channel layout and significantly improves the cooling response efficiency. At the same time, the equidistant arrangement of the concentric annular water channels further optimizes the uniformity of the coolant flow field and avoids turbulent disturbances caused by the interlacing of flow channels. Ultimately, this achieves precise and smooth control of the temperature distribution across the entire spray plate 3, ensuring the stability and repeatability of the thin film deposition process.

[0034] In one embodiment, the width of the central cooling channel 12 is greater than the width of the intermediate cooling channel 13, and the width of the intermediate cooling channel 13 is greater than the width of the edge cooling channel 14.

[0035] Specifically, this embodiment addresses the problem of localized overcooling or undercooling caused by the mismatch between cooling capacity distribution and heat load gradient in multi-layer cooling channels within a wide temperature range process, proposing a flow rate adaptation optimization scheme. The width of the central cooling channel 12 is made greater than that of the intermediate cooling channel 13, and the width of the intermediate cooling channel 13 is greater than that of the edge cooling channel 14, forming a channel width distribution that gradually decreases from the center to the edge. The wide central cooling channel 12 provides a high-heat-capacity coolant flow rate, adapting to the high-intensity heat radiation in the central region of the spray plate 3, while the gradually narrowing intermediate and edge channels correspond to the medium and low heat load regions, respectively, achieving a precise match between cooling capacity and temperature zone requirements. For example, in high-temperature processes (e.g., above 600°C), a wide central cooling channel 12 is opened, its large cross-section allowing the coolant to circulate at a high flow rate, fully absorbing the concentrated heat radiation energy in the central area; in medium-temperature processes (e.g., 400-600°C), a medium-width intermediate cooling channel 13 is opened, its flow rate and heat dissipation surface actively adapting to the temperature control requirements of the transition zone; in low-temperature processes (e.g., below 400°C), only the narrow edge cooling channel 14 needs to be opened to avoid excessive cooling causing the edge temperature of the spray plate 3 to be too low. Furthermore, when the process temperature changes dynamically (e.g., from 500°C to 650°C), the central and intermediate cooling channels 13 can be opened simultaneously, and by increasing the flow rate proportion of the central channel, the cooling capacity can be gradually concentrated towards the center as the heat load increases. This embodiment uses a gradient decreasing design of the water channel width to make the coolant flow distribution positively correlated with the heat radiation intensity distribution of the spray plate 3. This avoids redundant consumption of cooling resources in wide temperature range processes and ensures optimal heat dissipation efficiency in each area. As a result, it significantly improves the temperature control accuracy of the entire spray plate 3 while reducing energy consumption, and ultimately ensures the uniformity of thin film deposition and process stability.

[0036] In one embodiment, the central cooling channel 12, the intermediate cooling channel 13, and the edge cooling channel 14 are parallel to each other. Specifically, the central cooling channel 12, the intermediate cooling channel 13, and the edge cooling channel 14 are arranged in parallel, with the spacing and flow direction of each annular channel strictly consistent, thereby forming a uniform and symmetrical cooling field distribution on the plate 11. The parallel flow channel design ensures that the flow rate and heat exchange efficiency of the coolant in different areas of the plate 11 are consistent, eliminating the directional deviation in heat dissipation caused by differences in channel orientation. Due to the geometric constraints of the parallel structure, the cooling areas formed by each cooling channel are uniformly distributed on the plate 11, ensuring that the surface temperature gradient of the spray plate 3 changes symmetrically along the radial direction. This design ensures that the process gas is uniformly subjected to the thermal field during deposition, avoiding the problem of eccentric film thickness distribution caused by directional deviations in the temperature field. This embodiment strengthens the symmetry of the cooling field through the parallel channel layout, ensuring that the film deposition thickness strictly follows the central symmetry law, thereby improving the concentricity of the film.

[0037] In one embodiment, the inlet 15 and the outlet 16 are located on the upper surface of the plate 11 and above the corresponding cooling water channels, and both the inlet 15 and the outlet 16 are connected to the cooling water channels. Specifically, the inlet 15 and the outlet 16 are both located on the upper surface of the plate 11 and directly above the corresponding cooling water channels, and the inlet 15 and the outlet 16 are connected to the cooling water channels below. By centrally arranging the interfaces on the upper surface of the plate 11, the connection path of the external cooling pipes is simplified, avoiding spatial interference caused by traditional side or bottom interfaces. This embodiment improves the modularity and maintenance convenience of the cooling device 1 through the top integrated layout of the inlet and outlet 16.

[0038] In one embodiment, a central hole 17 is provided at the center of the plate 11, which is used for the air intake channel 4 to pass through. Specifically, the central hole 17 is provided at the center of the plate 11, and its diameter matches the outer diameter of the air intake channel 4, so that the air intake channel 4 can vertically pass through the central hole 17 of the plate 11 and communicate with the gas distribution plate 2 below. By providing the central hole 17, a straight path for the delivery of process gas is provided without affecting the layout of the cooling water channel.

