Liquid cooling radiator assembly capable of conducting heat in multiple directions

Abstract

The utility model discloses a liquid cooling radiator assembly capable of conducting heat in multiple directions, which belongs to the technical field of liquid cooling radiators and is characterized in that the liquid cooling radiator assembly capable of conducting heat in multiple directions comprises a heat conducting fin, and a heat dissipation mechanism is arranged at the top of the heat conducting fin, the heat dissipation mechanism is arranged, the heat conducting fin is tightly attached to a CPU and is responsible for absorbing heat generated by the CPU, and then heat generated by the CPU is dissipated by the heat dissipation mechanism. The flat heat absorption pipes rapidly absorb heat on the heat conduction pieces, the cooling bent pipes communicated with the tops of the flat heat absorption pipes can disperse the heat to a larger range, the heat dissipation area is greatly increased through the multidirectional heat conduction fins on the outer sides of the cooling bent pipes, the heat can be more efficiently dissipated to the surrounding environment, the cooling bent pipes are connected with the cooling liquid box through the three-way pipe, and the cooling effect is better. And a circulation path is formed by combining a suction and discharge structure, and in the circulation system, the cooling liquid continuously flows and passes through the flat heat-absorbing pipes to take away heat absorbed by the heat-conducting fins from the CPU in time, so that the heat generated by equipment can be rapidly discharged.

Description

Technical Field

[0001] This utility model relates to the field of liquid cooling radiator technology, and in particular to a liquid cooling radiator assembly with multi-directional heat conduction. Background Technology

[0002] A heatsink is a general term for a series of devices used to conduct and release heat. Currently, most common heatsinks are divided into air-cooled heatsinks and liquid-cooled heatsinks. Both types of heatsinks absorb heat from the computer CPU, northbridge, and graphics card through heat-absorbing parts. The effect is singular and cannot effectively cool down the heat-generating electronic components quickly.

[0003] Currently, most common heat sinks are divided into air-cooled heat sinks and liquid-cooled heat sinks. Both types of heat sinks absorb heat from the computer CPU, northbridge, and graphics card through heat-absorbing parts. The effect is singular and cannot effectively cool down the hot electronic components quickly.

[0004] An existing patent (publication number: CN220290166U) discloses a liquid-cooled heat sink. This utility model dissipates heat from the CPU through the combination of a water-cooled chassis and heat-conducting components, and achieves a dual cooling effect through a fan, thereby further improving the heat dissipation effect and enhancing the practicality of the device.

[0005] Existing patents offer solutions to the aforementioned problems. However, as the performance of electronic devices continues to improve, heat dissipation has become a key factor affecting device stability and lifespan. Traditional air-cooled radiators rely mainly on airflow to remove heat, resulting in relatively low heat dissipation efficiency. When dealing with high-power devices, they struggle to quickly dissipate large amounts of heat, leading to localized overheating. While liquid-cooled radiators utilize the high specific heat capacity of liquids and offer better heat dissipation than air cooling, uneven coolant distribution can occur in complex device structures, making it impossible to achieve uniform heat dissipation. Consequently, a single heat dissipation method often fails to meet the requirements for efficient and uniform heat dissipation.

[0006] To address this, a liquid-cooled heat sink assembly with multi-directional thermal conductivity is proposed. Utility Model Content

[0007] The purpose of this invention is to provide a multi-directional heat-conducting liquid-cooled radiator assembly, which can address the issue that with the continuous improvement of the performance of existing electronic devices, heat dissipation has become a key factor affecting the stability and lifespan of the equipment. Traditional air-cooled radiators mainly rely on airflow to remove heat, and their heat dissipation efficiency is relatively low. When dealing with high-power equipment, it is difficult to quickly dissipate a large amount of heat, leading to local overheating of the equipment. Although liquid-cooled radiators utilize the high specific heat capacity of liquids and have a better heat dissipation effect than air cooling, in some complex equipment structures, the coolant distribution may be uneven, making it impossible to achieve uniform heat dissipation. Therefore, a single heat dissipation method often cannot meet the requirements of efficient and uniform heat dissipation.

