Two-in-one power semiconductor module and power system
By integrating rectification and inversion functions into one module, the problem of redundant structure and inconsistent heat dissipation design of existing IGBT modules in new energy vehicles is solved, achieving a reduction in module size and weight, an increase in efficiency and reliability.
Patent Information
- Application Number
- CN202520321070.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-02-26
- Publication Date
- 2026-02-24
- Estimated Expiration
- 2035-02-26
AI Technical Summary
When existing IGBT modules are used in new energy vehicles to simultaneously function as rectifier and inverter modules, problems arise such as redundant structure, large space occupation, heavy weight, complex installation, inconsistent heat dissipation design, and inconsistent reliability due to differences in module electrical characteristics.
Design a two-in-one power semiconductor module that integrates rectification and inversion functions into one module. The inverter unit and the rectifier unit are set on an insulating board, sharing a circuit structure, reducing redundancy, unifying heat dissipation design, and improving power density.
Reduce module size and weight, lower installation and maintenance costs, improve efficiency, simplify heat dissipation design, increase module power density, and enhance module reliability.
Smart Images
Figure CN223942585U_ABST
Abstract
Description
Technical Field
[0001] This utility model belongs to the field of power semiconductor module technology, specifically relating to a two-in-one power semiconductor module and power system. Background Technology
[0002] IGBT modules are widely used in the field of power electronics, and there are many types with specific functions to meet different operating conditions. (See attached image) Figure 1 and attached Figure 2 The diagram shows the topology of two common IGBT modules. Figure 1 This is a topology diagram of a three-phase PWM rectifier, which converts AC power to DC power. Figure 2 This is a topology diagram of an inverter, whose function is to convert direct current (DC, battery, storage battery) into alternating current.
[0003] In the field of new energy vehicles, there exists a scenario where generators generate electricity and store it in battery packs (AC→DC), and then convert the DC power from the battery packs into AC power to drive the vehicle (DC→AC). This involves both rectification and inversion. Existing solutions primarily use auxiliary circuits in the electronic control system. Figure 1 and 2 This approach uses two modules to meet the requirements. However, this approach has its flaws and shortcomings:
[0004] 1. Using both types of modules simultaneously results in numerous redundant structures (such as bus capacitors, heat sinks, and housings), occupying a large space and increasing weight, which is not conducive to reducing the size of the electronic control system and the overall vehicle weight. It also increases installation and maintenance costs.
[0005] 2. Different modules have different installation methods, interface types, and cooling methods, making it impossible to use a unified heat dissipation design to reduce thermal resistance and power density. At the same time, it places higher demands on the design of electronic control systems and interface support.
[0006] 3. There are many types of modules with inverter or rectification functions, and they differ in terms of electrical characteristics and packaging reliability. There is a risk of inconsistency in the stability and reliability of module selection. Utility Model Content
[0007] The purpose of this invention is to provide a two-in-one power semiconductor module and power system to solve the above-mentioned technical problems.
[0008] This application provides a dual-in-one power semiconductor module. The dual-in-one power semiconductor module includes:
[0009] platform;
[0010] A first insulating plate and a second insulating plate are disposed on one surface of the platform; and
[0011] The inverter unit is mounted on the first insulating plate;
[0012] The rectifier unit is mounted on the second insulating plate.
[0013] In one embodiment of this application, the inverter unit includes an inverter IGBT module topology;
[0014] The rectifier unit includes a rectifier IGBT module topology.
[0015] In one embodiment of this application, the inverter unit includes an inverter unit DC+ interface, an inverter unit AC interface, an inverter unit signal control interface, and an inverter unit DC- interface.
[0016] In one embodiment of this application, the rectifier unit includes a rectifier unit DC+ interface, a rectifier unit AC interface, a rectifier unit signal control interface, and a rectifier unit DC- interface.
[0017] Accordingly, this application also provides a power system, including: a drive motor, a battery, an alternator, and the dual-in-one power semiconductor module as described above;
[0018] The inverter unit in the two-in-one power semiconductor module is connected to the battery and the drive motor, and is used to invert the DC power output by the battery into the AC power required by the drive motor.
[0019] The rectifier unit in the two-in-one power semiconductor module is connected to the generator and the battery, and is used to rectify the AC power output by the AC generator into DC power to charge the battery.
[0020] The beneficial effects of this utility model are:
[0021] Unlike existing technologies, this application provides a two-in-one power semiconductor module. This two-in-one power semiconductor module includes: a platform; a first insulating plate and a second insulating plate disposed on one surface of the platform; an inverter unit disposed on the first insulating plate; and a rectifier unit disposed on the second insulating plate. The two-in-one power semiconductor module of this application integrates rectification and inversion functions into one module, reducing redundant structures in traditional discrete solutions. It allows for the sharing of some circuitry, thereby reducing the module's size and weight, and lowering installation and maintenance costs. The module with integrated rectification and inversion functions can reduce module size, shorten current paths, reduce parasitic inductance and resistance, and improve efficiency. It also facilitates unified heat dissipation design, efficiently utilizes heat dissipation area, reduces thermal resistance, and thus increases the module's power density.