[0039] Please see Figures 1-2 This utility model embodiment also provides a thin film deposition apparatus, including: a cooling device 1, a gas equalization plate 2, a spray plate 3, an air inlet channel 4, and a heating ring 5. The cooling device 1 is the same as the cooling device 1 described in the above embodiment. The cooling device 1 is disposed above the gas equalization plate 2, and the gas equalization plate 2 is disposed above the spray plate 3. The air inlet channel 4 passes through the plate body 11 of the cooling device 1 and connects to the gas equalization plate 2. The heating ring 5 is disposed on the outer periphery of the gas equalization plate 2. The cooling device 1 is configured to control the on / off state and / or flow rate of different cooling water channels. The cooling device 1 has been described in detail in the above embodiments, and for the sake of brevity, it will not be repeated here.

[0040] Specifically, the cooling device 1, the air distribution plate 2, and the spray plate 3 are arranged sequentially from top to bottom. The air inlet channel 4 passes vertically through the central hole 17 of the cooling device 1 plate body 11 and communicates with the gas distribution chamber of the air distribution plate 2. The heating ring 5 is arranged around the outer edge of the air distribution plate 2 and aligned with the edge area of ​​the spray plate 3. Through the coordinated operation of the zoned cooling capacity of the cooling device 1 and the edge temperature control function of the heating ring 5, the dynamic balance of the temperature across the entire spray plate 3 is achieved. For example: For high-temperature processes (e.g., 600℃), the central and intermediate cooling water channels 13 of the cooling device 1 are opened to strongly cool the central area of ​​the spray plate 3, while the heating ring 5 operates at low power to compensate for edge heat dissipation, keeping the overall temperature gradient of the spray plate 3 within ±10℃; For low-temperature processes (e.g., 300℃), only the edge cooling water channels 14 of the cooling device 1 are opened and the flow rate is reduced, while the heating ring 5 operates at medium power to prevent overcooling at the edges, ensuring that the surface temperature difference of the spray plate 3 is less than ±5℃; For dynamic process switching (e.g., 400℃→550℃): the edge cooling water channels 14 are closed in stages while the intermediate and central cooling water channels 12 are gradually opened, while the power of the heating ring 5 is increased proportionally to achieve a smooth temperature transition without abrupt changes. Of course, it is understood that the on / off state and flow rate of different cooling water channels can also be controlled according to different process temperatures and process requirements, which is not limited here. This embodiment overcomes the limitations of traditional single-point temperature control by linking the cooling device 1 with the heating ring 5, making it possible to dynamically adjust the heat field distribution on the surface of the spray plate 3 with high precision, thereby significantly improving the uniformity of thin film deposition and process stability.

[0041] The above description is merely a specific embodiment of this utility model, but the protection scope of this utility model is not limited thereto. Any person skilled in the art can easily conceive of various equivalent modifications or substitutions within the technical scope disclosed in this utility model, and these modifications or substitutions should all be covered within the protection scope of this utility model. Therefore, the protection scope of this utility model should be determined by the scope of the claims.

Claims

1. A cooling device, characterized in that, The cooling device for regulating the temperature of the spray plate includes: a plate body, in which multiple cooling water channels are provided, each of the cooling water channels being provided with an inlet and an outlet as well as a valve element, wherein cooling liquid enters the cooling water channel from the inlet and flows out from the outlet, and the valve element is used to control the on / off state and / or flow rate of the corresponding cooling water channel; Different cooling water channels are distributed in different areas of the plate, and the different areas of the plate correspond one-to-one with the different areas of the spray plate.

2. The cooling device according to claim 1, characterized in that, One of the cooling channels is a central cooling channel, which is located in the central region of the plate, and the central region of the plate is opposite to the central region of the spray plate.

3. The cooling device according to claim 2, characterized in that, One of the cooling channels is an edge cooling channel, which is located in the edge region of the plate, and the edge region of the plate is opposite to the edge region of the spray plate.

4. The cooling device according to claim 3, characterized in that, One of the cooling channels is a middle cooling channel, which is located between the central cooling channel and the edge cooling channel, and in the middle region between the central region and the edge region of the plate. The middle region of the plate is opposite to the middle region of the spray plate.

5. The cooling device according to claim 4, characterized in that, The central cooling channel, the intermediate cooling channel, and the edge cooling channel are all annular cooling channels, and the three are arranged concentrically.

6. The cooling device according to claim 4, characterized in that, The width of the central cooling channel is greater than the width of the intermediate cooling channel, and the width of the intermediate cooling channel is greater than the width of the edge cooling channel.

7. The cooling device according to claim 4, characterized in that, The central cooling channel, the intermediate cooling channel, and the edge cooling channel are parallel to each other.

8. The cooling device according to any one of claims 1-7, characterized in that, The water inlet and the water outlet are located on the upper surface of the plate and above the corresponding cooling water channel. Both the water inlet and the water outlet are connected to the cooling water channel.

9. The cooling device according to any one of claims 1-7, characterized in that, The plate has a central hole at its center, which is used for the air intake channel to pass through.

10. A thin film deposition apparatus, characterized in that, include: The device comprises a cooling device, a uniform air distribution plate, a spray plate, an air inlet channel, and a heating ring. The cooling device is as described in any one of claims 1-9. The cooling device is disposed above the uniform air distribution plate, the uniform air distribution plate is disposed above the spray plate, the air inlet channel passes through the plate body of the cooling device and is connected to the uniform air distribution plate, and the heating ring is disposed on the outer periphery of the uniform air distribution plate. The cooling device is configured to control the on / off state and / or flow rate of different cooling water channels.

Images