[0008] To achieve the above objectives, the present invention provides the following technical solution: a multi-directional heat-conducting liquid-cooled radiator assembly, comprising a heat-conducting plate, wherein a heat dissipation mechanism is provided on the top of the heat-conducting plate;

[0009] The heat dissipation mechanism includes a flat heat-absorbing tube disposed inside the heat-conducting fin. Cooling bends are connected to the front, middle, and rear sides of the top two sides of the flat heat-absorbing tube. The cooling bends are located at the top of the heat-conducting fin. Multiple heat-conducting fins are disposed on the outer side of the cooling bends. A top plate is bolted to the top of the multiple heat-conducting fins. A T-connector is connected to the inner side of the cooling bends. The top of the T-connector penetrates the bottom of the top plate. A coolant tank is disposed on the top of the top plate. The bottom of the coolant tank is connected to the top of the T-connector. A suction / discharge structure is disposed on the top of the top plate. The top of the rear side of the suction / discharge structure is connected to the front side of the coolant tank. The bottom of the rear side of the suction / discharge structure is connected to the front side of the front flat heat-absorbing tube. A heat-conducting fan is disposed on the rear side of the top plate. A temperature measuring structure is disposed on the top of the coolant tank.

[0010] Preferably, the temperature measuring structure includes a temperature detector disposed on the top of the coolant tank, and the detection end of the temperature detector is located inside the coolant tank.

[0011] Preferably, the temperature detector is electrically connected to a connecting cable on its rear side, and the connecting cable is located at the top of the coolant tank.

[0012] Preferably, a temperature display panel is electrically connected to the rear side of the connecting cable, and the temperature display panel is bolted to the top of the heat-conducting fan.

[0013] Preferably, the suction and discharge structure includes an output pump bolted to the front side of the top of the top plate, the absorption end of the output pump being connected to a suction pipe, and the suction pipe being connected to the front side of the coolant tank.

[0014] Preferably, the output end of the output pump is connected to an output pipe, and the bottom of the output pipe is connected to the front side of the flat heat absorption tube.

[0015] Preferably, the top of the coolant tank is connected to a replenishment / replacement pipe, and the top of the replenishment / replacement pipe is fitted with a sealing sleeve.

[0016] Preferably, a protective shell is snapped onto the top of the coolant tank, and the protective shell is located on top of the temperature detector.

[0017] Compared with the prior art, the beneficial effects of this utility model are:

[0018] 1. This application features a heat dissipation mechanism where the heat-conducting fins are in close contact with the CPU to absorb the heat generated by the CPU. Subsequently, the flat heat-absorbing pipes quickly absorb the heat from the heat-conducting fins. Multiple cooling bends connected to the top of the bends can disperse the heat over a wider area. The multi-layered heat-conducting fins on the outside of the cooling bends greatly increase the heat dissipation area, allowing the heat to be dissipated more efficiently to the surrounding environment. The cooling bends are connected to the coolant tank via a T-connector, and together with the suction and discharge structure, they form a circulation path. In this circulation system, the coolant flows continuously, passing through the flat heat-conducting pipes to promptly remove the heat absorbed by the heat-conducting fins from the CPU, ensuring that the heat generated by the device can be quickly dissipated. In addition, the heat-conducting fan accelerates airflow when it runs, further enhancing the heat dissipation efficiency. These components work together to effectively solve the problems of low efficiency and uneven heat dissipation in traditional single heat dissipation methods, significantly improving the heat dissipation performance of the device.

[0019] 2. This application, by setting a temperature measuring structure, can monitor the temperature inside the coolant tank in real time. When the temperature reaches the set threshold, it is convenient for the operator to replace and replenish the coolant in the coolant tank in a timely manner. Attached Figure Description

[0020] Figure 1 This is an overall structural diagram of the multi-directional heat-conducting liquid-cooled radiator assembly of this utility model;

[0021] Figure 2 This is a structural diagram of the heat dissipation mechanism of this utility model;

[0022] Figure 3 This is a structural diagram of the suction and discharge structure of this utility model;

[0023] Figure 4 This is a structural diagram of the temperature measuring structure of this utility model;

[0024] Figure 5 This is a structural diagram of the flat heat absorption tube of this utility model.