[0022] Other features and advantages of this invention will be set forth in the description which follows, and will be apparent in part from the description, or may be learned by practicing the invention. The objectives and other advantages of this invention are realized and obtained through the structures particularly pointed out in the description and the accompanying drawings.
[0023] To make the above-mentioned objectives, features and advantages of this utility model more apparent and understandable, preferred embodiments are described below in detail with reference to the accompanying drawings. Attached Figure Description
[0024] To more clearly illustrate the specific embodiments of this utility model or the technical solutions in the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this utility model. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.
[0025] Figure 1 This is a topology diagram of an existing three-phase PWM rectifier module;
[0026] Figure 2 This is a topology diagram of the existing inverter module;
[0027] Figure 3 This is a topology diagram of a preferred embodiment of the two-in-one power semiconductor module of this utility model;
[0028] Figure 4 This is a front view of the two-in-one power semiconductor module of this utility model;
[0029] Figure 5 This is a perspective view of the two-in-one power semiconductor module of this utility model;
[0030] Figure 6 This is a schematic diagram of the power system of this utility model.
[0031] In the picture:
[0032] Platform 1, First Insulation Board 2, Inverter Unit 3, Rectifier Unit 4, Inverter Unit DC+ Interface 5, Inverter Unit AC Interface 6, Inverter Unit Signal Control Interface 7, Inverter Unit DC- Interface 8, Rectifier Unit DC+ Interface 9, Rectifier Unit AC Interface 10, Rectifier Unit Signal Control Interface 11, Rectifier Unit DC- Interface 12, Second Insulation Board 13. Detailed Implementation
[0033] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of this utility model.
[0034] This application provides a two-in-one power semiconductor module and power system, which will be described in detail below. It should be noted that the order of description of the following embodiments is not intended to limit the preferred order of the embodiments of this application. Furthermore, in the following embodiments, the descriptions of each embodiment have their own emphasis; parts not described in detail in a certain embodiment can be referred to in the relevant descriptions of other embodiments.
[0035] See Figure 4 and Figure 5 In one embodiment, the two-in-one power semiconductor module includes: a platform 1; a first insulating plate 2 and a second insulating plate 13 disposed on a surface of the platform 1; an inverter unit 3 disposed on the first insulating plate 2; and a rectifier unit 4 disposed on the second insulating plate 13.
[0036] In this embodiment, the inverter unit 3 and the rectifier unit 4 can be connected to the first insulating plate 2 and the second insulating plate 13 to achieve electrical insulation; then the first insulating plate 2 and the second insulating plate 13 can be connected to the platform 1 to form an integrated module, thereby realizing the combination of inverter and rectification functions. Optionally, the connection can be achieved by welding.
[0037] In this embodiment, by integrating rectification and inversion functions into a single module, redundant structures (such as bus capacitors, heat sinks, and housings) in traditional discrete solutions are reduced. Some circuits (such as DC buses) can be shared, thereby reducing the module's size and weight, and lowering installation and maintenance costs. The module with both rectification and inversion functions can reduce module size, shorten current paths, reduce parasitic inductance and resistance, and improve efficiency (such as reduced switching losses). It also facilitates unified heat dissipation design, efficiently utilizes heat dissipation area, reduces thermal resistance, and thus increases the module's power density.
[0038] In some embodiments, the inverter unit 3 includes an inverter IGBT module topology; the rectifier unit 4 includes a rectifier IGBT module topology.
[0039] Optionally, the inverter IGBT module topology may include multiple IGBT chips connected to form a semiconductor chip topology with inverter functionality. Similarly, the rectifier IGBT module topology may include multiple IGBT chips connected to form a semiconductor chip topology with rectification functionality. In some embodiments, the inverter IGBT module topology and the rectifier IGBT module topology may be implemented using existing topologies.
[0040] For example, see Figure 3The semiconductor chip topology within the inverter unit provides inverter functionality. U1, V1, W1, P1-P3, and N1-N3 represent the power interfaces of the inverter unit; G1-G6, C1-C6, and E1-E6 represent the chip signal control interfaces; and T1-T6 represent the thermistor conductive pins. By connecting the positive and negative terminals of the DC power supply to P1-P3 and N1-N3 respectively, and activating the corresponding semiconductor chips through the chip control signal interfaces G1-G6, C1-C6, and E1-E6, the inverter function of outputting three-phase AC power from the U1, V1, and W1 interfaces can be achieved.
[0041] The semiconductor chip topology within the rectifier unit has a rectification function. U2, V2, W2, DC+, and DC- represent the power interfaces of the rectifier unit. G7~G12, C7~C12, and E7~E12 represent the chip control signal interfaces of the rectifier unit. T7~T8 represent the conductive pins of the thermistors in the rectifier unit. By connecting the three-phase AC input terminals to interfaces U2, V2, and W2 respectively, and controlling the corresponding semiconductor chips through the chip signal control interfaces G7~G12, C7~C12, and E7~E12, the rectification function of DC power output from the DC+ and DC- interfaces can be realized.
[0042] See Figure 4 and Figure 5 The inverter unit 3 includes an inverter unit DC+ interface 5, an inverter unit AC interface 6, an inverter unit signal control interface 7, and an inverter unit DC- interface 8.