[0025] In the diagram, 1. Heat-conducting fin; 2. Heat dissipation mechanism; 21. Flat heat-absorbing tube; 22. Cooling bend; 23. Multi-directional heat-conducting fins; 24. Top plate; 25. T-connector; 26. Coolant tank; 27. Suction and discharge structure; 271. Output pump; 272. Suction tube; 273. Output tube; 28. Heat-conducting fan; 29. ​​Temperature measuring structure; 291. Temperature detector; 292. Connecting cable; 293. Temperature display panel; 3. Replenishment and replacement tube; 4. Sealing sleeve; 5. Protective shell. Detailed Implementation

[0026] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0027] Please see Figure 1-5 The present invention provides the following technical solution:

[0028] A liquid-cooled heat sink assembly with multi-directional heat conduction includes a heat conduction plate 1, and a heat dissipation mechanism 2 is provided on the top of the heat conduction plate 1.

[0029] The heat dissipation mechanism 2 includes a flat heat-absorbing pipe 21 disposed inside the heat-conducting plate 1. Cooling bends 22 are connected to the front, middle and rear sides of the top two sides of the flat heat-absorbing pipe 21. The cooling bends 22 are located at the top of the heat-conducting plate 1. Multi-directional heat-conducting fins 23 are disposed on the outer side of the cooling bends 22. A top plate 24 is bolted to the top of the multi-directional heat-conducting fins 23. A three-way pipe 25 is connected to the inner side of the cooling bends 22. The top of the three-way pipe 25 passes through the bottom of the top plate 24. A coolant tank 26 is disposed on the top of the top plate 24. The bottom of the coolant tank 26 is connected to the top of the three-way pipe 25. A suction and discharge structure 27 is disposed on the top of the top plate 24. The top of the rear side of the suction and discharge structure 27 is connected to the front side of the coolant tank 26. The bottom of the rear side of the suction and discharge structure 27 is connected to the front side of the flat heat-absorbing pipe 21. A heat-conducting fan 28 is disposed on the rear side of the top plate 24. A temperature measuring structure 29 is disposed on the top of the coolant tank 26.

[0030] In this embodiment: By setting up a heat dissipation mechanism 2, when the electronic device is running, the CPU generates a large amount of heat. The heat-conducting plate 1, which is in close contact with the CPU, quickly absorbs this heat. Subsequently, the flat heat-absorbing pipe 21, with its good thermal conductivity, quickly absorbs heat from the heat-conducting plate 1. The multiple cooling bends 22 connected to the top of the flat heat-absorbing pipe 21 disperse the heat over a larger area, increasing the heat dissipation coverage area. The multiple heat-conducting fins 23 on the outside of the cooling bends 22 greatly expand the heat dissipation area, allowing the heat to be dissipated more efficiently into the surrounding environment and accelerating the heat dissipation rate. The cooling bends 22 are connected to the coolant tank 26 through a three-way pipe 25 and form a circulation path with the suction and discharge structure 27. After the suction and discharge structure 27 starts working, the coolant... The coolant flows continuously through this circulation system. As the coolant flows through the flat heat absorber 21, it continuously carries away the heat absorbed by the heat conductor 1, keeping the heat conductor 1 at a low temperature. This ensures that the heat generated by the CPU can be dissipated in a timely manner, maintaining stable operation of the equipment. At the same time, the heat-conducting fan 28 on the rear side of the top plate 24 runs continuously, accelerating the airflow speed. The rapidly flowing air can more effectively carry away the heat dissipated by the multi-directional heat-conducting fins 23, further enhancing the heat dissipation efficiency. During this process, the temperature measuring structure 29 located on the top of the coolant tank 26 can monitor the temperature inside the coolant tank 26 in real time. When the temperature reaches the set threshold, it is convenient for the operator to replace and replenish the coolant in the coolant tank 26 in a timely manner.

[0031] Specifically, such as Figure 4 As shown, the temperature measuring structure 29 includes a temperature detector 291 disposed on the top of the coolant tank 26, and the detection end of the temperature detector 291 is located inside the coolant tank 26.

[0032] Specifically, such as Figure 4 As shown, a connecting cable 292 is electrically connected to the rear side of the temperature detector 291, and the connecting cable 292 is located on the top of the coolant tank 26.

[0033] Specifically, such as Figure 4 As shown, a temperature display panel 293 is electrically connected to the rear side of the connecting cable 292, and the temperature display panel 293 is attached to the top of the heat-conducting fan 28.

[0034] In this embodiment: by setting a temperature measuring structure 29, a temperature detector 291 located at the top of the coolant tank 26 is inserted into the coolant tank 26, which can directly sense the temperature change of the coolant. When the coolant absorbs heat and its temperature changes after long-term use, the temperature detector 291 quickly converts the temperature information into an electrical signal. These electrical signals are transmitted through the connecting cable 292 on the rear side. The connecting cable 292 stably transmits the signal to the temperature display panel 293, which is attached to the top of the heat-conducting fan 28. The operator can intuitively and clearly see the real-time temperature value of the coolant. When the temperature reaches the set threshold, the operator can detect it in time and replace or replenish the coolant in the coolant tank 26 according to the actual situation, ensuring that the coolant always maintains good heat dissipation performance, maintaining the efficient operation of the entire heat dissipation system, and ensuring that the electronic equipment works stably at a suitable temperature.

[0035] Specifically, such as Figure 3 As shown, the suction and discharge structure 27 includes an output pump 271 bolted to the front side of the top of the top plate 24. The absorption end of the output pump 271 is connected to a suction pipe 272, which is connected to the front side of the coolant tank 26.

[0036] Specifically, such as Figure 3 As shown, the output end of the output pump 271 is connected to the output pipe 273, and the bottom of the output pipe 273 is connected to the front side of the flat heat absorption pipe 21.

[0037] In this embodiment: by setting the suction and discharge structure 27, when the output pump 271 is started, its absorption end draws coolant from the front of the coolant tank 26 through the suction pipe 272. Under the action of the output pump 271, the drawn coolant is injected from the bottom into the flat heat absorption tube 21 through the output pipe 273. In the flat heat absorption tube 21, the coolant fully absorbs the heat taken from the heat conduction plate 1 by the flat heat absorption tube 21, completing the heat exchange. Afterwards, the heated coolant returns to the coolant tank 26 through the cooling bend pipe 22 and the three-way pipe 25, completing one cycle. The output pump 271 continues to work, so that the coolant circulates continuously, continuously carrying away the heat of the flat heat absorption tube 21, thereby ensuring that the heat conduction plate 1 can continuously and efficiently absorb the heat generated by the CPU, maintain the heat dissipation efficiency of the electronic device, ensure the stable operation of the device, and avoid performance degradation and failure problems caused by heat accumulation.

[0038] Specifically, such as Figure 4 As shown, the top of the coolant tank 26 is connected to a replenishment and replacement pipe 3, and the top of the replenishment and replacement pipe 3 is fitted with a sealing sleeve 4.

[0039] Specifically, such as Figure 1 As shown, a protective shell 5 is snapped onto the top of the coolant tank 26, and the protective shell 5 is located on top of the temperature detector 291.

[0040] In this embodiment: by setting up a replenishment and replacement pipe 3, a sealing sleeve 4, and a protective shell 5, the replenishment and replacement pipe 3 at the top of the coolant tank 26 provides a convenient channel for replenishing and replacing the coolant. When the coolant temperature is abnormal and it is determined that the coolant needs to be replaced or replenished, the sealing sleeve 4 can be opened and the operation can be carried out through the replenishment and replacement pipe 3, which is convenient and quick, reducing maintenance time and difficulty. In addition, the protective shell 5 located at the top of the temperature detector 291 can protect the temperature detector 291 from external impacts, dust, and moisture, ensuring that the temperature detector 291 works stably.

[0041] Working Principle: During the use of the multi-directional heat-conducting liquid cooling radiator assembly, its heat-conducting plate 1 is in close contact with the CPU of the electronic device. The CPU generates a large amount of heat during operation, which is quickly absorbed by the heat-conducting plate 1. Then, the flat heat-absorbing pipe 21, with its excellent thermal conductivity, draws heat from the heat-conducting plate 1. Multiple cooling bends 22 at the top of the flat heat-absorbing pipe 21 disperse the heat over a larger area. The multi-directional heat-conducting fins 23 on the outer side of the cooling bends 22 increase the heat dissipation area, allowing heat to be efficiently dissipated to the surrounding environment. Simultaneously, the output pump 271 on the front side of the top plate 24 starts, drawing coolant from the front of the coolant tank 26 through the suction pipe 272. The coolant is then injected into the flat heat-absorbing pipe 21 through the output pipe 273. In the flat heat-absorbing pipe 21, the coolant absorbs heat and then returns to the coolant tank 26 through the cooling bends 22 and the T-connector 25, completing the cycle. The continuously circulating coolant continuously removes heat from the flat heat-absorbing pipe 21, keeping the heat-conducting plate 1 at a low temperature, ensuring timely heat dissipation from the CPU, and maintaining the device's performance. Stable operation is ensured by the continuous operation of the heat-conducting fan 28 on the rear side of the top plate 24, which accelerates airflow and more effectively removes the heat dissipated by the multi-directional heat-conducting fins 23, further enhancing heat dissipation efficiency. During the entire heat dissipation process, the temperature detector 291 located on the top of the coolant tank 26 monitors the coolant temperature in real time. The detection end of the temperature detector 291 senses the change in coolant temperature and converts the temperature information into an electrical signal, which is transmitted to the temperature display panel 293 through the connecting cable 292. The operator can intuitively see the real-time temperature value of the coolant. When the temperature reaches the set threshold, the coolant can be replaced or replenished in time to ensure the heat dissipation performance of the coolant. In addition, the replenishment and replacement pipe 3 on the top of the coolant tank 26 provides a convenient channel for replenishing and replacing the coolant. It can be operated by opening the sealing sleeve 4. The protective shell 5 on the top of the temperature detector 291 protects the temperature detector 291 from external impacts, dust and moisture, ensuring its stable operation and thus ensuring the normal operation of the entire heat dissipation system.