[0043] Specifically, the inverter unit DC+ interface 5 corresponds to Figure 2 The P1 to P3 interfaces; the AC interface 6 of the inverter unit corresponds to... Figure 2 The U1, V1, and W1 interfaces; the inverter unit signal control interface 7 corresponds to... Figure 2 The G1~G6, C1~C6, E1~E6 and T1~T6 interfaces; the inverter unit DC-interface 8 corresponds to Figure 2 The N1 to N3 interfaces. Connect the positive and negative terminals of the DC power supply to the DC+ interface 5 and DC- interface 8 of the inverter unit, respectively. By controlling the inverter unit signal control interface 7 to turn on the corresponding semiconductor chip, the inverter unit can output three-phase AC power from the AC interface 6.
[0044] Furthermore, the rectifier unit 4 includes a rectifier unit DC+ interface 9, a rectifier unit AC interface 10, a rectifier unit signal control interface 11, and a rectifier unit DC- interface 12.
[0045] Specifically, the rectifier unit DC+ interface 9 corresponds to Figure 2 The rectifier unit DC+ interface; the rectifier unit AC interface 10 corresponds to Figure 2The rectifier unit interfaces U2, V2, and W2; the rectifier unit signal control interface 11 corresponds to... Figure 2 The G7~G12, C7~C12, E7~E12 and T7~T8 interfaces; the rectifier unit DC-interface 12 corresponds to Figure 2 The DC- interface. Connect the three-phase AC input terminal to the AC interface 10 of the rectifier unit, and turn on the corresponding semiconductor chip through the signal control interface 11 of the rectifier unit to realize the rectification function of DC power output from the DC+ interface 9 and the DC- interface 12 of the rectifier unit.
[0046] Accordingly, based on the above embodiments, see also Figure 6 An embodiment of this application also provides a power system, characterized in that it includes: a drive motor, a battery, an alternator, and a dual-in-one power semiconductor module as described above; the inverter unit 3 in the dual-in-one power semiconductor module is connected to the battery and the drive motor, and is used to invert the DC power output by the battery into AC power required by the drive motor; the rectifier unit 4 in the dual-in-one power semiconductor module is connected to the alternator and the battery, and is used to rectify the AC power output by the alternator into DC power to charge the battery.
[0047] In summary, the two-in-one power semiconductor module of this invention is only elongated in the length direction to accommodate the inverter and rectifier units. Its overall layout and structure are largely similar to existing modules on the market, requiring minimal changes to applications (such as motors and electronic controls), and offering good client-side support. Furthermore, as... Figure 4 As shown, the chip unit, insulating board, and platform are connected by welding (or other feasible connection methods). The process flow and production equipment for the three components and connecting materials are all very mature, and the feasibility of process and production is high. Furthermore, this utility model's two-in-one power semiconductor module can adapt to various electrical interfaces and heat dissipation methods (both water cooling and air cooling are supported), exhibiting strong interface and heat dissipation compatibility. The module has a simple structure and high reliability.
[0048] It should be noted that all the devices (parts whose specific structures are not specified) selected in this application are general standard parts or parts known to those skilled in the art, and their structures and principles can be known to those skilled in the art through technical manuals or conventional experimental methods.
[0049] In the description of the embodiments of this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.
[0050] In the description of this utility model, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the accompanying drawings and are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.
[0051] Based on the above-described preferred embodiments of this utility model, and through the foregoing description, those skilled in the art can make various changes and modifications without departing from the technical concept of this utility model. The technical scope of this utility model is not limited to the contents of the specification, but must be determined according to the scope of the claims.
Claims
1. A two-in-one power semiconductor module, characterized in that, include: Platform (1); The first insulating plate (2) and the second insulating plate (13) are disposed on one surface of the platform (1); as well as An inverter unit (3) is mounted on the first insulating plate (2); The rectifier unit (4) is mounted on the second insulating plate (13).
2. The dual-in-one power semiconductor module according to claim 1, characterized in that, The inverter unit (3) includes an inverter IGBT module topology; The rectifier unit (4) includes a rectifier IGBT module topology.
3. The dual-in-one power semiconductor module according to claim 1, characterized in that, The inverter unit (3) includes an inverter unit DC+ interface (5), an inverter unit AC interface (6), an inverter unit signal control interface (7), and an inverter unit DC- interface (8).
4. The dual-in-one power semiconductor module according to claim 1, characterized in that, The rectifier unit (4) includes a rectifier unit DC+ interface (9), a rectifier unit AC interface (10), a rectifier unit signal control interface (11), and a rectifier unit DC- interface (12).
5. A power system, characterized in that, include: The drive motor, battery, alternator, and the dual-in-one power semiconductor module as described in any one of claims 1-4; The inverter unit (3) in the two-in-one power semiconductor module is connected to the battery and the drive motor, and is used to invert the DC power output by the battery into the AC power required by the drive motor. The rectifier unit (4) in the two-in-one power semiconductor module is connected to the generator and the battery, and is used to rectify the AC power output by the AC generator into DC power to charge the battery.