[0042] The above are merely preferred embodiments of the present utility model and are not intended to limit the present utility model. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A multi-directional thermally conductive liquid-cooled heat sink assembly, comprising a thermally conductive sheet (1), characterized in that: The top of the heat-conducting sheet (1) is provided with a heat dissipation mechanism (2); The heat dissipation mechanism (2) includes a flat heat-absorbing tube (21) disposed inside the heat-conducting plate (1). Cooling bends (22) are connected to the front, middle and rear sides of the top two sides of the flat heat-absorbing tube (21). The cooling bends (22) are located at the top of the heat-conducting plate (1). Multi-directional heat-conducting fins (23) are disposed on the outer side of the cooling bends (22). A top plate (24) is bolted to the top of the multi-directional heat-conducting fins (23). A three-way pipe (25) is connected to the inner side of the cooling bends (22). The top of the three-way pipe (25) penetrates the top plate (24). At the bottom, a coolant tank (26) is provided on the top of the top plate (24). The bottom of the coolant tank (26) is connected to the top of the three-way pipe (25). A suction and discharge structure (27) is provided on the top of the top plate (24). The top of the rear side of the suction and discharge structure (27) is connected to the front side of the coolant tank (26). The bottom of the rear side of the suction and discharge structure (27) is connected to the front side of the front flat heat absorption pipe (21). A heat-conducting fan (28) is provided on the rear side of the top plate (24). A temperature measuring structure (29) is provided on the top of the coolant tank (26).

2. The liquid-cooled radiator assembly with multi-directional thermal conductivity according to claim 1, characterized in that: The temperature measuring structure (29) includes a temperature detector (291) disposed on the top of the coolant tank (26), and the detection end of the temperature detector (291) is located inside the coolant tank (26).

3. The liquid-cooled radiator assembly with multi-directional thermal conductivity according to claim 2, characterized in that: The temperature detector (291) is electrically connected to a connecting cable (292) on its rear side, and the connecting cable (292) is located on top of the coolant tank (26).

4. The multi-directional thermally conductive liquid-cooled radiator assembly according to claim 3, characterized in that: The rear side of the connecting cable (292) is electrically connected to a temperature display panel (293), which is bolted to the top of the heat-conducting fan (28).

5. The multi-directional thermally conductive liquid-cooled radiator assembly according to claim 1, characterized in that: The suction and discharge structure (27) includes an output pump (271) bolted to the front side of the top plate (24), the absorption end of the output pump (271) is connected to a suction pipe (272), and the suction pipe (272) is connected to the front side of the coolant tank (26).

6. The multi-directional thermally conductive liquid-cooled radiator assembly according to claim 5, characterized in that: The output end of the output pump (271) is connected to an output pipe (273), and the bottom of the output pipe (273) is connected to the front side of the flat heat absorption pipe (21).

7. A multi-directional thermally conductive liquid-cooled radiator assembly according to claim 1, characterized in that: The top of the coolant tank (26) is connected to a replenishment and replacement pipe (3), and the top of the replenishment and replacement pipe (3) is fitted with a sealing sleeve (4).

8. A multi-directional thermally conductive liquid-cooled radiator assembly according to claim 2, characterized in that: The top of the coolant tank (26) is fitted with a protective shell (5), which is located on top of the temperature detector (291).

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